CN211959661U - Flexible circuit board structure and electronic device - Google Patents
Flexible circuit board structure and electronic device Download PDFInfo
- Publication number
- CN211959661U CN211959661U CN202021008915.4U CN202021008915U CN211959661U CN 211959661 U CN211959661 U CN 211959661U CN 202021008915 U CN202021008915 U CN 202021008915U CN 211959661 U CN211959661 U CN 211959661U
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- Prior art keywords
- circuit board
- flexible circuit
- flexible
- section
- board structure
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- 229920006267 polyester film Polymers 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 5
- 230000003466 anti-cipated effect Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004033 plastic Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A flexible circuit board structure and an electronic device are provided. The flexible circuit board structure comprises a flexible circuit board and a flexible film layer; one surface of the flexible circuit board is provided with at least one first section and at least two second sections, and the first section is connected between the two second sections; the flexible film layer is arranged on the surface of the flexible circuit board, covers the two second sections and exposes the first section, so that the thickness of the flexible circuit board structure in the first section is smaller than that of the flexible circuit board structure in each second section. The utility model discloses installing the in-process to electron device with pliability circuit board structure, pliability circuit board structure easily produces in predetermined bending region and buckles, and can arrange the line with anticipated mode, according to in order to promote its equipment yield.
Description
Technical Field
The present invention relates to a circuit board structure and an electronic device, and more particularly to a flexible circuit board structure and an electronic device having the same.
Background
In response to the trend of light and thin personal electronic products such as notebook computers, tablet computers, smart phones, etc., Flexible Printed Circuits (FPCs) are widely used in these electronic products to arrange the circuits in a manner of saving the arrangement space under the condition of limited internal space of the electronic products.
In order to avoid the failure of the flexible printed circuit due to the poor wire arrangement and the stress of the internal structure of the electronic product, the flexible printed circuit needs to be bent in a predetermined manner to facilitate the wire arrangement. Flexible printed circuits are generally easily mounted in electronic products in a predetermined bent configuration by virtue of the metal plastic deformability of the conductive copper layers therein. However, in some flexible printed circuits, the metal content is low and cannot provide sufficient metal plastic deformation capability, so that the flexible printed circuit cannot maintain a predetermined bending shape after being mounted to an electronic product.
Therefore, it is desirable to provide a flexible circuit board structure and an electronic device to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a compliance circuit board structure easily arranges the line with anticipated mode.
The utility model provides an electronic device, its compliance circuit board structure is easily with anticipated mode reason line.
The flexible circuit board structure of the present invention includes a flexible circuit board and a flexible film layer. One surface of the flexible circuit board is provided with at least one first section and at least two second sections, and the first section is connected between the two second sections. The flexible film layer is arranged on the surface of the flexible circuit board, covers the two second sections and exposes the first section, so that the thickness of the flexible circuit board structure in the first section is smaller than that of the flexible circuit board structure in each second section.
The utility model discloses an electronic device includes two electronic component and a compliance circuit board structure. The flexible circuit board structure comprises a flexible circuit board and a flexible film layer. The flexible circuit board is connected between the two electronic components. One surface of the flexible circuit board is provided with at least one first section and at least two second sections, and the first section is connected between the two second sections. The flexible film layer is arranged on the surface of the flexible circuit board, covers the two second sections and exposes the first section, so that the thickness of the flexible circuit board structure in the first section is smaller than that of the flexible circuit board structure in each second section.
In an embodiment of the invention, the first segment and the two second segments are sequentially arranged along a length direction of the flexible circuit board.
In an embodiment of the present invention, in the length direction of the flexible circuit board, the length of each second segment is greater than the length of the first segment.
In an embodiment of the present invention, the flexible film has at least one opening, and the opening exposes the first section.
In an embodiment of the present invention, the flexible film layer has at least one break, and the break exposes the first section.
In an embodiment of the present invention, the flexible film layer is a polyester film.
Based on the above, the present invention adds the flexible film layer on the flexible circuit board, and the predetermined bending region (i.e. the first section) of the flexible circuit board is not covered by the flexible film layer, so that the thickness of the flexible circuit board in the predetermined bending region is smaller and the flexible circuit board has lower structural strength. Therefore, in the process of mounting the flexible circuit board structure to the electronic device, the flexible circuit board structure is easy to bend in the preset bending area, so that the wires can be arranged in an expected manner, and the assembly yield is improved.
Drawings
Fig. 1 is a side view of a partial structure of an electronic device according to an embodiment of the present invention.
Fig. 2 is a perspective view of a part of the components of the electronic device of fig. 1.
Fig. 3 is a top view of the flexible circuit board of fig. 1 in a flattened state.
FIG. 4 is a cross-sectional view of the flexible circuit board of FIG. 3 along line I-I.
Fig. 5 is a top view of a flexible circuit board according to another embodiment of the invention in a flattened state.
Description of the main component symbols:
100 electronic device
110. 120 electronic assembly
130. 130' flexible circuit board structure
132 flexible circuit board
132a surface
134. 134' Flexible film layer
134a opening
134b fracture
140 casing
D longitudinal direction
L1, L2 Length
S1 first section
S2 second section
T1, T2 thickness
Detailed Description
Fig. 1 is a side view of a partial structure of an electronic device according to an embodiment of the present invention. Referring to fig. 1, an electronic device 100 of the present embodiment includes two electronic components 110 and 120 and a flexible circuit board structure 130. The electronic components 110 and 120 are disposed in the housing 140 of the electronic device 100, and the flexible circuit board structure 130 is connected between the two electronic components 110 and 120. The electronic device 100 may be a tablet computer or other electronic products, the Flexible Circuit board structure 130 may be a Flexible Printed Circuit (FPC), and the electronic components 110 and 120 may be any components suitable for connecting the FPC in the electronic products, which is not limited by the present invention.
Fig. 2 is a perspective view of a part of the components of the electronic device of fig. 1. Fig. 3 is a top view of the flexible circuit board of fig. 1 in a flattened state. FIG. 4 is a cross-sectional view of the flexible circuit board of FIG. 3 along line I-I. Referring to fig. 2 to fig. 4, the flexible circuit board structure 130 of the present embodiment includes a flexible circuit board 132 and a flexible film 134. The flexible circuit board 132 is connected between the two electronic components 110 and 120 shown in fig. 1. A surface 132a (shown in fig. 4) of the flexible circuit board 132 is provided with a plurality of first sections S1 and a plurality of second sections S2, the first sections S1 and the second sections S2 are sequentially arranged along the length direction D of the flexible circuit board 132, and each first section S1 is connected between two second sections S2.
The flexible film layer 134 is disposed on the surface 132a of the flexible circuit board 132, and the flexible film layer 134 covers the second sections S2 and exposes the first sections S1, so that the thickness T1 of the flexible circuit board structure 130 in each first section S1 is smaller than the thickness T2 of the flexible circuit board structure 130 in each second section S2. The flexible film 134 can be a polyester film (e.g., Mylar) or other flexible structure, which is not limited by the present invention.
As described above, in the present embodiment, the flexible circuit board 132 is additionally provided with the flexible film layer 134, and the predetermined bending region (i.e., each of the first sections S1) of the flexible circuit board 132 is not covered by the flexible film layer 134, so that the thickness T1 of the flexible circuit board 132 in the predetermined bending region is smaller and has lower structural strength. Therefore, in the process of installing the flexible circuit board structure 130 into the electronic device 100, the flexible circuit board structure 130 is easily bent at the predetermined bending region as shown in fig. 1 and fig. 2, and the wires can be arranged in a desired manner, so as to improve the assembly yield.
Further, in the length direction D of the flexible circuit board 132, the length L2 of each second segment S2 is greater than the length L1 of each first segment S1. Therefore, the variation of the bending shape of the flexible circuit board structure 130 caused by the over-range of the predetermined bending region (i.e., each of the first sections S1) of the flexible circuit board 132 can be avoided.
In the present embodiment, the flexible film 134 has a plurality of openings 134a, and the first sections S1 of the flexible circuit board 132 are respectively exposed through the openings 134 a. As shown in fig. 3, the shape of each opening 134a is, for example, a rectangle, but the present invention is not limited thereto, and each opening 134a may be provided with other suitable shapes according to the bending requirement. Since the flexible film 134 of the present embodiment is formed of a single film as shown in fig. 2 and 4, rather than comprising a plurality of segments separated from each other, it is easy to manufacture and attach. In other embodiments, the flexible film layer may expose the first sections S1 of the flexible circuit board 132 by other methods, which are illustrated in the following figures.
Fig. 5 is a top view of a flexible circuit board according to another embodiment of the invention in a flattened state. The difference between the flexible circuit board structure 130 ' shown in fig. 5 and the flexible circuit board structure 130 shown in fig. 3 is that in the flexible circuit board structure 130 ', the flexible film layer 134 ' has a plurality of breaks 134b, and the first sections S1 of the flexible circuit board 132 are respectively exposed through the breaks 134 b.
It should be noted that the positions and the number of the predetermined bending regions (i.e., the first sections S1) shown in fig. 2 to 5 are only schematic, and the actual positions, the number and the shapes of the predetermined bending regions can be determined according to the bending form required by the flexible circuit board structure 130, so as to form the openings 134a (the breaks 134b) at the corresponding positions of the flexible film layer 134 (the flexible film layer 134').
To sum up, the utility model discloses add the compliance rete on the compliance circuit board, and the predetermined region of buckling of compliance circuit board (promptly the first district) is not covered by the compliance rete to the compliance circuit board is less and has lower structural strength in the regional thickness of predetermined buckling. Therefore, in the process of mounting the flexible circuit board structure to the electronic device, the flexible circuit board structure is easy to bend in the preset bending area, so that the wires can be arranged in an expected manner, and the assembly yield is improved.
Claims (12)
1. A flexible circuit board structure is characterized in that the flexible circuit board structure comprises:
a flexible circuit board, wherein one surface of the flexible circuit board is provided with at least one first section and at least two second sections, and the at least one first section is connected between the at least two second sections; and
a flexible film layer disposed on the surface of the flexible circuit board, wherein the flexible film layer covers the at least two second sections and exposes the at least one first section, so that the thickness of the flexible circuit board structure in the at least one first section is smaller than the thickness of the flexible circuit board structure in each second section.
2. The structure of claim 1, wherein the at least one first segment and the at least two second segments are sequentially arranged along the length of the flexible circuit board.
3. The structure of claim 1, wherein the length of each second segment is greater than the length of the at least one first segment along the length direction of the flexible circuit board.
4. The structure of claim 1, wherein the flexible film has at least one opening exposing the at least one first section.
5. The structure of claim 1, wherein the flexible film has at least one break exposing the at least one first segment.
6. The structure of claim 1, wherein said flexible film is a polyester film.
7. An electronic device, comprising:
two electronic components; and
a flexible circuit board structure, the flexible circuit board structure comprising:
a flexible circuit board connected between the two electronic components, wherein one surface of the flexible circuit board is provided with at least one first section and at least two second sections, and the at least one first section is connected between the at least two second sections; and
a flexible film layer disposed on the surface of the flexible circuit board, wherein the flexible film layer covers the at least two second sections and exposes the at least one first section, so that the thickness of the flexible circuit board structure in the at least one first section is smaller than the thickness of the flexible circuit board structure in each second section.
8. The electronic device of claim 7, wherein the at least one first segment and the at least two second segments are sequentially arranged along the length direction of the flexible circuit board.
9. The electronic device of claim 7, wherein the length of each second segment is greater than the length of the at least one first segment along the length direction of the flexible circuit board.
10. The electronic device of claim 7, wherein the flexible film has at least one opening exposing the at least one first segment.
11. The electronic device of claim 7, wherein the flexible film has at least one break exposing the at least one first segment.
12. The electronic device of claim 7, wherein the flexible film is a polyester film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109206129U TWM600058U (en) | 2020-05-19 | 2020-05-19 | Flexible circuit board structure and electronic device |
| TW109206129 | 2020-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211959661U true CN211959661U (en) | 2020-11-17 |
Family
ID=73003793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021008915.4U Active CN211959661U (en) | 2020-05-19 | 2020-06-04 | Flexible circuit board structure and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN211959661U (en) |
| TW (1) | TWM600058U (en) |
-
2020
- 2020-05-19 TW TW109206129U patent/TWM600058U/en unknown
- 2020-06-04 CN CN202021008915.4U patent/CN211959661U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM600058U (en) | 2020-08-11 |
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