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DK0613608T3 - - Google Patents

Info

Publication number
DK0613608T3
DK0613608T3 DK93921699.0T DK93921699T DK0613608T3 DK 0613608 T3 DK0613608 T3 DK 0613608T3 DK 93921699 T DK93921699 T DK 93921699T DK 0613608 T3 DK0613608 T3 DK 0613608T3
Authority
DK
Denmark
Application number
DK93921699.0T
Other languages
Danish (da)
Inventor
Robert D Washburn
Robert F Mcclanahan
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DK0613608T3 publication Critical patent/DK0613608T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DK93921699.0T 1992-09-24 1993-09-21 DK0613608T3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/951,504 US5396397A (en) 1992-09-24 1992-09-24 Field control and stability enhancement in multi-layer, 3-dimensional structures

Publications (1)

Publication Number Publication Date
DK0613608T3 true DK0613608T3 (fr) 1997-05-05

Family

ID=25491760

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93921699.0T DK0613608T3 (fr) 1992-09-24 1993-09-21

Country Status (10)

Country Link
US (1) US5396397A (fr)
EP (1) EP0613608B1 (fr)
JP (1) JPH07501909A (fr)
CA (1) CA2125994C (fr)
DE (1) DE69309652T2 (fr)
DK (1) DK0613608T3 (fr)
ES (1) ES2101345T3 (fr)
GR (1) GR3023705T3 (fr)
MX (1) MX9305884A (fr)
WO (1) WO1994007347A1 (fr)

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US5780375A (en) * 1993-10-19 1998-07-14 E. I. Du Pont De Nemours And Company Thick film composition for modifying the electrical properties of a dielectric layer
US5590017A (en) * 1995-04-03 1996-12-31 Aluminum Company Of America Alumina multilayer wiring substrate provided with high dielectric material layer
US5886597A (en) * 1997-03-28 1999-03-23 Virginia Tech Intellectual Properties, Inc. Circuit structure including RF/wideband resonant vias
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US5929729A (en) 1997-10-24 1999-07-27 Com Dev Limited Printed lumped element stripline circuit ground-signal-ground structure
JP2000124612A (ja) * 1998-01-19 2000-04-28 Toshiba Corp 配線基板とその製造方法、その配線基板を具える電気機器
JP3119630B2 (ja) * 1998-09-18 2000-12-25 日本電気株式会社 半導体チップモジュール用多層回路基板およびその製造方法
KR20000034924A (ko) * 1998-11-17 2000-06-26 제닌 엠. 데이비스 저온 동시소성 다층세라믹내 수동 전자소자들
US6288906B1 (en) * 1998-12-18 2001-09-11 Intel Corporation Multiple layer printed circuit board having power planes on outer layers
EP1149476A1 (fr) * 1999-02-03 2001-10-31 Siemens Aktiengesellschaft Element coupleur d'antenne integre
US6205032B1 (en) * 1999-03-16 2001-03-20 Cts Corporation Low temperature co-fired ceramic with improved registration
US6429383B1 (en) * 1999-04-14 2002-08-06 Intel Corporation Apparatus and method for improving circuit board solder
US6492600B1 (en) * 1999-06-28 2002-12-10 International Business Machines Corporation Laminate having plated microvia interconnects and method for forming the same
US6395996B1 (en) * 2000-05-16 2002-05-28 Silicon Integrated Systems Corporation Multi-layered substrate with a built-in capacitor design
JP2002111222A (ja) * 2000-10-02 2002-04-12 Matsushita Electric Ind Co Ltd 多層基板
DE10063437A1 (de) * 2000-12-20 2002-07-11 Bosch Gmbh Robert Antennenanordnung
JP3781178B2 (ja) * 2001-03-30 2006-05-31 ユーディナデバイス株式会社 高周波半導体装置の多層配線構造
JP3586435B2 (ja) * 2001-03-30 2004-11-10 ユーディナデバイス株式会社 高周波半導体装置
JP3818864B2 (ja) * 2001-03-30 2006-09-06 ユーディナデバイス株式会社 高周波半導体装置
US6900992B2 (en) * 2001-09-18 2005-05-31 Intel Corporation Printed circuit board routing and power delivery for high frequency integrated circuits
US6963493B2 (en) * 2001-11-08 2005-11-08 Avx Corporation Multilayer electronic devices with via components
JP3792635B2 (ja) * 2001-12-14 2006-07-05 富士通株式会社 電子装置
JP2003204209A (ja) * 2002-01-07 2003-07-18 Kyocera Corp 高周波用配線基板
US6711029B2 (en) * 2002-05-21 2004-03-23 Cts Corporation Low temperature co-fired ceramic with improved shrinkage control
US7349225B1 (en) * 2002-10-22 2008-03-25 Odyssian Technology, Llc Multifunctional composite sandwich element with embedded electronics
US7265300B2 (en) 2003-03-21 2007-09-04 Commscope Solutions Properties, Llc Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
US8569142B2 (en) * 2003-11-28 2013-10-29 Blackberry Limited Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
US7342181B2 (en) * 2004-03-12 2008-03-11 Commscope Inc. Of North Carolina Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
US6908809B1 (en) * 2004-04-02 2005-06-21 Harris Corporation Embedded capacitors using conductor filled vias
US7980900B2 (en) * 2004-05-14 2011-07-19 Commscope, Inc. Of North Carolina Next high frequency improvement by using frequency dependent effective capacitance
US7190594B2 (en) * 2004-05-14 2007-03-13 Commscope Solutions Properties, Llc Next high frequency improvement by using frequency dependent effective capacitance
US7067026B2 (en) * 2004-11-22 2006-06-27 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US7175724B2 (en) * 2004-11-22 2007-02-13 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US20060213686A1 (en) * 2004-12-28 2006-09-28 Shin-Hsien Wu Cut Via Structure For And Manufacturing Method Of Connecting Separate Conductors
WO2006093830A2 (fr) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Conditionneurs a superposition interne
JP4907281B2 (ja) * 2006-09-26 2012-03-28 日東電工株式会社 フレキシブル配線回路基板
US7742276B2 (en) * 2007-03-30 2010-06-22 Industrial Technology Research Institute Wiring structure of laminated capacitors
CN101772994B (zh) * 2007-07-26 2011-07-20 株式会社村田制作所 多层陶瓷基板及其制造方法
US8047879B2 (en) * 2009-01-26 2011-11-01 Commscope, Inc. Of North Carolina Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor
KR101038234B1 (ko) * 2009-02-24 2011-06-01 삼성전기주식회사 전자기 밴드갭 구조를 이용한 ｅｍｉ 노이즈 저감 기판
DE112011100633T5 (de) * 2010-03-31 2013-06-20 Murata Manufacturing Co., Ltd. Mehrschichtkeramiksubstrat und Verfahren zum Herstellen desselben
US20130052433A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom
TW201817280A (zh) 2016-07-06 2018-05-01 亮銳公司 用於整合式發光二極體驅動器之印刷電路板
CN206451500U (zh) * 2017-02-06 2017-08-29 京东方科技集团股份有限公司 显示装置控制单元和显示装置
CN115483033A (zh) * 2022-09-02 2022-12-16 深圳聚源新材科技有限公司 电容器、电路板及电路板埋容工艺

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Also Published As

Publication number Publication date
DE69309652T2 (de) 1997-10-30
EP0613608B1 (fr) 1997-04-09
CA2125994A1 (fr) 1994-03-31
US5396397A (en) 1995-03-07
CA2125994C (fr) 1997-08-12
EP0613608A1 (fr) 1994-09-07
WO1994007347A1 (fr) 1994-03-31
DE69309652D1 (de) 1997-05-15
MX9305884A (es) 1994-05-31
GR3023705T3 (en) 1997-09-30
ES2101345T3 (es) 1997-07-01
JPH07501909A (ja) 1995-02-23

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