CN219222830U - Electric water heater with liquid cooling type refrigerating mechanism - Google Patents

Abstract

The utility model discloses an electric water heater with a liquid-cooled refrigeration mechanism, which comprises an inner container, an electric heating mechanism and a liquid-cooled refrigeration mechanism, wherein the electric heating mechanism is arranged at the end part of the inner container and extends to the inner part of the inner container; the liquid cooling type refrigerating mechanism comprises a liquid storage box, a cold guide box, a liquid pump and a semiconductor refrigerating module, wherein the cold guide box, the liquid storage box and the liquid pump are sequentially connected through pipelines, the interiors of the cold guide box, the liquid storage box and the liquid pump are mutually communicated, the pipelines comprise cold guide sections, and the cold guide sections are coiled inside and/or outside the liner; the semiconductor refrigerating module is arranged close to the cold guide box, and is provided with a semiconductor refrigerating piece, and the cold end face of the semiconductor refrigerating piece is mutually attached to the cold guide box. The electric water heater with the liquid cooling type refrigerating mechanism has the advantage that the refrigerating speed of the electric water heater is increased on the premise of having a refrigerating function by additionally arranging the liquid cooling type refrigerating mechanism.

Description

Electric water heater with liquid cooling type refrigerating mechanism

Technical Field

The utility model relates to the technical field of household appliances, in particular to an electric water heater with a liquid-cooled refrigeration mechanism.

Background

At present, the electric water heater commonly used by people heats tap water entering the electric water heater from a water inlet through an electric heating element, and then the heated tap water flows out from a water outlet, so that the tap water is used as domestic water in a shower room and/or a kitchen by a user.

The existing electric water heater generally comprises a shell, an inner container, an electric heating element, a water inlet pipe and a water outlet pipe, wherein the water inlet pipe and the water outlet pipe are arranged on the inner container, the electric heating element is arranged at one end of the inner container and extends to the inner part of the inner container, and the electric heating element is used for heating tap water positioned in the inner container.

Because the water outlet pipe of the electric water heater in the prior art can only flow out hot water, however, in India, middle east or certain areas of China, the temperature of tap water can be up to 50 ℃ or even higher in summer, and the electric water heater cannot be directly used for bathing; in addition, when the temperature is low, a user generally washes dishes by using the water heated by the electric water heater, however, when the temperature is high, tap water with high water temperature is inconvenient to use as domestic water in a kitchen, so that the market needs an electric water heater capable of outputting hot water and cold water.

Disclosure of Invention

The utility model aims to provide an electric water heater with a liquid-cooled refrigeration mechanism, which is additionally provided with the liquid-cooled refrigeration mechanism, so that the refrigerating speed of the electric water heater is increased on the premise of having a refrigerating function, and the defects in the prior art are overcome.

To achieve the purpose, the utility model adopts the following technical scheme:

the electric water heater with the liquid cooling type refrigerating mechanism comprises an inner container, an electric heating mechanism and the liquid cooling type refrigerating mechanism, wherein the electric heating mechanism is arranged at the end part of the inner container and extends to the inner part of the inner container, and the liquid cooling type refrigerating mechanism is arranged at the outer part of the inner container;

the liquid cooling refrigeration mechanism comprises a liquid storage box, a cold guide box, a liquid pump and a semiconductor refrigeration module, wherein the cold guide box, the liquid storage box and the liquid pump are sequentially connected through a pipeline, the interiors of the cold guide box, the liquid storage box and the liquid pump are mutually communicated, the pipeline comprises a cold guide section, and the cold guide section is coiled inside and/or outside the liner;

the semiconductor refrigerating module is arranged close to the cold guide box, the semiconductor refrigerating module is provided with a semiconductor refrigerating piece, and the cold end face of the semiconductor refrigerating piece is mutually attached to the cold guide box.

Preferably, the semiconductor refrigeration module further comprises a heat dissipation block, and the hot end surface of the semiconductor refrigeration sheet is mutually attached to the heat dissipation surface of the heat dissipation block.

Preferably, the heat dissipation block comprises a heat dissipation plate and a plurality of heat dissipation fins, one plate surface of the heat dissipation plate is attached to the hot end surface of the semiconductor refrigerating plate, the heat dissipation fins arranged at intervals are arranged on the other plate surface of the heat dissipation plate, and the heat dissipation fins vertically extend.

Preferably, the semiconductor refrigeration module further comprises a heat radiation fan, wherein the heat radiation fan is installed at the bottom of the heat radiation fin, and the heat radiation fan is used for generating vertical upward air flow.

Preferably, the semiconductor refrigeration module further comprises a first heat preservation piece, and the first heat preservation piece is located between the cold guide box and the heat dissipation plate;

the face of the first heat preservation piece is provided with a mounting hole for accommodating the semiconductor refrigerating piece, and the semiconductor refrigerating piece is mounted between the cold guide box and the heat dissipation plate through the first heat preservation piece.

Preferably, the semiconductor refrigeration module further comprises a second heat preservation piece, and the second heat preservation piece is wrapped outside the cold guide box;

the second heat preservation piece comprises a heat preservation frame and a heat preservation strip, and the heat preservation frame and the heat preservation strip jointly enclose a heat preservation cavity for accommodating the cold guide box.

Preferably, one of the semiconductor refrigerating sheets, one of the radiating blocks and one of the first heat preservation pieces are a group of refrigerating and radiating pieces, at least two groups of refrigerating and radiating pieces are arranged, and the cold end faces of the semiconductor refrigerating sheets in the two groups of refrigerating and radiating pieces are mutually attached to the cold guide box.

Preferably, the refrigerator further comprises a shell, wherein the shell comprises a first installation part and a second installation part, the liner is installed in the first installation part, and the liquid-cooled refrigeration mechanism is installed in the second installation part;

the side wall of the second installation part is provided with a plurality of radiating holes, and the setting positions of the radiating holes are mutually corresponding to the positions of the radiating ends of the liquid-cooled refrigeration mechanism.

Preferably, a first mounting seat and a second mounting seat are arranged in the second mounting portion, the first mounting seat is used for mounting the liquid storage tank, and the second mounting seat is used for mounting the semiconductor refrigeration module.

Preferably, the liquid storage tank comprises a tank body and a cover body, wherein the cover body is used for opening and closing an opening of the tank body.

The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:

1. the liquid cooling type refrigerating mechanism is arranged outside the inner container, the inside of the liquid cooling type refrigerating mechanism is accommodated with refrigerating fluid, and the refrigerating fluid is used for conducting the cold carried by the refrigerating fluid to the water in the inner container through the inner container in a heat conduction mode, so that the cooling effect is achieved.

2. The cold quantity generated by the semiconductor refrigerating module is transferred to the liquid contained in the semiconductor refrigerating module by the cold guide box, so that the liquid is refrigerated and then is changed into refrigerating liquid again, and the liquid is reciprocally circulated, so that a liquid circulating system is formed, the liquid in the cold guide section is kept at a low temperature, the liquid of the liquid cooling refrigerating mechanism can be circularly used and continuously radiated, the use experience of a user is met, and the cooling effect of the water body in the liner is reduced without worrying about long-time use of the liquid cooling refrigerating mechanism.

Drawings

Fig. 1 is a schematic structural diagram of an electric water heater with a liquid-cooled refrigeration mechanism according to the present utility model.

Fig. 2 is a schematic partial structure of an embodiment of an electric water heater with a liquid-cooled refrigeration mechanism according to the present utility model.

Fig. 3 is a schematic partial structure of another embodiment of an electric water heater with a liquid-cooled refrigeration mechanism according to the present utility model.

Fig. 4 is an exploded view of a liquid-cooled refrigeration mechanism in an electric water heater with a liquid-cooled refrigeration mechanism according to the present utility model.

Wherein: an inner container 1;

an electric heating mechanism 2;

the liquid-cooled refrigeration mechanism 3, the liquid storage tank 31, the box body 311, the cover body 312, the cold guide box 32, the liquid pump 33, the semiconductor refrigeration module 34, the semiconductor refrigeration piece 341, the heat dissipation block 342, the heat dissipation plate 3421, the heat dissipation fins 3422, the heat dissipation fan 343, the first heat preservation piece 344, the mounting hole 3441, the second heat preservation piece 345, the heat preservation frame 3451, the heat preservation strip 3452 and the cold guide section 35;

the housing 4, the heat dissipation hole 401, the first mounting seat 41, and the second mounting seat 42.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

The technical scheme provides an electric water heater with a liquid-cooled refrigeration mechanism, which comprises an inner container 1, an electric heating mechanism 2 and a liquid-cooled refrigeration mechanism 3, wherein the electric heating mechanism 2 is arranged at the end part of the inner container 1 and extends to the inside of the inner container 1, and the liquid-cooled refrigeration mechanism 3 is arranged outside the inner container 1;

the liquid-cooled refrigeration mechanism 3 comprises a liquid storage tank 31, a cold guide box 32, a liquid pump 33 and a semiconductor refrigeration module 34, wherein the cold guide box 32, the liquid storage tank 31 and the liquid pump 33 are sequentially connected through pipelines, the interiors of the cold guide box 32, the liquid storage tank 31 and the liquid pump 33 are mutually communicated, the pipelines comprise a cold guide section 35, and the cold guide section 35 is coiled inside and/or outside the liner 1;

the semiconductor refrigeration module 34 is disposed near the cold guide box 32, and the semiconductor refrigeration module 34 is provided with a semiconductor refrigeration piece 341, and a cold end surface of the semiconductor refrigeration piece 341 is attached to the cold guide box 32.

In order to meet various use demands of users on the electric water heater, the technical scheme provides the electric water heater with the liquid-cooled refrigeration mechanism, and as shown in fig. 1-4, the liquid-cooled refrigeration mechanism 3 is arranged on the electric water heater, so that the refrigerating speed of the electric water heater can be increased on the premise of having a refrigerating function.

Specifically, the electric water heater in this scheme includes inner bag 1, electric heating mechanism 2 and liquid-cooled refrigeration mechanism 3. Wherein the liner 1 is used for storing water; the electric heating mechanism 2 is arranged at the end part of the inner container 1 and extends into the inner container 1 to heat water positioned in the inner container 1; the liquid cooling refrigeration mechanism 3 is installed outside the inner container 1, and the inside of the liquid cooling mechanism contains cooling liquid, and is used for conducting cooling capacity carried by the cooling liquid to water located inside the inner container 1 through a heat conduction mode, so that the cooling effect is achieved. The refrigerant liquid may be water, and is not limited herein.

More specifically, the liquid-cooled refrigeration mechanism 3 in this embodiment includes a liquid tank 31, a cold box 32, a liquid pump 33, and a semiconductor refrigeration module 34. Wherein the reservoir 31 is for storing liquid. The cold guide box 32 is used for transferring the cold generated by the semiconductor refrigeration module 34 to the liquid contained in the cold guide box, so that the liquid is refrigerated and then becomes refrigeration liquid; preferably, a containing cavity (not shown in the figure) for containing liquid may be provided inside the cold guide box 32, and a cooling pipe (not shown in the figure) for passing the liquid may also be provided inside the cold guide box 32, where the cold guide box 32 transfers the cold generated by the semiconductor refrigeration module 34 to the cooling pipe, so that the liquid in the cooling pipe is cooled and then becomes a cooling liquid, which is not limited herein; more preferably, the cold box 32 may be made of metal; the cooling pipe arranged inside the cold guide box 32 can be U-shaped or S-shaped, so that the contact area between the cooling pipe and the cold guide box 32 is conveniently increased, and the cooling effect is ensured. The liquid pump 33 powers the liquid flow. The semiconductor refrigerating piece 341 in the semiconductor refrigerating module 34 is used for refrigerating, and is made by using the peltier effect, wherein the peltier effect refers to the phenomenon that when direct current passes through a couple composed of two semiconductor materials, one end of the couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration piece 341 is made of two semiconductor materials, forming a hot end and a cold end, and the cold end continuously absorbs heat to realize refrigeration and the hot end continuously releases heat.

Preferably, the plurality of cold guide boxes 32 may be provided in this embodiment, and the plurality of cold guide boxes 32, the liquid storage tank 31 and the liquid pump 33 are connected through a pipeline with branches, so as to further improve the refrigeration efficiency of the semiconductor refrigeration sheet 341.

Preferably, a plurality of semiconductor cooling fins 341 may be provided in the present embodiment, and the cold end surfaces of the plurality of semiconductor cooling fins 341 are attached to the cold guiding box 32, so as to further improve the cooling efficiency of the semiconductor cooling fins 341.

The working flow of the liquid-cooled refrigeration mechanism 3 in this solution is as follows:

the liquid pump 33 pumps the refrigerating fluid stored in the liquid storage tank 31 to the cold guide section 35, and the cold guide section 35 is coiled inside and/or outside the liner 1, so that the cold carried by the refrigerating fluid in the cold guide section 35 can be transferred to the water body in the liner 1 through the cold guide section 35 and the liner 1 (as shown in fig. 2), or directly transferred to the water body in the liner 1 through the cold guide section 35 (as shown in fig. 3), or through the combination of the two modes, thereby realizing the cooling of the water body. The refrigerating fluid which absorbs heat due to heat exchange with the water body in the liner 1 enters the cold guide box 32 through a pipeline, the cold guide box 32 transfers the cold generated by the semiconductor refrigerating module 34 to the liquid contained in the cold guide box, so that the liquid is refrigerated and then changed into refrigerating fluid again, and the refrigerating fluid is reciprocally circulated, so that a liquid circulation system is formed, the liquid in the cold guide section 35 is kept at a low temperature, the liquid of the liquid cooling refrigerating mechanism 3 can be recycled and continuously radiated, the use experience of a user is met, and the cooling effect of the water body in the liner 1 is reduced without worrying about long-time use of the liquid cooling refrigerating mechanism 3.

Further, the semiconductor refrigeration module 34 further includes a heat dissipating block 342, and the heat end surface of the semiconductor refrigeration piece 341 is attached to the heat dissipating surface of the heat dissipating block 342.

Since the hot end and the cold end of the semiconductor refrigeration piece 341 are in a state of heat absorption and heat release balance in the working process, the rapid heat dissipation of the hot end face is also beneficial to accelerating the rapid heat absorption of the cold end face. In order to ensure that the heat generated by the hot end of the semiconductor refrigeration piece 341 can be timely dissipated, so as to accelerate the refrigeration efficiency of the semiconductor refrigeration module 34, the heat dissipation block 342 is additionally arranged in the scheme to rapidly dissipate the heat generated by the hot end surface of the semiconductor refrigeration piece 341, and the heat dissipation surfaces of the hot end surface and the heat dissipation block 342 are mutually attached, so that the direct conduction of the heat is facilitated, and the heat dissipation is further accelerated.

Further, the heat dissipating block 342 includes a heat dissipating plate 3421 and a plurality of heat dissipating fins 3422, wherein one surface of the heat dissipating plate 3421 is attached to the heat end surface of the semiconductor cooling fin 341, the heat dissipating fins 3422 are mounted on the other surface of the heat dissipating plate 3421 at intervals, and the heat dissipating fins 3422 extend vertically.

The radiating block 342 in this scheme includes heating panel 3421 and a plurality of radiating fin 3422, and the front and the hot junction face of heating panel 3421 paste mutually, and the radiating fin 3422 that the back-mounting of heating panel 3421 set up at the interval forms the through flow channel and water conservancy diversion air between a plurality of radiating fin 3422, is convenient for increase the area of contact of air and radiating block 3421, promotes the radiating effect, and radiating fin 3422 vertical extension, and the heat of being convenient for upwards dissipates, and the structural design of radiating block 342 accords with thermodynamic principle, the effective diffusion of the heat of being convenient for.

Further, the semiconductor refrigeration module 34 further includes a heat dissipation fan 343, the heat dissipation fan 343 is mounted at the bottom of the heat dissipation fins 3422, and the heat dissipation fan 343 is used for generating an air flow vertically upwards.

In order to further realize rapid diffusion of heat, the bottom of the radiating fin 3422 is provided with a radiating fan 343 which can effectively accelerate air flow, thereby improving the radiating efficiency of the liquid-cooled refrigeration mechanism 3; in addition, the cooling fan 343 in the present embodiment can generate an upward airflow, so that the heat diffusion speed is increased under the action of the cooling fan 343.

Note that, the cooling fan 443 in the present embodiment may be an axial fan or an eddy fan, which is not limited herein.

Further describing, the semiconductor refrigeration module 34 further includes a first thermal insulation member 344, the first thermal insulation member 344 being located between the cold box 32 and the heat dissipation plate 3421;

the first heat-insulating member 344 has a mounting hole 3441 formed in a plate surface thereof for accommodating the semiconductor cooling fin 341, and the semiconductor cooling fin 341 is mounted between the cooling box 32 and the heat dissipating plate 3421 via the first heat-insulating member 344.

In a preferred embodiment of the present disclosure, the semiconductor refrigeration module 34 further includes a first heat preservation member 344, specifically, the first heat preservation member 344 is located between the cold conducting box 32 and the heat dissipating plate 3421, a mounting hole 3441 for mounting the semiconductor refrigeration sheet 341 is formed in the middle of the first heat preservation member 344, the first heat preservation member 344 plays a role in positioning and mounting the semiconductor refrigeration sheet 341, and meanwhile, heat and cold generated by the semiconductor refrigeration sheet 341 can be effectively prevented from being dissipated to the surroundings.

Preferably, the material of the first insulating member 344 may be a heat insulation sponge, and is not limited herein.

Further described, the semiconductor refrigeration module 34 further includes a second heat-insulating member 345, and the second heat-insulating member 345 is wrapped outside the cold-conducting box 32;

the second heat insulation member 345 includes a heat insulation frame 3451 and a heat insulation strip 3452, where the heat insulation frame 3451 and the heat insulation strip 3452 together enclose a heat insulation cavity for accommodating the cold guide box 32.

In another preferred embodiment of the present disclosure, the semiconductor refrigeration module 34 is provided with a second heat-insulating member 345 for insulating the cold-conducting box 32, which has a function of accommodating and installing the cold-conducting box 32, and meanwhile, can effectively avoid the dissipation of the cold transferred from the semiconductor refrigeration sheet 341 to the cold-conducting box 32 to the surroundings, and has a heat-insulating function to the cold-conducting box 32, so as to ensure the refrigeration effect of the semiconductor refrigeration sheet 341 on the liquid.

To further illustrate, one of the semiconductor cooling fins 341, one of the heat dissipation blocks 342, and one of the first heat preservation members 344 are a set of cooling and heat dissipation members, at least two sets of cooling and heat dissipation members are provided, and cold end surfaces of the semiconductor cooling fins 341 in the two sets of cooling and heat dissipation members are all mutually attached to the cold guide box 32.

In a more preferred embodiment of the present disclosure, the electric water heater is provided with at least two sets of cooling heat dissipation elements for transferring cold energy to the cold guide box 32, which is more beneficial to improving the cooling efficiency of the liquid cooling type cooling mechanism 3.

Further, the refrigerator further comprises a shell 4, wherein the shell 4 comprises a first installation part and a second installation part, the liner 1 is installed inside the first installation part, and the liquid-cooled refrigeration mechanism 3 is installed inside the second installation part;

a plurality of heat dissipation holes 401 are formed in the side wall of the second mounting portion, and the positions of the heat dissipation holes 401 correspond to the positions of the heat dissipation ends of the liquid cooling refrigeration mechanism 3.

In order to further ensure that heat generated by the hot end surface is rapidly discharged out of the electric water heater, and heat accumulation in the electric water heater is prevented, a plurality of heat dissipation holes 401 are formed in the side wall of the second installation part for installing the liquid cooling refrigeration mechanism 3 in the scheme, and the arrangement positions of the heat dissipation holes 401 are mutually corresponding to the positions of the heat dissipation ends of the liquid cooling refrigeration mechanism 3, so that rapid heat dissipation is realized.

Further, a first mounting seat 41 and a second mounting seat 42 are disposed in the second mounting portion, and the first mounting seat 41 is used for mounting the liquid storage tank 31, and the second mounting seat 42 is used for mounting the semiconductor refrigeration module 34.

In addition, in order to ensure stable installation of the liquid-cooled refrigeration mechanism 3 in the electric water heater, the first mounting seat 41 for mounting the liquid storage tank 31 is additionally arranged in the shell 4, and the second mounting seat 42 for mounting the semiconductor refrigeration module 34 is additionally arranged at the same time, so that displacement of the liquid-cooled refrigeration mechanism 3 in the moving and running processes of the electric water heater is avoided.

To further illustrate, the liquid storage tank 31 includes a tank body 311 and a cover body 312, and the cover body 312 is used to open and close the opening of the tank body 311.

The liquid storage tank 31 in this scheme includes box 311 and lid 312, is favorable to pouring into the refrigerating fluid and discharging box 311 through the structure that the opening set up, and convenient to use person changes the refrigerating fluid after long-time use, avoids liquid to stink.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.

The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims (10)

1. An electric water heater with liquid cooling refrigeration mechanism, characterized in that: the electric heating mechanism is arranged at the end part of the inner container and extends to the inner part of the inner container, and the liquid cooling refrigerating mechanism is arranged outside the inner container;

the liquid cooling refrigeration mechanism comprises a liquid storage box, a cold guide box, a liquid pump and a semiconductor refrigeration module, wherein the cold guide box, the liquid storage box and the liquid pump are sequentially connected through a pipeline, the interiors of the cold guide box, the liquid storage box and the liquid pump are mutually communicated, the pipeline comprises a cold guide section, and the cold guide section is coiled inside and/or outside the liner;

the semiconductor refrigerating module is arranged close to the cold guide box, the semiconductor refrigerating module is provided with a semiconductor refrigerating piece, and the cold end face of the semiconductor refrigerating piece is mutually attached to the cold guide box.

2. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 1, wherein: the semiconductor refrigeration module further comprises a radiating block, and the hot end surface of the semiconductor refrigeration sheet is mutually attached to the radiating surface of the radiating block.

3. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 2, wherein: the heat dissipation block comprises a heat dissipation plate and a plurality of heat dissipation fins, one plate surface of the heat dissipation plate is attached to the hot end surface of the semiconductor refrigerating plate, the heat dissipation fins arranged at intervals are arranged on the other plate surface of the heat dissipation plate, and the heat dissipation fins vertically extend.

4. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 3, wherein: the semiconductor refrigeration module further comprises a cooling fan, wherein the cooling fan is arranged at the bottom of the cooling fin and is used for generating vertical upward air flow.

5. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 3, wherein: the semiconductor refrigeration module further comprises a first heat preservation piece, and the first heat preservation piece is positioned between the cold guide box and the heat dissipation plate;

the face of the first heat preservation piece is provided with a mounting hole for accommodating the semiconductor refrigerating piece, and the semiconductor refrigerating piece is mounted between the cold guide box and the heat dissipation plate through the first heat preservation piece.

6. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 1, wherein: the semiconductor refrigeration module further comprises a second heat preservation piece, and the second heat preservation piece is wrapped outside the cold guide box;

the second heat preservation piece comprises a heat preservation frame and a heat preservation strip, and the heat preservation frame and the heat preservation strip jointly enclose a heat preservation cavity for accommodating the cold guide box.

7. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 5, wherein: the semiconductor cooling fin, the heat dissipation block and the first heat preservation piece are a group of cooling heat dissipation pieces, at least two groups of cooling heat dissipation pieces are arranged, and the cold end faces of the semiconductor cooling fin in the cooling heat dissipation pieces are mutually attached to the cold guide box.

8. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 1, wherein: the inner container is arranged in the first mounting part, and the liquid-cooled refrigeration mechanism is arranged in the second mounting part;

the side wall of the second installation part is provided with a plurality of radiating holes, and the setting positions of the radiating holes are mutually corresponding to the positions of the radiating ends of the liquid-cooled refrigeration mechanism.

9. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 8, wherein: the inside of second installation department is provided with first mount pad and second mount pad, just first mount pad is used for installing the liquid reserve tank, the second mount pad is used for installing semiconductor refrigeration module.

10. An electric water heater with a liquid-cooled refrigeration mechanism as recited in claim 1, wherein: the liquid storage tank comprises a tank body and a cover body, wherein the cover body is used for opening and closing an opening of the tank body.

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