CN207852680U - A kind of energy-saving type low voltage chip voltage stabilizing triode - Google Patents
A kind of energy-saving type low voltage chip voltage stabilizing triode Download PDFInfo
- Publication number
- CN207852680U CN207852680U CN201820286436.5U CN201820286436U CN207852680U CN 207852680 U CN207852680 U CN 207852680U CN 201820286436 U CN201820286436 U CN 201820286436U CN 207852680 U CN207852680 U CN 207852680U
- Authority
- CN
- China
- Prior art keywords
- energy
- pin
- type low
- saving type
- low voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Thermally Actuated Switches (AREA)
Abstract
The utility model discloses a kind of energy-saving type low voltage chip voltage stabilizing triodes, including epoxy encapsulation body, the front surface of the epoxy encapsulation body is provided with graphite heat radiation fin, the junction of the epoxy encapsulation body and graphite heat radiation fin is provided with heat conduction adhesive layer, the graphite heat radiation fin is bonded in the front surface of epoxy encapsulation body by heat conduction adhesive layer, and the upper surface of the epoxy encapsulation body is inlaid with metallic plate；Vinyon protective case is provided on energy-saving type low voltage chip voltage stabilizing triode; it prevents from the installation foot on energy-saving type low voltage chip voltage stabilizing triode from bending in storage even to damage; graphite heat radiation fin is provided on energy-saving type low voltage chip voltage stabilizing triode; keep the heat dissipation performance of energy-saving type low voltage chip voltage stabilizing triode more preferable; insulating layer is provided on the installation foot of energy-saving type low voltage chip voltage stabilizing triode, to prevent the installation foot on energy-saving type low voltage chip voltage stabilizing triode from short circuit occurring when in use.
Description
Technical field
The utility model belongs to triode technical field, and in particular to a kind of energy-saving type low voltage chip voltage stabilizing triode.
Background technology
Triode full name should be transistor, also referred to as transistor, be a kind of semiconductor devices of control electric current,
Its effect is that small-signal is zoomed into the larger electric signal of range value, also serves as noncontacting switch, transistor is partly to lead
One of basic component of body has Current amplifier effect, is the core element of electronic circuit.
Energy-saving type low voltage chip voltage stabilizing triode will produce a large amount of heat when working long hours, however traditional section
Can type low-voltage chip voltage stabilizing triode due to relatively simple for structure, cause to lack on energy-saving type low voltage chip voltage stabilizing triode
Corresponding radiator structure so that the thermal diffusivity of energy-saving type low voltage chip voltage stabilizing triode is general, and secondly, traditional is energy-saving low
Voltage chip voltage stabilizing triode causes energy-saving type low voltage chip voltage stabilizing triode storing due to lacking corresponding protection structure
When, the installation foot on energy-saving type low voltage chip voltage stabilizing triode, which is easy to bend, even to be damaged, and influences user to section
The normal use of energy type low-voltage chip voltage stabilizing triode, in addition, on traditional energy-saving type low voltage chip voltage stabilizing triode
Installation foot causes energy-saving type low voltage chip voltage stabilizing triode to there is short circuit when in use due to lacking corresponding insulation system
Security risk influences usage experience of the user to energy-saving type low voltage chip voltage stabilizing triode.
Utility model content
The purpose of this utility model is to provide a kind of energy-saving type low voltage chip voltage stabilizing triodes, to solve above-mentioned background
The traditional energy-saving type low voltage chip voltage stabilizing triode proposed in technology leads to energy-saving type low voltage due to relatively simple for structure
Lack corresponding radiator structure on chip voltage stabilizing triode so that the thermal diffusivity one of energy-saving type low voltage chip voltage stabilizing triode
As, secondly, traditional energy-saving type low voltage chip voltage stabilizing triode leads to energy-saving low electricity due to lacking corresponding protection structure
In storage, the installation foot on energy-saving type low voltage chip voltage stabilizing triode is easy to bend very tabletting type voltage stabilizing triode
To being damage, normal use of the user to energy-saving type low voltage chip voltage stabilizing triode is influenced, in addition, traditional energy-saving low electricity
Installation foot on tabletting type voltage stabilizing triode leads to three pole of energy-saving type low voltage chip voltage stabilizing due to lacking corresponding insulation system
There is the security risk of short circuit in pipe, influence user to the usage experience of energy-saving type low voltage chip voltage stabilizing triode when in use
Problem.
To achieve the above object, the utility model provides the following technical solutions：A kind of energy-saving type low voltage chip voltage stabilizing three
The front surface of pole pipe, including epoxy encapsulation body, the epoxy encapsulation body is provided with graphite heat radiation fin, the asphalt mixtures modified by epoxy resin
The junction of fat packaging body and graphite heat radiation fin is provided with heat conduction adhesive layer, and the graphite heat radiation fin is bonded by heat conduction adhesive layer
It is inlaid with metallic plate, the epoxy resin in the upper surface of the front surface of epoxy encapsulation body, the epoxy encapsulation body
The lower surface of packaging body is inlaid with second pin, and the side of the second pin is inlaid with the first pin, the second pin
The other side is inlaid with third pin, and vinyon protective case, the third are provided with below the epoxy encapsulation body
It is welded with installation foot below pin, the outer surface of the installation foot is coated with insulating layer, on the vinyon protective case
Limiting slot corresponding with installation foot is offered, the vinyon protective case has been internally embedded metallic framework.
Preferably, the installation foot is rectangular parallelepiped structure, and installation foot is fixed on the of rectangular parallelepiped structure by welding manner
One end of three pins.
Preferably, there are two the graphite heat radiation fin is arranged in total, two graphite heat radiation fins are separately positioned on epoxy resin
Encapsulate body front surface and rear surface.
Preferably, the vinyon protective case is rectangular parallelepiped structure, is offered on vinyon protective case and the
One pin, second pin and corresponding second limiting groove of third pin, and vinyon protective case is internally embedded
There is the metallic framework of U-typed.
Preferably, the second pin is rectangular parallelepiped structure, and the shape of second pin and the first pin and third pin
Shape is identical.
Preferably, the epoxy encapsulation body is rectangular parallelepiped structure, offers on epoxy encapsulation body and draws with second
The corresponding third limiting groove of foot.
Compared with prior art, the utility model has the beneficial effects that：
1. being provided with vinyon protective case on energy-saving type low voltage chip voltage stabilizing triode, work as energy-saving type low voltage
When chip voltage stabilizing triode needs storage, the installation foot on energy-saving type low voltage chip voltage stabilizing triode can be inserted into poly- by user
In limiting slot on vinyl plastics protective case, to prevent the installation foot on energy-saving type low voltage chip voltage stabilizing triode from storing
When bend and even damage, and then ensure normal use of the user to energy-saving type low voltage chip voltage stabilizing triode.
2. being provided with graphite heat radiation fin on energy-saving type low voltage chip voltage stabilizing triode, surpass since graphite heat radiation fin has
High heat conductivility, therefore, the heat that graphite heat radiation fin can generate energy-saving type low voltage chip voltage stabilizing triode at work
Amount is quickly externally transmitted, to prevent heat from constantly being accumulated on energy-saving type low voltage chip voltage stabilizing triode, and then envoy
The heat dissipation performance of energy type low-voltage chip voltage stabilizing triode is more preferable.
3. being provided with insulating layer on the installation foot of energy-saving type low voltage chip voltage stabilizing triode, insulating layer can prevent three
A installation foot generates electrical connection when contacting with each other, to prevent the installation foot on energy-saving type low voltage chip voltage stabilizing triode from existing
Short circuit occurs when use, to promote usage experience of the user to energy-saving type low voltage chip voltage stabilizing triode.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the corresponding vinyon protective case structure sectional view of the utility model；
Fig. 3 is the corresponding graphite heat radiation fin structure sectional view of the utility model；
Fig. 4 is the corresponding installation foot structure sectional view of the utility model；
In figure：1- vinyons protective case, 2- epoxy encapsulations body, 3- metallic plates, 4- graphite heat radiation fins, 5- limits
Slot, the first pins of 6-, 7- second pins, 8- thirds pin, 9- installation feet, 10- metallic frameworks, 11- heat conduction adhesive layer, 12- are exhausted
Edge layer.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- Fig. 4 is please referred to Fig.1, the utility model provides a kind of technical solution：A kind of three pole of energy-saving type low voltage chip voltage stabilizing
Pipe, including epoxy encapsulation body 2, the front surface of epoxy encapsulation body 2 are provided with graphite heat radiation fin 4, epoxy encapsulation
Body 2 and the junction of graphite heat radiation fin 4 are provided with heat conduction adhesive layer 11, and graphite heat radiation fin 4 is bonded in by heat conduction adhesive layer 11
The upper surface of the front surface of epoxy encapsulation body 2, epoxy encapsulation body 2 is inlaid with metallic plate 3, epoxy encapsulation body 2
Lower surface be inlaid with second pin 7, the side of second pin 7 is inlaid with the first pin 6, and the other side of second pin 7 is inlayed
There are third pin 8, the lower section of epoxy encapsulation body 2 to be provided with vinyon protective case 1, the lower section welding of third pin 8
There are installation foot 9, the outer surface of installation foot 9 to be coated with insulating layer 12, is offered on vinyon protective case 1 and 9 phase of installation foot
Corresponding limiting slot 5, vinyon protective case 1 have been internally embedded metallic framework 10.
It is more secured in order to make installation foot 9 be connect with third pin 8, in the present embodiment, it is preferred that installation foot 9 is length
Cube structure, installation foot 9 are fixed on one end of the third pin 8 of rectangular parallelepiped structure by welding manner.
In order to keep the heat dissipation effect of graphite heat radiation fin 4 more preferable, in the present embodiment, it is preferred that graphite heat radiation fin 4 is arranged in total
There are two, two graphite heat radiation fins 4 are separately positioned on 2 front surface of epoxy encapsulation body and rear surface.
In order to make the structural strength higher of vinyon protective case 1, in the present embodiment, it is preferred that vinyon is protected
Sheath 1 is rectangular parallelepiped structure, is offered and the first pin 6, second pin 7 and third pin 8 on vinyon protective case 1
Corresponding second limiting groove, and the metallic framework 10 for being internally embedded U-typed of vinyon protective case 1.
In order to make the structural strength higher of second pin 7, in the present embodiment, it is preferred that second pin 7 is cuboid knot
Structure, and second pin 7 is identical as the first pin 6 and the shape of third pin 8.
It is relatively reliable in order to make epoxy encapsulation body 2 connect with second pin 7, in the present embodiment, it is preferred that epoxy
Resin-encapsulated body 2 is rectangular parallelepiped structure, and it is recessed that third limit corresponding with second pin 7 is offered on epoxy encapsulation body 2
Slot.
The operation principle and process for using of the utility model：After the utility model installs, by energy-saving type low voltage piece
Installation foot 9 on formula voltage stabilizing triode correctly accesses circuit, to make energy-saving type low voltage chip voltage stabilizing triode be powered on,
When energy-saving type low voltage chip voltage stabilizing triode needs storage, by the installation foot on energy-saving type low voltage chip voltage stabilizing triode
9 are inserted into vinyon protective case 1, to make vinyon protective case 1 play a protective role installation foot 9, prevent from pacifying
Dress foot 9 is damaged in storage, secondly, graphite heat radiation fin 4 due to the heat conductivility with superelevation, graphite heat radiation fin 4
The heat that can generate energy-saving type low voltage chip voltage stabilizing triode at work quickly externally transmits, to prevent heat from existing
It is constantly accumulated on energy-saving type low voltage chip voltage stabilizing triode, 9 surface coated insulating layer 12 of installation foot can be to installation foot 9
Insulating effect is played, prevents the installation foot 9 on energy-saving type low voltage chip voltage stabilizing triode from short circuit occurring when in use.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of energy-saving type low voltage chip voltage stabilizing triode, including epoxy encapsulation body (2), it is characterised in that：The ring
The front surface of oxygen resin-encapsulated body (2) is provided with graphite heat radiation fin (4), the epoxy encapsulation body (2) and graphite heat radiation fin
(4) junction is provided with heat conduction adhesive layer (11), and the graphite heat radiation fin (4) is bonded in epoxy by heat conduction adhesive layer (11)
The upper surface of the front surface of resin-encapsulated body (2), the epoxy encapsulation body (2) is inlaid with metallic plate (3), the asphalt mixtures modified by epoxy resin
The lower surface of fat packaging body (2) is inlaid with second pin (7), and the side of the second pin (7) is inlaid with the first pin (6),
The other side of the second pin (7) is inlaid with third pin (8), is provided with below the epoxy encapsulation body (2) poly-
Vinyl plastics protective case (1) is welded with installation foot (9), the outer surface of the installation foot (9) below the third pin (8)
It is coated with insulating layer (12), limiting slot (5) corresponding with installation foot (9) is offered on the vinyon protective case (1),
The vinyon protective case (1) has been internally embedded metallic framework (10).
2. a kind of energy-saving type low voltage chip voltage stabilizing triode according to claim 1, it is characterised in that：The installation foot
(9) it is rectangular parallelepiped structure, installation foot (9) is fixed on one end of the third pin (8) of rectangular parallelepiped structure by welding manner.
3. a kind of energy-saving type low voltage chip voltage stabilizing triode according to claim 1, it is characterised in that：The graphite dissipates
There are two backing (4) is arranged in total, two graphite heat radiation fins (4) be separately positioned on epoxy encapsulation body (2) front surface and
Rear surface.
4. a kind of energy-saving type low voltage chip voltage stabilizing triode according to claim 1, it is characterised in that：The polyethylene
Plastic protective sleeve (1) is rectangular parallelepiped structure, is offered and the first pin (6), second pin on vinyon protective case (1)
, (7) and corresponding second limiting groove of third pin (8) and vinyon protective case (1) has been internally embedded U-typed
Metallic framework (10).
5. a kind of energy-saving type low voltage chip voltage stabilizing triode according to claim 1, it is characterised in that：Described second draws
Foot (7) is rectangular parallelepiped structure, and second pin (7) is identical as the shape of the first pin (6) and third pin (8).
6. a kind of energy-saving type low voltage chip voltage stabilizing triode according to claim 1, it is characterised in that：The asphalt mixtures modified by epoxy resin
Fat packaging body (2) is rectangular parallelepiped structure, and third limit corresponding with second pin (7) is offered on epoxy encapsulation body (2)
Position groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820286436.5U CN207852680U (en) | 2018-03-01 | 2018-03-01 | A kind of energy-saving type low voltage chip voltage stabilizing triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820286436.5U CN207852680U (en) | 2018-03-01 | 2018-03-01 | A kind of energy-saving type low voltage chip voltage stabilizing triode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207852680U true CN207852680U (en) | 2018-09-11 |
Family
ID=63409955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820286436.5U Expired - Fee Related CN207852680U (en) | 2018-03-01 | 2018-03-01 | A kind of energy-saving type low voltage chip voltage stabilizing triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207852680U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112114A (en) * | 2019-04-29 | 2019-08-09 | 阜阳诚邦生产力促进中心有限公司 | A kind of triode |
-
2018
- 2018-03-01 CN CN201820286436.5U patent/CN207852680U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112114A (en) * | 2019-04-29 | 2019-08-09 | 阜阳诚邦生产力促进中心有限公司 | A kind of triode |
| CN110112114B (en) * | 2019-04-29 | 2020-09-25 | 蚌埠翰邦知识产权服务有限公司 | Triode transistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207852680U (en) | A kind of energy-saving type low voltage chip voltage stabilizing triode | |
| CN219435850U (en) | MOSFET chip packaging structure | |
| CN203674194U (en) | Triode | |
| CN212461657U (en) | Semiconductor chip packaging heat radiation structure | |
| CN204216023U (en) | A kind of triode with radiating surface | |
| CN205016530U (en) | High stable switch transistor | |
| CN203118935U (en) | DFN (dual flat-pack no-lead) package structure for rectifier chip | |
| CN201623104U (en) | External connection heat radiator encapsulation structure of resin circuit board chip positive mounting reverse T-shaped lock hole heat radiation block | |
| CN208753583U (en) | A kind of notebook shunting heat dissipation power connector | |
| CN207217518U (en) | A kind of triode of slim long-life | |
| CN207316516U (en) | A kind of integrated circuit Multi-chip parallel type LED lamp | |
| CN201623128U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator | |
| CN201623145U (en) | Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole and connected with external radiator | |
| CN207474469U (en) | A kind of foot position is the slim audion of CBE | |
| CN201629321U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap | |
| CN201623111U (en) | Package structure of external radiator of rectangular heat dissipation part with locking hole of resin circuit board chip normal | |
| CN201623073U (en) | External connection heat radiation cap encapsulation structure of resin circuit board chip positive mounting lock hole heat radiation block convex column | |
| CN201623125U (en) | Normal chip packaging structure with embedded substrate and heat sink connected with external radiator | |
| CN201623119U (en) | Packaging structure for a vertically-mounted rectangle radiating block externally connected with a radiator and having a chip embedded in a base | |
| CN201751996U (en) | Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole | |
| CN201623151U (en) | Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block and protruding column | |
| CN201629327U (en) | External heat radiator sealing structure for formal locking hole heat dissipation block of resin circuit board | |
| CN201623141U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external heat-dissipating plate | |
| CN201623103U (en) | Package structure for rectangular radiating block externally connected with radiator and inversed on chip with embedded inner lead | |
| CN201751986U (en) | Resin circuit board chip normally-assembled heat slug external radiator packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 Termination date: 20200301 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |