CN201590985U - Liquid cooling plate - Google Patents
Liquid cooling plate Download PDFInfo
- Publication number
- CN201590985U CN201590985U CN2010201034411U CN201020103441U CN201590985U CN 201590985 U CN201590985 U CN 201590985U CN 2010201034411 U CN2010201034411 U CN 2010201034411U CN 201020103441 U CN201020103441 U CN 201020103441U CN 201590985 U CN201590985 U CN 201590985U
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- liquid cooling
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- soaking
- plate
- unit
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Abstract
The utility model relates to a liquid cooling plate, which comprises a liquid cooling unit and a soaking unit. The soaking unit rapidly and evenly transmits heat energy of a heat source to the liquid cooling unit; and the soaking unit and the liquid cooling unit are an integral structure. By organically combining a soaking and head radiation structure and a liquid cooling heat radiation structure, the liquid cooling plate not only eliminates local heat points of a high heat flow density device and a local heat energy concentrated module, but also effectively solves the heat radiation problem of large power heat energy. As the soaking unit contacts with the heat source, and the soaking unit enables the heat energy to be rapidly and evenly transmitted onto the upper surface of the soaking unit by a phase transition process, thereby the liquid cooling plate can effectively eliminate the local heat points of the high heat flow density device and the local heat energy concentrated module. As the liquid cooling unit adopts a liquid cooling heat radiation method and brings out the heat energy of the heat source by a high-efficient convection heat exchange method, thereby the liquid cooling plate has comparatively strong head radiation capacity, and can realize heat radiation of large power heat energy.
Description
Technical field
The utility model relates to a kind of device that is used for electronic equipment chip or module heat dissipating, particularly relates to a kind of liquid cooling plate.
Background technology
Along with development of electronic technology, the integrated level of electronic equipment is more and more higher, and not only the caloric value of electronic equipment chips or module is increasing, and has characteristics such as local heat flux density is big.Studies show that local heat flux density's conference makes heat assemble in the part, produce hot localised points, not only influence the serviceability and the functional reliability of chip or module, and can shorten the working life of chip or module at chip or module surface.
The heat abstractor of electronic equipment mainly comprises wind-cooling heat dissipating device and liquid-cooling heat radiator, because the high heat capacity and the high conductance of liquid, liquid-cooling heat radiator has the heat-sinking capability stronger than wind-cooling heat dissipating device.At present, existing electronic equipment adopts the liquid cooling plate in direct contact heat source as liquid-cooling heat radiator usually, and the liquid cooling plate directly contacts with thermal source, and the heat transferred of thermal source in the liquid of its internal flow, is taken away heat by the circulation of liquid.But actual the use shows, though the liquid cooling plate can be realized bigger heat dissipation capacity, is subjected to the restriction of heat convection mechanism, and the heat exchange rate of liquid cooling plate is lower, and for the big thermal source of local heat flux density, there is the technological deficiency that can not eliminate hot localised points in the liquid cooling plate.For this reason, prior art has proposed multiple solution, local channel optimal design as local multitube road, concentrate the hot localised points of module to eliminate high heat flux device or amount of localized heat, but because local high density thermal source size is less, the space that can carry out CHANNEL OPTIMIZATION is very little, so these solutions of prior art can not effectively be eliminated hot localised points.
The utility model content
The technical problems to be solved in the utility model provides a kind of liquid cooling plate, can effectively eliminate the hot localised points that high heat flux device or amount of localized heat are concentrated module.
For solving the problems of the technologies described above, the utility model provides a kind of liquid cooling plate, comprises liquid cooling unit, also comprises the equal hot cell that the heat of thermal source is delivered to fast, equably described liquid cooling unit, and described equal hot cell and described liquid cooling unit are structure as a whole.
Further, described soaking unit comprises fixing soaking base plate and the soaking cover plate that also forms vacuum cavity betwixt of periphery welding, is provided with working medium in the described vacuum cavity.
Further, described working medium is water or alcohol.
Further, described soaking base plate and soaking cover plate are metallic article.
Further, described metallic article is copper product, aluminum products or stainless steel products.
Further, be provided with the micro-channel capillary structure in the described vacuum cavity.
On aforementioned techniques scheme basis, described liquid cooling unit comprises fixing liquid cooling base plate and the liquid cooling cover plate that also forms liquid flow path betwixt of welding, and described liquid cooling base plate and soaking cover plate are structure as a whole.
Further, described liquid cooling unit is provided with inlet and liquid outlet.
The utility model provides a kind of liquid cooling plate, combination by soaking radiator structure and liquid cooling radiator structure, not only effectively eliminate high heat flux device or amount of localized heat and concentrated the hot localised points of module, and efficiently solved the heat dissipation problem of big power-consumption heat.Because all hot cell contacts with thermal source, soaking unit by using phase transition process can make the thermal source heat be delivered to the upper surface (also be the lower surface of liquid cooling unit simultaneously) of equal hot cell fast, equably, so the utility model can effectively be eliminated the hot localised points that high heat flux device or amount of localized heat are concentrated module; Because liquid cooling unit adopts the liquid cooling radiating mode, utilize efficiently the heat convection mode that the heat of thermal source is taken away, therefore the utlity model has stronger heat-sinking capability, can realize the heat radiation of big power-consumption heat.The utility model has been simplified the structure of liquid cooling plate, has reduced design difficulty and production cost, is with a wide range of applications.
Description of drawings
Fig. 1 is the structural representation of the utility model liquid cooling plate.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further details.
Fig. 1 is the structural representation of the utility model liquid cooling plate.The utility model liquid cooling plate comprises the equal hot cell 1 and the liquid cooling unit 2 of integrative-structure, all hot cell 1 contacts with thermal source 3, be used for the heat of thermal source 3 is delivered to liquid cooling unit 2 fast, equably, liquid cooling unit 2 is used for by the heat convection mode with the liquid of heat transferred to its internal flow, by the circulation realization heat radiation of liquid.
As shown in Figure 1, the equal hot cell 1 of the utility model comprises soaking base plate 11 and soaking cover plate 12, soaking base plate 11 is fixing by welding with the periphery of soaking cover plate 12, and between soaking base plate 11 and soaking cover plate 12, form vacuum cavity 13, be provided with lower boiling working medium in the vacuum cavity 13, as water or alcohol etc.When all hot cell 1 is worked, soaking base plate 11, the heat that thermal source 3 produces is by absorbing rapidly and conduct with the thermal source 3 tight soaking base plates that contact 11, and the temperature constantly working medium of 11 pairs of vacuum cavity 13 bottoms of soaking base plate of rising heats; Working medium after the heating produces evaporative phase-change, is converted into gaseous working medium by liquid refrigerant, and the gaseous working medium after the evaporation is full of whole vacuum cavity 13 very soon; Just can produce the phase transformation of condensing when gaseous working medium touches the lower soaking cover plate 12 of temperature, be converted into liquid refrigerant by gaseous working medium, the liquid refrigerant after condensing is back to the bottom of vacuum cavity 13 by the sidewall of vacuum cavity 13.In said process, it is endothermic process that working medium produces evaporative phase-change, and working medium absorbs heat reduces the temperature of soaking base plate 11, and it is exothermic process that working medium produces the phase transformation of condensing, and the working medium release heat raises the temperature of soaking cover plate 12, therefore realizes heat transferred.Working medium can absorb new heat energy again after being back to vacuum cavity 13 bottoms, and by phase transformation heat transferred is arrived soaking cover plate 12 once again, forms new heat transfer cycle.Heat transfer process by equal hot cell as can be seen, soaking unit by using latent heat of phase change carries out heat transmission, because phase-change heat-exchange has the heat exchange rate height and heat is big, so the equal hot cell of the utility model can apace that local heat flux density is big heat transferred come out.In addition, even the size of thermal source is less, but heat transmits by all areas of soaking base plate and soaking cover plate, so heat transferred is uniform.
In the practical application, soaking base plate and soaking cover plate can adopt the metal material of copper, aluminium, stainless steel or other good heat conductivity.Soaking base plate and soaking cover plate are the plate body shape, can adopt inner surface to offer the structure of groove, also can adopt the plate body periphery to be bent to form the structure of sidewall, after the periphery welding of soaking base plate and soaking cover plate is fixing, makes between soaking base plate and the soaking cover plate and form vacuum cavity.In addition, in order to strengthen heat exchange efficiency, can also be provided with the micro-channel capillary structure in the vacuum cavity.The equal hot cell of the utility model also can adopt soaking plate (VaporChamber) structure of usual other form that adopts of those skilled in the art.
As shown in Figure 1, the utility model liquid cooling unit 2 comprises liquid cooling base plate 21 and liquid cooling cover plate 22, liquid cooling base plate 21 is fixing by welding with liquid cooling cover plate 22, and forms liquid flow path 23 between liquid cooling base plate 21 and liquid cooling cover plate 22, and liquid cooling base plate 21 is structure as a whole with soaking cover plate 12.During liquid cooling unit 2 work, liquid cooling base plate 21 (being soaking cover plate 12) will be from the heat transferred of thermal source 3 in the liquid of flow channel 23, and liquid is taken heat out of by circulating.
Liquid cooling unit adopts and equal hot cell identical materials, can the employing machine adds, digs mode such as mill and process flow channel, and form inlet and liquid outlet at periphery, and cooling flows into from inlet with liquid, from the liquid outlet outflow, finishes the cycle heat exchange process.In the practical application, liquid cooling base plate, liquid cooling cover plate, flow channel, inlet and liquid outlet etc. can adopt the usual version that adopts of those skilled in the art, repeat no more here.
By technique scheme as can be seen, the utility model is a kind of technical scheme with soaking radiator structure and the combination of liquid cooling radiator structure, not only effectively eliminate high heat flux device or amount of localized heat and concentrated the hot localised points of module, and efficiently solved the heat dissipation problem of big power-consumption heat.Because all hot cell contacts with thermal source, soaking unit by using phase transition process can make the thermal source heat be delivered to the upper surface (also be the lower surface of liquid cooling unit simultaneously) of equal hot cell fast, equably, so the utility model can effectively be eliminated the hot localised points that high heat flux device or amount of localized heat are concentrated module; Because liquid cooling unit adopts the liquid cooling radiating mode, utilize efficiently the heat convection mode that the heat of thermal source is taken away, therefore the utlity model has stronger heat-sinking capability, can realize the heat radiation of big power-consumption heat.Compare with prior art liquid cooling plate, the utility model is owing to adopted equal hot cell, make to optimize by the local channel in the design of liquid cooling plate and solve local high density heat concentration problem, simplified the structure of liquid cooling plate, reduced design difficulty and production cost.
The above is a preferred embodiment of the present utility model only, is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (8)
1. a liquid cooling plate comprises liquid cooling unit, it is characterized in that: also comprise the equal hot cell that the heat of thermal source is delivered to fast, equably described liquid cooling unit, described equal hot cell and described liquid cooling unit are structure as a whole.
2. liquid cooling plate as claimed in claim 1 is characterized in that: described soaking unit comprises fixing soaking base plate and the soaking cover plate that also forms vacuum cavity betwixt of periphery welding, is provided with working medium in the described vacuum cavity.
3. liquid cooling plate as claimed in claim 2 is characterized in that: described working medium is water or alcohol.
4. liquid cooling plate as claimed in claim 2 is characterized in that: described soaking base plate and soaking cover plate are metallic article.
5. liquid cooling plate as claimed in claim 4 is characterized in that: described metallic article is copper product, aluminum products or stainless steel products.
6. liquid cooling plate as claimed in claim 2 is characterized in that: be provided with the micro-channel capillary structure in the described vacuum cavity.
7. as arbitrary described liquid cooling plate in the claim 2～6, it is characterized in that: described liquid cooling unit comprises fixing liquid cooling base plate and the liquid cooling cover plate that also forms liquid flow path betwixt of welding, and described liquid cooling base plate and soaking cover plate are structure as a whole.
8. liquid cooling plate as claimed in claim 7 is characterized in that: described liquid cooling unit is provided with inlet and liquid outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201034411U CN201590985U (en) | 2010-01-25 | 2010-01-25 | Liquid cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201034411U CN201590985U (en) | 2010-01-25 | 2010-01-25 | Liquid cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201590985U true CN201590985U (en) | 2010-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201034411U Expired - Lifetime CN201590985U (en) | 2010-01-25 | 2010-01-25 | Liquid cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201590985U (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511577A (en) * | 2015-12-08 | 2016-04-20 | 山东超越数控电子有限公司 | High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling |
| CN105636411A (en) * | 2015-12-30 | 2016-06-01 | 中国电子科技集团公司第二十六研究所 | Manufacturing method of metal runners used for liquid cooling and liquid cooling metal runner cold plate |
| WO2016173286A1 (en) * | 2015-04-28 | 2016-11-03 | 中兴通讯股份有限公司 | Liquid cooling radiator and electronic device |
| CN106102418A (en) * | 2016-07-22 | 2016-11-09 | 中国船舶重工集团公司第七二四研究所 | Liquid based on soaking plate cold VPX cabinet efficient radiating apparatus and method |
| CN106197108A (en) * | 2016-07-29 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of board-like liquid cold temperature-uniforming plate composite heating radiator |
| CN106659094A (en) * | 2017-01-23 | 2017-05-10 | 中航光电科技股份有限公司 | Liquid cooling plate |
| CN107864595A (en) * | 2017-11-15 | 2018-03-30 | 深圳市迈安热控科技有限公司 | Heat pipe for conductive heat dissipation device |
| CN108811447A (en) * | 2018-06-26 | 2018-11-13 | 西安交通大学 | A kind of liquid cooling plate of tape channel |
| CN109099744A (en) * | 2018-09-27 | 2018-12-28 | 朱钢 | Heat exchanger and the new energy vehicles |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN110139539A (en) * | 2019-05-27 | 2019-08-16 | 天津大学 | It is a kind of for microwave from the self assembly microchannel structural design and implementation method of package platforms |
| CN110296616A (en) * | 2019-06-04 | 2019-10-01 | 常州大学 | A kind of misting cooling heat exchanger |
| CN112201633A (en) * | 2020-09-08 | 2021-01-08 | 华南理工大学 | Liquid cooling integrated inflation type soaking plate and manufacturing method thereof |
| US11016546B2 (en) | 2016-12-29 | 2021-05-25 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus and terminal device having same |
-
2010
- 2010-01-25 CN CN2010201034411U patent/CN201590985U/en not_active Expired - Lifetime
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016173286A1 (en) * | 2015-04-28 | 2016-11-03 | 中兴通讯股份有限公司 | Liquid cooling radiator and electronic device |
| CN105511577A (en) * | 2015-12-08 | 2016-04-20 | 山东超越数控电子有限公司 | High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling |
| CN105636411B (en) * | 2015-12-30 | 2018-02-16 | 中国电子科技集团公司第二十六研究所 | The colod-application metal flow passage preparation method of liquid and liquid cold metal runner cold drawing |
| CN105636411A (en) * | 2015-12-30 | 2016-06-01 | 中国电子科技集团公司第二十六研究所 | Manufacturing method of metal runners used for liquid cooling and liquid cooling metal runner cold plate |
| CN106102418A (en) * | 2016-07-22 | 2016-11-09 | 中国船舶重工集团公司第七二四研究所 | Liquid based on soaking plate cold VPX cabinet efficient radiating apparatus and method |
| CN106102418B (en) * | 2016-07-22 | 2018-04-03 | 中国船舶重工集团公司第七二四研究所 | The cold VPX cabinets efficient radiating apparatus of liquid and method based on soaking plate |
| CN106197108A (en) * | 2016-07-29 | 2016-12-07 | 广州华钻电子科技有限公司 | A kind of board-like liquid cold temperature-uniforming plate composite heating radiator |
| US11016546B2 (en) | 2016-12-29 | 2021-05-25 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus and terminal device having same |
| CN106659094A (en) * | 2017-01-23 | 2017-05-10 | 中航光电科技股份有限公司 | Liquid cooling plate |
| CN107864595A (en) * | 2017-11-15 | 2018-03-30 | 深圳市迈安热控科技有限公司 | Heat pipe for conductive heat dissipation device |
| CN108811447A (en) * | 2018-06-26 | 2018-11-13 | 西安交通大学 | A kind of liquid cooling plate of tape channel |
| CN109099744A (en) * | 2018-09-27 | 2018-12-28 | 朱钢 | Heat exchanger and the new energy vehicles |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN110139539A (en) * | 2019-05-27 | 2019-08-16 | 天津大学 | It is a kind of for microwave from the self assembly microchannel structural design and implementation method of package platforms |
| CN110296616A (en) * | 2019-06-04 | 2019-10-01 | 常州大学 | A kind of misting cooling heat exchanger |
| CN112201633A (en) * | 2020-09-08 | 2021-01-08 | 华南理工大学 | Liquid cooling integrated inflation type soaking plate and manufacturing method thereof |
| CN112201633B (en) * | 2020-09-08 | 2024-08-06 | 华南理工大学 | Liquid-cooled integrated inflation type vapor chamber and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100922 |