CN1332057A - Rare earth element-containing lead-less solder - Google Patents
Rare earth element-containing lead-less solder Download PDFInfo
- Publication number
- CN1332057A CN1332057A CN 01127901 CN01127901A CN1332057A CN 1332057 A CN1332057 A CN 1332057A CN 01127901 CN01127901 CN 01127901 CN 01127901 A CN01127901 A CN 01127901A CN 1332057 A CN1332057 A CN 1332057A
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- Prior art keywords
- balance
- solder
- alloy
- rare earth
- earth element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 21
- 229910052761 rare earth metal Inorganic materials 0.000 title claims description 6
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 16
- 239000000956 alloy Substances 0.000 abstract description 16
- 238000003466 welding Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 7
- 231100000252 nontoxic Toxicity 0.000 abstract description 3
- 230000003000 nontoxic effect Effects 0.000 abstract description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910016331 Bi—Ag Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 206010016256 fatigue Diseases 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明属于新材料技术领域,涉及到电子、宇航、通信、汽车等焊料使用领域。其特征是化学成分(%)为:(1)、(0.5～5)Ag;(0.05～2)RE;余量为Sn;(2)、(0.5～5)Ag;(0.05～2)RE;(1～10)Bi;余量为Sn;(3)、(0.5～5)Ag;(0.05～2)RE;(0.5～2)Cu;余量为Sn;(4)、(0.5～5)Ag;(0.05～2)RE;(1～20)In;;余量为Sn;(5)、(0.5～5)Ag;(0.05～2)RE;(1～10)Bi;(0.5～2)Cu;余量为Sn。合金无毒、无污染,具有优良的润湿性、力学性能、焊接性能及可靠性。可替代锡铅焊料,并可满足宇航、通信、汽车等领域对高性能焊料的要求。The invention belongs to the technical field of new materials and relates to the fields of using solders such as electronics, aerospace, communication, and automobiles. Its characteristic is that the chemical composition (%) is: (1), (0.5～5) Ag; (0.05～2) RE; the balance is Sn; (2), (0.5～5) Ag; (0.05～2) RE ;(1～10)Bi; balance is Sn; (3), (0.5～5) Ag; (0.05～2) RE; (0.5～2) Cu; balance is Sn; (4), (0.5～ 5)Ag;(0.05～2)RE;(1～20)In;;the balance is Sn;(5),(0.5～5)Ag;(0.05～2)RE;(1～10)Bi;( 0.5～2) Cu; the balance is Sn. The alloy is non-toxic, non-polluting, and has excellent wettability, mechanical properties, welding performance and reliability. It can replace tin-lead solder, and can meet the requirements of high-performance solder in aerospace, communication, automobile and other fields.
Description
The invention belongs to field of welding material in the new material technology, specially refer to Electronic Packaging with assembling, aerospace, communicate by letter, brazing solder such as automobile uses the field, be mainly used to substitute the use of tin-lead solder in electronics assembling and encapsulation field, and can satisfy of the requirement of fields such as aerospace, communication and automobile the high-performance scolder as welding material.
At present, the Sn-37Pb alloy is the main welding material of Electronic Packaging and assembling in the electronics industry.Characteristics such as that though it has is with low cost, good conductivity and mechanics, welding performance are good, Pb and to contain the Pb thing be the poisonous and harmful material, solder produce and use in be detrimental to health, the welding discarded object has great pollution to environment.Along with being gradually improved and strictness of legislations of environmental protection, ban use of plumbous cry surging day by day.Simultaneously, electronics industry develop rapidly and assembling and encapsulation technology constantly progressive, the performance requirement of scolder is improved constantly.In little soldering tech such as flip-chip weldering pressure technology, the encapsulation of ball bar display, a microbonding solder joint serves as mechanical connection and electrical connecting passage effect simultaneously, and this is very high to its reliability requirement.Traditional plumber's solder creep-resistant property and fatigability are poor, can not satisfy current demand.
In current lead-free solder, Sn-Ag is that alloy has application promise in clinical practice, and its combination property is more superior.But its wettability is relatively poor, and it is not obvious to its wetability improvement effect to add alloy elements such as a spot of In, Bi.And alloy structure is thicker, skewness.Add RE (mixed rare-earth elements mainly comprises element and oxides thereof such as Ce, La) element and not only can improve the wetability of alloy, and can crystal grain thinning, significantly improving Sn-Ag is mechanical property, welding performance and the reliability of alloy.Nontoxic, pollution-free, be a kind of novel environment friendly welding material.
The objective of the invention is, a kind of lead-free solder that contains rare earth element is provided, to solve present lead contamination problem and to satisfy of the requirement of fields such as aerospace, communication and automobile the high-performance scolder.
Technical scheme of the present invention is that a certain amount of RE element of adding improves alloy property in Sn-Ag, Sn-Bi-Ag, Sn-Ag-Cu, Sn-In-Ag, Sn-Ag-Bi, Sn-Bi-Ag-Cu alloy.Promptly select high Sn for use, low Ag contains certain RE element, adds an amount of Bi, Cu, In prepares the novel lead-free scolder as alloy element.
Below provide embodiment of the present invention:
The chemical composition (%) that contains the lead-free solder of rare earth element is as follows:
(1) (0.5～5) Ag; (0.05～2) RE; Remaining content is that Sn and unavoidable impurities are formed;
(2) (0.5～5) Ag; (0.05～2) RE; (1～10) Bi; Remaining content is that Sn and unavoidable impurities are formed; The fusing point of alloy is adjusted in the adding of Bi element, further improves wetability;
(3) (0.5～5) Ag; (0.05～2) RE; (0.5～2) Cu; Remaining content is that Sn and unavoidable impurities are formed; The adding of Cu element comes reinforced alloys;
(4) (0.5～5) Ag; (0.05～2) RE; (1～20In); Remaining content is that Sn and unavoidable impurities are formed; Fusing point is adjusted in the adding of In;
(5) (0.5～5) Ag; (0.05～2) RE; (1～10) Bi; (0.5～2) Cu; Remaining content is that Sn and unavoidable impurities are formed; Fusing point is adjusted in the adding of Bi, Cu, reinforced alloys.
Above-mentioned raw material of proportionately distributing is put into industrial non-vacuum induction furnace or vaccum sensitive stove is smelted, under normal pressure, 850 ℃～900 ℃ temperature insulation 1～2 hour, casting can obtain solder alloy.
Effect of the present invention and benefit are, because the adding of RE element makes this scolder have excellent wetting capacity; The alloy structure refinement has excellent mechanical property; Good welding performance and reliability.This scolder is nontoxic, pollution-free, can satisfy the requirement of industry such as current electronics, aerospace, automobile to high-performance environmental protection scolder.
Below be described in detail optimum implementation of the present invention:
(1) Sn-Ag-RE scolder, composition are (%): (2～4) Ag; (0.4～0.8) RE; Surplus is Sn;
(2) Sn-Ag-Bi-RE scolder, composition are (%): (2～4) Ag; (0.4～0.8) RE; (2～5) Bi; Surplus is Sn;
(3) Sn-Ag-Cu-RE scolder, composition are (%): (2～4) Ag; (0.4～0.8) RE; (0.5～2) Cu; Surplus is Sn;
(4) Sn-In-Ag-RE solder compositions (%): (2～4) Ag; (0.4～0.8) RE; (1～5) In; Surplus is Sn;
(5) Sn-Bi-Ag-Cu-RE solder compositions (%): (2～4) Ag; (0.4～0.8) RE; (2～5) Bi; (0.5～2) Cu; Surplus is Sn.
With the composition for preparing, preferably block or granular, put into vaccum sensitive stove and smelt, under normal pressure, 850 ℃～900 ℃ temperature insulation 1～2 hour, casting can obtain solder alloy.The solder alloy that obtains can be directly used in wave-soldering, further is processed into powder, is equipped with suitable solder flux, obtains soldering paste, can be used for reflow welding.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01127901 CN1332057A (en) | 2001-07-03 | 2001-07-03 | Rare earth element-containing lead-less solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01127901 CN1332057A (en) | 2001-07-03 | 2001-07-03 | Rare earth element-containing lead-less solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1332057A true CN1332057A (en) | 2002-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01127901 Pending CN1332057A (en) | 2001-07-03 | 2001-07-03 | Rare earth element-containing lead-less solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1332057A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352596C (en) * | 2005-07-22 | 2007-12-05 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN101862925A (en) * | 2010-05-17 | 2010-10-20 | 天津大学 | Tin-bismuth-silver lead-free solder and preparation method thereof |
| CN102660723A (en) * | 2012-05-17 | 2012-09-12 | 合肥工业大学 | Rare-earth modified tin alloy for continuous hot-dip coating of copper wire and copper-coated metal composite wire, and manufacturing method thereof |
| CN101801588B (en) * | 2007-07-13 | 2015-03-25 | 千住金属工业株式会社 | Lead-free solder for vehicle, and in-vehicle electronic circuit |
| CN105195916A (en) * | 2015-11-05 | 2015-12-30 | 广东轻工职业技术学院 | Lead-free solder alloy soldering paste |
| US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
| CN115533366A (en) * | 2022-09-21 | 2022-12-30 | 南京航空航天大学 | High-tin rare earth copper-phosphorous solder and preparation method thereof |
-
2001
- 2001-07-03 CN CN 01127901 patent/CN1332057A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
| CN100352596C (en) * | 2005-07-22 | 2007-12-05 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN101801588B (en) * | 2007-07-13 | 2015-03-25 | 千住金属工业株式会社 | Lead-free solder for vehicle, and in-vehicle electronic circuit |
| CN101862925A (en) * | 2010-05-17 | 2010-10-20 | 天津大学 | Tin-bismuth-silver lead-free solder and preparation method thereof |
| CN102660723A (en) * | 2012-05-17 | 2012-09-12 | 合肥工业大学 | Rare-earth modified tin alloy for continuous hot-dip coating of copper wire and copper-coated metal composite wire, and manufacturing method thereof |
| CN102660723B (en) * | 2012-05-17 | 2014-03-12 | 合肥工业大学 | Rare-earth modified tin alloy for continuous hot-dip coating of copper wire and copper-coated metal composite wire, and manufacturing method thereof |
| CN105195916A (en) * | 2015-11-05 | 2015-12-30 | 广东轻工职业技术学院 | Lead-free solder alloy soldering paste |
| CN105195916B (en) * | 2015-11-05 | 2017-06-16 | 广东轻工职业技术学院 | A kind of leadless welding alloy solder(ing) paste |
| CN115533366A (en) * | 2022-09-21 | 2022-12-30 | 南京航空航天大学 | High-tin rare earth copper-phosphorous solder and preparation method thereof |
| CN115533366B (en) * | 2022-09-21 | 2024-10-01 | 南京航空航天大学 | High-tin rare earth copper-phosphorus solder and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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