CN207596775U - A kind of heat conduction and heat radiation insulated compound adhesive tape with jog - Google Patents
A kind of heat conduction and heat radiation insulated compound adhesive tape with jog Download PDFInfo
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- CN207596775U CN207596775U CN201721554743.9U CN201721554743U CN207596775U CN 207596775 U CN207596775 U CN 207596775U CN 201721554743 U CN201721554743 U CN 201721554743U CN 207596775 U CN207596775 U CN 207596775U
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- jog
- heat
- adhesive tape
- compound adhesive
- heat conduction
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Abstract
The utility model discloses a kind of heat conduction and heat radiation insulating tapes with jog, including with jog foil basic layer, coated on foil basic layer jog while heat loss through radiation coating, the heat conductive insulating glue-line coated on foil basic layer another side, and the release film layer of heat conductive insulating glue-line outer surface, the jog shape of the metal foil is at least one of triangle, rectangle, trapezoidal, arc.The utility model realizes the uniformity in both vertically and horizontally heat conductivility, realizes in the heat dissipation area of low-temperature end and the Rapid radiating to external environment of heat are expanded under the premise of not increasing integral thickness.
Description
Technical field
The utility model is related to electronic application adhesive tape areas, insulate more particularly, to a kind of heat conduction and heat radiation with jog
Compound adhesive tape.
Background technology
With the high speed development of modern microelectronic technology, electronic equipment（Such as laptop, tablet computer, mobile phone）Day
Benefit becomes ultra-thin, light, and electronic device is made to develop to the efficient direction of miniaturization, lightweight, compact-sizedization, operation.
This structure causes electronic equipment internal power density to significantly improve, in operation generated heat be not easy to discharge,
Easily high-temperature region is formed with accumulating rapidly；On the other hand, high temperature can reduce the performance, reliability and service life of electronic equipment.
To ensure the stability of electronic device or equipment, the heat of generation need to be exported in time, thus it is quality to Heat Conduction Material, strong
Degree, thermal conductivity, thermal diffusivity, insulating properties and stability etc. propose higher requirement.
It is that use is matrix, high thermal conductivity inorganic particulate for heat filling using resin in the prior art, it is appropriate to be aided with
Heat Conductive Insulation Adhesive obtained from auxiliary agent realizes the conduction of heat.Although the prior art can realize Heat Conductive Insulation Adhesive
With higher thermal conductivity factor, but effectively the heat of transmission cannot be distributed, can not realize the aobvious of electronic component
Write cooling.
It is that expansible graphite is obtained after native graphite is handled separately to have technology, and vermiform is obtained after heat treatment, can after calendering
Obtain cooling fin.Or using natural flake graphite and coal tar pitch as raw material, then first kneading, rear compression moulding is graphitized preparation again
Conductive graphite heat sink material.Knowledge understands that graphite has higher thermal conductivity factor in x, y-axis direction（300~1500 W/
(m·K)）, but its thermal conductivity factor in z-axis direction is very low（5~40 W/(m·K)）Which greatly limits heat in adhesive tape thickness
The heat spent on direction is transmitted, and influences heat dissipation effect.
According to thermodynamic (al) relevant knowledge it is found that for the occasion that heat transfer speed requires, in addition to needing to select to close
The material of suitable thermal conductivity factor as heat-conduction medium outside, it is also necessary to the high and low temperature end of heat-conducting medium has sufficiently high average warm
Difference, that is to say, that needing the low-temperature end of heat-conducting medium has higher rate of heat dispation.
It is well known that the rate of heat dispation of object is directly proportional to heat dissipation area, it is therefore desirable to expand the low-temperature end of heat-conducting medium
Area improve radiating efficiency.
Invention content
The purpose of this utility model is to provide a kind of heat conduction and heat radiation insulated compound adhesive tape with jog, and the adhesive tape is in water
Square it is respectively provided with higher heat conductivility to vertical direction, and there is larger heat dissipation area and spoke in the low-temperature end of the adhesive tape
Penetrate heat dissipating layer.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of heat conduction and heat radiation with jog is exhausted
Edge adhesive tape, including with jog foil basic layer, coated on foil basic layer jog while heat loss through radiation apply
Layer, the heat conductive insulating glue-line coated on foil basic layer another side and the release film layer of heat conductive insulating glue-line outer surface.
It is thickness that the one side, which has the metal foil of jog,（D）For：30μm≤D≤500μm.
The one side has the jog height of the metal foil of jog（H）For：0<H≤0.5D.
The one side has the jog width or halfwidth of the metal foil of jog（W）For：0<W≤2D.
The one side has the adjacent jog interval of the metal foil of jog（L）For：0<L≤5W.
It is triangle that the one side, which has the jog shape of the metal foil of jog, rectangle, in trapezoidal, arc at least
It is a kind of.
It is using galvanoplastic, gas phase and liquid phase sedimentation, object that the one side, which has the jog of the metal foil of jog,
It is prepared by least one of reason/chemical etching process, rolling technology method.
It is goldleaf that the one side, which has the metal foil of jog, any one in silver foil, copper foil, nickel foil.
The heat conductive insulating bondline thickness is 10 ~ 100 μm, thermal conductivity factor >=2W/ (mK), volume resistivity >=3.5
×1014Ω cm, peel strength >=2.00N/mm.
The heat loss through radiation coating layer thickness is 15 ~ 100 μm, radiant emissivity >=85%.
The release film thickness is 12 ~ 75 μm, and peeling force grammes per square metre is 10 ~ 100g/m2。
Due to the utilization of the technical program, the utility model has following advantages and effect compared with prior art.
1. using one side that there is the metal foil of jog for base, realize in both vertically and horizontally thermal conductivity
The uniformity of energy.
2. using one side that there is the metal foil of jog for base, realize and expand under the premise of integral thickness is not increased
The big heat dissipation area of low-temperature end.
3. in foil basic layer jog one side coating heat loss through radiation coating, heat dissipation area is brought with reference to jog
Expand, in the Rapid radiating to external environment for realizing heat.
Description of the drawings
Fig. 1 is a kind of structure diagram for the heat conduction and heat radiation insulated compound adhesive tape that the utility model has jog.
Fig. 2 is the structure of metal foil schematic diagram that one side has jog.
Fig. 3 is another structure diagram for the heat conduction and heat radiation insulated compound adhesive tape that the utility model has jog.
Fig. 4 is another structure diagram for the heat conduction and heat radiation insulated compound adhesive tape that the utility model has jog.
Fig. 5 is another structure diagram for the heat conduction and heat radiation insulated compound adhesive tape that the utility model has jog.
Fig. 6 is another structure diagram for the heat conduction and heat radiation insulated compound adhesive tape that the utility model has jog.
Reference numeral：1- one sides have the foil basic layer of jog, the jog of 11- metal foils, and 2- heat loss through radiation applies
Layer, 3- heat conductive insulating glue-lines, 4- release film layers, D- metal foil thicknesses, H- jog height, W- jogs width or halfwidth,
The adjacent jog intervals of L-.
Specific embodiment
The utility model is further described with reference to specific embodiment.
Embodiment 1.
A kind of heat conduction and heat radiation insulating tape with jog, be using thickness D=30 μm, jog shape as rectangle gold
Foil is base, wherein the height 0 of jog<H≤0.1D, width 0<W≤0.2D, adjacent jog interval 0<L≤5W.
The heat conductive insulating bondline thickness is 10 μm, and thermal conductivity factor is 2W/ (mK), and volume resistivity is 3.5 × 1014
Ω cm, peel strength 2.00N/mm；The heat loss through radiation coating layer thickness is 15 μm, radiant emissivity 85%；It is described from
Type film thickness is 12 μm, and peeling force grammes per square metre is 10g/m2。
Embodiment 2.
A kind of heat conduction and heat radiation insulating tape with jog is using thickness D=40 μm, jog shape as trapezoidal silver
Foil is base, wherein the height 0 of jog<H≤0.2D, halfwidth 0<W≤0.3D, adjacent jog interval 0<L≤4W.
The heat conductive insulating bondline thickness is 15 μm, and thermal conductivity factor is 2.5W/ (mK), volume resistivity for 3.8 ×
1014Ω cm, peel strength 2.05N/mm；The heat loss through radiation coating layer thickness is 30 μm, radiant emissivity 86%；It is described
Release film thickness for 19 μm, peeling force grammes per square metre is 20g/m2。
Embodiment 3.
A kind of heat conduction and heat radiation insulating tape with jog is using thickness D=80 μm, jog shape as triangle
Copper foil is base, wherein the height 0 of jog<H≤0.3D, halfwidth 0<W≤0.5D, adjacent jog interval 0<L≤4W.
The heat conductive insulating bondline thickness is 30 μm, and thermal conductivity factor is 3.0W/ (mK), volume resistivity for 4.1 ×
1014Ω cm, peel strength 2.10N/mm；The heat loss through radiation coating layer thickness is 40 μm, radiant emissivity 87%；It is described
Release film thickness for 30 μm, peeling force grammes per square metre is 40g/m2。
Embodiment 4.
A kind of heat conduction and heat radiation insulating tape with jog, be using thickness D=100 μm, jog shape as arc nickel
Foil is base, wherein the height 0 of jog<H≤0.4D, halfwidth 0<W≤D, adjacent jog interval 0<L≤3W.
The heat conductive insulating bondline thickness is 60 μm, and thermal conductivity factor is 3.4W/ (mK), volume resistivity for 4.3 ×
1014Ω cm, peel strength 2.15N/mm；The heat loss through radiation coating layer thickness is 60 μm, radiant emissivity 88%；It is described
Release film thickness for 38 μm, peeling force grammes per square metre is 60g/m2。
Embodiment 5.
A kind of heat conduction and heat radiation insulating tape with jog is using thickness D=300 μm, jog shape as triangle
Nickel foil is base, wherein the height 0 of jog<H≤0.5D, halfwidth 0<W≤2D, adjacent jog interval 0<L≤2W.
The heat conductive insulating bondline thickness is 80 μm, and thermal conductivity factor is 3.6W/ (mK), volume resistivity for 4.5 ×
1014Ω cm, peel strength 2.20N/mm；The heat loss through radiation coating layer thickness is 80 μm, radiant emissivity 89%；It is described
Release film thickness for 50 μm, peeling force grammes per square metre is 80g/m2。
Embodiment 6.
A kind of heat conduction and heat radiation insulating tape with jog, be using thickness D=500 μm, jog shape as rectangle copper
Foil is base, wherein the height 0 of jog<H≤0.5D, width 0<W≤2D, adjacent jog interval 0<L≤W.
The heat conductive insulating bondline thickness is 100 μm, and thermal conductivity factor is 3.8W/ (mK), volume resistivity for 4.7 ×
1014Ω cm, peel strength 2.25N/mm；The heat loss through radiation coating layer thickness is 100 μm, radiant emissivity 90%；It is described
Release film thickness for 75 μm, peeling force grammes per square metre is 100g/m2。
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personnel it will be appreciated that the content of the utility model and implement according to this, the protection model of the utility model can not be limited with this
It encloses.All equivalent changes or modifications substantially done according to the spirit of the present invention, should all belong to the scope of protection of the utility model
Within.
Claims (10)
1. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog, it is characterised in that：There is the gold of jog including one side
Shu Bo bases（1）, heat loss through radiation coating coated on foil basic layer jog one side（2）, it is another coated on foil basic layer
The heat conductive insulating glue-line in face（3）And the release film layer of heat conductive insulating glue-line outer surface（4）.
2. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：It is described
One side have jog metal foil be thickness（D）For：30μm≤D≤500μm.
3. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：It is described
One side have jog metal foil jog height（H）For：0<H≤0.5D.
4. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：It is described
One side have jog metal foil jog width or halfwidth（W）For：0<W≤2D.
5. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：It is described
One side have jog metal foil adjacent jog interval（L）For：0<L≤5W.
6. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1-5 any one, special
Sign is：It is triangle that the one side, which has the jog shape of the metal foil of jog, rectangle, in trapezoidal, arc at least
It is a kind of.
7. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1-5 any one, special
Sign is：It is goldleaf that the one side, which has the metal foil of jog, any one in silver foil, copper foil, nickel foil.
8. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：It is described
Heat conductive insulating bondline thickness for 10 ~ 100 μm, thermal conductivity factor >=2W/ (mK), volume resistivity >=3.5 × 1014Ω cm,
Peel strength >=2.00N/mm.
9. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：It is described
Heat loss through radiation coating layer thickness for 15 ~ 100 μm, radiant emissivity >=85%.
10. a kind of heat conduction and heat radiation insulated compound adhesive tape with jog according to claim 1, it is characterised in that：Institute
The release film thickness stated is 12 ~ 75 μm, and peeling force grammes per square metre is 10 ~ 100g/m2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721554743.9U CN207596775U (en) | 2017-11-20 | 2017-11-20 | A kind of heat conduction and heat radiation insulated compound adhesive tape with jog |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721554743.9U CN207596775U (en) | 2017-11-20 | 2017-11-20 | A kind of heat conduction and heat radiation insulated compound adhesive tape with jog |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207596775U true CN207596775U (en) | 2018-07-10 |
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ID=62760975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721554743.9U Active CN207596775U (en) | 2017-11-20 | 2017-11-20 | A kind of heat conduction and heat radiation insulated compound adhesive tape with jog |
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|---|---|
| CN (1) | CN207596775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310012A (en) * | 2020-04-28 | 2021-02-02 | 北京字节跳动网络技术有限公司 | Heat sink and heat dissipation system |
-
2017
- 2017-11-20 CN CN201721554743.9U patent/CN207596775U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310012A (en) * | 2020-04-28 | 2021-02-02 | 北京字节跳动网络技术有限公司 | Heat sink and heat dissipation system |
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Address after: 215200 Wujiang 168 economic and Technological Development Zone, Suzhou, Jiangsu Patentee after: Suzhou Shihua new material Polytron Technologies Inc Address before: 215200 Wujiang 168 economic and Technological Development Zone, Suzhou, Jiangsu Patentee before: Suzhou Shihua New Material Technology Co., Ltd. |