CN215819070U - Transparent cover plate and electronic equipment - Google Patents
Transparent cover plate and electronic equipment Download PDFInfo
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- CN215819070U CN215819070U CN202121759064.1U CN202121759064U CN215819070U CN 215819070 U CN215819070 U CN 215819070U CN 202121759064 U CN202121759064 U CN 202121759064U CN 215819070 U CN215819070 U CN 215819070U
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- 239000000758 substrate Substances 0.000 claims abstract description 59
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Abstract
The application discloses transparent cover plate and electronic equipment. This transparent apron includes: the transparent substrate is provided with a first side and a second side which are arranged in a back-to-back manner; a transparent conductive layer disposed on a first side of the transparent substrate; and the electrode is electrically connected with the transparent conducting layer and used for providing an electric signal to the transparent conducting layer so as to enable the transparent conducting layer to generate heat. By the mode, the problems of condensation or fogging of the transparent cover plate of the electronic equipment in a low-temperature environment can be solved, so that the perspective of the transparent cover plate and the performance of the electronic product are improved.
Description
Technical Field
The present disclosure relates to cover plates for electronic devices, and particularly to a transparent cover plate and an electronic device.
Background
In recent years, with the improvement of living standard, the electronic products are more and more updated, and besides pursuing fashionable appearance and rich functions, the electronic products generally have high requirements on user experience.
The inventor of the present application finds that, in a long-term research and development process, when an electronic device such as a monitoring camera is in use, dew condensation or fogging may occur on the inner side of a transparent cover plate of the electronic device when the ambient temperature is low, so that image capturing is blurred.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application mainly solved is how to improve the transparent cover plate of electronic equipment and dewing or the problem such as fog under low temperature environment to improve the perspective of transparent cover plate and the performance of electronic product.
In order to solve the technical problem, the application adopts a technical scheme that: a transparent cover is provided. This transparent cover is used for electronic equipment, and this transparent cover includes: the transparent substrate is provided with a first side and a second side which are arranged in a back-to-back manner; a transparent conductive layer disposed on a first side of the transparent substrate; and the electrode is electrically connected with the transparent conducting layer and used for providing an electric signal to the transparent conducting layer so as to enable the transparent conducting layer to generate heat.
In one embodiment, the transparent cover further comprises: and the first antireflection layer is arranged on the second side of the transparent substrate and used for improving the transmissivity of the transparent substrate.
In one embodiment, the first antireflective layer comprises: at least one intermediate film layer; the protective layer, at least one intermediate film layer sets up between protective layer and transparent substrate.
In one embodiment, the intermediate film layer includes: a first film layer; the first film layer is positioned between the second film layer and the transparent substrate; the refractive index of the second film layer is smaller than that of the first film layer.
In one embodiment, the first film is Si3N4The second film layer is SiO2A film layer, a protective layer of MgF2And (5) film layer.
In one embodiment, the transparent cover further comprises: the second anti-reflection layer is arranged on one side, away from the transparent substrate, of the transparent conducting layer and used for improving the transmissivity of the transparent substrate; the electrode is arranged on one side of the transparent conducting layer, which is far away from the transparent substrate, and is positioned on the periphery of the second anti-reflection layer; the perspective side of the transparent cover plate is arranged at the same side as the first side of the transparent cover plate.
In one embodiment, the second antireflective layer comprises: the third film layer, the fourth film layer and the fifth film layer are sequentially stacked on one side, away from the transparent substrate, of the transparent conducting layer, and the third film layer is located between the transparent conducting layer and the fourth film layer; and the refractive index of the fifth film layer is smaller than that of the fourth film layer.
In one embodiment, the fourth layer is TiO2Film layer, Nb2O5Film layer, Ta2O5Film or Si3N4Any one of the film layers, the third film layer and the fifth film layer are made of SiO2And (5) film layer.
In one embodiment, the transparent substrate is tempered glass.
In order to solve the technical problem, the application adopts a technical scheme that: an electronic device is provided. The electronic equipment comprises a controller and the transparent cover plate, wherein the controller is connected with the electrodes and is used for providing electric signals for the electrodes.
The beneficial effect of this application is: be different from prior art, this application is used for electronic equipment's transparent cover plate to be equipped with transparent conducting layer and for this transparent conducting layer provides the electrode of signal of telecommunication in one side of transparent base plate for this transparent conducting layer can produce the heat, thereby makes the temperature of whole transparent cover plate rise, can avoid under low temperature environment, and transparent cover plate temperature is lower, and the inside (controller etc.) temperature of electronic equipment is higher, and makes the inboard (the one side that is close to the controller) of transparent cover plate produce dewfall or send out the fog scheduling problem. Therefore, the transparent cover plate of the electronic device can solve the problems of condensation, fogging and the like of the transparent cover plate of the electronic device in a low-temperature environment, and therefore the perspective property of the transparent cover plate and the performance of an electronic product can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of a first embodiment of a transparent cover plate according to the present application;
FIG. 2 is a schematic structural diagram of a second embodiment of the transparent cover of the present application;
FIG. 3 is a schematic structural diagram of a third embodiment of the transparent cover of the present application;
FIG. 4 is a schematic structural diagram of a fourth embodiment of the transparent cover of the present application;
fig. 5 is a schematic structural diagram of an embodiment of an electronic device according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
The transparent cover plate can be used for electronic products such as cameras, projectors and intelligent terminals, and the following embodiment transparent cover plate of the application is introduced based on the cameras.
The transparent cover of a camera typically suffers from two problems in outdoor applications: one is that dust is easily attached to the outer surface, resulting in later image blurring; the other is that the components and parts of the internal components of the camera generate heat, the transparent cover plate is in direct contact with the external environment, the temperature of the outer surface is the external temperature, the temperature of the inner side surface of the camera cover plate is basically close to the temperature of the outer surface due to the heat conduction relationship, and when the environmental temperature is low, dew condensation or fog formation and the like are easily generated on the inner side surface of the transparent cover plate, so that the camera shooting blur is caused.
In order to solve the problems, the application provides a transparent cover plate and an electronic device, which can solve the problem of camera blurring caused by condensation, fogging and the like and solve the problem that dust is easily attached to the outer surface.
The application firstly provides a transparent cover plate for electronic equipment. As shown in fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a transparent cover plate according to the present application. The transparent cover plate 10 of the present embodiment includes: a transparent substrate 11, a transparent conductive layer 12, and an electrode 13; the transparent substrate 11 is provided with a first side and a second side which are arranged oppositely; a transparent conductive layer 12 is disposed on a first side of the transparent substrate 11; the electrode 13 is electrically connected to the transparent conductive layer 12, and the electrode 13 is used to provide an electrical signal to the transparent conductive layer 12 to cause the transparent conductive layer 12 to generate heat.
The transparent substrate 11 of the present embodiment may be transparent glass.
In other embodiments, the transparent substrate may also be a transparent ceramic or a transparent substrate composed of polystyrene or polymethylmethacrylate, or the like.
The transparent cover plate 10 of the present embodiment is provided with a transparent conductive layer 12 and an electrode 13 for providing an electrical signal to the transparent conductive layer 12 on one side of a transparent substrate 11, so that the transparent conductive layer 12 can generate heat, thereby increasing the temperature of the whole transparent cover plate 10, and avoiding the problems of dewing or fogging on the inner side (the side close to the controller) of the transparent cover plate 10 due to the lower temperature of the transparent cover plate 10 and the higher temperature inside the electronic device (the controller, etc.) in a low temperature environment. Therefore, the present embodiment can improve the problems of dew condensation and fogging of the transparent cover 10 of the electronic device in a low temperature environment, and can improve the see-through property of the transparent cover 10 and the performance of the electronic product.
Alternatively, in order to improve the impact strength of the transparent cover plate 10, the transparent substrate 11 may be tempered glass, i.e., glass subjected to physical tempering treatment.
The transparent substrate 11 of the present embodiment includes a window region in the middle region and a non-window region located at the periphery of the window region, and the projection of the electrode 13 on the transparent substrate 11 is located in the non-window region so as not to affect the perspective of the window region.
The electrode 13 of the present embodiment includes a first electrode 131 and a second electrode 132, which are respectively connected to the positive electrode and the negative electrode of the power supply element.
In the case where the size of the transparent cover 10 is fixed, in order to enlarge the size of the window region as much as possible, the projections of the first electrode 131 and the second electrode 132 on the transparent substrate 11 are uniformly distributed in the non-window region.
The present application further proposes another embodiment of a transparent cover plate, as shown in fig. 2, fig. 2 is a schematic structural diagram of a second embodiment of the transparent cover plate of the present application. The transparent cover 20 of the present embodiment and the transparent cover 10 are as follows: the transparent cover plate 20 of this embodiment further includes a first anti-reflection layer 21, and the first anti-reflection layer 21 is disposed on the second side of the transparent substrate 11 for improving the transmittance of the transparent substrate 11.
Other structures of this embodiment can refer to the above embodiments, and are not described herein.
Optionally, the first antireflection layer 21 of this embodiment includes: a protective layer 211 and at least one intermediate film layer 212; at least one intermediate film layer 212 is disposed between the protective layer 211 and the transparent substrate 11; that is, the protection layer 211 is disposed on a side of the middle film layer 212 facing away from the transparent substrate 11, i.e., on an outermost side of the transparent cover plate 20, for protecting the transparent cover plate 20 from external contamination and the like.
The middle film layer 212 of the present embodiment includes: a first layer n1 and a second layer n 2; the first film layer n1 is located between the second film layer n2 and the transparent substrate 11; the refractive index of the second film layer n2 is smaller than that of the first film layer n 1. This structure enables adjustment of the spectral range of the light (visible light) transmittance of the cover plate as a whole.
Optionally, the first film n1 of this embodiment is Si3N4The second film layer n2 is SiO2And (5) film layer. In other embodiments, other types of film compositions or a single film layer may also be used as the middle film layer with an antireflection function, which is not limited specifically.
The intermediate film layer 212 of the present embodiment is made of Si3N4Film layer and SiO2The film lamination layer enables the middle film 212 to have both excellent passivation effect and low-density surface defects.
Optionally, the protection layer 211 of the embodiment is MgF2A film layer; MgF2The film layer is the outer surface layer of the transparent cover plate 20, has the antifouling performance of fluoride, and has better performance and durability as an inorganic substance. In other embodiments, the protective layer may also be another type of fluoride or another type of protective layer, and is not limited in particular.
Further, MgF2The refractive index of the film layer is less than SiO2The refractive index of the film layer can further improve the light (visible light) transmittance of the first antireflection layer 21.
In this embodiment, the first anti-reflection layer 21 only includes one middle film layer 212, which can reduce the thickness of the transparent cover plate 20.
In another embodiment, as shown in fig. 3, in order to increase the transmittance of the transparent cover plate 30, the first antireflection layer 31 of this embodiment may further include two middle film layers 212.
Of course, in other embodiments, the number of intermediate film layers may also be determined according to specific requirements.
Specifically, first antireflection layer 31 includes Si sequentially stacked and disposed on the second side of transparent substrate 113N4Film layer, SiO2Film layer, Si3N4Film layer, SiO2Film layer and MgF2And (5) film layer.
Wherein, is close to the transparent baseSi of the second side of the plate 113N4The thickness range of the film layer can be 8-22nm, and the thickness range can be 8nm, 10nm, 12nm, 14nm, 16nm, 18nm, 20nm, 22nm and the like; SiO near the second side of the transparent substrate 112The thickness range of the film layer can be 18-42nm, and the thickness range can be 18nm, 20nm, 24nm, 28nm, 32nm, 36nm, 40nm, 42nm and the like; near to MgF2Si of film layer3N4The thickness range of the film layer can be 78-122nm, and the thickness range can be 76nm, 80nm, 88nm, 96nm, 104nm, 112nm, 120nm, 122nm and the like; near to MgF2SiO of film layer2The thickness range of the film layer can be 48-82nm, and the thickness range can be 48nm, 50nm, 55nm, 60nm, 65nm, 70nm, 75nm, 80nm, 82nm and the like; MgF2The thickness of the film layer may be 18-42nm, and the thickness may be 18nm, 20nm, 24nm, 28nm, 32nm, 36nm, 40nm, 42nm, etc.
MgF2Film layer and the two Si3N4Film layer and two SiO2First antireflective layer 31 is an optical composite layer with antireflective properties. The composite layer has lower visible light reflectivity to the outside than the visible light reflectivity corresponding to the surface of the transparent glass, and can reduce the interference of ambient stray light, so that the composite layer has the function of increasing the definition of the transparent cover plate 30.
The present application further proposes another embodiment of a transparent cover plate, as shown in fig. 4, fig. 4 is a schematic structural diagram of a fourth embodiment of the transparent cover plate of the present application. The transparent cover plate 40 of the present embodiment is different from the transparent cover plate 30 of the embodiment of fig. 3 in that: the transparent cover 40 of the present embodiment further includes: and a second anti-reflection layer 41 arranged on the side of the transparent conductive layer 12 away from the transparent substrate 11 and used for improving the transmissivity of the transparent substrate 11.
In this embodiment, the second antireflection layer 41 includes: a third film layer n3, a fourth film layer n4 and a fifth film layer n5 which are sequentially stacked on one side of the transparent conductive layer 12, which is far away from the transparent substrate 11, wherein the third film layer n3 is positioned between the transparent conductive layer 12 and the fourth film layer n 4; the refractive index of the fifth film layer n5 is smaller than that of the fourth film layer n 4. This structure can improve the light (visible light) transmittance of second antireflection layer 41.
In this embodiment, the fourth film n4 is TiO2The third film n3 and the fifth film n5 are SiO2And (5) film layer.
In other embodiments, the fourth film layer may also be TiOx(x-1.5-2.0) film layer, Nb2O5Film layer, Ta2O5Film or Si3N4Any one of the film layers, the third film layer and the fifth film layer may be other film layers as long as the second antireflection layer is ensured to have better transmittance; the second antireflective layer may also be a single film layer with better transmission.
In this embodiment, TiO is used for second antireflection layer 412The film layer and the SiO2 film layer are laminated, so that the second anti-reflection layer 41 has both an excellent passivation effect and low-density surface defects.
The electrode 13 of this embodiment is disposed on a side of the transparent conductive layer 12 away from the transparent substrate 11 and located at the periphery of the second anti-reflection layer 41, a projection of the second anti-reflection layer 41 on the transparent substrate 11 overlaps with a window region of the transparent substrate 11, and a projection of the electrode 13 on the transparent substrate 11 overlaps with a non-window region of the transparent substrate 11, so that the perspective of the window region is not affected and the size of the transparent cover plate 40 is not increased.
The transparent conductive layer 12 of the present embodiment may be an Indium Tin Oxide (ITO) layer, which serves as a planar heater of the transparent substrate 11, and when the transparent substrate 11 is heated by applying electricity, the temperature of the transparent substrate 11 may reach a level which is a few degrees celsius to a dozen degrees celsius higher than the ambient temperature under proper voltage control. Through the design of circuit, the temperature of the surface of the window area of the transparent substrate 11 is relatively high, and under the low-temperature or humid external environment, the temperature reaches above the dew point temperature corresponding to the environment, so that the situations of dewing or fogging and the like of the window or the lens are effectively avoided. On the other hand, the ITO layer is used as a transparent dielectric layer to realize an optical composite layer with a light reflection reducing function with the third film layer n3, the fourth film layer n4 and the fifth film layer n 5. The composite layer has lower visible light reflectivity to the outside than the visible light reflectivity corresponding to the surface of the transparent glass, and can reduce the interference of environment stray light, so that the composite layer has the function of increasing the definition of the transparent cover plate 30; the electrode 13 may be a silver electrode layer, which is a lead electrode of a heating circuit in the electronic device, in contact with the ITO layer.
The thickness range of the transparent conductive layer 12 may be 18-42nm, and the thickness range may be 18nm, 20nm, 24nm, 28nm, 32nm, 36nm, 40nm, 42nm, and the like; the surface resistance of the transparent conductive layer 12 ranges from 40 to 100 ohms/Square (Ohm/Square); the resistance may be 40Ohm/Square, 50Ohm/Square, 60Ohm/Square, 70Ohm/Square, 80Ohm/Square, 90Ohm/Square, 100Ohm/Square, and 110 Ohm/Square; third film n3 (SiO)2Film layer) can be 28-47nm, and the thickness can be 28nm, 30nm, 34nm, 38nm, 42nm, 45nm, 47nm, etc.; fourth film n4 (TiO)2Film layer) can be 78-107nm, and the thickness can be 78nm, 80nm, 85nm, 90nm, 95nm, 100nm, 105nm, 107nm, etc.; fifth film n5 (SiO)2Film layer) may be 68-98nm, and the thickness may be 68nm, 70nm, 75nm, 80nm, 85nm, 90nm, 95nm, 98nm, and the like.
In an application scene, in the manufacturing process of the transparent cover plate 40, the glass substrate is physically strengthened to form strengthened glass; then, carrying out ITO film coating on the first side surface of the tempered glass to form an ITO film layer; then, silk-screen printing peelable glue on the edge of the surface of one side, away from the tempered glass, of the ITO film layer twice (corresponding to the position of the overlapped silver electrode), and baking for 40 minutes at 80 ℃; then SiO is carried out on the surfaces of the ITO film layer and the strippable glue2Film coating to form SiO2A film layer; then on SiO2Carrying out TiO2 film coating on the surface of the film layer departing from the ITO film layer to form TiO2A film layer; followed by reaction with TiO2Film layer deviating from SiO2SiO on the surface of the film layer2Coating a film to form another SiO layer2A film layer; then Si is carried out on the second side surface of the tempered glass3N4Coating is carried out by using a Si target and a medium-frequency reactive magnetron sputtering mode and introducing Ar gas and N2Gas to form Si3N4A film layer; then on Si3N4SiO is carried out on the surface of the film layer deviating from the tempered glass2Coating is carried out by using a Si target and a medium-frequency reactive magnetron sputtering mode and introducing Ar gas and O2Gas to form further SiO2A film layer; then on the further SiO2Film layer deviating from Si3N4Surface of the film layer is subjected to Si3N4Coating is carried out by using a Si target and a medium-frequency reactive magnetron sputtering mode and introducing Ar gas and N2Gas to form another Si3N4A film layer; then in the other Si3N4The film layer is away from the further SiO2SiO is carried out on the surface of the film layer2Coating is carried out by using a Si target and a medium-frequency reactive magnetron sputtering mode and introducing Ar gas and O2Gas to form further SiO2A film layer; then in the further SiO2The film layer is away from the other Si3N4MgF is carried out on the surface of the film layer2Coating by electron beam evaporation to form MgF2A film layer; and finally, peeling off the peelable glue and the film layer on the peelable glue to form an electrode position, and arranging a silver electrode at the electrode position.
In other embodiments, the second antireflection layer may also be disposed based on the other embodiments, such as the embodiments in fig. 1 and fig. 2.
The first side of the transparent cover plate 11 and the see-through side of the transparent cover plate 11 in the above embodiments of the present application are disposed on the same side, that is, the electrode 13 and the transparent conductive layer 12 are located on the inner side (the side opposite to the see-through side) of the transparent cover plate 11, so that the electrode 13 can be connected to a power supply element in an electronic device.
The transparent cover plate has the following properties:
the visible light transmittance can reach 97 percent; the contact angle of deionized water is 110 ℃; the heating resistance value is 20-50 ohm; the 24V heating power is 11-25 watts; the 12V heating power is 3-7 watts; the 4.5V heating power is 0.5-1 watt, etc.
The present application further provides an electronic device, as shown in fig. 5, fig. 5 is a schematic structural diagram of an embodiment of the electronic device of the present application. The electronic device 50 of the embodiment includes a controller 51 and a transparent cover 52, wherein the controller 51 is connected to the transparent cover 52 and is configured to provide an electrical signal to the transparent cover 52, so that the transparent cover 52 generates heat, and the temperature of the transparent cover 52 is increased, thereby avoiding the problems of low temperature of the transparent cover 52 and high internal temperature of the electronic device 50, which may cause condensation or fogging on the inner side of the transparent cover 52 in a low temperature environment.
The structure, the operation principle, and the like of the transparent cover plate 52 of this embodiment can refer to the above embodiments, and are not described herein.
Further, the electronic device 50 of the embodiment may further include a temperature sensor (not shown), and the controller 51, wherein the controller 51 controls the temperature sensor to obtain the external environment temperature, and controls the transparent cover 52 to heat according to the external environment temperature.
Further, the electronic device 50 of the present embodiment may further include another temperature sensor (not shown) for detecting the temperature inside the electronic device 50 and controlling the transparent cover 52 to heat according to the external environment temperature of the internal thermometer.
Specifically, the controller 51 of the present embodiment is connected to the electrode 13, and is configured to provide an electrical signal to the electrode 13 to control the transparent conductive layer 12 connected to the electrode 13 to heat the transparent substrate 11.
The electronic device 50 of the present embodiment may be a camera, a projector, a smart terminal, or the like.
Be different from prior art, this application transparent cover is used for electronic equipment, and this transparent cover includes: the transparent substrate is provided with a first side and a second side which are arranged in a back-to-back manner; a transparent conductive layer disposed on a first side of the transparent substrate; and the electrode is electrically connected with the transparent conducting layer and used for providing an electric signal to the transparent conducting layer so as to enable the transparent conducting layer to generate heat. The transparent cover plate is provided with the transparent conducting layer on one side of the transparent substrate and provides an electrode of an electric signal for the transparent conducting layer, so that the transparent conducting layer can generate heat, the temperature of the whole transparent cover plate is increased, the temperature of the transparent cover plate can be prevented from being increased under a low-temperature environment, the temperature inside electronic equipment (such as a controller) is higher, and the inner side (close to one side of the controller) of the transparent cover plate generates dewing or fogging problems. Therefore, the transparent cover plate of the electronic device can solve the problems of condensation, fogging and the like of the transparent cover plate of the electronic device in a low-temperature environment, and therefore the perspective property of the transparent cover plate and the performance of an electronic product can be improved.
Furthermore, the heating of the transparent cover plate is uniform heating of the whole surface, and each point in the window area can be synchronously soaked; the transparent cover plate has antifouling performance, and has better performance stability on the basis of fluoride; compared with the common glass cover plate, the transparent cover plate has higher visible light transmittance and lower visible light reflectivity, and the definition of monitoring images is improved; the glass of the transparent cover plate is subjected to physical strengthening treatment, and the impact strength is high.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A transparent cover for an electronic device, the transparent cover comprising:
the transparent substrate is provided with a first side and a second side which are arranged in a back-to-back manner;
a transparent conductive layer disposed on a first side of the transparent substrate;
and the electrode is electrically connected with the transparent conducting layer and used for providing an electric signal to the transparent conducting layer so as to enable the transparent conducting layer to generate heat.
2. The transparent cover sheet according to claim 1, further comprising: a first antireflective layer disposed on the second side of the transparent substrate for increasing the transmittance of the transparent substrate.
3. The transparent cover sheet of claim 2, wherein the first antireflective layer comprises:
at least one intermediate film layer;
a protective layer, the at least one intermediate film layer disposed between the protective layer and the transparent substrate.
4. The transparent cover sheet according to claim 3, wherein the intermediate film layer comprises:
a first film layer;
a second film layer, the first film layer being located between the second film layer and the transparent substrate;
wherein the refractive index of the second film layer is less than the refractive index of the first film layer.
5. The transparent cover sheet according to claim 4, wherein the first film layer is Si3N4A film layer, the second film layer is SiO2A film layer, the protective layer is MgF2And (5) film layer.
6. The transparent cover sheet according to claim 1, further comprising: the second antireflection layer is arranged on one side, away from the transparent substrate, of the transparent conducting layer and used for improving the transmissivity of the transparent substrate;
the electrode is arranged on one side, away from the transparent substrate, of the transparent conducting layer and is positioned on the periphery of the second antireflection layer;
the perspective side of the transparent cover plate is arranged on the same side as the first side of the transparent cover plate.
7. The transparent cover sheet of claim 6, wherein the second antireflective layer comprises: a third film layer, a fourth film layer and a fifth film layer are sequentially stacked on one side, away from the transparent substrate, of the transparent conductive layer, wherein the third film layer is located between the transparent conductive layer and the fourth film layer;
wherein the refractive index of the fifth film layer is less than the refractive index of the fourth film layer.
8. The transparent cover according to claim 7The board is characterized in that the fourth film layer is TiO2Film layer, Nb2O5Film layer, Ta2O5Film or Si3N4Any one of the layers, the third layer and the fifth layer are SiO2And (5) film layer.
9. The transparent cover sheet according to claim 1, wherein the transparent substrate is a tempered glass.
10. An electronic device comprising a controller and the transparent cover of any one of claims 1 to 9, wherein the controller is connected to the electrodes for providing electrical signals to the electrodes.
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| CN202121759064.1U CN215819070U (en) | 2021-07-29 | 2021-07-29 | Transparent cover plate and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597179A (en) * | 2021-07-29 | 2021-11-02 | 富士新材(深圳)有限公司 | Transparent cover plate, preparation method thereof and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597179A (en) * | 2021-07-29 | 2021-11-02 | 富士新材(深圳)有限公司 | Transparent cover plate, preparation method thereof and electronic equipment |
| CN113597179B (en) * | 2021-07-29 | 2025-03-07 | 富士新材(深圳)有限公司 | Transparent cover plate and preparation method thereof, and electronic device |
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