EP3164525B1 - Coated flat component in a cvd reactor - Google Patents
Coated flat component in a cvd reactor Download PDFInfo
- Publication number
- EP3164525B1 EP3164525B1 EP15736214.6A EP15736214A EP3164525B1 EP 3164525 B1 EP3164525 B1 EP 3164525B1 EP 15736214 A EP15736214 A EP 15736214A EP 3164525 B1 EP3164525 B1 EP 3164525B1
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- Prior art keywords
- component
- coating
- edge
- cvd reactor
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- 238000000576 coating method Methods 0.000 claims description 44
- 239000011248 coating agent Substances 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 38
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- IHQKEDIOMGYHEB-UHFFFAOYSA-M sodium dimethylarsinate Chemical class [Na+].C[As](C)([O-])=O IHQKEDIOMGYHEB-UHFFFAOYSA-M 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 11
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 11
- 230000005484 gravity Effects 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910003468 tantalcarbide Inorganic materials 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000012821 model calculation Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
Definitions
- the invention relates to a CVD reactor with a flat component or a flat component.
- the component has two preferably equally shaped, parallel and spaced apart width sides broadside, wherein an outer peripheral edge on each broad side adjacent to an edge of an outer peripheral side, an edge rounding with an edge radius of curvature and a Kantenlrundungsbogenleton, wherein the thickness is substantially smaller than a surface area equivalent to the broadside surface diameter, wherein the component forms a core body whose material has a greater coefficient of thermal expansion than the material of a coating with which the broad sides and the peripheral side at a coating temperature which is greater than the room temperature, coated so that at room temperature the coating has a compressive stress
- the WO 2013/064613 describes a CVD reactor with a gas inlet member and a susceptor arranged therein, which has a circular disk shape and carrier of substrates in a coating process.
- the WO 99/43874 also describes a CVD reactor with two disk-shaped components, namely a process chamber ceiling and a susceptor for receiving the substrates to be coated in the process chamber.
- the US 2005/0183669 A1 describes in the FIG. 5 a cap formed by a flat cylindrical member.
- the cap has a coating and two broadside facing away from each other.
- a broadside goes to form an edge fillet with a fillet arc length of 90 ° in a peripheral surface over.
- the peripheral surface merges with the formation of a bead and a kink in the second broad side.
- the US 5,837,058 describes a susceptor for a CVD device in which a bead running on the edge merges to form a rounding in a peripheral surface.
- the US 2003/0205324 A1 respectively US 2005/0092439 A1 describes in the FIG. 4 a susceptor with two facing away broad sides, which merge in each case to form an edge rounding in a peripheral surface.
- the peripheral surface has a circumferentially extending notch.
- Susceptors or ceiling panels in a CVD reactor are usually made of graphite.
- the graphite components have a flat, disk-like shape. They have two generally identically designed, mutually parallel broadsides. It can be a cylindrical body. The thickness of the body is low compared with its diameter.
- coated flat components are used in a CVD reactor, which have a different base area than a circular base. Again, the thickness relative to a diameter is relatively small, in which case the diameter of a circle is understood to mean that has the same base area as the broad side of the component.
- the graphite body is coated with a few micrometers thick layer. The layer thickness of the coating is less than 1 mm.
- SiC or TaC or other carbides or hard materials is used for coating usually SiC or TaC or other carbides or hard materials.
- the application of the coating takes place at temperatures of more than 1000 ° C.
- the core body has a larger thermal expansion coefficient than the coating, with which the broad side and the peripheral side is coated.
- stresses within the coating occur. These are compressive stresses.
- the compressive stresses are a consequence of the different shrinkage of the layer and the core body.
- the shrinkage takes place in the direction of the center of gravity of the component. If it is a homogeneous body, this is the center of mass. Otherwise it is the volume center of gravity.
- the peripheral sides are relatively far away from the center of gravity, so that there the greatest stresses occur in the layer or in the region of the interface between the coating and the core body.
- Within the coating which shrinks on cooling to a lesser extent than the core body, forms a compressive stress. High compressive stresses can influence the quality of the coating in the long term.
- the invention is therefore based on the object to take measures to make the coating more robust, in particular to reduce the occurring in the coating, critical maximum stresses at any time (at any temperature) to reduce.
- This valley can turn into a surrounding mountain. The latter can go back to a valley.
- the cross-sectional contour line of the peripheral side thus preferably extends undulating between the two broad sides. Since the components are coated when hot, the largest voltages occur in the cooled state, ie at room temperature. The stresses are reduced during operation, during which the component is heated to temperatures above 1000 ° C. It thus takes place at each temperature change, so with each use of the component, a load change. With the requirements of the invention, the negative influences of the frequent load changes can be reduced to the life of the component. It is advantageous if the arc length of the edge rounding is more than 90 °, preferably more than 95 °, 100 °, 105 °, 110 °, 115 or more than 120 °.
- the cross-sectional contour line of the peripheral side has no kinks, but has a waveform.
- the broad side of the component can be designed smooth. However, the broad side of the component can also have a plurality of depressions, in each case for receiving a circular disk-shaped wafer or a substrate carrier. Also, the downward-facing broad side of the component, which is a susceptor, may have a structuring. The same applies to a ceiling tile.
- the component has a hole. It may be a central hole of a circular cylindrical component.
- the inner wall of the opening also forms a circumferential side of the component, which is structured as already described above. It has rounded edges, where the radius of curvature is less than or equal to 1 mm.
- the wide side surface goes kink-free over the edge rounding in the peripheral side, wherein in viewing a cross-sectional area of the broad side surface corresponding straight bend-free a continuous curved arc line connects.
- the broad side surface is virtually smooth in a curved line, which curves without changing the direction of curvature by more than 90 ° before it turns into a curved turning point in an oppositely curved portion, which either merges into a rectilinear portion of the peripheral side or wavy continues.
- the edges of the broad side of the component run along two parallel lines.
- the two parallel lines correspond to the broad side surfaces and are spaced by less than half, preferably less than a quarter of their length.
- these lines merge into arcuate lines associated with the edge fillets.
- These arc lines preferably run on circular arcs or circular arcs.
- the circumferential length of these sheets is greater than 90 °, preferably at least 95 ° or at least 100 °.
- a first end of a bow joins without kinks to each one of the parallel lines.
- the second end of the arch preferably merges into an oppositely curved arc section, so that at least one valley forms on the peripheral surface, the base of which springs back against the imaginary line through the vertexes of the second arches.
- the component has over its entire circumference the above-described cross section of the edge region.
- the thickness of the component is preferably at least a factor of 5, preferably a factor of 10, less than the surface-equivalent circular diameter.
- the component may have a circular cylindrical ground plan. But it can also have a deviating from the circular shape floor plan.
- the invention relates to the configuration of the peripheral edge of a coated component of a CVD reactor, wherein the component may be a susceptor, a substrate holder in a pocket of a susceptor, a ceiling plate of a process chamber or the gas outlet plate of a showerhead.
- the FIG. 1 schematically shows a CVD reactor.
- the CVD reactor 10 has a housing in which a gas inlet member 13 is arranged, with which process gases can be fed into a process chamber of the CVD reactor 10.
- a process chamber ceiling 11 is formed by a graphite part having a hole in the middle.
- the graphite part has a circular disk-shaped outline contour.
- a bottom of the process chamber which is formed by a susceptor 12 which can be heated from below by means of a heater 14 to a process temperature of more than 1000 ° C.
- the susceptor is formed by a graphite part 12 which has a has circular outline.
- the top of the susceptor 12 is provided with structures that form pockets for receiving substrates.
- the two graphite components 11, 12 have identically designed upper sides and lower sides with regard to their outline contour.
- the components are schematically in the Figures 2 and 8, wherein the edge radii of curvature are shown for clarity much larger than they should be according to the invention.
- FIG. 2 It represents a circular disk-shaped graphite body 1 with a thickness d of 1 - 4 cm and a diameter D of more than 20 cm, in particular more than 30 cm.
- the entire outer surface of the graphite core body 1 is provided with a coating 2. It is a 50 to 200 ⁇ m or 75 to 150 ⁇ m thick coating of SiC or TaC.
- the coating is applied to the core body 1 at a temperature of more than 1000 ° C. Since silicon carbide or tantalum carbide have a lower thermal expansion than graphite, the graphite core body 1 shrinks to a greater extent along in the FIG. 3 marked and marked K in the direction of the center of gravity M as the coating 2. This has a slight bowls of the two facing away from each other, from the outline of the same designed broadsides 3 result. Also in the peripheral pages 4 a slight constriction when cooling the coated component 12 is observed.
- the marginal edges 5 of the component 12 are provided with a slight rounding.
- the radius of curvature R is greater than the thickness of the coating, but not more than 1 mm.
- the peripheral edge 5 has a rounding with a radius of curvature R of 1 mm.
- the arc length ⁇ of the Kantenverrundung 5 is here greater than 90 °.
- the Kantenverrundungsbogenin ⁇ has a value of about 120 °. This has the consequence that the force acting vertically on the peripheral side 4, due to the shrinkage force K does not attack vertically on the surface, but at an angle to it. The force K thus splits into mutually perpendicular partial forces P and S.
- the force component S acting perpendicularly to the interface between the core body 1 and the coating 2 has an amount which is less than the magnitude of the force K. This leads to a reduction in the pressure forces within the coating or at the interface between the coating 2 and the core body 1.
- FIG. 6 illustrated embodiment shows a component with a graphite core part 1, which is provided with a silicon carbide coating.
- the marginal edges 5 are provided with a rounding by almost 180 °. The rounding extends beyond the plane of the broad side 3. Between the two edge roundings 5, with which the peripheral side 4 merges into the respective broad side 3, a valley 6 is formed.
- the cross-sectional contour line of the peripheral side 4 is wavy, so that mountains 7 and valleys 6 alternate. Between the two edges 5, the peripheral side 4 runs without kinks. Convex rounding sections go smoothly into concave rounding sections. Thus, valleys 6 extending in the circumferential direction around the component and mountains 7 lying between valleys 6 are formed.
- the FIG. 8 shows a further embodiment.
- the component 11 is a ceiling plate. which has a hole 8 in the center.
- the hole 8 forms a peripheral side 4, which merges over a rounded edge 5 in the broad side 3.
- a valley 6 is formed between two edge fillets 5.
- the invention is based on the finding that fillets should pass into the peripheral side 4 or the broad side surface 2 with the formation of constrictions, or may not be greater than a minimum value. This leads to a voltage compensation. Furthermore, it is advantageous if the individual surface sections 3, 4, 5, 6, 7 pass without kinks, ie smoothly with the formation of rounding zones with low rounding radii.
- graphite bodies are described which have a circular cylindrical shape.
- the invention also relates to such flat graphite bodies which have a broad-side contour which deviates from the circular shape.
- the radius of the transition region between the broad side surface and the peripheral surface should be less than 1 mm and the radius section should be more than 90 °.
- FIG. 10 schematically shows a further embodiment of a process chamber of a CVD reactor with a gas inlet member 13, which as Showerhead is trained. It has a graphite gas outlet plate 15, the gas outlet openings 16 has.
- the outer peripheral surface of the gas outlet plate 15 has a cross-sectional contour, as they FIG. 11 shows. At least in the edge portion of the two opposite broad sides 3, 3 'extend the broad sides 3, 3' parallel to each other. There, the broad side surface passes in each case without kinks in a Kantenverrundung 5, which has a rounding radius R 1 , R 2 , which is about 1 mm.
- an arc section with a radius R 3 follows without kinks. Relative to a median plane extending between the two broad sides 3, 3 ', the cross section of the edge of the gas outlet plate 15 is symmetrical. This means that the radii R 1 , R 2 are the same size.
- An imaginary straight line g which is defined by the vertices of the edge fillets 5, spans a valley 6 whose bottom is formed by the radius R 3 .
- the process chamber shown has a susceptor 12 which can be heated from below by means of a heating device 14.
- the peripheral side 4 of the susceptor 12 may have a contour as shown in the cross-sectional views of Figures 11 . 13 . 14 and 15 is shown.
- FIG. 12 shows a further embodiment of a susceptor, wherein in the pockets of the susceptor 12 substrate carrier 17 eino.
- the substrate carriers 17 are rotationally driven in the coating operation by a gas flow and are mounted on a gas bearing generated by the gas stream.
- the FIG. 13 shows the edge cross section of the susceptor 12 and the FIG. 14 shows the edge cross section of the substrate carrier 17. From the Figures 13 and 14 shows that the cross section of the peripheral side 4 of a series arrangement of three Arcs is composed, which arcs with the radii R 1 , R 2 , R 3 transition points 18 without kinks into each other.
- the radii R1, R2 are about 1 mm.
- the radius R 3 depends on the thickness d of the core 1, which is coated with a maximum of 0.5 mm thick coating 2 and can be substantially larger than the radii R 1 and R 2 .
- the radius R 3 can be between 8 and 9 mm with a thickness of the component of 13 cm.
- the cross-sectional radius of the valley 6 between the two edge fillets 5 can thus preferably be at least five times greater than the edge radius of curvature.
- the radius R 3 is further selected so that a transition point 18 is formed in which only the direction of curvature changes, but otherwise the contour lines merge into one another without kinks.
- FIG. 15 illustrated embodiment shows a variant in which in each case at the edge fillets 5 opposite curved arches connect with radii R3, which pass into a running on a straight valley 6, wherein the flat valley 6 kinks at transition points 19 in the hollow rounding with the radius R. 3 passes.
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Description
Die Erfindung betrifft einen CVD-Reaktor mit einem flachen Bauteil bzw. ein flaches Bauteil. Das Bauteil weist zwei bevorzugt gleich gestaltete, parallel zueinander verlaufende und um eine Dicke voneinander beabstandete Breitenseiten auf, wobei eine äußere Randkante auf jeder Breitseite, die an einen Rand einer äußeren Umfangsseite angrenzt, eine Kantenverrundung mit einem Kantenverrundungsradius und eine Kantenverrundungsbogenlänge aufweist, wobei die Dicke wesentlich kleiner ist, als ein zur Breitseitenfläche oberflächenäquivalenter Kreisdurchmesser, wobei das Bauteil einen Kernkörper ausbildet, dessen Werkstoff einen größeren Wärmeausdehnungskoeffizienten aufweist als der Werkstoff einer Beschichtung, mit der die Breitseiten und die Umfangsseite bei einer Beschichtungstemperatur, die größer ist als die Raumtemperatur, beschichtet ist, so dass bei Raumtemperatur die Beschichtung eine Druckspannung aufweistThe invention relates to a CVD reactor with a flat component or a flat component. The component has two preferably equally shaped, parallel and spaced apart width sides broadside, wherein an outer peripheral edge on each broad side adjacent to an edge of an outer peripheral side, an edge rounding with an edge radius of curvature and a Kantenlrundungsbogenlänge, wherein the thickness is substantially smaller than a surface area equivalent to the broadside surface diameter, wherein the component forms a core body whose material has a greater coefficient of thermal expansion than the material of a coating with which the broad sides and the peripheral side at a coating temperature which is greater than the room temperature, coated so that at room temperature the coating has a compressive stress
Die
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Suszeptoren bzw. Deckenplatten in einem CVD-Reaktor werden in der Regel aus Graphit gefertigt. Die Graphitbauteile haben eine flache, scheibenförmige Gestalt. Sie haben zwei in der Regel gleich gestaltete, parallel zueinander verlaufende Breitseiten. Es kann sich um einen zylindrischen Körper handeln. Die Dicke des Körpers ist vergleichen mit seinem Durchmesser gering. Neben Bauteilen, die einen kreisförmigen Grundriss aufweisen, werden in einem CVD-Reaktor aber auch beschichtete flache Bauteile verwendet, die eine andere Grundfläche als eine kreisförmige Grundfläche aufweisen. Auch hier ist die Dicke gegenüber einem Durchmesser verhältnismäßig klein, wobei hier als Durchmesser der Durchmesser eines Kreises verstanden wird, der die selbe Grundfläche wie die Breitseite des Bauteiles aufweist. Der Graphitkörper ist mit einer wenige Mikrometer dicken Schicht beschichtet. Die Schichtdicke der Beschichtung ist geringer als 1 mm. Zur Beschichtung wird üblicherweise SiC oder TaC oder andere Carbide oder Hartstoffe verwendet. Das Aufbringen der Beschichtung findet bei Temperaturen von mehr als 1000°C statt. Der Kernkörper besitzt einen größeren Wärmeausdehnungskoeffizienten als die Beschichtung, mit der die Breitseite und die Umfangsseite beschichtet ist. Beim Abkühlen des beschichteten Bauteils von der Beschichtungstemperatur herunter zur Raumtemperatur treten Spannungen innerhalb der Beschichtung auf. Es handelt sich dabei um Druckspannungen. Die Druckspannungen sind eine Folge der unterschiedlichen Schrumpfung von Schicht und Kernkörper. Die Schrumpfung findet in Richtung zum Schwerpunkt des Bauteils statt. Handelt es sich um einen homogenen Körper, so ist dies der Massenschwerpunkt. Ansonsten ist es der Volumenschwerpunkt. Aufgrund der Scheibenform des Bauteils sind die Umfangsseiten verhältnismäßig weit vom Schwerpunkt entfernt, so dass dort die größten Spannungen in der Schicht bzw. im Bereich der Grenzfläche zwischen Beschichtung und Kernkörper auftreten. Innerhalb der Beschichtung, die beim Abkühlen um ein geringeres Maß schrumpft als der Kernkörper, bildet sich eine Druckspannung aus. Hohe Druckspannungen können langfristig die Qualität der Beschichtung beeinflussen.Susceptors or ceiling panels in a CVD reactor are usually made of graphite. The graphite components have a flat, disk-like shape. They have two generally identically designed, mutually parallel broadsides. It can be a cylindrical body. The thickness of the body is low compared with its diameter. In addition to components that have a circular plan, but coated flat components are used in a CVD reactor, which have a different base area than a circular base. Again, the thickness relative to a diameter is relatively small, in which case the diameter of a circle is understood to mean that has the same base area as the broad side of the component. The graphite body is coated with a few micrometers thick layer. The layer thickness of the coating is less than 1 mm. For coating usually SiC or TaC or other carbides or hard materials is used. The application of the coating takes place at temperatures of more than 1000 ° C. The core body has a larger thermal expansion coefficient than the coating, with which the broad side and the peripheral side is coated. As the coated component cools from the coating temperature down to room temperature, stresses within the coating occur. These are compressive stresses. The compressive stresses are a consequence of the different shrinkage of the layer and the core body. The shrinkage takes place in the direction of the center of gravity of the component. If it is a homogeneous body, this is the center of mass. Otherwise it is the volume center of gravity. Due to the disc shape of the component, the peripheral sides are relatively far away from the center of gravity, so that there the greatest stresses occur in the layer or in the region of the interface between the coating and the core body. Within the coating, which shrinks on cooling to a lesser extent than the core body, forms a compressive stress. High compressive stresses can influence the quality of the coating in the long term.
Der Erfindung liegt daher die Aufgabe zugrunde, Maßnahmen zu ergreifen, um die Beschichtung robuster zu machen, insbesondere die in der Beschichtung auftretenden, kritischen maximalen Spannungen zu jedem Zeitpunkt (bei jeder Temperatur) zu reduzieren.The invention is therefore based on the object to take measures to make the coating more robust, in particular to reduce the occurring in the coating, critical maximum stresses at any time (at any temperature) to reduce.
Gelöst wird die Aufgabe durch die in den Ansprüchen angegebene Erfindung.The object is achieved by the invention specified in the claims.
Modellrechnungen haben ergeben, dass große Kantenverrundungsradien zu großen Maximalspannungen im Bereich der Grenzfläche zwischen Beschichtung und Kernkörper führen. Dies ist eine Folge der geometrisch bedingten Stabilität des durch die Kantenverrundung gebildeten Bogens der Beschichtung. Der Bogen besitzt eine relativ große Stabilität in Radialrichtung. Überraschend hat sich ergeben, dass eine Kantenverrundung mit einer Bogenlänge von mehr als 90° zu einer nennenswerten Verringerung der Maximalspannung führt. Eine nennenswerte Verringerung der Maximalspannung tritt auch dann ein, wenn der Kantenverrundungsradius etwa 1 mm beträgt bzw. geringer ist als 1 mm. Bei einer bevorzugten Ausgestaltung eines flachen Bauteils, bei dem die Breitseiten gleich gestaltet sind, das Bauteil somit gewissermaßen ein Flachzylinder ist, ist es von Vorteil, wenn sich an die Verrundung auf der Umfangs seite ein hinterschnittenes umlaufendes Tal anschließt. Dieses Tal kann in einen umlaufenden Berg übergehen. Letzterer kann wieder in ein Tal übergehen. Die Querschnittskonturlinie der Umfangsseite verläuft somit bevorzugt wellenförmig zwischen den beiden Breitseiten. Da die Bauteile im heißen Zustand beschichtet werden, treten die größten Spannungen im abgekühlten Zustand, also bei Raumtemperatur, auf. Die Spannungen vermindern sich beim Betrieb, währenddessen das Bauteil auf Temperaturen bis über 1000°C aufgeheizt wird. Es findet somit bei jedem Temperaturwechsel, also bei jeder Benutzung des Bauteils ein Lastwechsel statt. Mit den erfindungsgemäßen Vorgaben lassen sich die negativen Einflüsse des oftmaligen Lastwechsels auf die Standzeit des Bauteils vermindern. Es ist von Vorteil, wenn die Bogenlänge der Kantenverrundung mehr als 90°, bevorzugt mehr als 95°, 100°, 105°, 110°, 115 oder mehr als 120° beträgt. Die Querschnittskonturlinie der Umfangsseite hat keine Knickstellen, sondern besitzt eine Wellenform. Die Breitseite des Bauteils kann glatt gestaltet sein. Die Breitseite des Bauteils kann aber auch eine Vielzahl von Vertiefungen besitzen, jeweils zur Aufnahme eines kreisscheibenförmigen Wavers oder eines Substratträgers. Auch die nach unten weisende Breitseite des Bauteils, bei dem es sich um einen Suszeptor handelt, kann eine Strukturierung aufweisen. Selbiges gilt auch für eine Deckenplatte. Ferner kann vorgesehen sein, dass das Bauteil ein Loch besitzt. Es kann sich um zentrales Loch eines kreiszylindrischen Bauteils handeln. Die Innenwandung der Öffnung bildet ebenfalls eine Umfangsseite des Bauteils aus, die wie oben bereits beschrieben strukturiert ist. Sie besitzt verrundete Kanten, wobei der Rundungsradius kleiner als oder gleich 1 mm ist. Die Breitseitenfläche geht knickstellenfrei über die Kantenverrundung in die Umfangsseite über, wobei sich bei der Betrachtung einer Querschnittsfläche einer der Breitseitenfläche entsprechenden Gerade knickfrei eine durchgehend gekrümmte Bogenlinie anschließt. Die Breitseitenfläche geht gewissermaßen glatt in eine Bogenlinie über, die sich ohne Wechsel der Krümmungsrichtung um mehr als 90° krümmt bevor sie in einem Krümmungswendepunkt in einen entgegengerichtet gekrümmten Abschnitt übergeht, der entweder in einen geradlinig verlaufenden Abschnitt der Umfangsseite übergeht oder sich wellenförmig fortsetzt. In einer Querschnittsebene durch das Bauteil verlaufen die Ränder der Breitseite des Bauteils entlang zweier paralleler Linien. Die beiden parallelen Linien entsprechen den Breitseitenflächen und sind um weniger als die Hälfte, bevorzugt um weniger als ein Viertel ihrer Länge voneinander beabstandet. An ihren Enden gehen diese Linien in Bogenlinien über, die den Kantenverrundungen zugeordnet sind. Diese Bogenlinien verlaufen bevorzugt auf Kreisbögen oder kreisähnlichen Bögen. Die Umfangslänge dieser Bögen ist größer als 90°, bevorzugt mindestens 95° oder mindestens 100°. Ein erstes Ende eines Bogens schließt sich knickstellenfrei an jeweils eine der parallelen Linien an. Das zweite Ende des Bogens geht bevorzugt in einen entgegengerichtet gekrümmten Bogenabschnitt über, so dass sich auf der Umfangsfläche zumindest ein Tal ausbildet, dessen Grund gegenüber einer gedachten Linie durch die Scheitel zweiter Bögen zurückspringt. Bevorzugt besitzt das Bauteil auf seinem gesamten Umfang den zuvor beschriebenen Querschnitt des Randbereichs. Wegen der mehr als 90° betragenden Bogenlänge der Verrundung entsteht ein umlaufendes, zumindestens im Randbereichquerschnitt gerundetes Tal zwischen den beiden verrundeten Randkanten der Breitseitenflächen des Bauteils. Die Dicke des Bauteils ist bevorzugt um mindestens einen Faktor 5, bevorzugt einen Faktor 10 geringer als der oberflächenäquivalente Kreisdurchmesser. Das Bauteil kann einen kreiszylindrischen Grundriss aufweisen. Es kann aber auch einen von der Kreisform abweichenden Grundriss aufweisen. Die Erfindung betrifft die Ausgestaltung des Umfangsrandes eines beschichteten Bauteils eines CVD-Reaktors, wobei es sich bei dem Bauteil um einen Suszeptor, einen in einer Tasche einliegenden Substrathalter eines Suszeptors, einer Deckenplatte einer Prozesskammer oder um die Gasaustrittsplatte eines Showerheads handeln kann.Model calculations have shown that large edge radii lead to large maximum stresses in the region of the interface between the coating and the core body. This is a consequence of the geometric stability of the arc of the coating formed by the edge rounding. The bow has a relatively high stability in the radial direction. Surprisingly, it has been found that an edge rounding with an arc length of more than 90 ° leads to a significant reduction in the maximum stress. A Significant reduction of the maximum stress also occurs when the edge radius of curvature is about 1 mm or less than 1 mm. In a preferred embodiment of a flat component in which the broad sides are designed the same, the component is thus effectively a flat cylinder, it is advantageous if the recut side on the peripheral side followed by an undercut circumferential valley. This valley can turn into a surrounding mountain. The latter can go back to a valley. The cross-sectional contour line of the peripheral side thus preferably extends undulating between the two broad sides. Since the components are coated when hot, the largest voltages occur in the cooled state, ie at room temperature. The stresses are reduced during operation, during which the component is heated to temperatures above 1000 ° C. It thus takes place at each temperature change, so with each use of the component, a load change. With the requirements of the invention, the negative influences of the frequent load changes can be reduced to the life of the component. It is advantageous if the arc length of the edge rounding is more than 90 °, preferably more than 95 °, 100 °, 105 °, 110 °, 115 or more than 120 °. The cross-sectional contour line of the peripheral side has no kinks, but has a waveform. The broad side of the component can be designed smooth. However, the broad side of the component can also have a plurality of depressions, in each case for receiving a circular disk-shaped wafer or a substrate carrier. Also, the downward-facing broad side of the component, which is a susceptor, may have a structuring. The same applies to a ceiling tile. Furthermore, it can be provided that the component has a hole. It may be a central hole of a circular cylindrical component. The inner wall of the opening also forms a circumferential side of the component, which is structured as already described above. It has rounded edges, where the radius of curvature is less than or equal to 1 mm. The wide side surface goes kink-free over the edge rounding in the peripheral side, wherein in viewing a cross-sectional area of the broad side surface corresponding straight bend-free a continuous curved arc line connects. The broad side surface is virtually smooth in a curved line, which curves without changing the direction of curvature by more than 90 ° before it turns into a curved turning point in an oppositely curved portion, which either merges into a rectilinear portion of the peripheral side or wavy continues. In a cross-sectional plane through the component, the edges of the broad side of the component run along two parallel lines. The two parallel lines correspond to the broad side surfaces and are spaced by less than half, preferably less than a quarter of their length. At their ends, these lines merge into arcuate lines associated with the edge fillets. These arc lines preferably run on circular arcs or circular arcs. The circumferential length of these sheets is greater than 90 °, preferably at least 95 ° or at least 100 °. A first end of a bow joins without kinks to each one of the parallel lines. The second end of the arch preferably merges into an oppositely curved arc section, so that at least one valley forms on the peripheral surface, the base of which springs back against the imaginary line through the vertexes of the second arches. Preferably, the component has over its entire circumference the above-described cross section of the edge region. Because of the more than 90 ° amount of arc length of the rounding creates a circumferential, at least in the edge region cross-section rounded valley between the two rounded edges of the broad side surfaces of the component. The thickness of the component is preferably at least a factor of 5, preferably a factor of 10, less than the surface-equivalent circular diameter. The component may have a circular cylindrical ground plan. But it can also have a deviating from the circular shape floor plan. The invention relates to the configuration of the peripheral edge of a coated component of a CVD reactor, wherein the component may be a susceptor, a substrate holder in a pocket of a susceptor, a ceiling plate of a process chamber or the gas outlet plate of a showerhead.
Ausführungsbeispiele werden nachfolgend anhand beigefügter Zeichnungen erläutert. Es zeigen:
Figur 1- schematisch einen CVD-Reaktor mit darin angeordneten flachen Bauteilen 11, 12,
Figur 2- ein erstes flaches Bauteil 12 in Form eines Kreiszylinders,
Figur 3- den Schnitt gemäß der Linie 3 - 3 in
,Figur 2 Figur 4- eine Darstellung gemäß
Figur 3 eines zweiten Ausführungsbeispiels, Figur 5- eine vergrößerte Darstellung gemäß Ausschnitt V in
,Figur 4 Figur 6- eine Darstellung gemäß
Figur 5 eines dritten Ausführungsbeispiels, Figur 7- eine Darstellung gemäß
Figur 5 eines vierten Ausführungsbeispiels, Figur 8- ein fünftes Ausführungsbeispiel in Form einer
Kreisscheibe 11 miteinem zentralen Loch 8, Figur 9- den Schnitt gemäß der Linie IX-IX in
,Figur 8 Figur 10- eine Darstellung ähnlich der
Figur 1 , schematisch einen CVD-Reaktormit einem Gaseinlassorgan 13, welches eine beschichtete Gasauslassplatte 15mit Gasaustrittsöffnungen 16 aufweist, Figur 11- den Ausschnitt XI in
,Figur 10 Figur 12- einen beschichteten Suszeptor 12 mit Taschen, in denen beschichtete Substratträger 17 angeordnet sind,
Figur 13- vergrößert den Ausschnitt XIII in
,Figur 12 Figur 14- vergrößert den Ausschnitt XIV in
undFigur 12 Figur 15- ein weiteres Querschnittsprofil ähnlich der
Figuren 11 ,13 ,14 .
- FIG. 1
- 1 schematically shows a CVD reactor with
11, 12,flat components - FIG. 2
- a first
flat component 12 in the form of a circular cylinder, - FIG. 3
- the section according to the line 3 - 3 in
FIG. 2 . - FIG. 4
- a representation according to
FIG. 3 a second embodiment, - FIG. 5
- an enlarged view according to section V in
FIG. 4 . - FIG. 6
- a representation according to
FIG. 5 a third embodiment, - FIG. 7
- a representation according to
FIG. 5 a fourth embodiment, - FIG. 8
- A fifth embodiment in the form of a
circular disk 11 with acentral hole 8, - FIG. 9
- the section according to the line IX-IX in
FIG. 8 . - FIG. 10
- a representation similar to the
FIG. 1 schematically a CVD reactor with agas inlet member 13, which has a coatedgas outlet plate 15 withgas outlet openings 16, - FIG. 11
- the cutout XI in
FIG. 10 . - FIG. 12
- a
coated susceptor 12 having pockets in which coatedsubstrate carriers 17 are disposed, - FIG. 13
- Enlarges the section XIII in
FIG. 12 . - FIG. 14
- Enlarges the XIV section in
FIG. 12 and - FIG. 15
- another cross-sectional profile similar to the
Figures 11 .13 .14 ,
Die
Unterhalb der Decke 11 der Prozesskammer befindet sich ein Boden der Prozesskammer, der von einem Suszeptor 12 ausgebildet wird, der von unten mittels einer Heizung 14 auf eine Prozesstemperatur von mehr als 1000°C aufheizbar ist. Der Suszeptor wird von einem Graphitteil 12 ausgebildet, welches einen kreisförmigen Umriss aufweist. Die Oberseite des Suszeptors 12 ist mit Strukturen versehen, die Taschen ausbilden zur Aufnahme von Substraten.Below the
Die beiden Graphitbauteile 11, 12 besitzen hinsichtlich ihrer Umrisskontur gleichgestaltete Oberseiten und Unterseiten. Die Bauteile sind schematisch in den
Das in der
Erfindungsgemäß sind die Randkanten 5 des Bauteils 12 mit einer geringfügigen Verrundung versehen. Der Rundungsradius R ist größer als die Dicke der Beschichtung, aber maximal 1 mm.According to the invention, the
Bei dem in den
In dem Bereich der Kantenverrundungen 5 baut sich innerhalb der gerundeten Beschichtung 2 eine Druckspannung auf, die nicht vertikal über die Grenzfläche zwischen Beschichtung 2 und Kernkörper 1 in den Kernkörper 1 abgeleitet werden kann. Aufgrund der geometrischen Stabilität des Bogens werden die Kräfte vielmehr tangential in die Beschichtungsabschnitte der Breitseite 3 bzw. der Umfangsseite 4 eingeleitet. Eine Reduzierung des Verrundungsradius R auf Werte unterhalb 1 mm führt zu einer signifikanten Verminderung dieser Spannungen.In the area of the
Das in der
Bei dem in der
Die
Der Erfindung liegt die Erkenntnis zugrunde, dass Verrundungen unter Ausbildung von Einschnürungen in die Umfangsseite 4 bzw. die Breitenseitenfläche 2 übergehen sollten bzw. nicht größer als ein Minimalwert sein dürfen. Dies führt zu einer Spannungskompensation. Des Weiteren ist es von Vorteil, wenn die einzelnen Flächenabschnitte 3, 4, 5, 6, 7 knickstellenfrei, also glatt unter Ausbildung von Verrundungszonen mit geringen Rundungsradien ineinander übergehen.The invention is based on the finding that fillets should pass into the
Im Ausführungsbeispiel werden Graphitkörper beschrieben, die eine Kreiszylinderform besitzen. Die Erfindung betrifft aber auch solche flachen Graphitkörper, die eine von der Kreisform abweichende Breitseitenumrisskontur aufweisen. Auch hier sollte der Radius des Übergansbereichs zwischen der Breitseitenfläche und der Umfangsfläche kleiner als 1 mm sein und der Radiusabschnitt mehr als 90° betragen.In the exemplary embodiment, graphite bodies are described which have a circular cylindrical shape. However, the invention also relates to such flat graphite bodies which have a broad-side contour which deviates from the circular shape. Again, the radius of the transition region between the broad side surface and the peripheral surface should be less than 1 mm and the radius section should be more than 90 °.
Die
Die in
Die
Das in der
Claims (13)
- A CVD reactor with a flat component (11, 12), wherein the component (11, 12, 15, 17) exhibits two broad sides (3, 3') that run parallel to each other and are spaced apart from each other by a thickness (d), wherein an outer edge (5) of each broad side (3, 3') transitions without any kinks into an edge of an outer peripheral side (4), forming an edge rounding with an edge rounding radius (R) and an edge rounding arc length (α), wherein the thickness (d) is substantially less than a circle diameter (D) that is surface-equivalent to the broad side surface, wherein the component (11, 12, 15, 17) forms a core body (1) whose material exhibits a greater coefficient of thermal expansion than the material of a coating (2) with which the broad sides (3, 3') and peripheral side (4) are coated at a coating temperature greater than the room temperature, so that the coating exhibits a compressive stress at room temperature, characterized in that the edge rounding arc length (α) is greater than 90° to reduce the stress between the coating (2) and core body (1).
- A flat component for use in a CVD reactor, wherein the component exhibits two broad sides (3, 3') that run parallel to each other and are spaced apart from each other by a thickness (d), wherein an outer edge (5) of each broad side (3, 3') transitions without any kinks into an edge of an outer peripheral side (4), forming an edge rounding with an edge rounding radius (R) and an edge rounding arc length (α), wherein the thickness (d) is substantially less than a circle diameter (D) that is surface-equivalent to the broad side surface, wherein the component (11, 12, 15, 17) forms a core body (1) whose material exhibits a greater coefficient of thermal expansion than the material of a coating (2) with which the broad sides (3, 3') and peripheral side (4) are coated at a coating temperature greater than the room temperature, so that the coating exhibits a compressive stress at room temperature, characterized in that the edge rounding arc length (α) is greater than 90° to reduce the stress between the coating (2) and core body (1).
- The CVD reactor according to claim 1 or component according to claim 2, characterized in that the coating is SiC, TaC or another hard material.
- The CVD reactor or component according to one of the preceding claims, characterized in that the edge rounding radius (R) measures at most 1 mm and/or exceeds the thickness of the coating (2).
- The CVD reactor or component according to one of the preceding claims, characterized in that the core body (1) consists of graphite.
- The CVD reactor or component according to one of the preceding claims, characterized in that the coating (2) was applied at a temperature of >1000°C.
- The CVD reactor or component according to one of the preceding claims, characterized in that the peripheral side (4) exhibits rounding sections that transition into each other without any kinks and form at least one valley (6).
- The CVD reactor or component according to claim 7, characterized in that the peripheral side (4) is formed exclusively by circular arc sections in cross section.
- The CVD reactor or component according to one of the preceding claims, characterized in that the component (11, 12) is a susceptor (12) or a cover plate (11), a substrate carrier (17) or a gas outlet plate (15) of a gas inlet member (13).
- The CVD reactor or component according to one of the preceding claims, characterized in that the component (11, 12) exhibits a circle cylindrical shape, and in particular exhibits a diameter (D) of at least 20 cm, in particular at least 30 cm, and a thickness (d) of between 1 and 3 cm.
- The CVD reactor or component according to one of claims 1 to 9, characterized in that the component (11, 12) exhibits an outline that deviates from the circular shape.
- The CVD reactor or component according to one of the preceding claims, characterized in that, in a cross sectional plane through the component (11, 12, 15, 17), the cross section of the component exhibits two lines running parallel to each other at least near the edge of the component, which correspond to the edge regions of the broad sides (3, 3') of the component (11, 12, 15, 17), and the ends of these lines transition without any kinks into arc lines, which correspond to edge roundings (5), wherein the arc lines run on a circular arc or near-circular arc, and a curved connecting line joins the arc lines with each other without any kinks, and forms at least one valley (6), which jumps back relative to a straight line drawn through the vertices of the arc lines.
- The CVD reactor or component according to one of the preceding claims, characterized in that the peripheral side (4) is formed in cross section exclusively by circular arc lines with radii (R1, R2, R3) that are arranged one behind the other.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102014109327.5A DE102014109327A1 (en) | 2014-07-03 | 2014-07-03 | Coated flat disc-shaped component in a CVD reactor |
PCT/EP2015/064363 WO2016001053A1 (en) | 2014-07-03 | 2015-06-25 | Coated flat component in a cvd reactor |
Publications (2)
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EP3164525A1 EP3164525A1 (en) | 2017-05-10 |
EP3164525B1 true EP3164525B1 (en) | 2019-11-06 |
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EP15736214.6A Active EP3164525B1 (en) | 2014-07-03 | 2015-06-25 | Coated flat component in a cvd reactor |
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US (1) | US11053586B2 (en) |
EP (1) | EP3164525B1 (en) |
JP (1) | JP6576961B2 (en) |
KR (1) | KR102349341B1 (en) |
CN (1) | CN106488997B (en) |
DE (1) | DE102014109327A1 (en) |
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EP2659026B1 (en) * | 2010-12-30 | 2015-06-17 | Veeco Instruments Inc. | Wafer processing with carrier extension |
JP6562546B2 (en) * | 2015-07-14 | 2019-08-21 | 昭和電工株式会社 | Wafer support, wafer support, chemical vapor deposition equipment |
DE102016110408A1 (en) | 2016-06-06 | 2017-12-07 | Aixtron Se | Coated carbon body in a CVD reactor |
CN112374891B (en) * | 2020-11-16 | 2021-11-23 | 南京工业大学 | Graphite base plate surface gradient TaC coating |
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JPS5346436B2 (en) * | 1973-07-05 | 1978-12-13 | ||
US5837058A (en) * | 1996-07-12 | 1998-11-17 | Applied Materials, Inc. | High temperature susceptor |
WO1999043874A1 (en) | 1998-02-24 | 1999-09-02 | Northrop Grumman Corporation | Ceiling arrangement for an epitaxial growth reactor |
JP3226038B2 (en) * | 2000-03-15 | 2001-11-05 | 株式会社椿本チエイン | Low noise silent chain |
JP2001270789A (en) * | 2000-03-29 | 2001-10-02 | Ngk Insulators Ltd | Method for forming silicon carbide film on aluminum nitride, coating film structure, and silicon carbide film |
ITMI20020306A1 (en) * | 2002-02-15 | 2003-08-18 | Lpe Spa | RECEIVER EQUIPPED WITH REENTRANCES AND EPITAXIAL REACTOR THAT USES THE SAME |
US7070660B2 (en) * | 2002-05-03 | 2006-07-04 | Asm America, Inc. | Wafer holder with stiffening rib |
US20050092439A1 (en) * | 2003-10-29 | 2005-05-05 | Keeton Tony J. | Low/high temperature substrate holder to reduce edge rolloff and backside damage |
US7824498B2 (en) * | 2004-02-24 | 2010-11-02 | Applied Materials, Inc. | Coating for reducing contamination of substrates during processing |
WO2005111266A1 (en) * | 2004-05-18 | 2005-11-24 | Sumco Corporation | Susceptor for vapor deposition apparatus |
CN101001978B (en) * | 2004-07-22 | 2010-10-13 | 东洋炭素株式会社 | Susceptor |
DE102007056587A1 (en) * | 2007-11-23 | 2009-05-28 | Sortech Ag | Functional composite material |
EP2404228B1 (en) * | 2009-03-02 | 2020-01-15 | Apple Inc. | Techniques for strengthening glass covers for portable electronic devices |
EP2543063B1 (en) * | 2010-03-03 | 2019-05-08 | Veeco Instruments Inc. | Wafer carrier with sloped edge |
EP2400573A1 (en) * | 2010-06-23 | 2011-12-28 | Bayer MaterialScience AG | Electromechanical converter, method for manufacture and use of same |
EP2646221A1 (en) * | 2010-12-03 | 2013-10-09 | The Swisscore AG | Device and method for producing a honeycomb structure and a honeycomb structure |
DE102011055061A1 (en) | 2011-11-04 | 2013-05-08 | Aixtron Se | CVD reactor or substrate holder for a CVD reactor |
CN105088187B (en) * | 2011-11-23 | 2018-09-18 | 中微半导体设备(上海)有限公司 | CVD reactor or outer layer growth reactor and its support device |
DE102012108986A1 (en) * | 2012-09-24 | 2014-03-27 | Aixtron Se | Substrate holder for use in process chamber of semiconductor substrate treatment device, has recess having bearing surfaces which lie in common plane, and wall in region of projections in plan view of top face is straight |
EP2722416A1 (en) * | 2012-10-16 | 2014-04-23 | Sandvik Intellectual Property AB | Coated cemented carbide cutting tool with patterned surface area |
US20160115623A1 (en) * | 2013-06-06 | 2016-04-28 | Ibiden Co., Ltd. | Wafer carrier and epitaxial growth device using same |
-
2014
- 2014-07-03 DE DE102014109327.5A patent/DE102014109327A1/en not_active Withdrawn
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2015
- 2015-06-25 CN CN201580035721.9A patent/CN106488997B/en active Active
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- 2015-06-25 JP JP2016574076A patent/JP6576961B2/en active Active
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US11053586B2 (en) | 2021-07-06 |
EP3164525A1 (en) | 2017-05-10 |
DE102014109327A1 (en) | 2016-01-07 |
CN106488997A (en) | 2017-03-08 |
TW201606123A (en) | 2016-02-16 |
US20170152598A1 (en) | 2017-06-01 |
JP2017522454A (en) | 2017-08-10 |
CN106488997B (en) | 2020-01-14 |
KR20170026618A (en) | 2017-03-08 |
KR102349341B1 (en) | 2022-01-07 |
JP6576961B2 (en) | 2019-09-18 |
TWI679300B (en) | 2019-12-11 |
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