[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP1068029A1 - Method and apparatus for two layered coating of copper foils with meltable coating - Google Patents

Method and apparatus for two layered coating of copper foils with meltable coating

Info

Publication number
EP1068029A1
EP1068029A1 EP99917836A EP99917836A EP1068029A1 EP 1068029 A1 EP1068029 A1 EP 1068029A1 EP 99917836 A EP99917836 A EP 99917836A EP 99917836 A EP99917836 A EP 99917836A EP 1068029 A1 EP1068029 A1 EP 1068029A1
Authority
EP
European Patent Office
Prior art keywords
coating
roll
foil
coating means
meltable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99917836A
Other languages
German (de)
French (fr)
Inventor
Hans Jürgen SCHÄFER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electra Holdings Ltd
Original Assignee
Electra Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electra Holdings Ltd filed Critical Electra Holdings Ltd
Publication of EP1068029A1 publication Critical patent/EP1068029A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/083Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets being passed between the coating roller and one or more backing rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/0834Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets the coating roller co-operating with other rollers, e.g. dosing, transfer rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/28Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065After-treatment
    • B05D3/067Curing or cross-linking the coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50Multilayers
    • B05D7/52Two layers
    • B05D7/54No clear coat specified
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/06Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00Metallic substrate
    • B05D2202/40Metallic substrate based on other transition elements
    • B05D2202/45Metallic substrate based on other transition elements based on Cu
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0358Resin coated copper [RCC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Definitions

  • the resin In order to manufacture sequential multi-layers, it is necessary to press or to laminate copper foils coated with dialectical resins onto printed circuit boards.
  • the resin must have a very good flowability, in order to be able to fill, free of air-bubbles, the gaps between conductors.
  • An opposing requirement resides in the fact that the vertical spacing between the conductor levels must be constant, in order to guarantee a uniform insulation spacing.
  • the resin In order to be able to meet this requirement, the resin must have as little flowability as possible.
  • the resin should not change, under the effect of temperature and pressure, its layer thickness obtained on the copper foil.
  • the present invention seeks to provide a method, and an apparatus in which a drying and pre-hardening is not necessary after the first coating, and which thus achieves coating speeds of greater than 10 metres per minute.
  • an ultravioletly and thermally hardenable epoxy resin which may be melted on at temperatures under 100°C. At this temperature, a hardening reaction only takes place so slowly that the coating process is not impaired.
  • the copper foil is placed about a heated roll, winding around half of the roll.
  • This roll (1) should have as large a diameter as possible.
  • a diameter is advantageous which corresponds to about twice the diameter of the applicator rolls (2) and (3) .
  • the first heatable roll-type coating unit comprises the metering roll (4) and the applicator roll (2) .
  • This roll pair forms a gap, into which the melted resin is metered from a heated resin supply vessel (6) disposed above the gap .
  • a second roll-type coating unit comprising the applicator roll (3) and the metering roll (5) .
  • a second heated resin supply vessel (7) out of which a second melted, only thermally hardenable resin is supplied to the roll pair (5,3) .
  • the second coating is applied wet-on-wet to the first layer.
  • the foil (9) is drawn tangentially off the foil roll (1) at an angle of 45° and the varnish layer (8) is radiated by an - 4 - ultraviolet radiator (10) .
  • This radiation may also be further intensified by a vertical deflection of the foil (9) .
  • Cooled deflection rolls (11) , (12) & (13) are required for this purpose. Between the rolls (11) S_ (12) there is disposed an ultraviolet radiator and between the rolls (12) & (13) an infrared radiator. After cooling off to ambient temperature, the foil (9) is wound up on a winding station (14) .
  • the temperatures of the applicator rolls (2) & (3) are chosen so that there is produced, from the mean of the applicator roll temperature (2) &. (3) and the temperature of the foil roll (1) , a mean coating temperature at which the epoxy resin to be applied has a melt viscosity of approx. 5,000 to 15,000 mPa . s .
  • the ultraviolet radiation after the double coating ensures that the first varnish layer (17) is crosslinked by radiation.
  • the second varnish layer (8) is smoothed by the heating, but does not harden.
  • a defined pre-hardening of the second layer (8) is achieved by the infrared radiator (16) .
  • Electrolytic copper foil thickness 17.5 ⁇ m
  • the coating means 1 is put into the supply vessel (6) which is preheated to 60°C.
  • the applicator roll (2) and the metering roll (4) are brought to a temperature of 60°C.
  • the foil roll (1) is brought to a temperature of 70°C.
  • the costing means 2 is put into the varnish supply tank (7) which is brought to a temperature of 100°C.
  • the applicator roll (3) and the metering roll (5) are heated to 100°C.
  • the applicator roll (2) &. (3) are provided with a 3 nm thick rubber coating which is profiled.
  • the profiling amounts to 125 grooves per 25 mm.
  • the varnish film divides in the middle. 25 ⁇ m of layer thickness are applied in each coating operation.
  • the coating speed is 15 metres per minute.
  • the ultraviolet hardening of the first layer is carried out in 2 x 10 seconds.
  • the ultraviolet radiators (10) & (15) each have a length of 2,500 mm.
  • the deflection rolls (11) , (12) & (13) are cooled to 5 -6- °C.
  • the roll surface is teflon coated.
  • Applicator rolls rubber-coated, 3 mm LURA 2105, Shore A 40, by L ⁇ raflex Diameter 250 mm
  • Ultraviolet radiator 10 kW, wavelength 350 nm, length 2,500 mm (10, 15)

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

A method is described which is characterised in that copper foils are twice-coated with meltable coating means in such a way that the copper foil (19) is guided approximately half encirclingly about a heatable roll (1), and coated by means of two heatable roll-type coating units (2, 4 & 3, 5) in such a way that in a first coating operation, there is applied from the melt an ultravioletly and thermally hardenable solvent-free coating means and in a second coating operation, a solvent-free, only thermally hardenable, meltable coating means is applied over the first coating means, and in that the first binding agent layer is cross-linked by radiation by ultraviolet radiators disposed downstream. There is furthermore described an apparatus for execution of the method.

Description

METHOD AND APPARATUS FOR TWO-LAYERED COAΗNG OF COPPER FOILS WITH MELTABLE COAΗNG
In order to manufacture sequential multi-layers, it is necessary to press or to laminate copper foils coated with dialectical resins onto printed circuit boards. In this connection, the resin must have a very good flowability, in order to be able to fill, free of air-bubbles, the gaps between conductors. An opposing requirement resides in the fact that the vertical spacing between the conductor levels must be constant, in order to guarantee a uniform insulation spacing. In order to be able to meet this requirement, the resin must have as little flowability as possible. Preferably, the resin should not change, under the effect of temperature and pressure, its layer thickness obtained on the copper foil. In order to be able to meet these opposing requirements, coating methods have been described, in which solvent-containing resin was applied to the copper foil in a first coating process, the solvent was dried and the resin was pre-hardened up to the C-stage under the influence of temperature. The C-stage means, in regard to epoxy resins, that all epoxy groups are crosslinked and that no more free epoxy groups are detectable. The foil coated in this manner is then coated a second time with the same epoxy resin solution. This second layer must be capable of flowing under application of pressure and temperature. Accordingly, it is only dried and, if required, pre- hardened up to the imminent B-stage. For a dryer temperature of 160°C and a dryer length of 10 metres with a gelling time of 180 seconds at 160°C, the first coating requires a coating speed of three metres per minute .
In view of the above, the present invention seeks to provide a method, and an apparatus in which a drying and pre-hardening is not necessary after the first coating, and which thus achieves coating speeds of greater than 10 metres per minute.
A method of this kind has been described in P195 39 193.4. Here there were used powdered resins having different melting point and a first layer was applied having a high melting point as well as a second layer having a low melting point.
This method is very difficult to control in particular because of the high melting temperatures and coating temperatures, since the hardening reaction sets in and unacceptable processing times are obtained.
According to the present invention, there is provided a method for the two layered coating of copper foils with meltable coating means, characterised in that a copper foil is guided approximately half encirclingly about a heatable roll, and coated by means of two heatable roll-type coating units in such way that in a first coating operation, there is applied from the melt an ultravioletly and thermally hardenable solvent-free coating means and in a second coating operation, a solvent-free, only thermally hardenable, meltable coating means is applied over the first coating means, and in that the first binding agent layer is crosslinked by radiation by ultraviolet radiators disposed downstream.
According to a second aspect of the- present invention there is provided a method for the multi- layered coating of foils with meltable coating means, characterised in that a foil is guided approximately half encirclingly about a heatable roll and coated by means of two heatable roll-type coating units in such a way that in a first coating operation, there is applied from the melt a first solvent-free coating means which is hardenable by exposure to ultraviolet radiation and by heating and in a second coating operation, a second solvent -free, only thermally hardenable, meltable coating means is applied over the first coating means, and in that the first coating means is crosslinked by radiation by ultraviolet radiators disposed downstream. Preferably, there is used, for the first coating, an ultravioletly and thermally hardenable epoxy resin which may be melted on at temperatures under 100°C. At this temperature, a hardening reaction only takes place so slowly that the coating process is not impaired. For a better understanding of the present invention and to show how the same may be carried into effect reference will now be made, by way of example, to the accompanying drawing.
For the purpose of coating, the copper foil is placed about a heated roll, winding around half of the roll. This roll (1) should have as large a diameter as possible. A diameter is advantageous which corresponds to about twice the diameter of the applicator rolls (2) and (3) .
To the surface of this heated foil roll (1 ) there are applied roll-type coating units, one each in the horizontal axis- and in the vertical axis. The first heatable roll-type coating unit comprises the metering roll (4) and the applicator roll (2) . This roll pair forms a gap, into which the melted resin is metered from a heated resin supply vessel (6) disposed above the gap .
In the vertical axis of the foil roll (1) there is disposed a second roll-type coating unit comprising the applicator roll (3) and the metering roll (5) . Above this roll pair there is disposed a second heated resin supply vessel (7) , out of which a second melted, only thermally hardenable resin is supplied to the roll pair (5,3) . The second coating is applied wet-on-wet to the first layer. On completion of coating, the foil (9) is drawn tangentially off the foil roll (1) at an angle of 45° and the varnish layer (8) is radiated by an - 4 - ultraviolet radiator (10) .
This radiation may also be further intensified by a vertical deflection of the foil (9) . Cooled deflection rolls (11) , (12) & (13) are required for this purpose. Between the rolls (11) S_ (12) there is disposed an ultraviolet radiator and between the rolls (12) & (13) an infrared radiator. After cooling off to ambient temperature, the foil (9) is wound up on a winding station (14) . The temperatures of the applicator rolls (2) & (3) are chosen so that there is produced, from the mean of the applicator roll temperature (2) &. (3) and the temperature of the foil roll (1) , a mean coating temperature at which the epoxy resin to be applied has a melt viscosity of approx. 5,000 to 15,000 mPa . s .
The ultraviolet radiation after the double coating ensures that the first varnish layer (17) is crosslinked by radiation. The second varnish layer (8) is smoothed by the heating, but does not harden. A defined pre-hardening of the second layer (8) is achieved by the infrared radiator (16) .
The present invention is to be explained with reference to the following example:
Example:
Coating means 1
45.00 parts by weight Rϋtapox VE 4704 R by Bakelite
36.00 parts by weight Mg ( OH) 2 15.00 parts by weight cresol novolak
3.00 parts by weight 2-ethylanthraquinone, BASF
0.50 parts by weight 2-ethyl-4-methylimidazole, BASF
0.50 parts by weight helio fast green 100.00 parts by weight 100 % by weight
Coating means 2
53.00 parts by weight Rϋtapox 0400 by Bakelite
18.00 parts by weight Rύtapox 0164 by Bakelite
28.00 parts by weight cresol novolak
0.50 parts by weight 2-ethyl-4-methylimidazole
0.50 parts by weight helio fast green
100.00 parts by weight 100 % by weight
Electrolytic copper foil thickness 17.5 μm
The coating means 1 is put into the supply vessel (6) which is preheated to 60°C.
The applicator roll (2) and the metering roll (4) are brought to a temperature of 60°C.
The foil roll (1) is brought to a temperature of 70°C. The costing means 2 is put into the varnish supply tank (7) which is brought to a temperature of 100°C. The applicator roll (3) and the metering roll (5) are heated to 100°C.
The applicator roll (2) &. (3) are provided with a 3 nm thick rubber coating which is profiled. The profiling amounts to 125 grooves per 25 mm. The varnish film divides in the middle. 25 μm of layer thickness are applied in each coating operation. The coating speed is 15 metres per minute. The ultraviolet hardening of the first layer is carried out in 2 x 10 seconds. The ultraviolet radiators (10) & (15) each have a length of 2,500 mm.
The deflection rolls (11) , (12) & (13) are cooled to 5 -6- °C. The roll surface is teflon coated.
Coating plant :
Foil roll diameter 500 mm, chromium-plated (1) Metering rolls (4,5), diameter 250 mm
Applicator rolls, rubber-coated, 3 mm LURA 2105, Shore A 40, by Lύraflex Diameter 250 mm
Ultraviolet radiator, 10 kW, wavelength 350 nm, length 2,500 mm (10, 15)

Claims

1. A method for the two layered coating of copper foils with meltable coating means, characterised in that a copper foil (19) is guided approximately half encirclingly about a heatable roll (1) , and coated by means of two heatable roll-type coating units (2,4) & (3,5) in such way that in a first coating operation, there is applied from the melt an ultravioletly and thermally hardenable solvent-free coating means and in a second coating operation, a solvent-free, only thermally hardenable, meltable coating means is applied over the first coating means, and in that the first binding agent layer is crosslinked by radiation by ultraviolet radiators disposed downstream.
2. A method as claimed in Claim 1, characterised in that the mean value of the temperatures of the applicator rolls (2 & 3) and of the foil roll (1) produces a temperature at which the coating means reaches a viscosity of 5,000 "to 15 , 000- mPa. s .
3. An apparatus for execution of the method according to Claim 1, characterised in that on a heated roll having a preferred diameter of 200 to 600 mm, two roll-type coating units comprising heatable applicator rolls (2) (3) having a preferred diameter of 100 to 300 mm are disposed in such a way that the first applicator roll (2) touches the foil (19) in the horizontal axis of the foil roll (1 ) and the second applicator roll (3) does so in the vertical axis.
4. An apparatus as claimed in Claim 3 , characterised in that the diameter of the foil roll (1) is approximately twice as large as the diameter of the applicator rolls (2 & 3) .
5. An apparatus as claimed in Claim 3 , characterised in that ultraviolet radiators (10,15) are disposed after the roll-type coating unit (3,5).
6. A method for the multi-layered coating of foils with meltable coating means, characterised in that a foil is guided approximately half encirclingly about a heatable roll and coated by means of two heatable roll-type coating units in such a way that in a first coating operation, there is applied from the melt a first solvent-free coating means which is hardenable by exposure -to ultraviolet radiation and by heating and in a second coating operation, a second solvent-free, only thermally hardenable, meltable coating means is applied over the first coating means, and in that the first coating means is crosslinked by radiation by ultraviolet radiators disposed downstream.
EP99917836A 1998-03-23 1999-03-22 Method and apparatus for two layered coating of copper foils with meltable coating Withdrawn EP1068029A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19812471 1998-03-23
DE1998112471 DE19812471A1 (en) 1998-03-23 1998-03-23 Method and device for the two-layer coating of copper foils with meltable coating agents
PCT/EP1999/001936 WO1999048619A1 (en) 1998-03-23 1999-03-22 Method and apparatus for two-layered coating of copper foils with meltable coating

Publications (1)

Publication Number Publication Date
EP1068029A1 true EP1068029A1 (en) 2001-01-17

Family

ID=7861816

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99917836A Withdrawn EP1068029A1 (en) 1998-03-23 1999-03-22 Method and apparatus for two layered coating of copper foils with meltable coating

Country Status (5)

Country Link
EP (1) EP1068029A1 (en)
CN (1) CN1297384A (en)
AU (1) AU3597799A (en)
DE (1) DE19812471A1 (en)
WO (1) WO1999048619A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1317555B1 (en) * 2000-05-23 2003-07-09 Pulverit S P A PROCEDURE AND PLANT FOR THE APPLICATION OF A SOLID, PHOTOLYMERIZABLE PAINT ON FLAT SURFACES OF MANUFACTURED AND MANUFACTURED PRODUCTS
JP5727773B2 (en) * 2010-12-08 2015-06-03 芝浦メカトロニクス株式会社 Adhesive supply device and adhesive supply method
ITMI20121242A1 (en) * 2012-07-17 2014-01-18 C M R Machineries S R L APPARATUS FOR THE COATING OF STICKERS ON CONTINUOUS FILMS.
CN103990581B (en) * 2014-05-27 2016-07-06 北京垠海工程技术研究有限责任公司 Coating machine
CN105499060A (en) * 2016-01-08 2016-04-20 北京东方雨虹防水技术股份有限公司 Waterproof coating production device
CN106098274A (en) * 2016-06-20 2016-11-09 河南省亚安绝缘材料厂有限公司 A kind of Moistureproof insulation material and production method thereof
JP6825440B2 (en) * 2016-06-29 2021-02-03 トヨタ自動車株式会社 Electrode manufacturing method and electrode manufacturing equipment
CN107626539B (en) * 2016-07-19 2023-05-02 扬州万润光电科技股份有限公司 Coating film drying and self-cutting device
CN106733415A (en) * 2017-01-23 2017-05-31 合肥国轩高科动力能源有限公司 Lithium battery pole piece coating machine
CN106581776A (en) * 2017-01-26 2017-04-26 福州大学 Directional microporous collagen/chitosan/silk fibroin composite scaffold and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07119092A (en) * 1993-08-18 1995-05-09 Sugiyama Kinji Double-coating treatment of sheet paper
DE19539193A1 (en) * 1995-10-20 1997-04-24 Schaefer Hans Juergen Making epoxy] resin coated films for via sheets for multi layer switches for IC s
JP3876292B2 (en) * 1997-08-06 2007-01-31 ケイディケイ株式会社 Manufacturing method of information communication body

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9948619A1 *

Also Published As

Publication number Publication date
AU3597799A (en) 1999-10-18
DE19812471A1 (en) 1999-09-30
WO1999048619A1 (en) 1999-09-30
CN1297384A (en) 2001-05-30

Similar Documents

Publication Publication Date Title
CA2354753C (en) Formation of an embedded capacitor plane using a thin dielectric
CN101678609B (en) Method for manufacturing laminated board, and laminated board
WO1999048619A1 (en) Method and apparatus for two-layered coating of copper foils with meltable coating
JPS6055541B2 (en) Method for manufacturing epoxy prepreg containing a large amount of resin
RU96117242A (en) METHOD FOR MANUFACTURING A LAYERED STRUCTURE AND SUBSTRATE FOR PCB BASES ON ITS BASIS
JPH08510164A (en) Method and apparatus for coating conductor plate
WO2003096775A2 (en) Thermal dissipating printed circuit board and methods
JP3548691B2 (en) Liquid thermosetting filling composition and method for filling permanent holes in printed wiring boards using the same
DE102006016400A1 (en) Base material for making printed circuit boards, produced by pressing layers of glass fabric vacuum-impregnated with solvent-free epoxy resin, has defined properties
US5804256A (en) Method and device for coating printed-circuit boards
US20040091622A1 (en) Coated prepreg method and use
US5976699A (en) Insulating adhesive for multilayer printed circuit board
JP3320432B2 (en) Method for manufacturing multilayer wiring board
US5789279A (en) Method and apparatus for electrically insulating heat sinks in electronic power devices
JP2000104033A (en) Inter layer insulation adhesive for multi-layer printed wiring board and preparation of multi-layer printed- wiring board
JP3084351B2 (en) Interlayer insulating adhesive for multilayer printed wiring boards
JP3046201B2 (en) Method for manufacturing multilayer printed wiring board
WO1995018000A1 (en) Process and apparatus for resin impregnation of a porous web
JPH07336054A (en) Interlayer insulating resin material for multilayer board printed circuit board and manufacture of the same board
JPH11186725A (en) Manufacturing multilayered printed wiring board
JPH07216111A (en) Preparation of prepreg
TWI358356B (en)
JP2911778B2 (en) Manufacturing method of multilayer printed wiring board
JPH02134239A (en) Manufacture of substrate for flexible printed circuit
GB2161325A (en) Method for making wire scribed circuit boards

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20001016

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

17Q First examination report despatched

Effective date: 20010911

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20031223