CN1893764A - Composite printed circuit board and electronic apparatus - Google Patents
Composite printed circuit board and electronic apparatus Download PDFInfo
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- CN1893764A CN1893764A CN 200510037027 CN200510037027A CN1893764A CN 1893764 A CN1893764 A CN 1893764A CN 200510037027 CN200510037027 CN 200510037027 CN 200510037027 A CN200510037027 A CN 200510037027A CN 1893764 A CN1893764 A CN 1893764A
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- circuit board
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Abstract
Combined type printed circuit board (PCB) includes a first PCB and a second PCB. The first PCB lays first connect pattern; and the second PCB lays second connect pattern. The first PCB is placed on the second PCB flatly. Area of the first PCB is smaller than area of the second PCB; and the first connect pattern is connected to the second connect pattern electrically. The disclosed combined type PCB can replace application of traditional multi-layer board. The invention reduces cost of PCB as well as cost of electronic equipment.
Description
[technical field]
(Printed Circuit board PCB), relates in particular to a kind of structure with a plurality of printed circuit board (PCB) combinations to the present invention relates to a kind of printed circuit board (PCB).
[background technology]
(Printed Circuit board is the strutting piece of electronic component in the electronic product PCB) to printed circuit board (PCB), is used to provide the electric connection between various electronic components.Along with the develop rapidly of electronic technology, the electronic component that needs in the electronic product is more and more, and circuit and element on the printed circuit board (PCB) are also more and more intensive.In order to adapt to the needs of present wiring, printed circuit board (PCB) mainly is divided into three kinds of single sided board (Single-sided Board), double sided board (Double-sided Board) and multi-layer sheet (Multi-layer Board).Because single sided board has the restriction of many strictnesses on designed lines, for example:, just can not have the intersection must be between wiring around independent paths, so the simple circuit that is only applicable to connect up because have only one side to connect up.Therefore all there is wiring on the two sides of double sided board, and the area of wiring is bigger one times than single sided board, and can be interlaced between wiring, promptly around the another side to double sided board, so be suitable for use in than on the more complicated circuit of single sided board circuit.And multi-layer sheet system is formed by the pressing of a plurality of single or double plate, and be exclusively used in complicated circuit to reach required circuit performance, for example: computer main frame panel is generally 4 to 8 layers printed circuit board (PCB).
When selecting printed circuit board (PCB), except select printed circuit board (PCB) according to circuit complexity itself, also need to consider from the cost angle of using various printed circuit board (PCB)s.Usually, the many more costs of the number of plies of printed circuit board (PCB) are just high more.Common single sided board and not have the unit price of double sided board of guide hole (Via) more much lower than the double sided board with guide hole and multiple-plate unit price.But because the use of printed circuit board (PCB) is generally single structure at present, the double sided board that promptly uses single sided board or do not have a guide hole is to reduce cost, or use double sided board with guide hole or multi-layer sheet to guarantee circuit performance, yet the circuit board of single structure is difficult to take into account simultaneously circuit and is suitable for the requirement that reaches two aspects of cost.
Again, printed circuit board (PCB) is applied in the electronic installation usually, so the performance of printed circuit board (PCB) and cost directly influence the performance and the cost of electronic installation.Find out thus, use the electronic installation of single structure printed circuit board (PCB), can't under the condition that the assurance circuit is suitable for, reduce cost simultaneously.
[summary of the invention]
Based on above-mentioned deficiency, a kind of composite printed circuit board need be provided, and (Printed Circuitboard PCB), under the condition that the assurance circuit is suitable for, reduces cost.
Yet, also need provide a kind of electronic installation, it uses composite printed circuit board, reduces cost.
A kind of composite printed circuit board of embodiment of the present invention comprises one first printed circuit board (PCB) and one second printed circuit board (PCB).First printed circuit board (PCB) is furnished with first lead (ConnectPattern); Second printed circuit board (PCB) is furnished with second lead.Wherein, first printed circuit board (PCB) is placed horizontally on second printed circuit board (PCB), and the area of first printed circuit board (PCB) is less than the area of second printed circuit board (PCB), and second lead of first lead of first printed circuit board (PCB) and second printed circuit board (PCB) electrically connects.
In embodiment of the present invention, first printed circuit board (PCB) can be selected an a pair of panel (Double-sided Board) or a multi-layer sheet (Multi-Layer Board) for use, and second printed circuit board (PCB) can be selected a single sided board (Single-sided Board) or a double sided board for use.When wiring, based on second printed circuit board (PCB).According to the circuit needs, on first printed circuit board (PCB), remainder circuit cloth is on second printed circuit board (PCB) with part complexity or high-tension circuit cloth.The size of first printed circuit board (PCB) and second printed circuit board (PCB) then designs according to the circuit needs.Adopt the replaceable traditional multi-layer sheet that must use of printed circuit board (PCB) of this kind structure, reached the effect of " making the best use of everything ", can significantly reduce cost, and not influence the performance of circuit.
Secondly, because being positioned at above second printed circuit board (PCB) of the first printed circuit plate level, on second printed circuit board (PCB), the orthographic projection below of first printed circuit board (PCB), cloth a slice covers the electromagnetic shield made from Copper Foil of orthographic projection position, then can play the effect to the first printed circuit board (PCB) electromagnetic shielding.
Once more, owing to embodiments of the present invention adopt based on single sided board, and on described single sided board, electrically connect a multiple-plate composite printed circuit board.Described single sided board adopts thicker sheet material to meet certain mechanical strength usually, and multi-layer sheet is set up on the described single sided board, then can not consider the requirement of mechanical strength, adopts thin sheet material more easily to form high power capacity electric capacity.According to the printed circuit board (PCB) buried capacitor principle is set so, on composite printed circuit board of the present invention, also can forms high power capacity electric capacity and low capacity electric capacity simultaneously, use on the power supply road.
A kind of electronic installation of embodiment of the present invention comprises an electronic component, one first printed circuit board (PCB) and one second printed circuit board (PCB).Electronic component comprises one first pin and one second pin; First printed circuit board (PCB) is furnished with one first lead, electrically connects in order to first pin with electronic component; Second printed circuit board (PCB) is furnished with one second lead, electrically connects in order to second pin with electronic component; Wherein, first printed circuit board (PCB) is placed horizontally on second printed circuit board (PCB), and the area of first printed circuit board (PCB) is less than the area of second printed circuit board (PCB), and second lead of first lead of first printed circuit board (PCB) and second printed circuit board (PCB) electrically connects.
[description of drawings]
Fig. 1 is the first execution mode schematic diagram of composite printed circuit board of the present invention.
Fig. 2 is the second execution mode schematic diagram of composite printed circuit board of the present invention.
Fig. 3 is the 3rd execution mode schematic diagram of composite printed circuit board of the present invention.
Fig. 4 is the 4th execution mode schematic diagram of composite printed circuit board of the present invention.
Fig. 5 is the 5th execution mode schematic diagram of composite printed circuit board of the present invention.
Fig. 6 is the 6th execution mode schematic diagram of composite printed circuit board of the present invention.
Fig. 7 is an execution mode schematic diagram of electronic installation of the present invention.
Fig. 8 is another execution mode schematic diagram of electronic installation of the present invention.
[embodiment]
See also Fig. 1, be composite printed circuit board of the present invention (Printed Circuit board, first execution mode schematic diagram PCB).Composite printed circuit board comprises: one first printed circuit board (PCB) 100 and one second printed circuit board (PCB), 200, the first printed circuit board (PCB)s 100 are placed horizontally at the top of second printed circuit board (PCB) 200.In the present embodiment, first printed circuit board (PCB) 100 is a double sided board (Double-sided board), second printed circuit board (PCB) 200 is a single sided board (Single-sided board), and the area of first printed circuit board (PCB) 100 is less than the area of second printed circuit board (PCB) 200.The first printing electroplax 100 is furnished with one first lead (Connect Pattern) 102, is positioned at its upper and lower surface, electrically connects in order to provide between electronic component.First lead 102 can be printed circuit board surface through the Copper Foil after the etch processes.In the present embodiment, 102 in first lead of first printed circuit board (PCB), 100 upper and lower surfaces is embedded with a plurality of guide holes (Via) (not shown), the madial wall of described guide hole is electroplate with metal level, is used to make first lead 102 of first printed circuit board (PCB), 100 upper and lower surfaces and the lead (not shown) of first printed circuit board (PCB), 100 interior each interlayer to be electrically connected to each other.Second printed circuit board (PCB) 200 is furnished with one second lead 108, is positioned at its upper surface, electrically connects in order to provide between electronic component.In order to electrically connect with realization at first lead 102 of first printed circuit board (PCB) 100 and 108 solder 106a of second lead of second printed circuit board (PCB) 200, in the present embodiment, sidewall at first printed circuit board (PCB) 100 is attached with metal promoted weldering body 104, so that the lead (not shown) of each interlayer can be electrically connected to each other in first lead 102 of first printed circuit board (PCB), 100 upper and lower surfaces and first printed circuit board (PCB) 100, and provide the pad of solder 106a.In the present embodiment, described metal promoted weldering body 104 can be realized in the following manner: utilize plated-through-hole processing procedure (Plated-through-hole, PTH), at the sidewall of first printed circuit board (PCB) 100, a metal level is electroplated or deposited to 102 in first lead of upper and lower surface as metal promoted weldering body 104; The metal level of guide hole sidewall that perhaps utilizes first printed circuit board (PCB) 100 itself is as metal promoted weldering body 104.
Adopt the composite printed circuit board of present embodiment, can be on first printed circuit board (PCB) 100 with the circuit cloth of part complexity or high pressure, with remainder circuit cloth on second printed circuit board (PCB) 200.Because second printed circuit board (PCB) 200 is cheap single sided board, and when the cloth circuit based on second printed circuit board (PCB) 200, only will part necessary complexity or high-tension circuit cloth is at the higher relatively multi-layer sheet of price, promptly on less first printed circuit board (PCB) 100 of area.Therefore, this kind composite printed circuit board not only can replace traditional multi-layer sheet that must use and just can meet complicated wiring, and can significantly reduce production costs under the condition that does not influence circuit performance.
See also Fig. 2, be the second execution mode schematic diagram of composite printed circuit board of the present invention.The electric connection mode of first lead 102 of first printed circuit board (PCB) 100 of present embodiment and second lead 108 of second printed circuit board (PCB) 200 is identical with execution mode shown in Figure 1.Difference is that the orthographic projection position of first printed circuit board (PCB) 100 on second printed circuit board (PCB) 200 is provided with an electromagnetic shield 300, reaches the effect to first printed circuit board (PCB), 100 electromagnetic shieldings.Electromagnetic shield 300 can be a Copper Foil, is positioned on second printed circuit board (PCB) 200, and covers the orthographic projection position of first printed circuit board (PCB) 100.
Except that above-mentioned advantage, embodiments of the present invention adopt based on second printed circuit board (PCB) 200, and electrically connect the structure of one first printed circuit board (PCB) 100 on described second printed circuit board (PCB) 200.Described second printed circuit, 200 plates adopt thicker sheet material usually for satisfying the certain mechanical strength requirement.First printed circuit board (PCB) 100 is set up on described second printed circuit board (PCB) 200, need not consider the requirement of mechanical strength, can adopt thin sheet material, more easily forms high power capacity or low electric weight electric capacity.Form principle according to the printed circuit board (PCB) buried capacitor, on composite printed circuit board of the present invention, also can form high power capacity electric capacity or low capacity capacitances to supply power road simultaneously and use.
In the composite printed circuit board of the present invention, the electric connection that first lead 102 of first printed circuit board (PCB) 100 and second lead of second printed circuit board (PCB) 200 are 108, except that can adopting above-mentioned execution mode, other several execution modes also are provided, all can realize above-mentioned advantage of the present invention.
See also Fig. 3, be the 3rd execution mode schematic diagram of composite printed circuit board of the present invention.The electric connection that first lead 102 of first printed circuit board (PCB) 100 and second lead of second printed circuit board (PCB) 200 are 108 is by direct solder 106b between second lead 108 of first lead 102 of first printed circuit board (PCB), 100 lower surfaces and second printed circuit board (PCB), 200 upper surfaces.Wherein, solder 106b can be positioned at first printed circuit board (PCB) 100 under, also can be positioned at the below of first printed circuit board (PCB), 100 1 sides.
See also Fig. 4, be the 4th execution mode schematic diagram of composite printed circuit board of the present invention.The electric connection that first lead 102 of first printed circuit board (PCB) 100 and second lead of second printed circuit board (PCB) 200 are 108 is by the routing mode, promptly at first lead 102 on first printed circuit board (PCB) 100 and 108 welding of second lead on second printed circuit board (PCB) 200 bonding wire 110a, that is bonding wire 110a connects first lead 102 of first printed circuit board (PCB) 100 and second lead 108 of second printed circuit board (PCB) 200.
See also Fig. 5, be the 5th execution mode schematic diagram of composite printed circuit board of the present invention.Present embodiment part different from the embodiment described above is the electric connection part nationality of 108 in second lead of first lead 102 of first printed circuit board (PCB) 100 and second printed circuit board (PCB) 200 by solder 106c, and the part nationality is realized by welding bonding wire 110b.
See also Fig. 6, be the 6th execution mode schematic diagram of composite printed circuit board of the present invention.The electric connection that first lead 102 of first printed circuit board (PCB) 100 and second lead of second printed circuit board (PCB) 200 are 108 utilizes a connector to realize.In the present embodiment, comprise one first connector 116 on first printed circuit board (PCB) 100, electrically connect that correspondence comprises one second connector 118 on second printed circuit board (PCB) 200, electrically connect with second lead 108 with first lead 102.In the present embodiment, first connector 116 is a public connector, and second connector 118 is a female connectors.Be connected direction and first printed circuit board (PCB) 100 of first connector 116 and second connector 118 surperficial parallel.Know clearly it, first connector 116 inserts second connector 118 with level in first printed circuit board (PCB), 100 directions, and first lead 102 of the printed circuit board (PCB) 100 of winning and second lead 108 of second printed circuit board (PCB) 200 are electrically connected.In other execution modes of the present invention, first connector 116 on first printed circuit board (PCB) 100 can be female connectors, and correspondingly, second connector 118 on second printed circuit board (PCB) 200 can be public connector.
Other execution mode beyond the present invention, according to the needs of wiring, the selection of first printed circuit board (PCB) 100 is not limited to multi-layer sheet, the double sided board that also can select not have the double sided board of guide hole or guide hole is arranged; The selection of second printed circuit board (PCB) 200 also is not limited to single sided board, the double sided board that also can select not have the double sided board of guide hole or guide hole is arranged.The electric connection that first printed circuit board (PCB) 100 and second printed circuit board (PCB) are 200, except can adopting above-mentioned execution mode, also can adopt the combination in any of above-mentioned various execution modes, all attainable cost is invented technical problem to be solved, has advantage of the present invention.
Except composite printed circuit board is provided, also provide the electronic installation of using composite printed circuit board in the embodiment of the present invention.Because composite printed circuit board has lower cost, correspondingly, uses its electronic installation also to have lower cost.
See also Fig. 7, be an execution mode schematic diagram of electronic installation 10 of the present invention.Electronic installation 10 comprises one first printed circuit board (PCB) 100, one second printing path plate 200 and an electronic component 40.Wherein, first printed circuit board (PCB) 100 is placed horizontally on second printed circuit board (PCB) 200, and the first printing electroplax 100 is furnished with one first lead 102, is positioned at its upper and lower surface, electrically connects in order to provide between electronic component.Second printed circuit board (PCB) 200 is furnished with one second lead 108, is positioned at its upper surface, electrically connects in order to provide between electronic component.Wherein, first printed circuit board (PCB) 100 electrically connects by the scolder 106a and second printed circuit board (PCB) 200, and the area of first printed circuit board (PCB) 100 is less than the area of second printed circuit board (PCB) 200.Again, the electric connection of 200 of first circuit board 100 and second circuit boards can also be adopted the electric connection mode of above-mentioned all execution modes.
In the present embodiment, electronic component 40, for example: transformer, inductance etc. comprise a body 400, one first pin 401 and one second pin 402.First pin 401 comprises one first lead division A1 and one first contact site B1, and second pin 402 comprises one second lead division A2 and one second contact site B2.Wherein, the first lead division A1 and the second lead division A2 all electrically connect with the body 400 of electronic component 40, the first contact site B1 is positioned at the upper surface of first printed circuit board (PCB) 100, and electrically connect with first lead 102, the second contact site B2 is positioned at the upper surface of second printed circuit board (PCB) 200, and electrically connects with second lead 108.In the present embodiment, the first lead division A1 and the second lead division A2 are on the same horizontal plane.In order to be connected with first printed circuit board (PCB) 100, second printed circuit board (PCB) 200 of diverse location, the first contact site B1 and the second contact site B2 are positioned on the non-same horizontal plane.
See also Fig. 8, be the schematic diagram of electronic installation 10 another execution modes of the present invention.Wherein, the first lead division A1 and the second lead division A2 ' also can be on the non-same horizontal plane.
Claims (16)
1. composite printed circuit board comprises:
One first printed circuit board (PCB), it is furnished with one first lead; And
One second printed circuit board (PCB), it is furnished with one second lead;
It is characterized in that described first printed circuit board (PCB) is placed horizontally on described second printed circuit board (PCB), and the area of first printed circuit board (PCB) is less than the area of second printed circuit board (PCB), and second lead of first lead of first printed circuit board (PCB) and second printed circuit board (PCB) electrically connects.
2. composite printed circuit board as claimed in claim 1 is characterized in that described first lead is distributed in the surface of first printed circuit board (PCB), and described second lead is distributed in the surface of second printed circuit board (PCB).
3. composite printed circuit board as claimed in claim 1 is characterized in that described second printed circuit board (PCB) is single sided board, guide hole (Via) double sided board is arranged or do not have the guide hole double sided board.
4. composite printed circuit board as claimed in claim 1 is characterized in that also comprising a bonding wire, and described bonding wire connects first lead of first printed circuit board (PCB) and second lead of described second printed circuit board (PCB).
5. composite printed circuit board as claimed in claim 1 is characterized in that also comprising a scolder, and described scolder connects first lead of described first printed circuit board (PCB) and second lead of described second printed circuit board (PCB).
6. composite printed circuit board as claimed in claim 1 is characterized in that described first printed circuit board (PCB) comprises metal promoted weldering body, and first lead of described metal promoted weldering body and described first printed circuit board (PCB) electrically connects.
7. composite printed circuit board as claimed in claim 6 is characterized in that also comprising a scolder, and described scolder connects the metal promoted weldering body of first printed circuit board (PCB) and second lead of second printed circuit board (PCB).
8. composite printed circuit board as claimed in claim 7 is characterized in that also comprising a bonding wire, and described bonding wire partly connects first lead of first printed circuit board (PCB) and second lead of second printed circuit board (PCB).
9. composite printed circuit board as claimed in claim 1, it is characterized in that described first printed circuit board (PCB) comprises one first connector, electrically connect with described first lead, the described second printed circuit board (PCB) correspondence comprises one second connector, electrically connect with described second lead, and electrically connect with first connector of described first printed circuit board (PCB).
10. composite printed circuit board as claimed in claim 9, first connector that it is characterized in that described first printed circuit board (PCB) and the closure of second connector of described second printed circuit board (PCB) are surperficial parallel with described first printed circuit board (PCB).
11. composite printed circuit board as claimed in claim 1 is characterized in that described second printed circuit board (PCB) more comprises an electromagnetic shield, is positioned at the orthographic projection position of described first printed circuit board (PCB) on described second printed circuit board (PCB).
12. an electronic installation comprises:
One electronic component comprises one first pin and one second pin;
One first printed circuit board (PCB) is furnished with one first lead on it; And
One second printed circuit board (PCB) is furnished with one second lead on it;
It is characterized in that described first pin and described first lead electrically connect, described second pin and described second lead electrically connect; Described first printed circuit board (PCB) is placed horizontally on described second printed circuit board (PCB), and the area of first printed circuit board (PCB) is less than the area of second printed circuit board (PCB), and second lead of first lead of first printed circuit board (PCB) and second printed circuit board (PCB) electrically connects.
13. electronic installation as claimed in claim 12 is characterized in that described first lead is distributed in the surface of first printed circuit board (PCB), described second lead is distributed in the surface of second printed circuit board (PCB).
14. electronic installation as claimed in claim 12 is characterized in that described first pin comprises one first contact site, electrically connects with first lead; And described second pin comprises one second contact site, electrically connects with second lead.
15. electronic installation as claimed in claim 14 is characterized in that described first contact site is higher than second contact site.
16. electronic installation as claimed in claim 12 is characterized in that described electronic component comprises a body, described first pin comprises one first lead division, with the body electric connection of electronic installation; And described second pin comprises one second lead division, electrically connects with the body of electronic installation.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510037027 CN1893764A (en) | 2005-07-01 | 2005-09-02 | Composite printed circuit board and electronic apparatus |
| US11/308,935 US20070051535A1 (en) | 2005-09-02 | 2006-05-29 | Circuit board assembly and electronic device utilizing the same |
| KR1020060082224A KR100822109B1 (en) | 2005-09-02 | 2006-08-29 | Circuit board assembly and electronic device utilizing the same |
| JP2006234175A JP2007073956A (en) | 2005-09-02 | 2006-08-30 | Printed circuit board assembly and electronic device utilizing it |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510035751.8 | 2005-07-01 | ||
| CN200510035751 | 2005-07-01 | ||
| CN 200510037027 CN1893764A (en) | 2005-07-01 | 2005-09-02 | Composite printed circuit board and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1893764A true CN1893764A (en) | 2007-01-10 |
Family
ID=37598144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510037027 Pending CN1893764A (en) | 2005-07-01 | 2005-09-02 | Composite printed circuit board and electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1893764A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101668391B (en) * | 2008-09-02 | 2011-02-16 | 深圳市龙岗区横岗光台电子厂 | Circuit board assembly and manufacturing method thereof |
| CN108393222A (en) * | 2018-04-28 | 2018-08-14 | 广东电网有限责任公司 | Spraying device for manufacturing circuit board and manufacturing method of multilayer circuit board |
| CN113015324A (en) * | 2019-12-19 | 2021-06-22 | 华为技术有限公司 | Circuit board assembly, electronic device, and method of processing circuit board assembly |
-
2005
- 2005-09-02 CN CN 200510037027 patent/CN1893764A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101668391B (en) * | 2008-09-02 | 2011-02-16 | 深圳市龙岗区横岗光台电子厂 | Circuit board assembly and manufacturing method thereof |
| CN108393222A (en) * | 2018-04-28 | 2018-08-14 | 广东电网有限责任公司 | Spraying device for manufacturing circuit board and manufacturing method of multilayer circuit board |
| CN113015324A (en) * | 2019-12-19 | 2021-06-22 | 华为技术有限公司 | Circuit board assembly, electronic device, and method of processing circuit board assembly |
| WO2021120877A1 (en) * | 2019-12-19 | 2021-06-24 | 华为技术有限公司 | Circuit board assembly, electronic device, and method for processing circuit board assembly |
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