CN210959320U - EMC protective housing and electronic controller - Google Patents
EMC protective housing and electronic controller Download PDFInfo
- Publication number
- CN210959320U CN210959320U CN201921068452.8U CN201921068452U CN210959320U CN 210959320 U CN210959320 U CN 210959320U CN 201921068452 U CN201921068452 U CN 201921068452U CN 210959320 U CN210959320 U CN 210959320U
- Authority
- CN
- China
- Prior art keywords
- emc
- circuit board
- electronic controller
- wall
- bosses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 44
- 239000002344 surface layer Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 11
- 239000006260 foam Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 9
- 238000007689 inspection Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to an EMC protecting crust and electronic controller. Wherein the electronic controller includes circuit board and EMC protective housing, EMC protective housing covers and establishes on the circuit board and include the casing and form the EMC protective wall of casing internal surface, EMC protective wall and the surperficial ground contact on the circuit board are in order to carry out EMC shielding to predetermined object, just EMC protective wall with casing integrated into one piece. The utility model provides an EMC protecting wall and casing integrated into one piece are assembling the EMC protecting crust with accomplish EMC protective structure's equipment promptly in the time of the circuit board, reduced electronic controller's equipment process like this, improved production efficiency.
Description
Technical Field
The utility model relates to an electromagnetic compatibility technical field, concretely relates to EMC protecting crust and electronic controller.
Background
With the development of technology, electronic controllers increasingly use high-speed communication protocols such as ethernet, Low-Voltage Differential signaling (LVDS), and the like. Compared with the traditional electronic controller, the signal transmission rate of the electronic controller adopting the high-speed communication protocol is improved by 100 times. On the basis, higher requirements are put on the electromagnetic Compatibility (EMC) of the electronic controller, and therefore the EMC protective structures are arranged in the electronic controller. The EMC protection structure that is common at present has two kinds of forms of EMC shielded enclosure and EMC shell fragment, and these two kinds of EMC protection structure all set up on Circuit Board (Printed Circuit Board, PCB), can select the use according to actual need, or both use in combination.
Fig. 1a shows a prior art electronic controller with an EMC shield, which includes a circuit board 10 and a housing (not shown) covering the circuit board 10, wherein the housing mainly reduces the shock impact to the circuit board 10, and at the same time, an EMC shield 20 is further provided in the housing, and the EMC shield 20 is used for EMC shielding of high-speed devices (not shown) on the circuit board 10, such as an Ethernet switch (Ethernet switch) and an Ethernet interface (PHY). Wherein the EMC shield 20 comprises an annular carrier 21 and an end cap 22. In actual assembly, at a Surface Mount Technology (SMT) station, the bracket 21 is first Mounted on the circuit board 10 (step one), and is placed around the high-speed device, then the high-speed device is subjected to automatic optical inspection and X-ray inspection, and then the end cap 22 is fixed on the bracket 21 (step two), and finally the housing is Mounted. Therefore, two processes are required to complete the assembly of the EMC shield case 20 on the circuit board 10. And the assembly of the EMC spring is the same. Fig. 1b also shows an existing electronic controller using EMC spring, which also includes a circuit board 10 and a housing 40 covering the circuit board 10, and an EMC spring 30 is disposed in the housing 40. In actual assembly, the EMC spring 30 is first mounted on the housing 40, and then the housing 40 with the EMC spring 30 is connected to the circuit board 10. Therefore, the assembly of the EMC spring also requires two processes.
Therefore, the process of arranging the EMC protection structure on the existing electronic controller is complicated, and particularly the production process of the electronic controller using the EMC shielding case and the EMC elastic sheet is complicated, so that the production efficiency of the electronic controller is not improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an EMC protecting crust and electronic controller to solve and set up the loaded down with trivial details problem of EMC protective structure process on current electronic controller.
In order to realize the above object, the utility model provides a pair of EMC protecting sheathing for the cover is located on the circuit board in order to carry out the EMC protection, the EMC protecting sheathing includes the casing, be formed with the EMC protecting wall on the internal surface of casing, the EMC protecting wall with casing integrated into one piece just the EMC protecting wall with the circuit board contact.
To achieve the above object, the present invention also provides an electronic controller, including:
the circuit board is provided with a surface layer ground; and the number of the first and second groups,
the EMC protective shell comprises a shell, wherein EMC protective walls are formed on the inner surface of the shell and are integrally formed with the shell;
wherein the EMC protective shell covers the circuit board, and the EMC protective wall contacts with the surface layer on the circuit board.
Optionally, the EMC protection wall includes a surrounding first side wall.
Optionally, the EMC protection wall includes a second side wall that does not enclose.
Optionally, the second side wall is disposed adjacent an edge of the inner surface of the housing.
Optionally, the EMC protection wall is provided with two or more bosses at an end facing the circuit board, the two or more bosses are arranged at intervals along a single path, and the bosses are used for contacting with the circuit board; and the distance between any two adjacent bosses is L which is not more than lambda/20, wherein lambda is the wavelength of the frequency band to be shielded.
Optionally, the surface layer ground includes a first surface layer ground, the EMC protection wall includes a first side wall surrounded, the first side wall contacts with the first surface layer ground, and the first surface layer ground matches with the first side wall.
Optionally, the surface layer ground includes a second surface layer ground, the EMC protection wall includes a second side wall that does not surround, the second surface layer ground is in contact with the second side wall, and the second side wall is matched with the second surface layer ground.
Optionally, the electronic controller further includes a connector disposed at an edge of the circuit board and connected to the circuit board, and the second sidewall is disposed adjacent to an edge of the housing near the connector.
Optionally, the electronic controller further includes a fastener provided at the EMC shield wall to connect the circuit board and the housing so that the EMC shield wall is in close contact with the surface layer of the circuit board.
Optionally, a conductive layer is arranged between the EMC protective wall and the surface layer ground.
Optionally, the conductive layer is conductive adhesive or conductive foam.
Compared with the prior art, the utility model provides an EMC protecting crust and electronic controller has following advantage:
the utility model provides an EMC protecting crust include the casing and be formed at EMC protecting wall on the internal surface of casing, just EMC protecting wall and casing integrated into one piece. The EMC protective wall and the shell can be used as the EMC protective structure, so that the EMC protective structure can be integrally formed without multi-step assembly, the assembly processes of the electronic controller are reduced, and the production efficiency is improved.
Drawings
FIG. 1a is a schematic diagram of a prior art electronic controller showing an EMC protective structure as an EMC shield;
FIG. 1b is a schematic diagram of a prior art electronic controller, in which an EMC protection structure is an EMC spring;
fig. 2a is a schematic structural diagram of an EMC protective housing according to an embodiment of the present invention;
FIG. 2b is a schematic diagram of a first sidewall on the EMC shield case shown in FIG. 2 a;
FIG. 2c is a schematic diagram of a second sidewall on the EMC shield case shown in FIG. 2 a;
fig. 3 is an exploded schematic view of an electronic controller provided in accordance with an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a circuit board in an electronic controller according to an embodiment of the present invention;
fig. 5 a-5 c are schematic diagrams illustrating an assembly process of the electronic controller according to an embodiment of the present invention;
fig. 6a is a schematic structural diagram of a first sidewall on an EMC shield according to another embodiment of the present invention;
fig. 6b is a schematic structural diagram of a second side wall on the EMC protective shell according to an embodiment of the present invention.
In the figure:
10. 200-a circuit board;
20-an EMC shield;
21-bracket, 22-end cap;
30-EMC spring plate; 40. 110-a housing;
100-EMC protective shell;
120-protective walls;
121-a first side wall, 122-a second side wall, 123-a first boss, 124-a second boss;
210-superficial;
211-a first surface, 212-a second surface;
220-high speed devices;
300-a connector;
400-shell.
Detailed Description
To make the objects, advantages and features of the present invention clearer, the EMC protective case and the electronic controller according to the present invention will be described in further detail with reference to the accompanying drawings. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.
As used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise, and the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either fixedly connected, detachably connected, or integrally connected. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. The same or similar reference numbers in the drawings identify the same or similar elements.
An object of the utility model is to provide an EMC protective housing 100, this EMC protective housing 100 is used for the cover to establish in order to carry out the EMC protection on a circuit board. Fig. 2a shows a structure of an EMC protective case 100 according to an embodiment of the present invention. As shown in fig. 2a, the EMC protection shell 100 includes a shell 110 and EMC protection walls 120, wherein the shell 110 has an inner surface and an outer surface, and the EMC protection walls 120 are disposed on the inner surface of the shell 110, and in particular, the EMC protection walls 120 are integrally formed with the shell 110, but the invention is not limited to the specific manner of integral forming, including but not limited to die-casting forming. When the EMC shield 100 is covered on the circuit board, the EMC shield wall 120 is in contact with the circuit board. Here, the inner surface of the housing 110 refers to a surface facing a circuit board described below.
A second object of the present invention is to provide an electronic controller, which can be an automobile controller, and also can be a remote controller of other electronic devices, such as a television remote controller, an air conditioner remote controller, etc. Fig. 3 shows a structure of an electronic controller according to an embodiment of the present invention. As shown in fig. 3, the electronic controller provided in the present embodiment includes an EMC protective shell 100 and a circuit board 200, where the circuit board 200 includes, but is not limited to, a PCB circuit board.
Fig. 4 shows a structure of a circuit board 200 according to an embodiment of the present invention. As shown in fig. 4, the circuit board 200 has a first surface (e.g., a front surface) and a second surface (e.g., a back surface) opposite to each other, the first surface having a surface ground 210 formed thereon, the surface ground 210 being matched with the EMC shield wall 120. The "matching" here means that the shape and position of the surface ground 210 match the shape and position of the EMC shield wall 210. In this way, when the EMC shield case 100 is covered on the circuit board 200, the EMC shield wall 120 can just contact the surface layer 210 at a predetermined position, so as to EMC shield the designated device or portion on the circuit board 200, and thus the EMC shield wall 120 and the housing 110 together constitute the EMC shield mechanism of the electronic controller. It should be understood that the surface ground 210 is a ground copper plane, and the voltage of the ground copper plane is 0, so that when the EMC protection wall 120 is grounded, the current generated by the electromagnetic interference can flow away from the surface ground 210, thereby implementing the EMC protection of the electronic controller.
In this embodiment, the EMC protection wall 120 and the housing 110 are integrally formed, so that the EMC protection structure is mounted while the EMC protection housing 100 and the circuit board 200 are assembled, thereby simplifying the assembly process of the electronic controller and reducing the production cost. Of course, the material of the EMC protective shell 100 of the present invention is metal, but there is no special limitation to the metal material, as long as the EMC protective effect can be achieved.
As shown in fig. 5a, the electronic controller may further include a connector 300 disposed at an edge portion of the circuit board 200 for electrically connecting with an external device to implement signal transmission. In this embodiment, the circuit board 200 may have a rectangular structure, and the connector 300 may be disposed on one side of the circuit board 200 and connected to the circuit board 200. However, the EMC protective wall 120 and the surface ground 210 may be arranged differently according to the usage requirements of the electronic controller.
Specifically, referring to fig. 4, the high-speed device 220 is disposed on the first surface of the circuit board 200, the surface layer ground 210 may include a first surface layer ground 211, the first surface layer ground 211 is a closed ring structure, and the first surface layer ground 211 is disposed around the high-speed device 220. Correspondingly, as shown in fig. 2a, the EMC protection wall 120 may include a surrounding first side wall 121, that is, the first side wall 121 is also a closed ring structure, and the shape and the size of the first side wall 121 and the first surface ground 211 are matched, so that the first side wall 121 may be in fit contact with the first surface ground 211. Thus, the first side wall 121 and the housing 110 together form an EMC shield case. In this embodiment, the high-speed device 220 is, for example, an Ethernet switch (Ethernet switch), an Ethernet interface (PHY), etc., and after completing the automatic optical inspection and the X-ray inspection, an EMC protective shell is assembled to ensure the quality of the electronic controller.
Referring to fig. 4, the surface layer 210 may include a second surface layer 212, and the second surface layer 212 is disposed at an edge of the circuit board 200 near the connector 300 and extends along the edge of the circuit board 200 to form an elongated structure. As shown in fig. 2a, the EMC protection wall 120 includes a second side wall 122 that is not enclosed, and the shape and size of the second side wall 122 match those of the second surface layer 212, so that the second side wall 122 is also in a strip shape. When the second sidewall 122 contacts the second surface layer 212, the second sidewall 122 may isolate all devices on the circuit board 200 from the connector 300, so as to reduce the radiation of the electronic controller through the connector 300.
It should be noted that the first sidewall 121 and the first surface layer 211 are disposed at the same time, and the second sidewall 122 and the second surface layer 212 are disposed at the same time. In practice, the first sidewall 121 and the second sidewall 122 may be disposed alternatively or simultaneously as needed.
Further, as shown in FIG. 2b, at least two first bosses 123 are disposed at an end of the first side wall 121 facing the circuit board 200, and the at least two first bosses 123 are disposed at intervals along a single path (that is, the at least two first bosses 123 are disposed at intervals and arranged in a ring shape along an extending direction of the first side wall 121). The first bosses 123 are adapted to contact the first skin 211. And the distance between any two adjacent first bosses 123 is L1,L1≤λa/20, where λaIs the wavelength of the frequency band a to be shielded. In this embodiment, the first protrusion 123 is disposed at an end of the first sidewall 121 facing the circuit board 200, so that a contact position between the first sidewall 121 and the first surface layer 211 is controllable. In addition, the distance (i.e., L) between two adjacent first bosses 123 is generally the same1) The smaller the better, in order to protect against high frequency signals.
In addition, in order to enhance the effective contact between the first boss 123 and the first surface layer ground 211 and improve the protection effect, a conductive layer (not shown in the figure) may be further disposed between the first boss 123 and the first surface layer ground 211, and the specific material of the conductive layer may be conductive adhesive or conductive foam.
Similarly, as shown in fig. 2c, at least two second bosses 124 are disposed on an end of the second side wall 122 facing the circuit board 200, and the at least two second bosses 124 are disposed at intervals along a single path (i.e., the at least two second bosses 124 are disposed at intervals along a length direction of the second side wall 122). The second bosses 124 are adapted to contact the second skin 212. And the distance between any two adjacent second bosses 124 is L2,L2≤λb/20, where λaIs the wavelength of the band b to be shielded. A conductive layer (not shown) may also be disposed between the second bump 124 and the second surface layer 212, and the conductive layer may be made of conductive adhesive or conductive foam.
In this embodiment, the EMC shield case 100 may be connected to the circuit board 200 by screws. Preferably, a fastener such as a screw is further disposed near the EMC protection wall 120, so as to enhance the contact between the surface layer 210 and the EMC protection wall 120, thereby avoiding the EMC protection wall 120 and the surface layer 210 being separated when the operation condition is bad. Specifically, as shown in fig. 2b and fig. 3, screw holes may be formed in the first surface layer 211 and corresponding positions of the wall of the first sidewall 121, and then the circuit board 200 and the EMC shield case 100 are connected by screws. Alternatively, as shown in fig. 2c and fig. 3, screw holes may be formed in the second surface layer 212 and the wall of the second sidewall 122 at corresponding positions, and then the circuit board 200 and the EMC shield 100 are connected by screws.
Fig. 5a to 5c are schematic views illustrating an assembly process of the electronic controller according to the present embodiment, wherein the EMC shield is provided with a first side wall 121 and a second side wall 122.
As shown in fig. 5a, when the electronic controller according to this embodiment is assembled, the connector 300 is first disposed on the side of the circuit board 200 where the second surface layer 212 is disposed; then, as shown in fig. 5b, the first side wall 121 of the EMC shield 100 is aligned with the first surface ground 211 on the circuit board 200, and the second side wall 122 of the EMC shield 100 is aligned with the second surface ground 212 on the circuit board 200, and then the EMC shield 100 and the circuit board 200 are connected by screws; finally, as shown in fig. 5c, a housing 400 is provided on the side of the circuit board 200 remote from the EMC shield 100.
In the above embodiment, the first side wall 121 and the second side wall 122 are both of a single-layer structure, and actually, as shown in fig. 6, the first side wall 121 may also be of a structure with more than two layers, and when the first side wall 121 is of at least two-layer structure, the first side wall 121 is arranged in a stacked manner. As shown in fig. 6b, the second sidewall 122 may also be a multi-layer structure arranged in a stacked manner.
In addition, the present invention is not specifically limited to the specific shapes of the first side wall 121 and the second side wall 122, and the first side wall 121 is used to surround the high-speed devices 220 on the circuit board 200, so the shape of the first side wall 121 can be set according to the distribution mode of the high-speed devices 220; the second side wall 122 serves to isolate the connector 300 from all devices on the circuit board 200, and thus the second side wall 122 may be provided according to the shape of the circuit board 200.
The utility model provides an EMC protecting crust and electronic controller, through set up the protecting wall on the casing at the EMC protecting crust, just the protecting wall with casing integrated into one piece assembles electronic controller's in-process, accomplishes EMC protective structure's equipment when connecting EMC protecting crust and circuit board, need not to carry out EMC protective structure's installation alone, has simplified electronic controller's equipment process, has improved production efficiency.
Although the present invention is disclosed above, it is not limited thereto. Various modifications and alterations of this invention may be made by those skilled in the art without departing from the spirit and scope of this invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (14)
1. The utility model provides a EMC protective housing for cover establishes on the circuit board in order to carry out EMC protection, its characterized in that, includes the casing, be formed with the EMC protective wall on the internal surface of casing, the EMC protective wall with casing integrated into one piece just the EMC protective wall with the circuit board contact.
2. The EMC shield of claim 1, wherein the EMC shield includes a surrounding first side wall.
3. The EMC shield of claim 1 or 2, wherein the EMC shield comprises an unenclosed second side wall.
4. The EMC protective case of claim 3, wherein the second side wall is disposed adjacent an edge of an inner surface of the housing.
5. The EMC shield of claim 1, wherein two or more bosses are provided on an end of the EMC shield facing the circuit board, the two or more bosses being spaced apart along a single path; and the distance between any two adjacent bosses is L which is not more than lambda/20, wherein lambda is the wavelength of the frequency band to be shielded.
6. An electronic controller, comprising:
the circuit board is provided with a surface layer ground; and the number of the first and second groups,
the EMC protective shell comprises a shell, wherein EMC protective walls are formed on the inner surface of the shell and are integrally formed with the shell;
wherein the EMC protective shell covers the circuit board, and the EMC protective wall contacts with the surface layer on the circuit board.
7. The electronic controller of claim 6, wherein the surface ground comprises a first surface ground, wherein the EMC shield walls comprise surrounding first side walls, wherein the first side walls are in contact with the first surface ground, and wherein the first surface ground is matched to the first side walls.
8. The electronic controller of claim 6 or 7, wherein the surface ground comprises a second surface ground, the EMC shield wall comprises an unenclosed second sidewall, the second surface ground is in contact with the second sidewall, and the second sidewall is mated with the second surface ground.
9. The electronic controller of claim 8, wherein the second side wall is disposed adjacent an edge of an inner surface of the housing.
10. The electronic controller of claim 8, further comprising a connector disposed on an edge of the circuit board and coupled to the circuit board, and wherein the second sidewall is disposed adjacent to an edge of the housing proximate the connector.
11. The electronic controller of claim 6, wherein two or more bosses are provided on an end of the EMC protective wall remote from the inner surface of the housing, the two or more bosses being spaced apart along a single path, the bosses being in contact with the skin; and the distance between any two adjacent bosses is L which is not more than lambda/20, wherein lambda is the wavelength of the frequency band to be shielded.
12. The electronic controller of claim 6, further comprising a fastener provided at the EMC fence to connect the circuit board and the housing to bring the EMC fence into close contact with the surface of the circuit board.
13. The electronic controller of claim 6, wherein a conductive layer is disposed between the EMC protective wall and the surface ground.
14. The electronic controller of claim 13, wherein the conductive layer is a conductive glue or a conductive foam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921068452.8U CN210959320U (en) | 2019-07-09 | 2019-07-09 | EMC protective housing and electronic controller |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921068452.8U CN210959320U (en) | 2019-07-09 | 2019-07-09 | EMC protective housing and electronic controller |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210959320U true CN210959320U (en) | 2020-07-07 |
Family
ID=71381668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921068452.8U Active CN210959320U (en) | 2019-07-09 | 2019-07-09 | EMC protective housing and electronic controller |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210959320U (en) |
-
2019
- 2019-07-09 CN CN201921068452.8U patent/CN210959320U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4829432A (en) | Apparatus for shielding an electrical circuit from electromagnetic interference | |
CN204179390U (en) | High density cable termination connector | |
US8773867B2 (en) | Camera module for shielding EMI | |
US20060189183A1 (en) | Camera module connector | |
JP2013529839A (en) | EMI gasket | |
US9930229B2 (en) | EMI shield with a lens-sized aperture for camera modules and camera modules including the same | |
US7341488B2 (en) | EMI-resistant circuit board assembly | |
JP2017521876A (en) | Circuit protection structure and electronic device | |
CN112187970B (en) | Camera module and electronic device thereof | |
TWI769682B (en) | Electrical connector with electromagnetic shielding function | |
CN210959320U (en) | EMC protective housing and electronic controller | |
WO2006057424A1 (en) | Connector with shield, and circuit board device | |
US9502826B1 (en) | Electrical connector assembly having a plug with a first shielding housing and a socket with a second shielding housing | |
CN107018645A (en) | Shielding construction, shielding construction preparation method, circuit module and mobile electronic terminal | |
TWI536690B (en) | Noise suppress assembly and electronic device having the same | |
CN113543617B (en) | Electromagnetic compatibility shielding device and electronic equipment | |
CN212517768U (en) | Micro-rectangular filter board connector socket | |
TWM505729U (en) | High frequency connector structure | |
KR100612574B1 (en) | Noise Reduction Structure of Flexible Circuit Board of Mobile Communication Terminal | |
JPH05152820A (en) | Antenna system | |
JPH0822867A (en) | Means for electromagnetically shielding connection between electronic mechanism component and cable | |
US7147491B1 (en) | Non-continuous counterpoise shield | |
CN206923232U (en) | Shielding construction, circuit module and mobile electronic terminal | |
CN221329477U (en) | Controller assembly and vehicle | |
EP1843625B1 (en) | Shielded Microphone for Mobile Communications Device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |