CN1591968A - Method for forming RF ceramic block filters - Google Patents
Method for forming RF ceramic block filters Download PDFInfo
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- CN1591968A CN1591968A CNA200410056032XA CN200410056032A CN1591968A CN 1591968 A CN1591968 A CN 1591968A CN A200410056032X A CNA200410056032X A CN A200410056032XA CN 200410056032 A CN200410056032 A CN 200410056032A CN 1591968 A CN1591968 A CN 1591968A
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- ceramic block
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Filtering Materials (AREA)
Abstract
A method which is used for manufacturing the radio frequency ceramic wave filter comprises the following procedures: forming a ceramic material block with an external surface which comprises at least one pair of opposite side surfaces and comprises a plurality of through holes extending between the opposite side surfaces; covering the ceramic material block with the conductive film; and heat treating the ceramic material block covered with film; ablating and etching the selected area of the ceramic material block which is heat treated and is covered with film to form the metalized and non-metalized area pattern on the ceramic material block, wherein the non-metalized area is concave into the ceramic material block when the ablating and etching are executed. With the method of the invention a radio frequency ceramic wave filter can be conveniently and economically produced.
Description
The application is that application number is 00810420.4, the applying date is 2000/6/12, denomination of invention is divided an application for PCT international application (international application no is PCT/US00/16138) of " being used to form the ablative method of RF ceramic block filters ".
Technical field
The present invention relates generally to the method that is used to make the radio frequency ceramic filter.
Background technology
Comprise description of Related Art according to 37 CFR 1.97 and 1.98 disclosed information:
The radio frequency ceramic filter is well-known in the art.They are by typically constituting with the ceramic block that other electronic circuit is coupled through discrete lead, cable and with the pin of conduction tie point coupling on the block outer surface.They are used to construct duplexer and other electron component equally.
Ceramic block filters is used for wireless communications products.Three main technique steps making these filters are: (1) generates the capacitor element pattern, (2) generate input and output pad and (3) with filter tuner to suitable operating frequency.The effect of the capacitor element pattern on the filter is the needed radio-frequency responsive near the user.The effect of the generating run of input and output pad is to provide by the interface of filter to the radio communication product.The effect of tuner operation is finally to adjust this approximate radio-frequency responsive to satisfy the strict demand of user to needed response.
In the prior art, with the ceramic block sintering and subsequently silver metal cream is arranged in except that need be such as on all the block sides those sides of predetermining circuits such as capacitor element pattern or input and output (I/O) pad.On those sides, silver metal cream is applied in to ceramic block (via well-known silk-screen printing technique technology or grinding technique) with the form and the shape of required pattern and I/O pad.Heating process causes metal cream by described (some) patterns and/or I/O pad and by on the correct position that roughly is solidificated in them.
But when coating capacitor element filter pattern and other filter element, this silk-screen printing technique does not have needed dimensional accuracy.The dimension precision requirement of the capacitor element filter pattern on the ceramic block filters is: in the precision of 1.8GHz is at 900MHz 4 times.
So in order to improve this product, further tuning capacity device filter pattern is to satisfy strict technical requirements of users.This can realize by the following method, promptly adds excessive metal cream to adjacent circuit pattern feature, and uses this metal cream of sintering someway subsequently, to form the integral body of pattern or pad is added, or can remove material in some cases in order to tuning.By applying a signal and monitoring output signal to input, reach suitable when tuning when output signal shows in this technical process, the operator can stop to add material to pad or terminal.
So, at United States Patent (USP) 5,198, the fine tuning of ceramic filter metal terminal or pad is disclosed in 788.In this patent, ceramic block is capped on all faces except that a side (adjacent side that perhaps also has part), and on the side that is not capped (and part), silver metal cream is formed the general shape of needed electric terminal, pattern or pad.Silver metal cream is formed rigid coating by heat treatment.Subsequently, additional silver metal cream is arranged to adjacent with established terminal or pad and electrically contacts, when at output monitoring input signal, with laser beam scanning silver metal cream with its sintering, and formation is to the solid interpolation of terminal or pad, until obtaining the suitable electrical characteristics of device.So this patent relates to the terminal that roughly forms, pattern or pad adds metal with tuning circuit.
At United States Patent (USP) 5,769, a kind of method of manufacturing ceramic electronic component is disclosed in 988, it has dielectric ceramics and comprises the conductor of silver as main component on it.By the devices such as dielectric resonator that heat treatment for example forms with this technology, " Q " of resonator value will increase.In to the device process of thermal treatment, well-known device be 400 ℃ or higher temperature and the volume ratio that is containing aerobic be 10% or air still less in heat-treat.In addition, people (' 988) such as Kagata discloses on the dielectric ceramics substrate of sintering " with conductive paste ... form electrode pattern ".
United States Patent (USP) 5,162,760 relate to the electrical filter that is formed by ceramic block equally, and it is removed metallization or uses different screen printing techniques that electric conducting material is applied on the different surfaces of ceramic block by using grinding or method for milling.In ' 760 patents, conductive material layer is deposited on the surface of block, and after this layer quilt disposed well, uses any suitable milling drum that the partially conductive layer is removed, and makes needed conductive pattern stay on the surface.The electric conducting material of covering blocks and dielectric substance are all removed the zone of milling from block.Because the size of electrode forms with milling drum, so the precision of this device or accuracy are restricted.
At United States Patent (USP) 5, a kind of ceramic band-pass filter has been described in 379,011, and this filter has improved I/O insulation, and electric conducting material removed from the metal layer of block, and the I/O pad is deposited in removed those zones of conducting metal.Once more, in this patent, except that top or upper face and part side surface, whole six sides of ceramic block are metallized.Form the slit between the adjacent metal in I/O pad that is deposited and ceramic material, when not coated, change the dielectric between the I/O pad thus.
Be necessary to make this filter between conductive region, to have good insulation performance, and can provide the higher filter pattern and the dimensional accuracy of I/O pad than prior art.
Summary of the invention
In this technology, ceramic block forms in mode commonly used.It has at least one plane surface.Subsequently, not only to cover the side that those will not form pattern or I/O pad, but cover whole ceramic block with conductive metallic material.An example of this metal backing is well-known and comprise the cream of conducting metal (for example silver, only be used for for example) in a kind of prior art, and carries out necessary heat treatment subsequently with curing metal.Other example of conductive coating comprises ceramic block deposited with conducting metal or similar material.
A kind of ablative method of scan laser light beam that for example uses is used for unwanted metal material is removed from least one plane surface, to form needed capacitor element filter pattern.This silk screen printing with the Ginding process of prior art or prior art is different.By laser beam ablate metals layer and a part of ceramic block, with form around the metal filter element, and press the groove of required form generation pattern.The degree of depth of groove and width have determined the coupling capacitance of filter and have determined its operating frequency thus.Accuracy and repeatable capacitor element filter element pattern and other filter element of allowing of forming groove with laser technology have higher precision and repeatability.More accurate patterns can realize higher tuning rate, higher production output and be bigger design margin concerning product designer.
But, because of well-known problem can appear in ablating technics.In the laser technology process, ceramic material is adversely affected, and " Q " of ceramic material is reduced to the degree that filter does not have commercial value.Therefore need back laser action and heat technology to get back to its approximate initial value with " Q " that recovers pottery.
Owing in ablation process, form capacitor element pattern and other filter element, monitor on the pad in output so signal can not be connected with the input pad being used for, whether have correct size with other filter element thereby find formed capacitor element pattern.After forming filter, because ceramic block has the general expression of the signal that low " Q " like this make these signals only be in final products to be seen, so such signal can not adapt to and satisfy the specification requirement of product.Therefore,, use and approach ablating technics one by one, be established to form " benchmark " ceramic block up to the signal of the suitable radio-frequency responsive scope of expression by making metallization piece continuously with different size conductive pattern for given product technology requirement.Because laser technology is extremely accurately and repeatably, so can produce a large amount of benchmark devices, in case produce suitable pattern, then the heat process quilt is used to the radio-frequency responsive that provides suitable.
Summary of the invention
So, the object of the present invention is to provide a kind of method that is used to make the radio frequency ceramic filter.
According to the method that is used to make the radio frequency ceramic filter of the present invention, comprise step: form the ceramic block with outer surface, this outer surface has at least one pair of relative side, and has a plurality of through holes to extend between the described relative side; Cover described ceramic block with conducting film; And the ceramic block of film is stamped in this lining of heat treatment; The ablation etching should be stamped the selection area of the ceramic block of film by heat treated and lining, on this ceramic block, to form metallized and non-metallic zone map, wherein when the described ablation etching of execution, described non-metallic zone is recessed in the described ceramic block.
Preferably, described method further comprises step: heat treatment is formed the ceramic block behind the pattern.Or further comprise step: heat treatment is formed the ceramic block behind the pattern, makes it reach a temperature that is enough to reduce filter insertion loss.
In a kind of improvement project, cover described ceramic block with conducting film and comprise with silver paste and contact described ceramic block.
Valuably, the step of described ablation etching ceramic block is undertaken by adopting laser beam.Or the step of described ablation etching ceramic block is undertaken by adopting scan laser.
Be used to make the alternative method of radio frequency ceramic filter according to another kind, comprise step: the ceramic block with outer surface is provided, and this outer surface has at least one pair of relative side, and has a plurality of through holes to extend between the described relative side; Seal described ceramic block with conducting film; The ceramic block of film is stamped in this lining of heat treatment; Ablating from this selection area that is stamped the ceramic block of film by heat treated and lining etches away described conducting film and a part of ceramic block, to form the pattern of metallized area and non-metallic sunk area on this ceramic block; And heat treatment is formed the ceramic block behind the pattern.
Equally, advantageously, the step of described ablation etching ceramic block is undertaken by adopting scan laser in this alternative method.
Preferably heat treatment is formed the ceramic block behind the pattern, makes it reach a temperature that is enough to reduce filter insertion loss.
The step of described ablation etching ceramic block also can be undertaken by adopting laser beam.
According to of the present invention another be used to make the method for radio frequency ceramic filter, comprise step: provide a ceramic block; Seal described ceramic block with conducting film; The ceramic block of film is stamped in this lining of heat treatment; Should be stamped the selection area of the ceramic block of film by heat treated and lining with the laser ablation etching, on this ceramic block, to form the pattern of non-metallic sunk area and not ablated metallized area; And heat treatment is formed the ceramic block behind the pattern.
Another kind according to the present invention is used to make the method for radio frequency ceramic filter, comprises step: the ceramic block with outer surface (a) is provided, and this outer surface has at least one pair of relative side, and has a plurality of through holes to extend between the described relative side; (b) seal described ceramic block with conducting film; (c) ceramic block of film is stamped in this lining of heat treatment; (d) ablate from this selection area that is stamped the ceramic block of film by heat treated and lining with laser and etch away described conductive metal film and a part of ceramic block, on this ceramic block, to form the pattern of metallized area and non-metallic sunk area; Wherein, the pattern of described metallized area and non-metallic sunk area comprises a transmitter pad, an antenna pad and a receiver pad; Repeating step (a)-(d) to be to make a plurality of ceramic blocks that are formed pattern, then these a plurality of ceramic blocks that are formed pattern of heat treatment.
Description of drawings
In conjunction with the detailed description of following preferred embodiment, these and other feature of the present invention will be by more fully open, wherein identical numeral components identical, and wherein:
Fig. 1 is suitable for by adding the perspective view that material carries out tuning ceramic band-pass filter to it for prior art;
Fig. 2 is a perspective view of using the ceramic block of the present invention that all wraps up such as electric conducting materials such as metal cream;
Fig. 3 is the top view with the duplexer of method formation of the present invention;
Fig. 4 is the end view of the duplexer of Fig. 3, shows formation conductive spacer or terminal and around the conduction filter element and the groove that forms thereon;
Fig. 5 is the flow chart that novel step of the present invention is shown;
Fig. 6 is the curve of frequency response that the filter of a plurality of prior aries shown in Fig. 1 is shown;
Fig. 7 be illustrate form by technology of the present invention, after laser action but the frequency response curve of a plurality of filters before heat technology; And
Fig. 8 be illustrate form by technology of the present invention, burning to the frequency response curve of " Q " a plurality of filters afterwards that recover pottery.
Embodiment
Fig. 1 is the perspective view of the ceramic band-pass filter of prior art.Conducting metal is deposited to be formed with some the surperficial ceramic blocks on it filter 10 by having, and comprises end face 12, bottom surface 14, side 16 and 18, and end face 20 and 22.Filter 10 is included in the parallel cylinder-shaped hole 24 and 26 that opening extends between end face 12 and the bottom surface 14 in addition.Silk screen printing is carried out with conductive metallic materials such as for example silver paste in a well-known manner in zone such as ceramic block surfaces such as top surface or end faces 12, to form the hardware of filter, between filter element, stay the exposed ceramic surface material of ceramic block.The element 36 and 38 of printing exceeds the end face of the plane surface 12 of ceramic block, and comprises the input pad 28 and the output pad 30 that can be looped around between end face 12 and the side 16.When filter is inserted in the Electronic Packaging subsequently, should around structure be particularly suitable for mounted on surface and connect.The continuous metal sheet that side 16 and 18, bottom surface 14 and end face 20 and 22 usefulness form earth element 32 hides.On face 16, ground plate 32 is separated with input pad 28 and output pad 30 by exposed ceramic region 34 and 35, to prevent electrical short.When being screen printed on the ceramic substrate, the I/O pad just produces these exposed ceramic region 34 and 35.Through hole 26 and 28 is capped to extend to the conducting metal on the end face 12, to comprise the resonator pad 36 and 38 that is centered on by exposed ceramic surface.According to prior art, pad 36 and 38 comprises the breach 40 and 42 that is used for tuned filter.
The filter of prior art as shown in Figure 1 has with injection, silk screen printing or other well-known technology and imposes on metal cream thick film main surface and that impose on through hole or inner chamber 24 and 26 except that face 12 and face 16.The film of conductive paste is screen printed on top surface 12 and the side surface 16 by needed pattern.Filter can be as United States Patent (USP) 5,198, and equally carrying out of fully describing in 788 is tuning.
Therefore, in the prior art, with the ceramic block sintering and subsequently silver metal cream is arranged on all block sides except that those sides of capacitor element pattern of need determining or input and output (I/O) pad.On those sides, silver metal cream is applied in to ceramic block (via well-known silk-screen printing technique technology) with the form and the shape of required pattern and pad, forms the conductive surface on the plane surface 12 of ceramic block thus.Heating process causes metal cream by pattern and/or I/O pad and roughly be solidificated on their appropriate location.But when coating capacitor element filter pattern, this silk-screen printing technique does not have needed dimensional accuracy.The dimension precision requirement of the capacitor element filter pattern on the ceramic block filters is: 4 times (4x) that are needed precision when 900MHz when 1.8GHz.The dimensional accuracy of silk-screen printing technique can be made qualified 900MHz filter.But more than 900MHz, frequency response constantly descends, and produces the filter with pass frequency response less and less thus.So in order to improve this product, further tuning capacity device filter pattern is to satisfy strict technical requirements of users.This can realize by adding excessive metal cream to adjacent pattern characteristics (for example slit among Fig. 1 40 and 42), and uses this metal cream of sintering someway subsequently, so the metal integral that forms pattern or pad adds.By applying a signal to input and at the output monitoring output signal, when showing, output signal reaches suitable when tuning, and the operator can stop to add material to pad or terminal.Referring to the U.S. Patent number 5,198,788 that is incorporated herein.
Fig. 2 shows the ceramic block of the present invention with the whole parcel of conducting metal.Conducting metal can be applied with on it, or the available conductive metal paste that has been heating and curing forms.Block 40 has by the inner ceramic part 39 of whole parcel, wraps up the electric capacity that comprises of this ceramic segment with conducting metal and adjusts on all outer surfaces of through hole 43 and 45.Though two through holes only are shown, obviously, can comprise more through hole as shown in Figure 3.Therefore, not all sides that only cover except that the side that will form pattern or I/O pad, but wrapping up whole ceramic block with the conducting metal that for example (only is used for for example) a kind of conductive metal paste (well-known) in this area, this metal cream is easy to through heat treatment with curing metal.
Fig. 3 shows the duplexer 42 that uses the filter that forms with technology of the present invention.It comprises transmitter section 44 and receiver section 46.It comprises the I/O pad 48 that is used for the transmitter (not shown), be used for to from the antenna pad 50 of transmitter section 44 and receiver section 46 coupled signals and the I/O pad 52 that is used for signal is connected to the receiver (not shown).The transmitter section 44 of duplexer 42 comprises resonator and relevant circuit element 53,54,55,56 and 58, and receiver section 46 uses resonator and relevant element 60,62,64,66 and 68.Form before the circuit element thereon, Fig. 3 looks like the block among Fig. 2, and metal and corresponding pottery are removed from upper surface 41 ablations, so that the dielectric substance pattern of formation and electric insulation circuit element 53,54,55,56,58,60,62,64,66 and 68 to be provided.Should be noted that term " electric insulation " means " directly not being electrically connected " as used herein.Promptly no longer include electric continuity or connection between " insulation " conducting element.But,, between adjacent element, have electricity " coupling " by mechanical-electric coupling (piezoelectric effect) or through the coupling of the alternating current (AC) of capacity effect.Can see that the appropriate section of metal and ceramic material is removed with ablating technics in zone 70,72,74 and 78.For preferred this ablating technics that carries out with the scan laser light beam, it not only removes conducting metal, and the appropriate section of equally also removing electrolyte blocks is to form " groove " or recessed region 70,72,74,76 and 78.These grooves have a kind of degree of depth and width in any given part of filter pattern, they affect the coupling capacitance between the adjacent metal surface in a well-known manner, and therefore influence for example filter such as operating frequency and impedance electrical characteristics.Certainly, if desired, some conducting elements can form with the art methods of silk screen printing, and its external margin is repaired to control conducting element exactly with laser beam according to the present invention.The remainder of dielectric substance can form with novel artistic of the present invention.Groove has formed at least 10% of pattern of dielectric material that the circuit pattern element is insulated, preferably is about 70% to about 90% but in this case.
So for the duplexer shown in Fig. 3 42, it is formed by the dielectric material block that all blocks as shown in Figure 2 etc. have a plurality of surfaces that comprise at least one plane surface.Equally as shown in Figure 2, it also has the metal material layer of all sides on a plurality of surfaces of covering dielectric material block.Ground plane 80 is formed by the metal surface of at least some electric conducting materials 82 as shown in Figure 3.Filter for receiver 46 is formed in the first area of at least one plane surface of electrolyte blocks, and comprises more than first conducting element 60,62,64,66 and 68.Groove or recessed region 74,76 and 78 around each conducting element with they electric insulations, and be recessed to the predetermined degree of depth and have predetermined width, between conducting element and ground plane, to produce the capacitive coupling of a kind of decision filter for receiver operating characteristic (for example operating frequency).
In a similar fashion, transmitter filter 44 is formed on second zones of different of at least one plane surface of electrolyte blocks shown in Figure 2, and comprising more than second conducting element 53,54,55,56 and 58, they have the groove 70,72 and 74 that forms a plurality of conducting elements of transmitter section 44 around each.These grooves are ablated once more to be removed, and extends through conductive metallic material and enter dielectric substance.So, between the conducting element of receiver 44 and ground plane, forming second capacitive coupling, this provides once more by the degree of depth of groove or recessed region and width capacitive coupling decision and that determined the transmitter filter operating frequency.First and second ends 48 and 52 that are respectively applied for transmitter and receiver have been formed on the top and the side of the electrolyte blocks that is capped as shown in Fig. 1 and Fig. 3 and 4.Connect by the 3rd end 50 reception antennas, and in a well-known manner with filter for receiver and transmitter filter electric coupling.It transmits radiofrequency signal between antenna and radio-frequency transmitter and radio frequency sending set.
As can be known, one or more for example is that 43 and 45 through hole is applied with conductive materials, to produce resonant circuit components from prior art.
Fine tuning filter if desired, metal can be removed from for example ablating for the zone of (only being used for for example) 88,90,92 and 94, with tuning transmitter subtly.Receiver 46 can be tuning in the same way.In this case, ablation etching will be removed metallic plate and ceramic to the needed degree of depth once more.
Fig. 4 is the end view of Fig. 3 duplexer.All elements shown in it all are exaggerated and not according to any ratio.But as can be seen, on side 82, transmitter terminal 48 extends downwards along the side of block in Fig. 4, and, remove around terminal 48 with the zone of the conducting metal shown in 84 82, expose pottery 86 thus.In the same way, produce groove or recess form with 58 as passing through of when Fig. 3 is discussed, being stated at the conducting element shown in the ceramic top 53,54,55,57.
At the 3rd end 50 and second end 52 identical construction can be shown.
Important thing in this consideration is that block has been used the whole covering of conducting metal, and by unwanted material ablation is etched to the needed degree of depth and width, so that form pattern from the teeth outwards to provide filter suitable operating characteristic.To notice in Fig. 4 that the surface of conducting element is in identical height with the surface 41 of Fig. 2 and Fig. 4.In other words, on the top of pottery, do not form conducting element, but by using ablative method deletion metal and ceramic block.This with prior art be formed on the electrolyte blocks top and to be positioned at the filter element of surface different fully with the terminal that is formed on the block side by silk screen printing.
But as previously mentioned, the partially conductive metal material can form with silk screen printing as prior art, and available subsequently so far described ablation etching forms the remainder of conducting metal circuit pattern.
Fig. 5 discloses the flow chart that novel step of the present invention is described.At step (A), use conducting metal, preferably use metal cream to cover the whole surface of ceramic block.At step (B), for example conducting metal is cured as metal material, and causes it attached on the corresponding ceramic block by heating of metal cream.At step (C), unwanted metal material etches away with partly ceramic block is ablated accordingly, to form the needed metal pattern that comprises the I/O terminal on block.Certainly, the I/O terminal can be added on the side with other method, the method for printing screen for example explained in front, and can be subsequently and the metal pattern electric coupling that is formed on by the ablation etching on the top surface.
In step (D) and (E), prototype filter is carried out electro-detection.At step (D), input signal is connected with input, and at step (E), the output signal of monitoring output is with the electrical characteristics of the ceramic block of decision ablation.
At step (F), repeating step (A) to (E) is up to the ceramic block that obtains to have approximate needed electrical characteristics.At that time, ceramic block filters can be produced in a large number, and at step (G), heating is to increase its " Q " in environmental gas.Certainly, the ceramic block of ablation can be heated recovering its " Q ", and if find suitable filter response subsequently, just ceramic block filters can be produced in a large number, heat, and provide quality control to have needed characteristic to guarantee filter.
Fig. 6 is for utilizing the frequency response curve that circuit is printed on a plurality of filters that the lip-deep prior art processes of ceramic block forms.It may be noted that it is-1.2dB that the frequency standard deviation is 2.63MHz simultaneously that peak value inserts loss.Can see at each end of curve, in filter, have a large amount of variations and response, change the bandwidth of device thus.
Fig. 7 is the curve that utilizes a plurality of filters of novel method manufacturing of the present invention.It may be noted that how approaching they be in all responses between the bandwidth at the top between all curves and particularly.This curve shows after laser technology produces the filter circuit element but be heated to recover the frequency response of " Q " a plurality of devices before.Therefore, notice that it is 5.4dB that peak value inserts loss.But the centre frequency deviation has been reduced to .85MHz.
Fig. 8 utilizes technology of the present invention identical ceramic filter that make and shown in Figure 7 heating them to recover " Q " curve afterwards.Notice that once more how approachingly they duplicate mutually, and peak value inserts loss and be reduced to now-1.2dB, the centre frequency standard deviation is 0.75MHz simultaneously.
So can see the remarkable improvement of the use of the filter of making according to technology of the present invention.
So, a kind of technology and device of novelty are disclosed, wherein technology comprises two key steps.First, cover all surface of ceramic block with the metal of coating, and the second, etch away unwanted material by ablating and come ablate metals and the pottery under it to form at least some needed filter circuit patterns from one of ceramic block of coating or part second surface.
First novel step is with the different of prior art, in the prior art, stays one or more surfaces and does not cover, and subsequently pattern is applied with on it, so pattern has the top surface that is higher than the ceramic block top surface.In this application, because other metal surface coplane of not removing on the metal surface of the pattern that forms and the block, so tuning only the needs from the unnecessary metal of metallic circuit pattern removal.In addition, the ablation technology that is used to remove metal is removed the part dielectric equally, produces groove or recessed region around each conducting element of filter circuit pattern thus, with they electric insulations.What the width of these recessed regions and the degree of depth had determined filter for example is the running parameter of operating frequency.
Because in the prior art, laser only is used to add metal with the tuned filter circuit, etches away unwanted material and dielectric not only to form metal filter circuit pattern but also second step of decision filter freguency response is novel so ablate.
Claims (12)
1. be used to make the method for radio frequency ceramic filter, comprise step:
Formation has the ceramic block of outer surface, and this outer surface has at least one pair of relative side, and has a plurality of through holes to extend between the described relative side;
Cover described ceramic block with conducting film; And
The ceramic block of film is stamped in this lining of heat treatment;
The ablation etching should be stamped the selection area of the ceramic block of film by heat treated and lining, on this ceramic block, to form metallized and non-metallic zone map, wherein when the described ablation etching of execution, described non-metallic zone is recessed in the described ceramic block.
2. the method for claim 1, further comprise step: heat treatment is formed the ceramic block behind the pattern.
3. the method for claim 1, further comprise step: heat treatment is formed the ceramic block behind the pattern, makes it reach a temperature that is enough to reduce filter insertion loss.
4. the process of claim 1 wherein, cover described ceramic block with conducting film and comprise with silver paste and contact described ceramic block.
5. the process of claim 1 wherein that the step of described ablation etching ceramic block is undertaken by adopting laser beam.
6. the process of claim 1 wherein that the step of described ablation etching ceramic block is undertaken by adopting scan laser.
7. be used to make the method for radio frequency ceramic filter, comprise step:
Ceramic block with outer surface is provided, and this outer surface has at least one pair of relative side, and has a plurality of through holes to extend between the described relative side;
Seal described ceramic block with conducting film;
The ceramic block of film is stamped in this lining of heat treatment;
Ablating from this selection area that is stamped the ceramic block of film by heat treated and lining etches away described conducting film and a part of ceramic block, to form the pattern of metallized area and non-metallic sunk area on this ceramic block; And
Heat treatment is formed the ceramic block behind the pattern.
8. the method for claim 7, wherein, the step of described ablation etching ceramic block is undertaken by adopting scan laser.
9. the method for claim 7, further comprise step: heat treatment is formed the ceramic block behind the pattern, makes it reach a temperature that is enough to reduce filter insertion loss.
10. the method for claim 7, wherein, the step of described ablation etching ceramic block is undertaken by adopting laser beam.
11. be used to make the method for radio frequency ceramic filter, comprise step:
One ceramic block is provided;
Seal described ceramic block with conducting film;
The ceramic block of film is stamped in this lining of heat treatment;
Should be stamped the selection area of the ceramic block of film by heat treated and lining with the laser ablation etching, on this ceramic block, to form the pattern of non-metallic sunk area and not ablated metallized area; And
Heat treatment is formed the ceramic block behind the pattern.
12. be used to make the method for radio frequency ceramic filter, comprise step:
(a) provide the ceramic block with outer surface, this outer surface has at least one pair of relative side, and has a plurality of through holes to extend between the described relative side;
(b) seal described ceramic block with conducting film;
(c) ceramic block of film is stamped in this lining of heat treatment;
(d) ablate from this selection area that is stamped the ceramic block of film by heat treated and lining with laser and etch away described conductive metal film and a part of ceramic block, on this ceramic block, to form the pattern of metallized area and non-metallic sunk area;
Wherein, the pattern of described metallized area and non-metallic sunk area comprises a transmitter pad, an antenna pad and a receiver pad;
Repeating step (a)-(d) to be to make a plurality of ceramic blocks that are formed pattern, then these a plurality of ceramic blocks that are formed pattern of heat treatment.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/333,716 US6462629B1 (en) | 1999-06-15 | 1999-06-15 | Ablative RF ceramic block filters |
| US09/333716 | 1999-06-15 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008104204A Division CN1196224C (en) | 1999-06-15 | 2000-06-12 | Ablative method for forming RF ceramic block filters |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101006922A Division CN101013768A (en) | 1999-06-15 | 2000-06-12 | Ablative method for forming RF ceramic block filters |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1591968A true CN1591968A (en) | 2005-03-09 |
| CN100505416C CN100505416C (en) | 2009-06-24 |
Family
ID=23303968
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008104204A Expired - Lifetime CN1196224C (en) | 1999-06-15 | 2000-06-12 | Ablative method for forming RF ceramic block filters |
| CNB200410056032XA Expired - Lifetime CN100505416C (en) | 1999-06-15 | 2000-06-12 | Method for manufacturing radio frequency ceramic filter |
| CNA2006101006922A Pending CN101013768A (en) | 1999-06-15 | 2000-06-12 | Ablative method for forming RF ceramic block filters |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008104204A Expired - Lifetime CN1196224C (en) | 1999-06-15 | 2000-06-12 | Ablative method for forming RF ceramic block filters |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101006922A Pending CN101013768A (en) | 1999-06-15 | 2000-06-12 | Ablative method for forming RF ceramic block filters |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6462629B1 (en) |
| EP (1) | EP1192682B1 (en) |
| JP (3) | JP2003502893A (en) |
| KR (3) | KR100628677B1 (en) |
| CN (3) | CN1196224C (en) |
| AT (1) | ATE346393T1 (en) |
| DE (1) | DE60031979T2 (en) |
| WO (1) | WO2000077883A1 (en) |
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- 2000-06-12 KR KR1020067007402A patent/KR100769845B1/en not_active Expired - Lifetime
- 2000-06-12 KR KR1020017016098A patent/KR100563021B1/en not_active Expired - Fee Related
- 2000-06-12 AT AT00939810T patent/ATE346393T1/en not_active IP Right Cessation
- 2000-06-12 WO PCT/US2000/016138 patent/WO2000077883A1/en active IP Right Grant
- 2000-06-12 JP JP2001504036A patent/JP2003502893A/en active Pending
- 2000-06-12 EP EP00939810A patent/EP1192682B1/en not_active Expired - Lifetime
- 2000-06-12 CN CNB008104204A patent/CN1196224C/en not_active Expired - Lifetime
- 2000-06-12 DE DE60031979T patent/DE60031979T2/en not_active Expired - Lifetime
- 2000-06-12 CN CNB200410056032XA patent/CN100505416C/en not_active Expired - Lifetime
- 2000-06-12 CN CNA2006101006922A patent/CN101013768A/en active Pending
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2001
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2004
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| CN109273575A (en) * | 2017-07-18 | 2019-01-25 | Zkw集团有限责任公司 | Thermal coupling of copper diffusion surface |
| CN109273575B (en) * | 2017-07-18 | 2021-04-02 | Zkw集团有限责任公司 | Conductor plate and motor vehicle headlight |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1196224C (en) | 2005-04-06 |
| US6834429B2 (en) | 2004-12-28 |
| JP2003502893A (en) | 2003-01-21 |
| WO2000077883A1 (en) | 2000-12-21 |
| US6462629B1 (en) | 2002-10-08 |
| KR20020041336A (en) | 2002-06-01 |
| KR100769845B1 (en) | 2007-10-24 |
| DE60031979D1 (en) | 2007-01-04 |
| JP2005117675A (en) | 2005-04-28 |
| KR100628677B1 (en) | 2006-09-27 |
| EP1192682A1 (en) | 2002-04-03 |
| KR20060053020A (en) | 2006-05-19 |
| CN100505416C (en) | 2009-06-24 |
| DE60031979T2 (en) | 2007-09-20 |
| KR100563021B1 (en) | 2006-03-22 |
| KR20050089892A (en) | 2005-09-08 |
| US20010016982A1 (en) | 2001-08-30 |
| CN1363125A (en) | 2002-08-07 |
| EP1192682B1 (en) | 2006-11-22 |
| JP2006180544A (en) | 2006-07-06 |
| CN101013768A (en) | 2007-08-08 |
| ATE346393T1 (en) | 2006-12-15 |
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