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DE60335074D1 - Kondensator und Verfahren zu dessen Herstellung, und Leiterplatte mit einem eingebauten Kondensator und Verfahren zu deren Herstellung - Google Patents

Kondensator und Verfahren zu dessen Herstellung, und Leiterplatte mit einem eingebauten Kondensator und Verfahren zu deren Herstellung

Info

Publication number
DE60335074D1
DE60335074D1 DE60335074T DE60335074T DE60335074D1 DE 60335074 D1 DE60335074 D1 DE 60335074D1 DE 60335074 T DE60335074 T DE 60335074T DE 60335074 T DE60335074 T DE 60335074T DE 60335074 D1 DE60335074 D1 DE 60335074D1
Authority
DE
Germany
Prior art keywords
capacitor
built
manufacture
making
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60335074T
Other languages
English (en)
Inventor
Koichi Hirano
Tsunenori Yoshida
Hiroyuki Handa
Yoshihisa Yamashita
Seiichi Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60335074D1 publication Critical patent/DE60335074D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/26—Folded capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE60335074T 2002-12-27 2003-11-27 Kondensator und Verfahren zu dessen Herstellung, und Leiterplatte mit einem eingebauten Kondensator und Verfahren zu deren Herstellung Expired - Lifetime DE60335074D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002379231 2002-12-27

Publications (1)

Publication Number Publication Date
DE60335074D1 true DE60335074D1 (de) 2011-01-05

Family

ID=32463619

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60335074T Expired - Lifetime DE60335074D1 (de) 2002-12-27 2003-11-27 Kondensator und Verfahren zu dessen Herstellung, und Leiterplatte mit einem eingebauten Kondensator und Verfahren zu deren Herstellung

Country Status (4)

Country Link
US (2) US7126811B2 (de)
EP (1) EP1434242B1 (de)
CN (1) CN100431074C (de)
DE (1) DE60335074D1 (de)

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US20090279230A1 (en) * 2008-05-08 2009-11-12 Renewable Energy Development, Inc. Electrode structure for the manufacture of an electric double layer capacitor
US8411413B2 (en) 2008-08-28 2013-04-02 Ioxus, Inc. High voltage EDLC cell and method for the manufacture thereof
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JP5289123B2 (ja) * 2009-03-23 2013-09-11 三洋電機株式会社 固体電解コンデンサ及びその製造方法
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US20100266878A1 (en) * 2009-04-16 2010-10-21 Ioxus, Inc. Prismatic polymer case for electrochemical devices
JP5644096B2 (ja) * 2009-11-30 2014-12-24 ソニー株式会社 接合基板の製造方法及び固体撮像装置の製造方法
CN102906834B (zh) * 2010-04-02 2016-03-16 英特尔公司 电荷存储设备、其制备方法、其导电结构的制备方法、使用其的移动电子设备以及包含其的微电子设备
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US9013893B2 (en) 2010-12-29 2015-04-21 Industrial Technology Research Institute Embedded capacitor module
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JP6186584B2 (ja) * 2011-11-25 2017-08-30 パナソニックＩｐマネジメント株式会社 固体電解コンデンサ及びその製造方法
TWI483352B (zh) 2012-03-12 2015-05-01 Ind Tech Res Inst 固態電解電容基板模組及包括該固態電解電容基板模組的電路板
US9025313B2 (en) 2012-08-13 2015-05-05 Intel Corporation Energy storage devices with at least one porous polycrystalline substrate
TWI443698B (zh) * 2012-09-13 2014-07-01 Ind Tech Res Inst 去耦合元件及其製造方法
US9386701B2 (en) * 2012-11-30 2016-07-05 Samsung Electro-Mechanics Co., Ltd. Electronic component embedded printed circuit board
US9412518B2 (en) * 2013-12-18 2016-08-09 Caterpillar Inc. Method and apparatus for mounting a large capacitor
TW202312190A (zh) * 2014-11-17 2023-03-16 日商迪睿合股份有限公司 異向性導電膜及連接構造體
US9928963B2 (en) * 2015-03-13 2018-03-27 Avx Corporation Thermally conductive encapsulant material for a capacitor assembly
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JP2018073900A (ja) * 2016-10-26 2018-05-10 株式会社村田製作所 積層セラミックコンデンサ
US10504657B2 (en) * 2016-11-15 2019-12-10 Avx Corporation Lead wire configuration for a solid electrolytic capacitor
JP6724881B2 (ja) * 2017-10-20 2020-07-15 株式会社村田製作所 固体電解コンデンサの製造方法、及び、固体電解コンデンサ
US11085674B1 (en) * 2018-08-06 2021-08-10 U.S.A, as represented by the Administrator of the National Aeronautics and Space Administration Electrocaloric-based cooling system
CN109347450A (zh) * 2018-09-13 2019-02-15 安徽华东光电技术研究所有限公司 一种亚太赫兹波段20瓦脉冲功率放大器的加工方法
CN111383844B (zh) 2018-12-26 2022-04-08 株式会社村田制作所 电解电容器
CN113678217B (zh) 2019-05-17 2023-06-23 京瓷Avx元器件公司 抗分层固体电解电容器
JP7279538B2 (ja) * 2019-06-19 2023-05-23 富士フイルムビジネスイノベーション株式会社 発光装置
DE112020004430T5 (de) 2019-09-18 2022-05-25 KYOCERA AVX Components Corporation Festelektrolytkondensator, der eine Sperrbeschichtung enthält
WO2021066091A1 (ja) * 2019-10-04 2021-04-08 株式会社村田製作所 電解コンデンサ及び電解コンデンサの製造方法
CN115485800A (zh) * 2020-05-15 2022-12-16 松下知识产权经营株式会社 固体电解电容器元件和固体电解电容器
US11923148B2 (en) * 2022-04-18 2024-03-05 Capxon Electronic Technology Co., Ltd. Substrate-type multi-layer polymer capacitor (MLPC) having electroplated terminal structure

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Also Published As

Publication number Publication date
US20040125543A1 (en) 2004-07-01
US20070022590A1 (en) 2007-02-01
EP1434242B1 (de) 2010-11-24
CN1512525A (zh) 2004-07-14
US7247178B2 (en) 2007-07-24
EP1434242A3 (de) 2008-04-30
CN100431074C (zh) 2008-11-05
EP1434242A2 (de) 2004-06-30
US7126811B2 (en) 2006-10-24

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