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CN205071579U - Heat conduction structure applied to network control automation system - Google Patents

Heat conduction structure applied to network control automation system Download PDF

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Publication number
CN205071579U
CN205071579U CN201520778216.0U CN201520778216U CN205071579U CN 205071579 U CN205071579 U CN 205071579U CN 201520778216 U CN201520778216 U CN 201520778216U CN 205071579 U CN205071579 U CN 205071579U
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heat conduction
circuit board
network control
circuit module
copper foil
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余家德
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Adlink Technology Inc
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Adlink Technology Inc
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Abstract

The utility model provides a heat conduction structure applied to a network control automation system, which is characterized in that a circuit board of a circuit module is provided with a heating source, a copper foil layer is arranged in a bare copper area formed at the end positions of two sides of the circuit board, the copper foil layer is respectively coated with a sliding sleeve of a guide rail part on two side plates of a shell of a positioning mechanism to form a heat conduction path, a containing space for positioning the circuit board is formed between the shell and the side plates, and elastic convex parts are respectively arranged on the surfaces of the two side plates of the shell, so that the circuit module matching positioning mechanism can be inserted into a butt joint space from an opening of a heat dissipation seat by embedding the sliding sleeve of the guide rail part along the embedding part, and the elastic convex parts are abutted against the inner wall surface of the butt joint space around the embedding part to form a heat conduction path, so that the heat generated when the heating source of the auxiliary circuit board operates is guided out to the heat dissipation seat by the copper foil layer matching positioning, thereby improving the overall heat dissipation efficiency.

Description

应用于网络控制自动化系统的热传导结构Heat conduction structure applied to network control automation system

技术领域technical field

本实用新型是提供一种应用于网络控制自动化系统的热传导结构,尤指可将电路模块上的发热源于运作时所产生的热量经由电路板二侧端部位置的铜箔层配合定位机构导出至散热座上辅助进行散热,以提高整体的散热效率。The utility model provides a heat conduction structure applied to the network control automation system, especially refers to that the heat generated on the circuit module can be derived from the heat generated during operation through the copper foil layer at the ends of the two sides of the circuit board and the positioning mechanism. To assist heat dissipation on the heat sink, so as to improve the overall heat dissipation efficiency.

背景技术Background technique

现今电子科技以日新月异的速度成长,使计算机、笔记本电脑等计算机设备皆已普遍存在于社会上各个角落中,并朝运算功能强、速度快及体积小的方向迈进,然而,随着计算机设备开放架构的下及软硬件的标准化,加上功能不断的扩充与升级,厂商便开发适用于各专业领域的工业计算机,主要应用在如工业控制、工业自动化、网络与通讯设备、机器视觉、智能运输系统等,亦可适用于肩负重要任务的军事、交通运输与航天领域等需要高可靠度与稳定性的工业应用,以满足顾客特定规格及严苛环境下执行各项高效能运作的要求。Today's electronic technology is growing at an ever-changing rate, making computers, notebook computers and other computer equipment widely available in every corner of society, and moving towards the direction of powerful computing functions, fast speed and small size. However, with the opening of computer equipment Under the framework and the standardization of software and hardware, coupled with the continuous expansion and upgrading of functions, manufacturers have developed industrial computers suitable for various professional fields, mainly used in industrial control, industrial automation, network and communication equipment, machine vision, intelligent transportation Systems, etc., can also be applied to industrial applications that require high reliability and stability in the military, transportation, and aerospace fields that shoulder important tasks, so as to meet customer-specific specifications and perform various high-efficiency operations in harsh environments.

再者,由于信息产业的持续进步与网络通讯技术的提升,使得以实时通讯接口为基础的新世代工业自动化设备快速而蓬勃地发展,传统的自动化设备与工具机台所使用的伺服控制技术因面临了多轴同步与实时性能不佳、分辨率不足,并受限于配线繁多及噪声干扰等问题,所以利用串行式伺服控制通过实时通讯系统,并经由网络媒介传递数字信号与控制参数,应用于工业自动化控制系统中的各式通讯传输协议,遂于近年来逐一被提出,如工业控制自动化以太网络技术(EtherCAT)新一代的开放性技术,是以太网络架构为基础的现场总线技术,亦是高性能的分布式I/O系统,其主要优点为配线容易、节省成本、抗干扰性、远程控制,并可发展更高速、高精度的运动控制技术,进而加以整合成为分布式控制服务器驱动系统,以取代一个大型的单一控制系统,但因工业自动化控制系统尺寸较小和趋向于高速发展,使得电路板上的现场可编辑逻辑门阵列(FPGA)芯片、中央处理器(CPU)、芯片组或图像处理器等发热源产生的温度也将相对大幅提高,故要如何确保其在允许温度下正常的工作,并提升整体的散热效率,将是影响工业自动化控制系统稳定的重要关键,已被业界视为所亟欲解决的课题,则有待从事此行业者重新设计来加以有效解决。Furthermore, due to the continuous progress of the information industry and the improvement of network communication technology, the new generation of industrial automation equipment based on real-time communication interfaces has developed rapidly and vigorously. The servo control technology used in traditional automation equipment and machine tools is facing Due to poor multi-axis synchronization and real-time performance, insufficient resolution, and limited wiring and noise interference, etc., serial servo control is used to transmit digital signals and control parameters through real-time communication systems and network media. Various communication transmission protocols used in industrial automation control systems have been proposed one by one in recent years, such as the new generation of open technology of industrial control automation Ethernet technology (EtherCAT), which is a fieldbus technology based on Ethernet network architecture. It is also a high-performance distributed I/O system. Its main advantages are easy wiring, cost saving, anti-interference, and remote control. It can also develop higher-speed, high-precision motion control technology, and then integrate it into a distributed control system. The server drives the system to replace a large single control system, but because the industrial automation control system is small in size and tends to develop at a high speed, the field programmable logic gate array (FPGA) chip, central processing unit (CPU) on the circuit board The temperature generated by heat sources such as chip sets or image processors will also increase relatively significantly, so how to ensure their normal operation at the allowable temperature and improve the overall heat dissipation efficiency will be an important key to the stability of industrial automation control systems , has been regarded as an urgent problem to be solved by the industry, and it needs to be redesigned by those engaged in this industry to be effectively solved.

实用新型内容Utility model content

故,新型创作人有鉴于上述现有的问题与缺点,乃搜集相关资料经由多方的评估及考虑,并利用从事于此行业的多年研发经验不断的试作与修改,始设计出此种应用于网络控制自动化系统的热传导结构的新型诞生。Therefore, in view of the above-mentioned existing problems and shortcomings, the new creators collected relevant information, evaluated and considered in many ways, and used years of research and development experience in this industry to continuously try and modify, and then designed this kind of application. A new type of heat conduction structure for network control automation systems is born.

本实用新型的目的在于,提供一种应用于网络控制自动化系统的热传导结构,其可提高整体的散热效率。The purpose of the utility model is to provide a heat conduction structure applied to a network control automation system, which can improve the overall heat dissipation efficiency.

本实用新型提供一种应用于网络控制自动化系统的热传导结构,包括有电路模块、定位机构及散热座,其特征在于,其中:The utility model provides a heat conduction structure applied to a network control automation system, which includes a circuit module, a positioning mechanism and a heat sink, and is characterized in that:

该电路模块具有一电路板及电路板上所设的至少一个发热源,并于电路板二侧端部位置所形成的裸铜区设有用以传导发热源于运作时产生的热量的铜箔层;The circuit module has a circuit board and at least one heat source provided on the circuit board, and the bare copper area formed at the ends of both sides of the circuit board is provided with a copper foil layer for conducting heat generated during operation ;

该定位机构所具的外壳二侧处设有相对的侧板,并于侧板上皆设有导轨部所具的滑套用以包覆于铜箔层处形成一热传导路径,且外壳及其侧板之间形成有可供电路板定位于其内的容置空间,再于外壳的二侧板表面上分别设有至少一个弹性凸部;The two sides of the housing of the positioning mechanism are provided with opposite side plates, and the sliding sleeves of the guide rail are provided on the side plates to cover the copper foil layer to form a heat conduction path, and the housing and its sides An accommodating space for positioning the circuit board is formed between the boards, and at least one elastic protrusion is respectively provided on the surfaces of the two side boards of the housing;

该散热座具有一本体及本体内部所形成前方处具开口的对接空间,并于对接空间二侧内壁面处形成有可供导轨部的滑套嵌入使电路模块配合定位机构由开口处插入至对接空间内的多个嵌合部,且外壳上的各弹性凸部抵持接触于嵌合部周围的对接空间内壁面处形成一热传导路径。The heat sink has a body and a docking space with an opening in the front formed inside the body, and there are sliding sleeves on both sides of the docking space that can be inserted into the sliding sleeves of the guide rail so that the circuit module can be inserted from the opening to the docking with the positioning mechanism. There are a plurality of fitting parts in the space, and each elastic convex part on the shell is in contact with the inner wall surface of the docking space around the fitting parts to form a heat conduction path.

其中该电路模块的发热源于运作时产生的热量经由电路板导出至铜箔层上形成一热传导路径,且发热源为现场可编辑逻辑门阵列芯片、中央处理器、芯片组或图像处理器。The heating of the circuit module is derived from the heat generated during operation through the circuit board to the copper foil layer to form a heat conduction path, and the heat source is field programmable logic gate array chip, central processing unit, chipset or image processor.

其中该电路模块的电路板前方处设有多个端口及面板,并于面板上设有可供端口嵌设而外露的多个镂空孔,且端口为电源连接器或网络连接器,以组构成符合以太网络架构为基础的现场总线技术的网络传输适配卡。Wherein the front of the circuit board of the circuit module is provided with a plurality of ports and a panel, and the panel is provided with a plurality of hollow holes for the ports to be embedded and exposed, and the ports are power connectors or network connectors to form a The network transmission adapter card conforms to the fieldbus technology based on the Ethernet network architecture.

其中该电路模块的电路板后方端部位置设有插接部,而散热座的对接空间后方处设置有线路板,并于线路板表面上设有至少一个可供插接部对接形成电性连接的对接部。The rear end of the circuit board of the circuit module is provided with a socket, and the rear of the docking space of the heat sink is provided with a circuit board, and at least one socket is provided on the surface of the circuit board to form an electrical connection. the docking part.

其中该电路模块的面板上下二侧处分别设有一手动螺丝,而散热座的本体位于开口周围表面的上下二侧处设有间隔排列而可供手动螺丝螺入于其内锁接固定的多个螺孔。Wherein the upper and lower sides of the panel of the circuit module are respectively provided with a manual screw, and the body of the cooling seat is located on the upper and lower sides of the surface around the opening, and is provided with a plurality of spaces arranged at intervals for manual screws to be screwed into it for locking and fixing. screw holes.

其中该定位机构的导轨部先相对向外延伸后再向内反折有滑套,并于滑套内部皆形成有沿着水平方向延伸而可供电路模块的铜箔层滑动嵌入形成抵持接触的嵌槽。Wherein the guide rail of the positioning mechanism first extends relatively outwards and then folds inwards a sliding sleeve, and inside the sliding sleeve there is formed a horizontally extending copper foil layer for the circuit module to slide and embed to form abutting contact of the socket.

其中该电路模块的铜箔层上设有位于电路板角落处的多个通孔,而定位机构导轨部的滑套位于嵌槽前后二侧开口处分别向外延伸设有凸耳,并于凸耳上皆具有穿孔,且各穿孔内穿设有可供穿过通孔结合成一体的固定元件。Among them, the copper foil layer of the circuit module is provided with a plurality of through holes located at the corners of the circuit board, and the sliding sleeve of the guide rail of the positioning mechanism is located at the openings on the front and rear sides of the embedded groove, respectively extending outwards with lugs, and on the protrusions There are perforations on the ears, and each perforation is pierced with a fixing element that can pass through the through hole and be combined into one body.

其中该定位机构的弹性凸部具有拱起状的弹片,并于弹片表面上形成有平整状的顶持面,而散热座的嵌合部上分别具有可供定位机构导轨部的滑套嵌入的轨槽,并于各二相对的轨槽周围的对接空间内壁面处分别设有凸出而可供顶持面抵持接触于其上使弹片产生弹性变形的抵持块。Wherein the elastic convex portion of the positioning mechanism has an arched elastic piece, and a flat supporting surface is formed on the surface of the elastic piece, and the fitting portion of the heat dissipation seat has a sliding sleeve for the positioning mechanism guide rail to embed. Rail grooves, and the inner walls of the docking space around the two opposite rail grooves are respectively provided with abutting blocks that protrude and can be used by the top-holding surface to abut and contact on it to make the elastic deformation of the shrapnel.

其中该定位机构弹性凸部的弹片位于顶持面前后二侧相邻于侧板处形成有连接部,并于弹片左右二侧处剖设有破孔。Wherein the shrapnel of the elastic convex part of the positioning mechanism is located at the front and rear sides of the top holding surface and forms a connecting portion adjacent to the side plate, and is provided with perforations at the left and right sides of the shrapnel.

其中该散热座嵌合部的抵持块表面上形成有前低后高而可供弹片抵持接触形成一热传导路径的平整状接触面,并于接触面前方相邻于开口处形成有导角。Wherein the surface of the resisting block of the fitting part of the heat sink is formed with a flat contact surface which is low in the front and high in the rear for the shrapnel to resist and contact to form a heat conduction path, and a chamfer is formed adjacent to the opening in front of the contact surface.

本实用新型的有益效果是,可提高整体的散热效率。The beneficial effect of the utility model is that the overall heat dissipation efficiency can be improved.

附图说明Description of drawings

为进一步说明本实用新型的技术内容,以下结合实施例及附图详细说明如后,其中:In order to further illustrate the technical content of the present utility model, below in conjunction with embodiment and accompanying drawing, describe in detail as follows, wherein:

图1为本实用新型较佳实施例的立体外观图。Fig. 1 is a three-dimensional appearance view of a preferred embodiment of the present invention.

图2为本实用新型较佳实施例的立体分解图。Fig. 2 is a three-dimensional exploded view of a preferred embodiment of the present invention.

图3为本实用新型电路模块与定位机构组装前的立体外观图。Fig. 3 is a three-dimensional appearance view of the utility model before the assembly of the circuit module and the positioning mechanism.

图4为本实用新型电路模块与定位机构组装后的立体外观图。Fig. 4 is a three-dimensional appearance view of the assembled circuit module and positioning mechanism of the present invention.

图5为本实用新型较佳实施例插接时的立体外观图。Fig. 5 is a three-dimensional appearance view of a preferred embodiment of the present invention when plugged in.

图6为本实用新型较佳实施例插接时的侧视剖面图。Fig. 6 is a side sectional view of a preferred embodiment of the present invention when plugged in.

图7为本实用新型较佳实施例插接后的侧视剖面图。Fig. 7 is a side sectional view of a preferred embodiment of the present invention after insertion.

图8为本实用新型第七图的局部放大图。Figure 8 is a partially enlarged view of the seventh figure of the present invention.

具体实施方式detailed description

请参阅图1、2、3、4所示,是分别为本实用新型较佳实施例的立体外观图、立体分解图、电路模块与定位机构组装前的立体外观图及组装后的立体外观图,由图中可清楚看出,本实用新型为包括有电路模块1、定位机构2及散热座3,其中:Please refer to Figures 1, 2, 3, and 4, which are respectively the three-dimensional appearance diagram, the three-dimensional exploded view, the three-dimensional appearance diagram before the assembly of the circuit module and the positioning mechanism, and the three-dimensional appearance diagram after assembly of the preferred embodiment of the present invention. It can be clearly seen from the figure that the utility model includes a circuit module 1, a positioning mechanism 2 and a heat sink 3, wherein:

该电路模块1为具有一多层的电路板11,并于电路板11一侧或二侧表面上设有至少一个发热源111,且该发热源111较佳实施可为一现场可编辑逻辑门阵列(FPGA)芯片,但于实际应用时,亦可为中央处理器(COU)、芯片组(如ICH、RAM等)或图像处理器(如GMCH)等,而电路板11上下二侧的端部位置则形成有裸铜区110,并于裸铜区110在电路板11的端部二侧表面上分别沿着水平方向设有铜箔层12,且该铜箔层12为通过多层的电路板11内部的金属夹层(图中未示出)形成一热传导路径,以利于发热源111运作时所产生的热量可经由电路板11导出至铜箔层12上,再于铜箔层12上设有位于电路板11各角落处的多个通孔121。The circuit module 1 is a multi-layer circuit board 11, and at least one heat source 111 is provided on one or both sides of the circuit board 11, and the heat source 111 is preferably implemented as a field programmable logic gate. array (FPGA) chip, but in actual application, it can also be a central processing unit (COU), a chipset (such as ICH, RAM, etc.) or an image processor (such as GMCH), and the terminals on the upper and lower sides of the circuit board 11 A bare copper area 110 is formed at the position of the upper part, and a copper foil layer 12 is respectively arranged along the horizontal direction on the two side surfaces of the end of the circuit board 11 in the bare copper area 110, and the copper foil layer 12 is multi-layered. The metal interlayer (not shown) inside the circuit board 11 forms a heat conduction path, so that the heat generated during the operation of the heat source 111 can be exported to the copper foil layer 12 through the circuit board 11, and then on the copper foil layer 12 A plurality of through holes 121 are provided at each corner of the circuit board 11 .

再者,电路板11前方处为设有多个端口112,其端口112可为一电源连接器、网络连接器(如RJ45)或其它传输接口的规格,并于电路板11后方的端部位置沿着垂直方向设有插接部(如多个金属接点)113,且电路板11前方处设有一面板13,再于面板13上设有可供端口112嵌设而外露的多个镂空孔131,且该面板13上下二侧处分别设有一手动螺丝132,以组构成符合以太网络架构为基础的现场总线技术(EtherCAT)或其它通讯协议的网络传输适配卡或串行传输适配卡的型式。Furthermore, the front part of the circuit board 11 is provided with a plurality of ports 112, and the port 112 can be a power connector, a network connector (such as RJ45) or other transmission interface specifications, and is located at the end position of the circuit board 11 rear. Insertion parts (such as a plurality of metal contacts) 113 are provided along the vertical direction, and a panel 13 is provided at the front of the circuit board 11, and a plurality of hollow holes 131 are provided on the panel 13 for the ports 112 to be embedded and exposed. , and the upper and lower sides of the panel 13 are respectively provided with a manual screw 132 to form a network transmission adapter card or a serial transmission adapter card conforming to the fieldbus technology (EtherCAT) based on the Ethernet architecture or other communication protocols. type.

该定位机构2为具有一外壳21,其外壳21上下二侧处设有相对的侧板211,并于侧板211上皆设有导轨部22所先相对向外延伸后再向内反折的滑套221,且各滑套221内部形成有沿着水平方向延伸的嵌槽222,再于外壳21及其侧板211之间形成有前后贯通的容置空间20,而滑套221位于嵌槽222前后二侧开口处为分别向外延伸设有凸耳223,并于凸耳223上皆具有一穿孔224,且各穿孔224内穿设有固定元件225所具的螺丝2251及可与螺丝2251锁接固定的螺帽2252,该螺帽2252亦可直接焊固于铜箔层12上呈一定位,并与电路板11角落处的通孔121形成对正,以利于螺丝2251螺入于螺帽2252内;另,外壳21的二侧板211表面上为分别设有至少一个具拱起状弹片231的弹性凸部23,并于弹片231表面上皆形成有前高后低的平整状顶持面2311,且顶持面2311前后二侧相邻于侧板211处形成有连接部2312,再于弹片231的左右二侧处剖设有破孔230。The positioning mechanism 2 has a housing 21, and the upper and lower sides of the housing 21 are provided with opposite side plates 211, and the side plates 211 are provided with guide rails 22 that first extend relatively outward and then fold inward. Sliding sleeves 221, and the inside of each sliding sleeve 221 is formed with a slot 222 extending along the horizontal direction, and an accommodating space 20 through the front and back is formed between the shell 21 and its side plate 211, and the sliding sleeve 221 is located in the slot 222 front and rear two side openings are respectively outwardly extended to be provided with lugs 223, and all have a perforation 224 on the lugs 223, and each perforation 224 is perforated with the screw 2251 that fixing element 225 has and can be connected with screw 2251 Lock the fixed nut 2252, the nut 2252 can also be directly welded on the copper foil layer 12 to be positioned, and form an alignment with the through hole 121 at the corner of the circuit board 11, so as to facilitate screwing the screw 2251 into the screw. Inside the cap 2252; in addition, the two side plates 211 of the shell 21 are respectively provided with at least one elastic protrusion 23 with an arched elastic piece 231, and a flat top with a high front and a low rear is formed on the surface of the elastic piece 231. The holding surface 2311 , and the connecting portion 2312 is formed adjacent to the side plate 211 at the front and rear sides of the holding surface 2311 , and the perforated holes 230 are cut at the left and right sides of the elastic piece 231 .

该散热座3为具有机箱状的本体31,并于本体31内部形成有前方处具开口301的对接空间30,且开口301周围表面上下二侧处设有间隔排列的多个螺孔311,而本体31的对接空间30上下二侧内壁面为由开口301处向后形成有沿着水平方向间隔排列的多个嵌合部32,并于嵌合部32上皆具有轨槽321,且各二相对的轨槽321周围的对接空间30内壁面处分别设有凸出的抵持块322,再于抵持块322表面上形成有前低后高的平整状接触面3221,且各接触面3221前方相邻于开口301处形成有导角3222;又,本体31的对接空间30后方处为设置有线路板33(如图6、图7所示),并于线路板33表面上设有至少一个对接部(如插座)331。The heat sink 3 has a chassis-shaped body 31, and a docking space 30 with an opening 301 at the front is formed inside the body 31, and a plurality of screw holes 311 are arranged at intervals on the upper and lower sides of the surface around the opening 301, and The upper and lower inner walls of the docking space 30 of the main body 31 are formed with a plurality of fitting parts 32 arranged at intervals along the horizontal direction backward from the opening 301, and there are rail grooves 321 on the fitting parts 32, and each has two The inner walls of the docking space 30 around the opposite rail grooves 321 are respectively provided with protruding abutment blocks 322, and then a flat contact surface 3221 with a low front and a high rear is formed on the surface of the abutment block 322, and each contact surface 3221 A chamfer 3222 is formed adjacent to the opening 301 at the front; and a circuit board 33 (as shown in FIGS. 6 and 7 ) is provided behind the docking space 30 of the body 31 , and at least A docking part (such as a socket) 331 .

然而,上述的定位机构2较佳实施可为铜、铁或钢材质所一体成型制成,并利用机械冲压与弯折等加工方式成型出外壳21及其导轨部22、弹性凸部23结构,但于实际应用时,定位机构2亦可为铝材质所一体成型制成,且该外壳21为呈一框板的型式,或者是可在外壳21表面上利用铝挤型加工的方式成型出矗立状的多个鳍片,以增加其散热的表面积,而散热座3也可为铜或铝材质所一体成型制成或多个板体分开组构结合成为一体,并于本体31内部形成有上下二侧内壁面具多个嵌合部32的对接空间30,惟此部分有关定位机构2的外壳21与散热座3的本体31组构与成型方式很多,亦可依实际的应用变更设计,且该细部的构成并非本案的创设要点,兹不再作赘述。However, the above-mentioned positioning mechanism 2 can be integrally formed of copper, iron or steel, and the shell 21 and its guide rail portion 22 and elastic convex portion 23 are formed by mechanical stamping and bending. However, in actual application, the positioning mechanism 2 can also be integrally formed of aluminum material, and the housing 21 is in the form of a frame plate, or can be formed on the surface of the housing 21 to stand upright Shaped multiple fins to increase the surface area for heat dissipation, and the heat sink 3 can also be integrally formed of copper or aluminum, or a plurality of plates can be separated and combined into one body, and an upper and lower structure is formed inside the main body 31. The inner wall of the two sides has a docking space 30 with a plurality of fitting parts 32, but there are many configurations and molding methods for this part related to the housing 21 of the positioning mechanism 2 and the body 31 of the heat sink 3, and the design can also be changed according to the actual application. The detailed composition is not the key point of this case, so I won't repeat it here.

当本实用新型的电路模块1与定位机构2于组装时,是先将外壳21上下二侧处的导轨部22以滑套221分别包覆于电路板11上对应的铜箔层12处,其电路板11上的铜箔层12便会沿着滑套221的嵌槽222内滑动嵌入,并横向推动于外壳21上朝电路板11相对向内位移而使电路板11定位于容置空间20内,且待凸耳223的穿孔224对应于铜箔层12的通孔121处后,再将固定元件225的螺丝2251分别穿过穿孔224与通孔121而螺入于螺帽2252内锁接固定成为一体,并具有稳定的阻挡定位及止退的效用,以确保外壳21与电路板11稳固的结合,且各铜箔层12抵持接触于导轨部22的滑套221内壁面处形成一热传导路径,续将面板13亦可利用上述的螺丝锁固的方式结合于电路板11前方处形成相互垂直的状态,并使电路板11上的端口112分别嵌设而外露于面板13的镂空孔131处,且该电路板11上相对于外壳21的另侧表面处也可利用螺丝锁固的方式结合有另一金属壳体(图中未标示)。When the circuit module 1 of the present utility model is assembled with the positioning mechanism 2, the guide rail parts 22 at the upper and lower sides of the housing 21 are respectively covered with the sliding sleeves 221 on the corresponding copper foil layers 12 on the circuit board 11. The copper foil layer 12 on the circuit board 11 will be slid and embedded in the slot 222 of the sliding sleeve 221, and pushed laterally on the casing 21 to move relatively inwardly towards the circuit board 11 so that the circuit board 11 is positioned in the accommodating space 20 After the perforation 224 of the lug 223 corresponds to the through hole 121 of the copper foil layer 12, the screws 2251 of the fixing element 225 are respectively passed through the perforation 224 and the through hole 121 and screwed into the nut 2252 for locking. It is fixed as a whole, and has the effect of stably blocking positioning and preventing retreat, so as to ensure the stable combination of the shell 21 and the circuit board 11, and each copper foil layer 12 is in contact with the inner wall of the sliding sleeve 221 of the guide rail part 22 to form a The heat conduction path, the panel 13 can also be combined with the front of the circuit board 11 by the above-mentioned screw locking method to form a mutually perpendicular state, and the ports 112 on the circuit board 11 are respectively embedded and exposed to the hollow holes of the panel 13 131 , and another metal shell (not shown in the figure) may also be combined with screw locking on the surface of the circuit board 11 opposite to the shell 21 .

请搭配参阅图5、6、7、8所示,是分别为本实用新型较佳实施例插接时的立体外观图、侧视剖面图、插接后的侧视剖面图及第七图的局部放大图,由图中可清楚看出,当已组装有定位机构2的电路模块1与散热座3于组装时,是先将外壳21上下二侧处的导轨部22以滑套221分别沿着嵌合部32上对应的轨槽321嵌入,其弹性凸部23的弹片231便会分别抵持于抵持块322上,并使弹片231的顶持面2311经由导角3222处而滑动位移至抵持块322的接触面3221上后便会产生向内弹性变形,且待外壳21推入至定位后,可使弹片231与抵持块322之间形成有大约为0.1mm的预设干涉值,或者是可将弹片231的顶持面2311直接抵持接触于本体31的对接空间30内壁面处,由于散热座3的本体31于加工成型时为了使工件与模具更容易脱离或拔出,通常会在工件与模具分模面之间默认一定的制造公差(如拔模角),即可通过弹性凸部23抵持于散热座3的导轨部22上形成紧密接触以利于热的传导,由此可将多组电路模块1配合定位机构2利用上述的组装方式分别依序插入至散热座3的对接空间30内形成并排设置,并使电路板11的插接部113对接于线路板33上对应的对接部331形成电性连接,且各面板13上下二侧处分别挡止于本体31的开口301周围表面处,再旋紧于手动螺丝132螺入于本体31的螺孔311内锁接固定成为一体,以防止散热座3受到外力的影响时所造成电路模块1与定位机构2不当松脱或掉落而损坏的缺点。Please refer to Figures 5, 6, 7, and 8, which are the three-dimensional appearance diagram, side sectional view, side sectional view after plugging, and the seventh figure of the preferred embodiment of the present invention when plugged in. Partial enlarged view, it can be clearly seen from the figure that when the circuit module 1 with the positioning mechanism 2 and the heat sink 3 are assembled, the guide rails 22 at the upper and lower sides of the housing 21 are first moved along with the sliding sleeve 221 respectively. Inserting the corresponding rail groove 321 on the fitting part 32, the elastic pieces 231 of the elastic convex part 23 will respectively bear against the abutting block 322, and make the supporting surface 2311 of the elastic piece 231 slide and displace through the corner 3222 After reaching the contact surface 3221 of the resisting block 322, inward elastic deformation will occur, and after the housing 21 is pushed into position, a preset interference of about 0.1 mm can be formed between the elastic piece 231 and the resisting block 322 value, or the supporting surface 2311 of the shrapnel 231 can be directly contacted with the inner wall surface of the docking space 30 of the body 31, because the body 31 of the heat sink 3 is easier to separate or pull out the workpiece and the mold during molding. , usually a certain manufacturing tolerance (such as draft angle) is defaulted between the workpiece and the parting surface of the mold, that is, the elastic convex part 23 is held against the guide rail part 22 of the heat sink 3 to form a close contact to facilitate heat conduction In this way, a plurality of groups of circuit modules 1 can be inserted into the docking space 30 of the heat sink 3 in sequence by using the above-mentioned assembly method in conjunction with the positioning mechanism 2 to form a side-by-side arrangement, and the socket part 113 of the circuit board 11 can be docked with the circuit board. 33 on the corresponding docking portion 331 to form an electrical connection, and the upper and lower sides of each panel 13 respectively block the surface around the opening 301 of the main body 31, and then tighten the manual screw 132 and screw it into the screw hole 311 of the main body 31 Locking and fixing are integrated to prevent the circuit module 1 and the positioning mechanism 2 from being damaged due to improper loosening or falling when the heat sink 3 is affected by an external force.

当电路模块1上的发热源111于运作时所产生的热量,可通过电路板11内部的金属夹层吸收而导出至铜箔层12上,并将铜箔层12上的热量经由定位机构2导轨部22的滑套221与弹性凸部23传导至散热座3内的嵌合部32上形成一热传导路径,便可通过散热座3增加整体的散热面积,并辅助电路板11的发热源111来将囤积的热量导出至定位机构2与散热座3进行散热,其温度测试(ThermalTest)结果得知大约可导引出20的热能而具有良好的散热效果,且该定位机构2配合散热座3所能导引出电路模块1的热能多寡主要视材质的种类而定,以提高发热源111的散热效率并保持系统正常的运作,也可通过电路板11上的铜箔层12将电路模块1于运作时所产生的电磁波干扰(EMI)、静电及串音等噪声干扰经由定位机构2导引传输至散热座3上进行接地释放,使整体信号传输的质量更为稳定。When the heat source 111 on the circuit module 1 is in operation, the heat generated can be absorbed by the metal interlayer inside the circuit board 11 and exported to the copper foil layer 12, and the heat on the copper foil layer 12 can be passed through the guide rail of the positioning mechanism 2 The sliding sleeve 221 of the part 22 and the elastic convex part 23 conduct to the fitting part 32 in the heat sink 3 to form a heat conduction path, which can increase the overall heat dissipation area through the heat sink 3 and assist the heat source 111 of the circuit board 11 to The accumulated heat is exported to the positioning mechanism 2 and the heat sink 3 for heat dissipation. The result of the thermal test (ThermalTest) shows that the heat energy of about 20 can be guided and has a good heat dissipation effect, and the positioning mechanism 2 cooperates with the heat sink 3 The amount of heat energy that can be guided out of the circuit module 1 mainly depends on the type of material, so as to improve the heat dissipation efficiency of the heat source 111 and maintain the normal operation of the system. Noise interference such as electromagnetic wave interference (EMI), static electricity, and crosstalk generated during operation is guided by the positioning mechanism 2 and transmitted to the heat sink 3 for ground release, making the overall signal transmission quality more stable.

而电路模块1配合定位机构2组装于散热座3的对接空间30内时,可利用导轨部22的滑套221弯折结构设计包覆于电路板11的铜箔层12处,以增加电路板11结构强度,并支撑电路模块1重复插拔对接的过程中不易产生变形或结构破坏,亦可通过导轨部22的滑套221配合散热座3上对应的嵌合部32导引与限位作用,使电路模块1稳固且确实的组装于散热座3的对接空间30内,也可利用定位机构2罩覆于电路板11的发热源111及其它电子元件,以保护电路板11上所有的发热源111及电子元件的安全,且因电路模块1插拔对接的过程中无法限制使用者的力度与方向,所以可利用定位机构2防止多组电路模块1之间不会因相互碰撞而受损或破坏,更具实用性的效果。When the circuit module 1 is assembled with the positioning mechanism 2 in the docking space 30 of the heat sink 3, the sliding sleeve 221 of the guide rail part 22 can be used to wrap the copper foil layer 12 of the circuit board 11 in a bending structure design to increase the number of circuit boards. 11 Structural strength, and support circuit module 1 is not easy to be deformed or damaged in the process of repeated plugging and docking, and can also be guided and limited by the sliding sleeve 221 of the guide rail part 22 and the corresponding fitting part 32 on the heat sink 3 , so that the circuit module 1 can be firmly and reliably assembled in the docking space 30 of the heat sink 3, and the positioning mechanism 2 can also be used to cover the heat source 111 and other electronic components on the circuit board 11 to protect all heat generated on the circuit board 11. The safety of the source 111 and electronic components, and because the strength and direction of the user cannot be restricted during the plugging and docking process of the circuit module 1, the positioning mechanism 2 can be used to prevent multiple groups of circuit modules 1 from being damaged due to mutual collision Or destroy, a more practical effect.

上述详细说明为针对本实用新型一种较佳的可行实施例说明而已,惟该实施例并非用以限定本实用新型的申请专利范围,凡其它未脱离本实用新型所揭示的技术精神下所完成的均等变化与修饰变更,均应包含于本实用新型所涵盖的专利范围中。The above detailed description is just a description of a preferred feasible embodiment of the utility model, but this embodiment is not used to limit the scope of the patent application of the utility model, and all others are completed without departing from the technical spirit disclosed in the utility model The equivalent changes and modification changes should be included in the patent scope covered by the utility model.

综上所述,本实用新型上述的应用于网络控制自动化系统的热传导结构于使用时为确实能达到其功效及目的,故本实用新型诚为一实用性优异的创作,实符合新型专利的申请条件,故依法提出申请。To sum up, the above-mentioned heat conduction structure applied to the network control automation system of the present utility model can really achieve its effect and purpose when used, so the utility model is a creation with excellent practicability, and it is in line with the application for a new patent Conditions, so apply in accordance with the law.

Claims (10)

1. be applied to a heat conduction structure for network control automated system, include circuit module, detent mechanism and radiating seat, it is characterized in that, wherein:
This circuit module has at least one pyrotoxin set on a circuit board and circuit board, and the naked copper district formed in circuit board two side end position is provided with the copper foil layer of the heat produced when coming from running in order to conduction heating;
The shell two side place of this detent mechanism institute tool is provided with relative side plate, and the sliding sleeve being all provided with rail portion institute tool on side plate forms a heat conduction path in order to be coated on copper foil layer place, and be formed with between shell and side plate thereof can power circuit board location accommodation space in the inner, then be respectively equipped with at least one resilient projection on two surface of side plate of shell;
This radiating seat has a body and body interior forms ostiolate docking space, front place, and be formed in docking internal face place, side, space two to embed for the sliding sleeve of rail portion and make circuit module coordinate detent mechanism to be inserted into multiple fitting portions in docking space by opening part, and each resilient projection on shell supports the docking space wall face place be contacted with around fitting portion forms a heat conduction path.
2. be applied to the heat conduction structure of network control automated system as claimed in claim 1, it is characterized in that, the heat produced when wherein the heating of this circuit module comes from running exports on copper foil layer via circuit board and forms a heat conduction path, and pyrotoxin is field-programmable logic gate array chip, central processing unit, chipset or image processor.
3. be applied to the heat conduction structure of network control automated system as claimed in claim 1, it is characterized in that, wherein the circuit board front place of this circuit module is provided with multiple port and panel, and be provided with can be embedded and multiple hollow holes of exposing for port in panel, and port is power connector or network connector, to organize the Internet Transmission adapter being formed the field bus technique met based on Ethernet framework.
4. be applied to the heat conduction structure of network control automated system as claimed in claim 3, it is characterized in that, wherein the circuit board rear end position of this circuit module is provided with Plug Division, and the rear place, docking space of radiating seat is provided with wiring board, and be provided with in PCB surface at least one can form electric connection docking section for Plug Division docking.
5. be applied to the heat conduction structure of network control automated system as claimed in claim 3, it is characterized in that, wherein the upper and lower two side places of the panel of this circuit module are respectively equipped with a manual screw, and the two side places up and down that the body of radiating seat is positioned at around openings surface are provided with and are spaced and can be screwed into for manual screw multiple screws that interlocking is fixing in the inner.
6. be applied to the heat conduction structure of network control automated system as claimed in claim 1, it is characterized in that, wherein after the first relative extension of the rail portion of this detent mechanism, inside reflexed has sliding sleeve again, and is all formed along horizontal direction extension in sliding sleeve inside and can forms for the copper foil layer slip embedding of circuit module the caulking groove supporting contact.
7. be applied to the heat conduction structure of network control automated system as claimed in claim 6, it is characterized in that, wherein the copper foil layer of this circuit module is provided with the multiple through holes being positioned at circuit board corner, and the sliding sleeve of detent mechanism rail portion is positioned at two side opening places before and after caulking groove stretches out respectively and be provided with lug, and all there is perforation on lug, and in each perforation, be equipped with the retaining element that can supply to be combined into one through through hole.
8. be applied to the heat conduction structure of network control automated system as claimed in claim 1, it is characterized in that, wherein the resilient projection of this detent mechanism has the shell fragment of the shape that arches upward, and be formed with smooth shape on the surface in shell fragment hold face, and the fitting portion of radiating seat has respectively the rail groove that can embed for the sliding sleeve of detent mechanism rail portion, and the docking space wall face place around each two relative rail grooves is respectively equipped with and protrudes and can support contact for the face of holding and make shell fragment produce the holding block of strain thereon.
9. be applied to the heat conduction structure of network control automated system as claimed in claim 8, it is characterized in that, wherein the shell fragment of this detent mechanism resilient projection be positioned at and hold in face of after two sides be formed with connecting portion adjacent to side plate place, and two side places cut open and are provided with holes in about shell fragment.
10. be applied to the heat conduction structure of network control automated system as claimed in claim 8, it is characterized in that, wherein the holding block of this radiating seat fitting portion is formed low early and high after on the surface and can supports for shell fragment the smooth shape contact-making surface contacting formation one heat conduction path, and is formed with lead angle in contact-making surface front adjacent to opening part.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107124854A (en) * 2017-05-26 2017-09-01 航天东方红卫星有限公司 A kind of storehouse assembly thermal controls apparatus
CN110291851A (en) * 2017-04-17 2019-09-27 株式会社电装 Electronic device
CN111656877A (en) * 2018-11-26 2020-09-11 倍福自动化有限公司 Control system and control system installation method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110291851A (en) * 2017-04-17 2019-09-27 株式会社电装 Electronic device
CN107124854A (en) * 2017-05-26 2017-09-01 航天东方红卫星有限公司 A kind of storehouse assembly thermal controls apparatus
CN111656877A (en) * 2018-11-26 2020-09-11 倍福自动化有限公司 Control system and control system installation method
US11128111B2 (en) 2018-11-26 2021-09-21 Beckhoff Automation Gmbh Control system and method of mounting a control system

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