CN1668929A - A device for electrically connecting a test component to a testing machine to test electronic circuits on the test component - Google Patents
A device for electrically connecting a test component to a testing machine to test electronic circuits on the test component Download PDFInfo
- Publication number
- CN1668929A CN1668929A CNA038166755A CN03816675A CN1668929A CN 1668929 A CN1668929 A CN 1668929A CN A038166755 A CNA038166755 A CN A038166755A CN 03816675 A CN03816675 A CN 03816675A CN 1668929 A CN1668929 A CN 1668929A
- Authority
- CN
- China
- Prior art keywords
- contactor
- card extender
- electric
- test
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 81
- 239000000523 sample Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 230000000295 complement effect Effects 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000004606 Fillers/Extenders Substances 0.000 claims 68
- 238000010719 annulation reaction Methods 0.000 claims 7
- 238000009434 installation Methods 0.000 claims 7
- 230000008878 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
- 230000005489 elastic deformation Effects 0.000 claims 4
- 238000012423 maintenance Methods 0.000 claims 3
- 239000012858 resilient material Substances 0.000 claims 2
- 229910000760 Hardened steel Inorganic materials 0.000 claims 1
- 230000003321 amplification Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000003199 nucleic acid amplification method Methods 0.000 claims 1
- 230000037361 pathway Effects 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 238000005482 strain hardening Methods 0.000 claims 1
- 230000007246 mechanism Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
技术领域technical field
本发明涉及测试设备。特别地,本发明涉及用于测试包含集成电路的电子线路的测试设备。The present invention relates to testing equipment. In particular, the invention relates to testing equipment for testing electronic circuits including integrated circuits.
背景技术Background technique
当电子器件例如计算机处理器和存储器制造完成时,电子器件要经受预烧和电子测试以在出货之前识别并清除有缺陷器件。术语“预烧”涉及在预定温度或温度曲线下对集成电路的操作,典型地为在高温炉中的高温下。某些工作电子偏差电平和/或信号在电子器件处于高温下时被提供给电子器件。高温的使用加强了预烧期间器件经受的压力,从而那些在向用户提供服务之后不久就会出故障的临界器件可以在预烧期间出现故障,并且因此可以不被出货。When electronic devices such as computer processors and memories are manufactured, the electronic devices are subjected to burn-in and electronic testing to identify and eliminate defective devices prior to shipment. The term "burn-in" relates to the operation of an integrated circuit at a predetermined temperature or temperature profile, typically at elevated temperatures in a high-temperature furnace. Certain operating electronic bias levels and/or signals are provided to the electronic device while the electronic device is at an elevated temperature. The use of high temperatures intensifies the stress experienced by devices during burn-in, so that critical devices that would fail shortly after being serviced to customers may fail during burn-in and therefore may not be shipped.
用于电子线路的预烧测试的测试设备一般包括连接装置,用于将待测试的电子线路例如晶片或测试底板上的集成电路电连接到测试探测电路。Test equipment for burn-in testing of electronic circuits generally includes connection means for electrically connecting an electronic circuit to be tested, such as an integrated circuit on a wafer or a test chassis, to a test probe circuit.
发明内容Contents of the invention
在一个实施例中,本发明提供了一种测试装置,用于将测试部件电连接到测试机以对测试部件上的电子线路进行测试。所述装置包括与测试部件互相连接的接触器组件,机械支撑所述接触器组件并且将所述接触器组件电连接到测试机的探测组件,以及包含第一夹钳构件和第二夹钳构件的夹钳机件,所述夹钳构件强压到一起以施加夹钳力,从而使得探测组件和接触器组件之间电连接的导电块变形。In one embodiment, the present invention provides a testing device for electrically connecting a testing component to a testing machine to test electronic circuits on the testing component. The apparatus includes a contactor assembly interconnected with a test component, a probing assembly that mechanically supports the contactor assembly and electrically connects the contactor assembly to a testing machine, and includes a first jaw member and a second jaw member A clamping mechanism, the clamping members are forced together to apply a clamping force, thereby deforming the conductive block electrically connected between the probe assembly and the contactor assembly.
附图说明Description of drawings
本发明以参考附图的示例方式进行描述,其中:The invention is described by way of example with reference to the accompanying drawings, in which:
图1是转接板(interposer)、电接触器和包含待测试电路的晶片的结构图;Fig. 1 is the block diagram of interposer (interposer), electric contactor and the chip that comprises circuit to be tested;
图2是根据本发明一个实施例的接触器组件的结构图;2 is a structural diagram of a contactor assembly according to an embodiment of the present invention;
图3是显示图2中接触器组件的形成阶段的结构图;FIG. 3 is a structural diagram showing stages of formation of the contactor assembly in FIG. 2;
图4是根据本发明一个实施例的连接到环形物的真空板的透视图;Figure 4 is a perspective view of a vacuum panel attached to an annulus according to one embodiment of the invention;
图5是图4中的真空板和环形物的顶部俯视图;Figure 5 is a top plan view of the vacuum panel and ring in Figure 4;
图6是图5中6-6的剖面;Fig. 6 is the section of 6-6 in Fig. 5;
图7是显示根据本发明一个实施例在此固定的环形物和转接板如何与接触器对齐的结构图;Fig. 7 is a structural view showing how the ring and adapter plate fixed here are aligned with the contactor according to one embodiment of the present invention;
图8是根据本发明一个实施例的对齐机的透视图;Figure 8 is a perspective view of an alignment machine according to one embodiment of the invention;
图9是图8中显示的其上安装了显微镜的对齐机的端视图;Figure 9 is an end view of the alignment machine shown in Figure 8 with the microscope mounted thereon;
图10是安装到探测板上的图8中的对齐机的透视图;Fig. 10 is a perspective view of the alignment machine of Fig. 8 mounted on a detection board;
图11是图10的端视图;Figure 11 is an end view of Figure 10;
图12A是显示根据本发明另一个实施例的将接触器组件电连接到探测板的柔性连接器的探测板的结构图;12A is a block diagram showing a probe board of a flexible connector electrically connecting a contactor assembly to a probe board according to another embodiment of the present invention;
图12B是显示根据本发明一个实施例的将接触器组件电连接到探测板的柔性连接器的探测板的结构图;12B is a block diagram showing a probe board of a flexible connector electrically connecting the contactor assembly to the probe board according to one embodiment of the present invention;
图13A是图12A中柔性连接器的侧视图;Figure 13A is a side view of the flexible connector in Figure 12A;
图13B是图12A中柔性连接器端部的顶部俯视图;Figure 13B is a top plan view of the end of the flexible connector in Figure 12A;
图14显示了根据本发明一个实施例的电接触器上的电接触元件的排列;Figure 14 shows the arrangement of electrical contact elements on an electrical contactor according to one embodiment of the present invention;
图15和16是显示图12中柔性电连接器和电接触器之间的电连接形成的不同阶段的结构图;15 and 16 are structural diagrams showing different stages of forming an electrical connection between the flexible electrical connector and the electrical contactor in FIG. 12;
图17是图12中不具有电连接器并显示接触器组件上基准标记的探测板的结构图;以及17 is a block diagram of the probe board of FIG. 12 without the electrical connector and showing fiducial marks on the contactor assembly; and
图18是根据本发明一个实施例的测试探测组件的结构图。FIG. 18 is a block diagram of a test probe assembly according to one embodiment of the present invention.
具体实施方式Detailed ways
附图中的图1显示了根据本发明一个实施例的转接板10和电接触器26,二者一起组成了接触器组件,用于测试例如晶片32上的电子线路。Figure 1 of the accompanying drawings shows an interposer 10 and
如同图1所示,转接板10包括具有第一侧面12和第二侧面14的底板。转接板10在第一侧面12上包括若干电端子16。转接板10还以互连弹簧元件18的形式包含弹性互连元件。每个互连弹簧元件18从侧面12上的电端子16延伸并终止于自由端。每个互连弹簧元件18的作用是使得与电接触器26上相应的电端子有良好的电接触。在其他实施例中,弹性互连元件包括弹簧针和软性(compliant)导电块。As shown in FIG. 1 , the adapter plate 10 includes a base plate having a first side 12 and a second side 14 . The adapter plate 10 includes a number of
转接板10在侧面14上的各个电端子16上还具有互连弹簧元件20。互连弹簧元件20与互连弹簧元件18类似,除了互连弹簧元件20是为了与晶片32上相应的电端子进行电接触。The adapter plate 10 also has interconnecting
转接板还包括侧面12和14上的机械对齐挡块22以防止互连弹簧元件18的超行程并且防止转接板接触晶片32的某些区域。The interposer also includes mechanical alignment stops 22 on the sides 12 and 14 to prevent overtravel of the
电接触器26包括接触器底板,所述接触器底板包括侧面28。电接触器26还包括侧面28上的电端子30。The
晶片32显示为包括侧面34,所述侧面34具有待测试的电子线路。晶片32具有侧面34上的电端子36,通过所述电端子36可以进行与所述电子线路的电连接。Wafer 32 is shown including side 34 having electronic circuitry to be tested. The
图2显示了根据本发明一个实施例的接触器组件40。所述组件40包括转接板10和以环形物42形式存在的固定组件。转接板被环形物42固定在相对于电接触器26的预定或者对齐位置。可以看到,在所述预定或者对齐位置,每个互连弹簧元件18对应于弹性力产生变形以与电接触器26的对应电端子30进行电接触。通过移动环形物42和其中容纳的转接板10直到对齐挡块22碰到电接触器26的侧面28而达到所述预定位置。在其他实施例中,当互连弹簧元件18(或者其他实施例中的弹簧针或软性导电块)施加足够压力时达到所述预定位置,以保持接触器26位于恰当位置。因此挡块22是可选的。转接板10和电接触器26之间的空间是每个被压缩的互连弹簧元件18的长度。FIG. 2 shows a
环形物42形成凹陷表面44,该凹陷表面44限定了转接板10的底座。环形物42具有类似平边缘的表面46,该表面46承受电接触器26的侧面28。环形物42通过接合件43的形式固定到电接触器26,例如延伸通过螺栓孔48的螺栓(见图4)。所述孔48的尺寸可以容纳接合件43,某种程度上作用为使得转接板10上的基准标记和接触器26分别对齐。The
图3显示了接触器组件40的形成中的第一阶段。参考图3,真空板50可松开地固定到环形物42相对于表面46的一侧以形成子部件51。真空板50可以通过联结器54和连接到联结器54的软管52而连接到泵(未显示)。使用时,泵在真空板50和转接板10之间的区域56形成真空。该真空将转接板10保持在凹陷表面44。如图4和5所示的,真空板50成形以提供接合件43的通道。FIG. 3 shows a first stage in the formation of the
图6显示了以图5中沿6-6获得的子部件51的剖视图,如图6所示,转接板10紧贴容纳于环形物42中。FIG. 6 shows a cross-sectional view of the subassembly 51 taken along line 6 - 6 in FIG. 5 . As shown in FIG. 6 , the adapter plate 10 is snugly received in the
图7显示了如何实现转接板10和电接触器26的对齐的结构图。转接板10容纳于环形物42中并且在x、y或θ方向上移动,从而转接板10的侧面12上的基准标记58与电接触器26的侧面28上的基准标记60对齐。一旦基准标记58与基准标记60对齐,环形物42与转接板10一起在Z方向上移位以便与接触器26接触。然后位于孔48中的螺栓43螺旋进入电接触器26中形成的互补的螺纹槽68。基准标记58、60使得电接触器26上的电端子30与互连弹簧元件18对齐,而不必留意互连弹簧元件18。每个互连弹簧元件在x-y平面内的位置或者从x-y平面的射角的偏差并不影响所述对齐过程。转接板10的侧面18上的机械挡块22可以在形成组件40时限制转接板10朝向电接触器26的移动,从而每个互连弹簧元件18处于所需压缩。FIG. 7 shows a structural diagram of how to achieve the alignment of the adapter board 10 and the
图8显示了根据本发明一个实施例的对齐机70的透视图,可以用于将环形物42和转接板10的结合体与电接触器26对齐。对齐机70包括基座72,其形状尺寸为可以置于探测板152上(见图10),所述探测板152在使用时可以容纳电接触器26(见图12A)。对齐机70还包括升起的平台或平板74,所述平台或平板74通过安装支架76而固定到基座72。平台74支撑托架78。托架78可以见图9,其中显示了对齐机70的侧视图。托架78通过包含角撑架88和水平弹簧90的安装装置而固定到平台74的下侧。角撑架88固定到平台74并且为弹簧90的一端提供支撑点,弹簧90的另一端固定到托架78的浮动板80,如同图9所示。FIG. 8 shows a perspective view of an
托架78进一步包括固定到垂直构件84的浮动板80的环形支撑物82,所述垂直构件84在环形支撑物安装板82和浮动板80之间延伸。The bracket 78 further includes an
设置在平台74和浮动板80之间的滚柱轴承94允许浮动板80相对于平台74可滑动的放置。垂直弹簧95迫使浮动板80接触滚柱轴承94。可以理解,浮动板80对于平台74的弹簧安装设置可以允许浮动板80在x-y平面内移动。这样的x-y平面内的移动通过调整机件进行控制,所述调整机件在一个实施例中包括测微计96、98和100,每个测微计可以作用迫使其一端承受浮动板80的边缘,从而引起浮动板80的位移。例如,如同图9所示,测微计98的一端98.1可以在y方向移位以承载浮动板80的边缘,从而使得浮动板80在y方向上位移。因为环形支撑物82刚性地连接到浮动板80,浮动板80的位移也会使得环形支撑物82相应地位移。Roller bearings 94 disposed between
使用时,通过真空板50和泵(未显示)协助产生的吸力而固定在环形物42中的转接板10机械连接到托架78的环形支撑物82。随后,对齐机70如图10所示置于探测板152上。在该位置,环形物42和固定在环形物42中的转接板10直接位于固定在探测板152中的电连接器26的上方。In use, the adapter plate 10 , held in the
图9中可以看到固定到平台74的包含显微镜102的放大系统,所述显微镜102包括视镜部件104和底座106。A magnification system comprising a microscope 102 including a mirror assembly 104 and a base 106 secured to
显微镜102分别放大转接板10和电连接器26上的基准标记58、60。然后测微计96、98和100可以工作以移动托架78,所述托架78随其承载环形物42和转接板10,从而转接板10可以位于电连接器26上方的预定或者对齐位置,其中转接板10和电接触器26上的基准标记58、60分别对齐。Microscope 102 magnifies fiducial marks 58 , 60 on interposer board 10 and
对齐机70进一步包括测微计顶部108,所述测微计顶部108可以用于在z方向上移动托架78,使得转接板和环形物结合体在z方向上朝向电接触器26位移。使用时,z方向上的位移一直进行到对齐挡块22接触到电接触器26的侧面28,或者达到所需z方向位置。当该位置达到时,螺栓43旋入电接触器26中的槽68中,从而将环形物42以及其中固定的转接板10固定到电接触器26。The
一旦环形物42和转接板10固定到电接触器26,真空板50和对齐机70即被移去。探测板152包括外部接口组件164,所述外部接口组件164包括多个形为电针脚166的电连接器,如图12A所示。柔性连接器110将接触器组件40电连接到接口组件164,所述接口组件164随后通过针脚166电连接到测试机的预烧室(未显示)。Once the
柔性连接器110包括具有侧面112.1和112.2的柔性底板112,如图13A所示。进一步,柔性底板112具有第一端115和第二端116。柔性线导体114.1和114.2分别形成于侧面112.1和112.2上,如图13A和13B所示。每个柔性线导体114.1具有电连接到接口组件164的第一端和远离第一端的第二端。每个柔性线导体114.1在其第二端包括一个端子,所述端子包含两个导电块118.1,如图13B所示。同样地,每个柔性线导体114.2具有电连接到接口组件164的第一端和远离第一端的第二端,所述第二端经过贯通底板112的通道113而连接到侧面112.1上的包含两个导电块118.2的端子。可以理解,通过在底板112的每个侧面112.1和112.2上设置柔性线导体,使得底板112可以承载更多的线导体114.1和114.2。The
柔性连接器110足够柔软,从而可以向自身折叠而不损坏柔性底板112,并且典型地由聚酰亚胺材料制成。根据一些实施例,柔性底板112可以具有25.4微米或者49微米的厚度,然而在可以折叠到自身而不损坏柔性底板112的意义上,当厚度达到125微米时仍然是柔软的。The
典型地,块118.1、118.2用金形成,并且具有大约100微米的宽度和大约60微米的高度。由于金不会氧化并且能够承受150℃到350℃的温度,因此它是块118的优选材料。进一步,金在180℃到240℃的温度范围内保持其弹性。柔性连接器110包括层119,所述层119覆盖线导体114.1和114.2。层119由非导电柔性材料制成,如图15所示。Typically, blocks 118.1, 118.2 are formed of gold and have a width of about 100 microns and a height of about 60 microns. Gold is the preferred material for block 118 since it does not oxidize and can withstand temperatures from 150°C to 350°C. Further, gold maintains its elasticity in the temperature range of 180°C to 240°C. The
柔性连接器110电连接到接触器组件40的刚性完全不可弯曲的电接触器26。为了达到该目的,电连接器26具有多个电接触元件120,所述电接触元件120适合于电连接到柔性连接器110的导电块118.1和118.2。图14显示了电接触器26上的电接触元件120的布局。参考图14,可以看到电接触元件120大致为长方形并且设置在两个行125中。每个元件120具有平的接触表面120.1(见图15)。所述电接触元件120的接触表面120.1在相同平面内。在一个实施例中,每个电接触元件120具有125和500微米的横向尺寸以及30微米的高度。在该实施例中,电接触器元件120分布间距为100微米。电接触元件120典型地以金形成,金可以提供与导电块118.1和118.2之间相当鲁棒的连接。柔性连接器110和电接触器26之间的电连接具有很低的外形并且在一个实施例中仅有大约6毫米高。The
图15显示了柔性连接器110和电接触元件120之间的电连接的形成阶段的结构图。FIG. 15 shows a structural view of the stages of formation of the electrical connection between the
基本上,为了形成柔性连接器110和电接触器26之间的电连接,使用夹钳将柔性电连接器110的第二端116夹钳到电接触器26上。所述夹钳包括以加工硬化金属制成的加长条122形式出现的第一夹钳构件,以及由电接触器26决定的第二夹钳构件。金属条122的热胀系数与电接触器26的热胀系数匹配。在一个实施例中,金属条122的热胀系数在电接触器26的热胀系数的0.5ppm/℃内。Basically, to form an electrical connection between the
加长金属条122、柔性连接器110以及电接触器26具有轴向延伸孔,以在其中容纳固定螺栓124。螺母126与螺栓124上的螺纹匹配,并且迫使导电块118.1和118.2接触到电接触器元件120上图16所示的位置。固定螺栓124施加的夹钳力使得导电块118.1和118.2挤压电接触器元件120,从而使得导电块118.1和118.2产生弹性和塑性形变。这保证了导电块118.1和118.2与电接触器元件120之间良好的电接触。The
因为固定螺栓124、金属条122以及导电块118.1和118.2可能具有不同的热胀系数,并且由于预烧测试期间达到的高温,固定螺栓124可能会在预烧测试期间变长。这导致了固定螺栓124的顶部124.1和金属条122之间的间隙。Because the fixing
可以理解,这样的间隙会减除固定螺栓124施加到柔性连接器110上的夹钳力。为了补偿所述间隙产生的趋势,可以在加长金属条122和柔性连接器110中间插入或者夹入弹性材料制成的膨胀构件128,如图16所示。所述膨胀构件128在固定螺栓124旋紧时产生的夹钳力作用下被压缩,并且在固定螺栓124变长时可以释放或者膨胀。因此,膨胀构件128占据了顶部124.1和金属条122之间的任何间隙,从而保持了固定螺栓124的夹钳力。所述膨胀构件由能够承受预烧室内高温的材料制成。进一步,由于导电块118.1和118.2的高度可能变化,膨胀构件128使得柔性底板112有差异的变形以补偿导电块118.1和118.2高度的变化。It will be appreciated that such a gap will reduce the clamping force exerted by the
图12A显示了柔性连接器的另一个实施例110A。除了其每端具有类似于块118.1和118.2的导电块,柔性连接器110A与柔性连接器110类似。柔性连接器110A的一端如同上面所述夹钳到电接触器26,并且柔性连接器110A的相对端以类似方式夹钳到连接器121,所述连接器121传送电信号到外部接口164或从外部接口传送电信号。Figure 12A shows another embodiment 110A of a flexible connector. Flexible connector 110A is similar to
接触器26包括基准标记130(如同图17所示)以在夹钳之前帮助对齐导电块118和电接触器元件120。基准标记130通过柔性连接器110是可见的。柔性连接器110具有互补的基准标记132(如同图13B所示),所述基准标记132可以与接触器26上的基准标记130对齐以确保导电块118与接触器元件120对齐。The
图18显示了根据本发明一个实施例的测试探测组件150的部件。测试探测组件150包括探测板152和夹板154,二者一起限定了其间的空间,该空间用于容纳接触器组件,例如图2中所示的接触器组件40。Figure 18 shows components of a test probe assembly 150 according to one embodiment of the invention. The test probe assembly 150 includes a
夹板154具有基架156以支持晶片32。探测盘152包括活塞158,在使用时,所述活塞158可以借助液压液体在缸体160内位移,所述液压液体通过可松开地连接在缸体160上的软管162引入缸体160中。活塞158与接触器组件40的电接触器26连接。The clamping plate 154 has a base frame 156 to support the
使用时,空气通过软管162被引入到室160内以迫使活塞158在z方向移动,从而使接触器组件40朝向夹板154位移直到转接板10的侧面14上的机械对齐挡块22接触到晶片32的侧面34。环形物42和夹板154之间的形式为O形环163的可弹性形变构件的作用是限制或控制通过活塞158的移动使接触器组件40产生多大的位移。因此,活塞158的移动并不需要精确控制。进一步,O形环163提供环形物42和夹板154之间的密封。O形环163通过在环形物42朝向夹板154位移时为环形物42加上衬垫而允许环形物42的表面46不在相同z平面的偏差。在一个实施例中,O形环163可以以弹簧代替,弹簧可以提供活塞158移动的反作用力。一旦转接板10的侧面14上的机械挡块22接触到晶片32的侧面34,互连弹簧元件被压缩以达到转接板10的互连弹簧元件20和晶片32的电端子36之间的良好的电接触。随后,软管162被移去。探测组件152还包括固定机件,用于可松动地将夹板154固定到探测板152。所述固定机件没有显示在图12中,但是包括任何适合的夹钳装置,例如美国专利No.6,340,895中的运动联结器,作为参考而将其结合于此。然后测试探测组件150被插入到测试预烧室中,其中电连接针脚166容纳于互补的电插槽中。In use, air is introduced into the chamber 160 through the hose 162 to force the piston 158 to move in the z direction, thereby displacing the
尽管本发明参考特定示例实施例进行了描述,然而显然可对这些实施例进行各种修改和改动而不背离权利要求书中提出的本发明的广泛的实质。因此,本说明书和附图应被认为是示例意义而非限制意义。Although the invention has been described with reference to particular example embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit of the invention as set forth in the claims. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.
Claims (62)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/197,104 US6867608B2 (en) | 2002-07-16 | 2002-07-16 | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component |
US10/197,133 | 2002-07-16 | ||
US10/197,104 | 2002-07-16 | ||
US10/197,133 US6853209B1 (en) | 2002-07-16 | 2002-07-16 | Contactor assembly for testing electrical circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1668929A true CN1668929A (en) | 2005-09-14 |
CN100523826C CN100523826C (en) | 2009-08-05 |
Family
ID=30117843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038166755A Expired - Fee Related CN100523826C (en) | 2002-07-16 | 2003-07-15 | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1523685A2 (en) |
JP (1) | JP2005533254A (en) |
KR (1) | KR20050029215A (en) |
CN (1) | CN100523826C (en) |
AU (1) | AU2003249276A1 (en) |
WO (1) | WO2004008163A2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101051067B (en) * | 2006-04-03 | 2010-08-11 | 航天科工防御技术研究试验中心 | Comprehensive detection control device design method for electric connector |
CN101545926B (en) * | 2008-03-25 | 2011-05-11 | 旺矽科技股份有限公司 | Probe testing device |
CN102365557A (en) * | 2009-03-10 | 2012-02-29 | 弗劳恩霍弗实用研究促进协会 | Measuring device for measuring structures that can be connected on one side for electrical measuring planes |
CN103187326A (en) * | 2011-12-28 | 2013-07-03 | 巨擘科技股份有限公司 | Packaging method of ultrathin substrate |
CN101779135B (en) * | 2007-08-14 | 2013-08-28 | 电子科学工业有限公司 | Automated contact alignment tool |
CN103808969A (en) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | Tool for bearing to-be-tested electronic device |
CN103808979A (en) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | Fixtures for carrying electronic devices to be tested |
CN105548859A (en) * | 2015-12-09 | 2016-05-04 | 上海精密计量测试研究所 | Testing equipment and method for environment testing |
CN106200239A (en) * | 2016-09-14 | 2016-12-07 | 海信集团有限公司 | Ray machine illuminator |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1894027A1 (en) | 2005-04-27 | 2008-03-05 | Aehr Test Systems, Inc. | Apparatus for testing electronic devices |
MY152599A (en) | 2007-02-14 | 2014-10-31 | Eles Semiconductor Equipment S P A | Test of electronic devices at package level using test boards without sockets |
EP1959265A1 (en) * | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
CN108780114B (en) | 2016-01-08 | 2021-11-16 | 雅赫测试系统公司 | Method and system for temperature control of devices in an electronic tester |
US10782316B2 (en) | 2017-01-09 | 2020-09-22 | Delta Design, Inc. | Socket side thermal system |
JP7164539B2 (en) | 2017-03-03 | 2022-11-01 | エイアー テスト システムズ | Electronic tester |
EP4226165A4 (en) | 2020-10-07 | 2024-10-30 | AEHR Test Systems | Electronics tester |
EP4364197A4 (en) | 2021-06-30 | 2025-03-05 | Delta Design Inc | TEMPERATURE CONTROL SYSTEM WITH CONTACTOR ARRANGEMENT |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
JPH0763788A (en) * | 1993-08-21 | 1995-03-10 | Hewlett Packard Co <Hp> | Probe, electrical part / circuit inspecting device and electrical part / method of circuit inspection |
US6028437A (en) * | 1997-05-19 | 2000-02-22 | Si Diamond Technology, Inc. | Probe head assembly |
US6137297A (en) * | 1999-01-06 | 2000-10-24 | Vertest Systemsn Corp. | Electronic test probe interface assembly and method of manufacture |
JP2001013208A (en) * | 1999-06-30 | 2001-01-19 | Mitsubishi Electric Corp | Semiconductor-testing tool |
-
2003
- 2003-07-15 WO PCT/US2003/022125 patent/WO2004008163A2/en active Application Filing
- 2003-07-15 AU AU2003249276A patent/AU2003249276A1/en not_active Abandoned
- 2003-07-15 EP EP03764698A patent/EP1523685A2/en not_active Withdrawn
- 2003-07-15 KR KR1020057000799A patent/KR20050029215A/en not_active Ceased
- 2003-07-15 CN CNB038166755A patent/CN100523826C/en not_active Expired - Fee Related
- 2003-07-15 JP JP2004521866A patent/JP2005533254A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101051067B (en) * | 2006-04-03 | 2010-08-11 | 航天科工防御技术研究试验中心 | Comprehensive detection control device design method for electric connector |
CN101779135B (en) * | 2007-08-14 | 2013-08-28 | 电子科学工业有限公司 | Automated contact alignment tool |
CN101545926B (en) * | 2008-03-25 | 2011-05-11 | 旺矽科技股份有限公司 | Probe testing device |
CN102365557A (en) * | 2009-03-10 | 2012-02-29 | 弗劳恩霍弗实用研究促进协会 | Measuring device for measuring structures that can be connected on one side for electrical measuring planes |
CN103187326A (en) * | 2011-12-28 | 2013-07-03 | 巨擘科技股份有限公司 | Packaging method of ultrathin substrate |
CN103187326B (en) * | 2011-12-28 | 2016-03-02 | 巨擘科技股份有限公司 | Packaging method of ultrathin substrate |
CN103808969A (en) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | Tool for bearing to-be-tested electronic device |
CN103808979A (en) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | Fixtures for carrying electronic devices to be tested |
CN105548859A (en) * | 2015-12-09 | 2016-05-04 | 上海精密计量测试研究所 | Testing equipment and method for environment testing |
CN106200239A (en) * | 2016-09-14 | 2016-12-07 | 海信集团有限公司 | Ray machine illuminator |
Also Published As
Publication number | Publication date |
---|---|
WO2004008163A3 (en) | 2004-06-10 |
CN100523826C (en) | 2009-08-05 |
WO2004008163A2 (en) | 2004-01-22 |
EP1523685A2 (en) | 2005-04-20 |
JP2005533254A (en) | 2005-11-04 |
AU2003249276A8 (en) | 2004-02-02 |
KR20050029215A (en) | 2005-03-24 |
AU2003249276A1 (en) | 2004-02-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7511521B2 (en) | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component | |
CN1668929A (en) | A device for electrically connecting a test component to a testing machine to test electronic circuits on the test component | |
US20080048698A1 (en) | Probe Card | |
US7195503B2 (en) | Electrical contactor, especially wafer level contactor, using fluid pressure | |
JP4704426B2 (en) | Electrical connection device, method of manufacturing the same, and electrical connection device | |
US8004296B2 (en) | Probe head apparatus for testing semiconductors | |
KR100915179B1 (en) | Probe card | |
EP1879035B1 (en) | Probe Card | |
CN1489695A (en) | planar interposer | |
US7301358B2 (en) | Contactor assembly for testing electrical circuits | |
US7382143B2 (en) | Wafer probe interconnect system | |
US7692433B2 (en) | Sawing tile corners on probe card substrates | |
US20050184745A1 (en) | Probe card | |
KR20110084978A (en) | Probe card | |
WO2005069019A1 (en) | Probe guard | |
KR100707044B1 (en) | Structure of integrated circuit wafer probe card assembly and its manufacturing method | |
WO2008114973A1 (en) | Probe card having planarization means | |
US20080100323A1 (en) | Low cost, high pin count, wafer sort automated test equipment (ate) device under test (dut) interface for testing electronic devices in high parallelism | |
JP7618014B2 (en) | Semiconductor wafer test device, semiconductor wafer test system, flatness measurement device, and method for adjusting flatness of wiring board | |
KR20080099996A (en) | Probe card for preventing thermal deformation | |
KR101913639B1 (en) | Electrical Connecting Apparatus | |
TW202411663A (en) | Probe card with improved temperature control | |
KR100906344B1 (en) | Probe card |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20110715 |