CN207480368U - A kind of novel wafer polisher lapper - Google Patents
A kind of novel wafer polisher lapper Download PDFInfo
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- CN207480368U CN207480368U CN201721552968.0U CN201721552968U CN207480368U CN 207480368 U CN207480368 U CN 207480368U CN 201721552968 U CN201721552968 U CN 201721552968U CN 207480368 U CN207480368 U CN 207480368U
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- turntable
- inlet tubes
- roundel
- disk
- inner disc
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Abstract
A kind of novel wafer polisher lapper, including engine base and turntable, the engine base includes operation panel and operation console；The turntable pedestal for placing rotary disk is provided on the operation console；The turntable pedestal axle center is provided with axle sleeve；The turntable is formed by stacking up and down by the roundel and big disk of concentric setting, great circle tray bottom axle center is provided with the shaft being rotatably connected with axle sleeve, run through at roundel axle center and be useful for the diversion pipe that rough lapping liquid stream is led to, and diversion pipe upper port is not less than roundel top planes；The bottom of the roundel is distributed with a plurality of from diversion pipe to the perforative turntable intake chute in roundel outer；The sample tray being matched therewith can be placed on the turntable；The sample tray includes inner disc and external disk, and wherein inner disc bottom surface is contacted with roundel top surface, and external disk bottom surface is contacted with big disk top surface；The utility model can synchronize the polishing for realizing chip difference grinding and polishing degree, time saving and energy saving.
Description
Technical field
The utility model belongs to grinding and polishing device technical field, and in particular to a kind of novel wafer polisher lapper.
Background technology
Wafer material is usually required before opto-electronic device is prepared by processes such as cutting, grinding, polishing and plated films
It is processed into the shape of needs and reaches using required surface optical uniformity.Wherein, the effect of grinding is thickness to be eliminated
Purpose with the deviation of flatness, and polishing is then to reach required surface smoothness.
In order to which chip is made to reach the optical homogeneity of application requirement, need to generally multiple grinding and polishing operation be carried out to chip.
During wafer grinding polishes, need that varigrained grounds travel is configured according to chip smoothness requirements.Existing routine is done
Method is by using varigrained grounds travel（Such as white fused alumina micro mist）The lapping liquid of configuration realizes that the different degrees of grinding of chip is thrown
Light.When realizing the different degrees of grinding and polishing of chip using existing apparatus, chip need to be carried out to repeat grinding and polishing operation in batches,
Time and effort consuming.
In conclusion a kind of polishing machine for synchronizing realization chip difference grinding and polishing degree of design is to be highly desirable
's.
Invention content
The utility model provides a kind of novel wafer polisher lapper, can synchronize and realize that the different degrees of grinding of chip is thrown
Light is time saving and energy saving.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of wafer grinding polishing machine, including engine base and turntable, the engine base includes operation panel and operation console；It is described
Operation console on be provided with turntable pedestal for placing rotary disk；The side of the turntable pedestal is provided with waste liquid tap hole,
Turntable base perimeter is provided with only liquid platform, for preventing lapping liquid from outflowing；The turntable pedestal axle center is provided with axle sleeve；It is described
Turntable by concentric setting roundel and big disk up and down be formed by stacking, great circle tray bottom axle center be provided with and axle sleeve rotate
The shaft of connection makes turntable be rotated under the driving of external motor, runs through being useful for what rough lapping liquid stream was led at roundel axle center
Diversion pipe, and diversion pipe upper port ensures that the fine lapping liquid at the top of roundel may not flow into and leads not less than roundel top planes
Flow tube；The bottom of the roundel be distributed with it is a plurality of from diversion pipe to the perforative turntable intake chute in roundel outer, for will
Rough lapping liquid is guided at the top of big disk；The sample tray being matched therewith can be placed on the turntable；The sample tray packet
Inner disc and external disk are included, wherein inner disc bottom surface is contacted with roundel top surface, and external disk bottom surface is contacted with big disk top surface；The inner disc
Axle center is coaxially nested with what is led to for rough lapping liquid stream through the 2# inlet tubes that fine lapping liquid stream is led to are useful for inside 2# inlet tubes
1# inlet tubes, and 1# feed liquors infratubal port, not less than diversion pipe upper port, 1# feed liquor infratubal ports diameter is less than diversion pipe upper end
Mouth diameter, can be such that 1# inlet tubes are nested in diversion pipe, ensure that rough lapping liquid may not flow into the roundel top planes of turntable, 1#
Inlet tube is connect with 2# inlet tubes by link block；The 1# inlet tubes and 2# inlet tubes upper port are not less than sample tray
Top planes, and 1# inlet tubes upper port is not less than 2# inlet tube upper ports, ensure to 1# inlet tubes inject rough lapping liquid when not
2# inlet tubes, 1# inlet tubes and 2# inlet tubes upper port outer can be fade-in, smoothly injects inlet tube convenient for lapping liquid；Described
Inner disc is provided through multiple 1# load samples holes for being used to assign viscous sample dish along its axle center circular array；The inner disc bottom phase
1# eddy flow slots are connected between adjacent two 1# load samples holes；The inner disc bottom is provided with along the tangential 1# intake chutes in 1# load samples hole；
The inner disc bottom is provided with connection 1# load samples hole and the 1# circulation grooves of 2# inlet tubes；The external disk along its axle center in a ring
Array is provided through multiple 2# load samples holes for being used to assign viscous sample dish；The outer tray bottom connects between adjacent two 2# load samples hole
It is connected to 2# eddy flow slots；The outer tray bottom is provided with along the tangential 2# intake chutes in 2# load samples hole；The outer tray bottom setting
There are the 2# circulation grooves in connection 2# load samples hole and edge in external disk；Support shank is provided on the alien invasion of the sample tray；Described
Mounting hole is provided in support shank；The side of the operation console is provided with supporting rod；It is slidably connected on the supporting rod
Fixed link, fixed link end set have with the matched fixed pin of mounting hole, will fixed pin be inserted into mounting hole in can be used for keep
Sample tray is fixed；It is provided on the operation console respectively to 1# inlet tubes and 2# inlet tubes injection rough lapping liquid and fine lapping liquid
Liquid pipe.
The viscous sample dish are the prior art, and the bottom plane of viscous sample dish is used to be bonded crystalline substance to be ground or polished
Piece, viscous sample dish can respectively assign in 1# load samples hole and 2# load samples hole as needed, glue sample dish and 1# load samples hole and 2# load samples hole
Between can form the minimum clearance fit of tolerance, viscous sample dish can rotate wherein, and can lower slider vertically.
The waste liquid tap hole is circumscribed with the sewer pipe for discharging the grinding clast that either polishing generates or waste liquid,
The sewer pipe is the prior art；
Two liquid pipes are circumscribed with the feed pathway for providing thick, fine lapping liquid respectively, which is existing
There is technology；
The operation panel is the prior art, and switch, rotational speed regulation button and grinding are provided on operation panel
Time button, scram button.
Preparation before wafer grinding：
（1）Turntable is placed on turntable pedestal, and shaft is made to be nested in axle sleeve, sample tray is positioned on turntable, and is made
1# feed liquor infratubal ports are nested in diversion pipe upper port, and fixed pin is inserted into mounting hole, ensures that sample tray is fixed, makes turntable
During rotation, turntable generates relative motion to sample tray, so as to effectively be ground to the chip for gluing sample dish bottom bonding.
（2）Pass through varigrained grounds travel（Such as white fused alumina micro mist）Lapping liquid is configured, the utility model is rough lapping
Liquid and fine lapping liquid.
（3）This polisher lapper once can be carried out at the same time grinding by the chip of different grinding demands to two kinds, as chip A with
Chip B（The roughness of chip A is more than chip B）, chip A and chip B are bonded in respectively using rosin or other bonding agents
Viscous sample dish bottom, same viscous sample dish bottom can be bonded multi-disc consistency of thickness, chip similar in roughness in the utility model.
The viscous sample dish for gluing chip A are assigned in the 2# load samples hole of external disk, the viscous sample dish for gluing chip B are assigned into
It in the 1# load samples hole of disk, turns on the switch, sets rotating speed and milling time, rough lapping liquid and fine lapping liquid are distinguished by liquid pipe
1# inlet tubes and 2# inlet tubes, the rotation of external motor driving disc are injected, turntable generates sample tray relative motion, turntable rotation
In the process, the fine lapping liquid injected in 2# inlet tubes is released slowly into the roundel top platform of turntable by 1# circulation grooves, and
It is evenly dispersed at each 1# load samples hole by the 1# eddy flow slots between 1# load samples hole, passes through lapping liquid on chip B and turntable
Friction realizes that the purpose that grinding either polishes is ground or polishing generates clast or waste liquid can pass through under the influence of centrifugal force
1# intake chutes discharge, the waste liquid can along the inner wall of sample tray external disk flow into turntable big disk top platform, the waste liquid or with
The external disk for sample tray continues to grind or throws away sample tray by 2# intake chutes；It is brilliant while being ground to chip B
Piece A is also being ground, and the rough lapping liquid injected in 1# inlet tubes is uniform by diversion pipe, turntable intake chute and 2# circulation grooves
Be distributed at each 2# load samples hole, realize the purpose of grinding or polishing by the friction of lapping liquid on chip A and turntable, grinding or
Polishing the clast generated, either waste liquid can throw away the final clast of sample tray by 2# intake chutes under the influence of centrifugal force or give up
Liquid concentrates in only liquid platform and passes through waste liquid tap hole and excludes.
The advantages of the utility model：
The utility model provides a kind of novel wafer polisher lapper, can synchronize and realize chip difference grinding and polishing degree
Polishing, time saving and energy saving, specific advantage is as follows：
（1）Thick, fine lapping liquid can be accomplished source separation, chip can be achieved at the same time by the utility model using double inlet tubes
Different degrees of grinding and polishing is time saving and energy saving；
（2）The setting of 1# eddy flows slot and 2# eddy flow slots so that lapping liquid can be uniformly distributed more rapidly, substantially increase chip
Grinding efficiency；
（3）Only the setting of liquid platform can prevent lapping liquid from outflowing, while be greatly improved the safety of operating personnel, prevent from carrying
Sample dish, which are flown, damages human body；
（4）Fixed link is inserted into mounting hole, is ensured the stability of sample tray, is prevented ground
Sample tray flies out in journey, is further ensured that the safety of operating personnel.
Description of the drawings
Attached drawing 1 is the stereoscopic schematic diagram of polisher lapper described in the utility model；Attached drawing 2 is described in the utility model
The stereoscopic schematic diagram of the polisher lapper of sample tray is not placed；Three-dimensional signal of the attached drawing 3 for sample tray described in the utility model
Figure；Attached drawing 4 is the vertical view of sample tray described in the utility model；Attached drawing 5 is looked up for sample tray described in the utility model
Figure；Attached drawing 6 is the stereoscopic schematic diagram of sample tray described in the utility model；Attached drawing 7 is the vertical of turntable described in the utility model
Body structure diagram；Attached drawing 8 is the vertical view of turntable described in the utility model；Attached drawing 9 is turntable described in the utility model
Front view；Attached drawing 10 is the structure diagram of viscous sample dish described in the utility model；
Wherein, 1 is 2# intake chutes, and 2 be operation console, and 3 be turntable pedestal, and 4 be support shank, and 5 be supporting rod, and 6 be fixed link,
7 be liquid pipe, and 8 be 1# inlet tubes, and 9 be 2# inlet tubes, and 10 be 1# load samples hole, and 11 be 2# load samples hole, and 12 be sample tray, and 13 be waste liquid
Tap hole, liquid platform until 14,15 be engine base, and 16 be operation panel, and 17 be mounting hole, and 18 be link block, and 19 be inner disc, and 20 be outer
Disk, 21 be 1# intake chutes, and 22 be 1# circulation grooves, and 23 be 2# eddy flow slots, and 24 be 1# eddy flow slots, and 25 be axle sleeve, and 26 be turntable drain
Slot, 27 be turntable, and 28 be shaft, and 29 be 2# circulation grooves, and 30 be diversion pipe, and 31 be fixed pin, and 32 be viscous sample dish, and 33 be roundlet
Disk, 34 be big disk.
Specific embodiment
A kind of wafer grinding polishing machine, including engine base 15 and turntable 27, the engine base 15 includes operation panel 16 and behaviour
Make platform 2；The turntable pedestal 3 for placing rotary disk 27 is provided on the operation console 2；The side of the turntable pedestal 3 is set
Waste liquid tap hole 13 is equipped with, 3 periphery of turntable pedestal is provided with only liquid platform 14；3 axle center of turntable pedestal is provided with axle sleeve 25；
The turntable 27 is formed by stacking by the roundel 33 and big disk of concentric setting about 34, the setting of 34 bottom axle center of big disk
There is the shaft 28 being rotatably connected with axle sleeve 25, run through at 33 axle center of roundel and be useful for the diversion pipe 30 that rough lapping liquid stream is led to, and
30 upper port of diversion pipe is not less than 33 top planes of roundel；The bottom of the roundel 33 is distributed with a plurality of by diversion pipe 30
To the perforative turntable intake chute 26 in 33 outer of roundel；The sample tray 12 being matched therewith can be placed on the turntable 27；Institute
The sample tray 12 stated includes inner disc 19 and external disk 20, and wherein 19 bottom surface of inner disc contacts with 33 top surface of roundel, 20 bottom surface of external disk and
34 top surface of big disk contacts；19 axle center of inner disc, which is run through, is useful for the 2# inlet tubes 9 that fine lapping liquid stream is led to, 2# inlet tubes 9
It is internal to be coaxially nested with the 1# inlet tubes 8 led to for rough lapping liquid stream, and 8 lower port of 1# inlet tubes is not less than 30 upper end of diversion pipe
Mouthful, 8 lower port diameter of 1# inlet tubes is less than 30 upper port diameter of diversion pipe, and 1# inlet tubes 8 pass through link block 18 with 2# inlet tubes 9
Connection；The 1# inlet tubes 8 and 9 upper port of 2# inlet tubes are not less than the top planes of sample tray 12, and on 1# inlet tubes 8
Port is not less than 9 upper port of 2# inlet tubes, 1# inlet tubes 8 and 9 upper port of 2# inlet tubes outer；The inner disc 19 is along its axis
Heart circular array is provided through multiple 1# load samples holes 10 for being used to assign viscous sample dish 32；19 bottom of inner disc adjacent two
1# eddy flows slot 24 is connected between 1# load samples hole 10；19 bottom of inner disc is provided with along the tangential 1# drains in 1# load samples hole 10
Slot 21；19 bottom of inner disc is provided with connection 1# load samples hole 10 and the 1# circulation grooves 22 of 2# inlet tubes 9；The external disk 20
Along its axle center, circular array is provided through multiple 2# load samples holes 11 for being used to assign viscous sample dish 32；20 bottom of external disk
2# eddy flows slot 23 is connected between adjacent two 2# load samples hole 11；20 bottom of external disk is provided with tangential along 2# load samples hole 11
2# intake chutes 1；20 bottom of external disk is provided with the 2# circulation grooves 29 in connection 2# load samples hole 11 and edge in external disk 20；Described
Support shank 4 is provided on the alien invasion of sample tray 12；Mounting hole 17 is provided in the support shank 4；The operation console 2
Side is provided with supporting rod 5；Fixed link 6 is slidably connected on the supporting rod 5,6 end set of fixed link has and mounting hole
Fixed pin 31 is inserted into mounting hole 17 and can be used for sample tray 12 is kept to fix by 17 matched fixed pins 31；The operation
The liquid pipe 7 for injecting rough lapping liquid and fine lapping liquid to 1# inlet tubes 8 and 2# inlet tubes 9 respectively is provided on platform 2.
Claims (2)
1. a kind of novel wafer polisher lapper, it is characterised in that：Including engine base（15）And turntable（27）, the engine base（15）
Including operation panel（16）And operation console（2）；The operation console（2）On be provided with for placing rotary disk（27）Turntable pedestal
（3）；The turntable pedestal（3）Side be provided with waste liquid tap hole（13）, turntable pedestal（3）Periphery is provided with only liquid platform
（14）；The turntable pedestal（3）Axle center is provided with axle sleeve（25）；The turntable（27）By the roundel of concentric setting
（33）And big disk（34）It is formed by stacking up and down, big disk（34）Bottom axle center is provided with and axle sleeve（25）The shaft of rotatable connection
（28）, roundel（33）Run through at axle center and be useful for the diversion pipe that rough lapping liquid stream is led to（30）, and diversion pipe（30）Upper port is not
Less than roundel（33）Top planes；The roundel（33）Bottom be distributed with it is a plurality of by diversion pipe（30）To roundel
（33）The perforative turntable intake chute in outer（26）；The turntable（27）On can place the sample tray being matched therewith（12）；Institute
The sample tray stated（12）Including inner disc（19）And external disk（20）, wherein inner disc（19）Bottom surface and roundel（33）Top surface contacts, outside
Disk（20）Bottom surface and big disk（34）Top surface contacts；The inner disc（19）Axle center run through be useful for 2# that fine lapping liquid stream leads into
Liquid pipe（9）, 2# inlet tubes（9）Inside is coaxially nested with the 1# inlet tubes led to for rough lapping liquid stream（8）, and 1# inlet tubes（8）
Lower port is not less than diversion pipe（30）Upper port, 1# inlet tubes（8）Lower port diameter is less than diversion pipe（30）Upper port diameter, 1#
Inlet tube（8）With 2# inlet tubes（9）Pass through link block（18）Connection；The 1# inlet tubes（8）With 2# inlet tubes（9）Upper port
It is not less than sample tray（12）Top planes；The inner disc（19）Along its axle center, circular array is provided through multiple use
In assigning viscous sample dish（32）1# load samples hole（10）；The inner disc（19）The adjacent two 1# load samples hole in bottom（10）Between be connected with
1# eddy flow slots（24）；The inner disc（19）Bottom is provided with along 1# load samples hole（10）Tangential 1# intake chutes（21）；Described
Inner disc（19）Bottom is provided with connection 1# load samples hole（10）With 2# inlet tubes（9）1# circulation grooves（22）；The external disk（20）
Along its axle center, circular array is provided through multiple for assigning viscous sample dish（32）2# load samples hole（11）；The external disk
（20）The adjacent two 2# load samples hole in bottom（11）Between be connected with 2# eddy flow slots（23）；The external disk（20）Bottom is provided with along 2#
Load sample hole（11）Tangential 2# intake chutes（1）；The external disk（20）Bottom is provided with connection 2# load samples hole（11）With external disk
（20）The 2# circulation grooves on interior edge（29）；The sample tray（12）Alien invasion on be provided with support shank（4）；The support shank
（4）On be provided with mounting hole（17）；The operation console（2）Side be provided with supporting rod（5）；The supporting rod（5）On
Slidably connect fixed link（6）, fixed link（6）End set has and mounting hole（17）Matched fixed pin（31）, by fixation
Needle（31）It is inserted into mounting hole（17）In can be used for keep sample tray（12）It is fixed；The operation console（2）On be provided with respectively to
1# inlet tubes（8）With 2# inlet tubes（9）Inject the liquid pipe of rough lapping liquid and fine lapping liquid（7）.
2. novel wafer polisher lapper according to claim 1, it is characterised in that：The 1# inlet tubes（8）Upper end
Mouth is not less than 2# inlet tubes（9）Upper port, 1# inlet tubes（8）With 2# inlet tubes（9）Upper port outer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721552968.0U CN207480368U (en) | 2017-11-20 | 2017-11-20 | A kind of novel wafer polisher lapper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721552968.0U CN207480368U (en) | 2017-11-20 | 2017-11-20 | A kind of novel wafer polisher lapper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207480368U true CN207480368U (en) | 2018-06-12 |
Family
ID=62474365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721552968.0U Active CN207480368U (en) | 2017-11-20 | 2017-11-20 | A kind of novel wafer polisher lapper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207480368U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107650009A (en) * | 2017-11-20 | 2018-02-02 | 山东省科学院新材料研究所 | A kind of novel wafer polisher lapper |
-
2017
- 2017-11-20 CN CN201721552968.0U patent/CN207480368U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107650009A (en) * | 2017-11-20 | 2018-02-02 | 山东省科学院新材料研究所 | A kind of novel wafer polisher lapper |
| CN107650009B (en) * | 2017-11-20 | 2023-08-25 | 山东省科学院新材料研究所 | Novel wafer grinding and polishing machine |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201225 Address after: 250014 203-a, Zhongchuang space, 19 Keyuan Road, Lixia District, Jinan City, Shandong Province Patentee after: Shandong Shanke Zhijing Photoelectric Technology Co.,Ltd. Address before: 250014 No. 19, ASTRI Road, Lixia District, Shandong, Ji'nan Patentee before: NEW MATERIAL INSTITUTE OF SHANDONG ACADEMY OF SCIENCES |
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| TR01 | Transfer of patent right |