CN220776261U - Electronic equipment - Google Patents

Abstract

The present application discloses an electronic device, belonging to the field of electronic devices. The electronic device includes a circuit board and a battery, the circuit board includes a first sub-section, a second sub-section and a third sub-section connected in sequence, the first sub-section, the second sub-section and the third sub-section together form an installation opening, the first sub-section includes a first circuit, the third sub-section includes a second circuit, and the second sub-section includes a connection circuit electrically connecting the first circuit and the second circuit; at least part of the battery is arranged in the installation opening.

Description

Electronic equipment

Technical Field

The present application belongs to the field of electronic equipment, and specifically relates to an electronic equipment.

Background technique

In order to facilitate the access to more functional modules in electronic devices, it is necessary to set a control main board and a control sub-board at both ends of the battery. The control main board and the control sub-board are electrically connected through FPC (Flexible Printed Circuit), and the FPC and the control main board are connected through BTB (Board to Board) to form a three-section structure of control main board-FPC-control sub-board. When preparing this three-section structure, it is necessary to perform chip processing of electronic components on the control main board and the control sub-board respectively, and then assemble the control main board, FPC and control sub-board, which makes the assembly steps of the electronic equipment cumbersome, and the assembly efficiency and process cost are also high.

Utility Model Content

The purpose of the embodiments of the present application is to provide an electronic device that can solve the technical problems of complicated assembly steps and low efficiency of electronic devices in related technologies.

In order to solve the above technical problems, this application is implemented as follows:

In a first aspect, an embodiment of the present application provides an electronic device, including:

The circuit board comprises a first sub-section, a second sub-section and a third sub-section connected in sequence, wherein the first sub-section, the second sub-section and the third sub-section enclose a mounting opening, the first sub-section comprises a first circuit, the third sub-section comprises a second circuit, and the second sub-section comprises a connecting circuit electrically connecting the first circuit and the second circuit;

A battery, at least a portion of which is disposed in the mounting opening.

In the embodiments provided in the present application, the battery is arranged in the installation opening to eliminate the thickness of the battery compartment itself that is additionally arranged to accommodate the battery in the related art, thereby achieving thinning of the entire device; the first division, the second division, and the third division are arranged in the circuit board to replace the control main board, the flexible circuit board, and the control sub-board in the related art, thereby eliminating the BTB electrical connector for connecting the control main board and the control sub-board, increasing the wiring space in the circuit board, eliminating the assembly steps of the control main board, the flexible circuit board, and the control sub-board, simplifying the assembly steps of the electronic device, and improving the assembly efficiency of the electronic device; the first division, the third division, and the second division can be prepared together, thereby improving the preparation efficiency of the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a partial plan view of the structure of an electronic device provided by an embodiment of the present application;

FIG2 is a schematic diagram of a cross-sectional structure of a circuit board provided in one embodiment of the present application;

FIG3 is a schematic diagram of a cross-sectional structure of an electronic device provided by an embodiment of the present application;

FIG4 is a schematic cross-sectional structure diagram of a first subsection provided by an embodiment of the present application;

FIG5 is a second schematic cross-sectional structural diagram of an electronic device provided by an embodiment of the present application;

FIG. 6 is a third schematic diagram of the cross-sectional structure of an electronic device provided in one embodiment of the present application.

Description of reference numerals:

1. Circuit board; 11. First subdivision; 111. First circuit; 112. First surface; 12. Second subdivision; 121. Connection circuit; 13. Third subdivision; 131. Second circuit; 14. Mounting opening; 15. Power protection circuit; 151. Power connection electrode; 1511. First conductive layer; 1512. Second conductive layer; 1513. Third conductive layer;

2. Battery; 3. Power terminal; 4. Heat sink.

Detailed ways

The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and/or" in the specification and claims represents at least one of the connected objects, and the character "/" generally indicates that the objects associated with each other are in an "or" relationship.

The electronic device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

As shown in Figures 1, 2 and 3, an embodiment of the present application provides an electronic device, which includes a circuit board 1 and a battery 2. The circuit board 1 includes a first division 11, a second division 12 and a third division 13 connected in sequence, the first division 11, the second division 12 and the third division 13 together form an installation opening 14, the first division 11 includes a first circuit 111, the third division 13 includes a second circuit 131, and the second division 12 includes a connecting circuit 121 electrically connecting the first circuit 111 and the second circuit 131. At least a portion of the battery 2 is arranged in the installation opening 14.

The electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted device, a mobile Internet device (MID), an augmented reality (AR)/virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited. The following description takes the electronic device as a mobile phone as an example.

The circuit board 1 may include one or more dielectric layers and one or more conductive layers, wherein the dielectric layers are arranged between adjacent conductive layers, and different conductive layers may be connected by vias penetrating the dielectric layers. One or more patterned conductive layers form the desired circuit. The first subdivision 11, the second subdivision 12, and the third subdivision 13 may each include one or more dielectric layers and one or more conductive layers, and the dielectric layers of the same layer in the first subdivision 11, the second subdivision 12, and the third subdivision 13 may be prepared together, and the conductive layers of the same layer may be prepared together. When preparing the circuit board 1, a conductive material is formed on the provided dielectric layer, and the conductive material is patterned to obtain a conductive layer having a desired pattern, and then another dielectric layer is formed on the conductive layer, and another conductive material is formed on the other dielectric layer, and the other conductive material is patterned to obtain another conductive layer having a desired pattern, and so on, until the first subdivision 11, the second subdivision 12, and the third subdivision 13 of the desired thickness and shape are formed. The patterned conductive layer can form circuit structures such as conductive lines, capacitors, and electrodes, so that the patterned conductive layer can form the first circuit 111, the second circuit 131, and the connecting circuit 121. The mounting opening 14 can be a blind hole formed by a depression on the surface of the circuit board 1 or a through hole penetrating the circuit board 1. The mounting opening 14 can be prepared by etching, mechanical opening, etc. in the area corresponding to the second section 12 after the dielectric layer and the conductive layer have been prepared.

The first circuit 111, the second circuit 131 and the connection circuit 121 may also include electronic components disposed on the dielectric layer, and the electronic components may be disposed on the dielectric layer by patch technology. The electronic components connected to the first subsection 11, the second subsection 12 and the third subsection 13 may be patched together on the dielectric layer, thereby improving the manufacturing efficiency of the circuit board 1.

The first circuit 111 may be a main control circuit in an electronic device, and is used to control the working state of the main functional modules of the electronic device. The equivalent circuit of the first circuit 111 may refer to the equivalent circuit design of the control main board in the relevant technology. The second circuit 131 may be a secondary control circuit in an electronic device, and the equivalent circuit of the second circuit 131 may refer to the equivalent circuit design of the control sub-board in the relevant technology. The connecting circuit 121 is used to electrically connect the first circuit 111 and the second circuit 131, and the equivalent circuit of the connecting circuit 121 may refer to the equivalent circuit design of the FPC connecting the control main board and the control sub-board in the relevant technology.

The battery 2 may be a square battery 2, and the battery 2 is roughly a rectangular parallelepiped. The battery 2 may be placed in the mounting opening 14 along its thickness direction, and the circuit board 1 is arranged at least around the short axis side of the battery 2. The battery 2 may be completely accommodated in the mounting opening 14, or may partially protrude from the mounting opening 14.

In the embodiment provided in the present application, the battery 2 is arranged in the installation opening 14, so as to eliminate the thickness of the battery 2 compartment itself which is additionally arranged in the related art to accommodate the battery 2, thereby achieving the thinning of the whole device; by arranging the first division 11, the second division 12 and the third division 13 in the circuit board 1, the control main board, the flexible circuit board and the control sub-board in the related art are replaced, the BTB electrical connector for connecting the control main board and the control sub-board is eliminated, the wiring space of the circuit structure in the circuit board 1 is increased, the assembly steps of the control main board, the flexible circuit board and the control sub-board are eliminated, the assembly steps of the electronic device are simplified, and the assembly efficiency of the electronic device is improved; the first division 11, the second division 12 and the third division 13 can be prepared together, thereby improving the preparation efficiency of the electronic device.

In some embodiments, the circuit board 1 further includes a power protection circuit 15 , and the electronic device further includes a power terminal 3 , and the power terminal 3 electrically connects the power protection circuit 15 and the battery 2 .

The power protection circuit 15 is used to protect the battery 2 from over-discharge, over-charge, over-current, etc. The equivalent circuit of the power protection circuit 15 can refer to the equivalent circuit design of the power protection board in the relevant technology. The power terminal 3 electrically connects the power protection circuit 15 and the battery 2. The power protection circuit 15 can be set in any one or more of the first subsection 11, the second subsection 12 and the third subsection 13 as needed. When assembling the electronic device, the battery 2 is placed in the mounting opening 14 of the prepared circuit board 1, and the power protection circuit 15 and the battery 2 are electrically connected through the power terminal 3, so that the assembly of the battery 2 and the circuit board 1 can be completed. The power protection circuit 15 and the battery 2 are electrically connected through the power terminal 3, thereby simplifying the electrical conduction path between the power protection circuit 15 and the battery 2, which is conducive to the power protection circuit 15 to control the battery 2.

In some embodiments, the power protection circuit 15 includes a power connection electrode 151 , which is exposed from the mounting opening 14 , and the power connection terminal 3 is abutted between the battery 2 and the connection electrode sheet.

The power electrode 151 is exposed from the installation opening 14, so that at least part of the power terminal 3 is placed in the installation opening 14, so that the power electrode 151 and the battery 2 can be electrically connected through the power terminal 3. The circuit board 1 can reduce or avoid external force damage to the power electrode 151 and the power terminal 3 to a certain extent.

The power terminal 3 may include a spring sheet with elastic recovery capability. After the battery 2 is placed in the installation opening 14, a portion of the power terminal 3 is deformed to abut between the battery 2 and the electrode sheet, thereby improving the stability of the electrical connection between the battery 2 and the power electrode 151.

In some embodiments, the power protection circuit 15 is disposed in the first subsection 11 .

The first circuit 111 and the power protection circuit 15 are arranged in the first sub-portion 11 , so as to facilitate the wiring design and preparation of the first sub-portion 11 and the power protection circuit 15 .

Exemplarily, the battery 2 is in a rectangular shape, and the battery 2 includes two long-axis side surfaces and two short-axis side surfaces. The first subdivision 11 and the third subdivision 13 can be disposed on opposite sides of the battery 2. The first subdivision 11 and the third subdivision 13 are disposed opposite to the short-axis side surfaces, respectively, and the second subdivision 114 is disposed opposite to the long-axis side surface of the battery 2. The first subdivision 11, the third subdivision 13, and the second subdivision 114 are disposed around the circumference of the battery 2.

The first circuit 111 and the power protection circuit 15 can be arranged alternately in the first subsection 11. In other embodiments, the power protection circuit 15 is arranged between the first circuit 111 and the battery 2, so as to facilitate the layout of the power connection electrode 151 close to the battery 2.

Please refer to FIG. 3 and FIG. 4 . In some embodiments, the power protection circuit 15 includes a power electrode 151 . The power terminal 3 connects the power electrode 151 and the battery 2 . The first section 11 includes a first surface 112 defining the mounting opening 14 . The power electrode 151 is embedded in the first surface 112 .

When the first section 11 is spaced apart from the short-axis side surface of the battery 2 , the first surface 112 is spaced apart from the short-axis side surface of the battery 2 , the power connection electrode 151 is embedded in the first surface 112 , the power connection terminal 3 is disposed between the first surface 112 and the short-axis side surface of the battery 2 , and the power connection terminal 3 electrically connects the power connection electrode 151 and the battery 2 .

In some embodiments, the first section 11 has a recessed portion that is recessed from the first surface 112 in a direction away from the battery 2, and at least a portion of the power electrode 151 is filled in the recessed portion. The power electrode 151 includes a first conductive layer 1511, a second conductive layer 1512, and a third conductive layer 1513 that are stacked in sequence from the first section 11 to the battery 2.

A semicircular hole or a slotted hole can be set as a concave portion on the first sub-portion 11 by mechanical drilling, and the aperture size of the concave portion can be 1 mm, 2 mm, 3 mm, etc. The first conductive layer 1511 is electroplated on the concave portion, and then the second conductive layer 1512 and the third conductive layer 1513 are sequentially deposited. The first conductive layer 1511 can be a copper layer, the second conductive layer 1512 can be a nickel layer, and the third conductive layer 1513 can be a gold layer.

The surface of the power electrode 151 close to the battery 2 may be coplanar with the first surface 112 , or may be protruding or recessed compared to the first surface 112 .

Please refer to FIG. 5 , in some embodiments, the second section 114 supports the battery 2 .

The mounting opening 14 may be a blind hole, and the second sub-portion 114 may cover one side of the battery 2 to support the battery 2. The second sub-portion 114 supporting the battery 2 may support the battery 2 along the thickness direction of the battery 2. Those skilled in the art may set the depth of the mounting opening 14 according to the thickness of the battery 2 so that the battery 2 can be completely accommodated in the mounting opening 14.

The mounting opening 14 may be a through hole, the second division 114 may include a side wall and a support wall, the opposite ends of the side wall connect the first division 11 and the third division 13, the support wall may extend from the side wall toward the central axis direction close to the mounting opening 14, the side wall and the support wall may form a step structure, and the support wall may support the battery 2 along the thickness direction of the battery 2.

Referring to FIG6 , in some embodiments, the mounting opening 14 is a through hole, and the electronic device further comprises a heat sink 4, which is connected to the circuit board 1 and covers one end of the mounting opening 14. The heat sink 4 can effectively conduct away the heat emitted by the circuit board 1 and the battery 2.

In addition to the mounting opening 14, other openings may be provided on the circuit board 1 to accommodate other functional modules in addition to the battery 2, such as heat pipes, heat spreaders, etc. The other openings may be spaced apart from the mounting opening 14, or may be connected to the mounting opening 14.

Please refer to FIG. 5 . In some embodiments, the power terminal 3 is disposed outside the mounting opening 14 , and the battery 2 and the power terminal 3 are electrically connected via a flexible printed circuit board.

The power terminal 3 may be a BTB connector provided on the circuit board 1, and the battery 2 may be electrically connected to the power terminal 3 through a flexible circuit board. A relief step may be provided on the circuit board 1 to communicate with the mounting opening 14, and the power terminal 3 may be provided on the relief step, thereby reducing the thickness of the overall structure of the circuit board 1 and the power terminal 3 along the opening direction of the mounting opening 14.

The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims (10)

1. An electronic device, comprising:

the circuit board comprises a first part, a second part and a third part which are sequentially connected, wherein an installation opening is formed by surrounding the first part, the second part and the third part, the first part comprises a first circuit, the third part comprises a second circuit, and the second part comprises a connecting circuit electrically connecting the first circuit and the second circuit;

and a battery, at least a portion of which is disposed within the mounting opening.

2. The electronic device of claim 1, wherein the circuit board further comprises a power protection circuit, the electronic device further comprising an electrical terminal electrically connecting the power protection circuit with the battery.

3. The electronic device of claim 2, wherein the power protection circuit includes a power-on electrode exposed to the mounting opening, the power-on terminal abutting between the power-on electrode and the battery.

4. The electronic device of claim 2, wherein the power protection circuit is disposed at the first section.

5. The electronic device of claim 4, wherein the power protection circuit is disposed between the first circuit and the battery.

6. The electronic device of claim 4, wherein the power protection circuit includes a power-on electrode, the power-on terminal connecting the power-on electrode and the battery, the first subsection including a first surface defining the mounting opening, the power-on electrode being embedded in the first surface.

7. The electronic device of claim 6, wherein the first subsection has a recess recessed from the first surface in a direction away from the battery, at least a portion of the powered electrode is filled in the recess, and the powered electrode includes a first conductive layer, a second conductive layer, and a third conductive layer stacked in sequence in a direction from the first subsection to the battery.

8. The electronic device of claim 2, wherein the electrical terminals are disposed outside of the mounting opening, the battery and the electrical terminals being electrically connected by a flexible circuit board.

9. The electronic device of claim 1, wherein the second section supports the battery.

10. The electronic device of claim 1, wherein the mounting opening is a through hole, and further comprising a heat sink coupled to the circuit board and covering one end of the mounting opening.