CN112961637A - Low-shrinkage two-component epoxy resin adhesive and preparation method and application thereof - Google Patents
Low-shrinkage two-component epoxy resin adhesive and preparation method and application thereof Download PDFInfo
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- CN112961637A CN112961637A CN202110402666.XA CN202110402666A CN112961637A CN 112961637 A CN112961637 A CN 112961637A CN 202110402666 A CN202110402666 A CN 202110402666A CN 112961637 A CN112961637 A CN 112961637A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 79
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 79
- 239000000853 adhesive Substances 0.000 title claims abstract description 51
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000178 monomer Substances 0.000 claims abstract description 27
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 25
- 239000003085 diluting agent Substances 0.000 claims abstract description 24
- 239000004014 plasticizer Substances 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 238000002156 mixing Methods 0.000 claims abstract description 21
- 238000003756 stirring Methods 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims description 12
- 230000008961 swelling Effects 0.000 claims description 11
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical group COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical group CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 9
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 8
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 claims description 5
- 229960001826 dimethylphthalate Drugs 0.000 claims description 5
- RMRCETUKXDDGKH-UHFFFAOYSA-N 1,4,6,9-tetraoxaspiro[4.4]nonane Chemical group O1CCOC21OCCO2 RMRCETUKXDDGKH-UHFFFAOYSA-N 0.000 claims description 4
- PCEBNPHEKQSKKT-UHFFFAOYSA-N 1,5,7,11-tetraoxaspiro[5.5]undecane Chemical compound O1CCCOC21OCCCO2 PCEBNPHEKQSKKT-UHFFFAOYSA-N 0.000 claims description 4
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 claims description 4
- GLPQQALOPDWQCF-UHFFFAOYSA-N 3,9-bis[(4-methoxyphenyl)methyl]-1,5,7,11-tetraoxaspiro[5.5]undecane Chemical compound COC1=CC=C(CC2COC3(OC2)OCC(CO3)CC2=CC=C(C=C2)OC)C=C1 GLPQQALOPDWQCF-UHFFFAOYSA-N 0.000 claims description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 4
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 3
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920006332 epoxy adhesive Polymers 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 11
- 238000003384 imaging method Methods 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 16
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- CIRMGZKUSBCWRL-LHLOQNFPSA-N (e)-10-[2-(7-carboxyheptyl)-5,6-dihexylcyclohex-3-en-1-yl]dec-9-enoic acid Chemical compound CCCCCCC1C=CC(CCCCCCCC(O)=O)C(\C=C\CCCCCCCC(O)=O)C1CCCCCC CIRMGZKUSBCWRL-LHLOQNFPSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical class CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- 229960001124 trientine Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a low-shrinkage two-component epoxy resin adhesive as well as a preparation method and application thereof, wherein the preparation method comprises the following steps: uniformly mixing epoxy resin and an expansion polymerization monomer, adjusting the temperature to 40-80 ℃, adding a diluent and a plasticizer, uniformly stirring, and carrying out vacuum defoaming for 5-30 minutes to obtain a component A; mixing a curing agent and a curing accelerator, stirring for 10-60 minutes at 50-90 ℃, and defoaming for 5-30 minutes in vacuum to obtain a component B; and uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive. The low-shrinkage double-component epoxy resin adhesive disclosed by the invention has the advantages that the volume change rate is close to zero after curing, the tensile strength and the shear strength are high, the adhesive is suitable for bonding optical components, and the final imaging quality of the optical components cannot be influenced by the deviation of the optical components from the original positions after bonding.
Description
Technical Field
The invention belongs to the technical field of adhesives applied to optical devices, and particularly relates to a low-shrinkage two-component epoxy resin adhesive as well as a preparation method and application thereof.
Background
The epoxy resin adhesive is a liquid adhesive composed of epoxy resin, a curing agent, a diluent, a plasticizer, a filler and the like, and is widely applied to bonding and fixing of various materials. The common epoxy resin adhesives have volume shrinkage of different degrees during curing, the volume shrinkage is about 2% -5%, and if the epoxy resin adhesives are directly applied to bonding of optical components, the optical components are easy to deviate from the positions where the optical components are located before bonding, the integrity of a light path is damaged, and the imaging quality is reduced.
The two-component epoxy resin adhesive mainly comprises a prepolymer part (generally called component A including epoxy resin, diluent and other components) and a curing agent part (generally called component B including curing agent, curing accelerator and other components). Because the two components are stored separately, the storage condition of the two-component epoxy resin adhesive is generally mild, and the two-component epoxy resin adhesive can be stored for a long time (generally one year) at room temperature without refrigeration. However, the existing two-component epoxy resin adhesive still has unequal volume shrinkage of 2% -5% during curing, and cannot be directly applied to bonding of optical components.
Disclosure of Invention
In order to overcome the defect that the volume shrinkage rate of the existing two-component epoxy resin adhesive is large during curing, the invention aims to provide a preparation method of a low-shrinkage-rate two-component epoxy resin adhesive.
The invention also aims to provide the low-shrinkage two-component epoxy resin adhesive prepared by the preparation method, wherein the volume shrinkage rate of the low-shrinkage two-component epoxy resin adhesive is close to zero when the low-shrinkage two-component epoxy resin adhesive is cured.
The purpose of the invention is realized by the following technical scheme.
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) uniformly mixing epoxy resin and an expansion polymerization monomer, adjusting the temperature to 40-80 ℃, adding a diluent and a plasticizer, uniformly stirring, and carrying out vacuum defoaming for 5-30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is (50-80): (5-35): (5-15): (5-15);
in the step 1), the method for uniformly mixing the epoxy resin and the swelling polymerization monomer comprises the following steps: adjusting the temperature to 60-100 ℃ and stirring for 10-60 minutes.
In the step 1), the diluent and the plasticizer are added and uniformly stirred for 10-60 minutes.
In the step 1), the epoxy resin is bisphenol a type epoxy resin or bisphenol F type epoxy resin.
In the step 1), the swelling polymerization monomer is 1,4,6, 9-tetraoxaspiro [4,4] nonane, 1,5,7, 11-tetraoxaspiro [5,5] undecane or 3, 9-bis (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane.
In the step 1), the diluent is one or a mixture of several of n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether and ethylene glycol diglycidyl ether.
In the step 1), the plasticizer is dimethyl phthalate, dibutyl phthalate or dioctyl phthalate.
2) And uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: (1-5), the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator, stirring for 10-60 minutes at 50-90 ℃, and defoaming for 5-30 minutes in vacuum to obtain the component B, wherein the ratio of the curing agent to the curing accelerator is (90-99.9) in parts by mass: (0.1-10).
In the step 2), the curing agent is low molecular polyamide (linoleic acid dimer triethylene tetramine, linoleic acid dimer diethylene triamine or eleostearic acid dimer diethylene triamine).
In the step 2), the curing accelerator is DMP-30(2,4, 6-tris (dimethylaminomethyl) phenol) or N, N-dimethylethanolamine.
The low-shrinkage double-component epoxy resin adhesive prepared by the preparation method.
The low-shrinkage bi-component epoxy resin adhesive is applied to reducing shrinkage after curing.
In the technical scheme, the low-shrinkage two-component epoxy resin adhesive is placed at the temperature of 50-120 ℃ for 1 minute-2 hours to obtain the cured low-shrinkage two-component epoxy resin adhesive.
The low-shrinkage double-component epoxy resin adhesive disclosed by the invention has the advantages that the volume change rate is close to zero after curing, the tensile strength and the shear strength are high, the adhesive is suitable for bonding optical components, and the final imaging quality of the optical components cannot be influenced by the deviation of the optical components from the original positions after bonding.
Detailed Description
The technical scheme of the invention is further explained by combining specific examples.
The relevant information for the reagents used in the examples of the invention is shown in the following table:
the swelling polymerization monomers 1,4,6, 9-tetraoxaspiro [4,4] nonane, 1,5,7, 11-tetraoxaspiro [5,5] undecane, 3, 9-bis (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane used in the examples of the present invention were prepared according to the methods in the references (Yuan Gui. synthesis of spiro orthocarbonate swelling monomers [ J ]. China adhesive (03): 32-35.).
Example 1
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) mixing epoxy resin and an expansion polymerization monomer in a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes until the mixture is uniform, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes until the mixture is uniform, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is 73: 13: 9: 5, the epoxy resin is bisphenol A type epoxy resin, the expansion polymerization monomer is 1,4,6, 9-tetraoxaspiro [4,4] nonane, the diluent is a mixture of n-butyl glycidyl ether and ethylene glycol diglycidyl ether, and the ratio of the n-butyl glycidyl ether to the ethylene glycol diglycidyl ether is 7:2, the plasticizer is dimethyl phthalate;
2) uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 97: 3, curing agent is 650#The low molecular polyamide (eleostearic acid dimer diethylenetriamine) and the curing accelerator are DMP-30(2,4, 6-tri (dimethylaminomethyl) phenol).
Example 2
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) mixing epoxy resin and an expansion polymerization monomer in a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes until the mixture is uniform, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes until the mixture is uniform, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is 73: 13: 9: 5, the epoxy resin is bisphenol A type epoxy resin, the expansion polymerization monomer is 1,5,7, 11-tetraoxaspiro [5,5] undecane, the diluent is a mixture of 2-ethylhexyl glycidyl ether and ethylene glycol diglycidyl ether, the ratio of the 2-ethylhexyl glycidyl ether to the ethylene glycol diglycidyl ether is 7:2 in parts by mass, and the plasticizer is dimethyl phthalate;
2) uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 97: 3, curing agent is 200#Low molecular polyamide (linoleic acid dimer triethylene tetramine)) The curing accelerator is DMP-30(2,4, 6-tris (dimethylaminomethyl) phenol).
Example 3
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) mixing epoxy resin and an expansion polymerization monomer in a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes until the mixture is uniform, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes until the mixture is uniform, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is 73: 13: 9: 5, the epoxy resin is bisphenol F type epoxy resin, the expansion polymerization monomer is 3, 9-di (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane, the diluent is allyl glycidyl ether, and the plasticizer is dioctyl phthalate;
2) uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 98: 2, the curing agent is 203#Low molecular polyamide (linoleic acid dimer diethylenetriamine) and a curing accelerator N, N-dimethylethanolamine.
Comparative example 1 (without the swelling polymerization monomer)
A preparation method of a two-component epoxy resin adhesive comprises the following steps:
1) adding epoxy resin into a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes till the mixture is uniformly stirred, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin to the diluent to the plasticizer is 86: 9: 5, the epoxy resin is bisphenol A epoxy resin, the diluent is a mixture of n-butyl glycidyl ether and ethylene glycol diglycidyl ether, and the ratio of the n-butyl glycidyl ether to the ethylene glycol diglycidyl ether is 7:2, the plasticizer is dimethyl phthalate;
2) uniformly mixing the component A and the component B to obtain the two-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 97: 3, curing agent is 650#The low molecular polyamide (eleostearic acid dimer diethylenetriamine) and the curing accelerator are DMP-30(2,4, 6-tri (dimethylaminomethyl) phenol).
The low-shrinkage two-component epoxy resin adhesive prepared in examples 1-3 and the two-component epoxy resin adhesive prepared in comparative example 1 were left at 60 ℃ for 1.5 hours to cure.
The low-shrinkage two-component epoxy resin adhesive prepared in examples 1-3 of the invention and the two-component epoxy resin adhesive prepared in comparative example 1 were subjected to volume change rate, tensile strength and shear strength tests. Wherein, the volume change rate is tested according to ISO 3521-1997 determination of the total volume shrinkage of the unsaturated polyester resin and the epoxy resin, and the tensile strength and the shear strength are tested according to GB/T7124-2008 determination standard of the tensile shear strength of the adhesive. The test results are shown in table 1.
Table 1 test characterization results
Note: the rate of change in volume is positive and represents the volume expansion after curing; the rate of change in volume is negative and represents the volumetric shrinkage after curing.
As can be seen from the test results in table 1, comparative example 1 contains no swelling polymerization monomer and only epoxy resin, so that the adhesive shrinks significantly in volume after curing. In contrast, examples 1 to 3 contain both an epoxy resin and an expansion polymerization monomer. Although the epoxy resin shrinks in volume when cured, the swelling polymeric monomer increases in volume when cured. The invention can make the volume increase of the swelling polymerization monomer approximately equal to the volume reduction of the epoxy resin by creatively adjusting the relative proportion of the epoxy resin and the swelling polymerization monomer. Therefore, the volume change rate of the cured adhesives of examples 1-3 was close to zero. Meanwhile, the low-shrinkage two-component epoxy resin adhesive obtained in the embodiments 1 to 3 has small volume change and low internal stress after curing, so that the tensile strength and the shear strength are higher than those of the comparative example 1 which does not contain the expansion polymerization monomer.
The invention has been described in an illustrative manner, and it is to be understood that any simple variations, modifications or other equivalent changes which can be made by one skilled in the art without departing from the spirit of the invention fall within the scope of the invention.
Claims (10)
1. A preparation method of a low-shrinkage double-component epoxy resin adhesive is characterized by comprising the following steps:
1) uniformly mixing epoxy resin and an expansion polymerization monomer, adjusting the temperature to 40-80 ℃, adding a diluent and a plasticizer, uniformly stirring, and carrying out vacuum defoaming for 5-30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is (50-80): (5-35): (5-15): (5-15);
2) and uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: (1-5), the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator, stirring for 10-60 minutes at 50-90 ℃, and defoaming for 5-30 minutes in vacuum to obtain the component B, wherein the ratio of the curing agent to the curing accelerator is (90-99.9) in parts by mass: (0.1-10).
2. The method of claim 1, wherein in the step 1), the epoxy resin and the swelling polymerization monomer are uniformly mixed by: adjusting the temperature to 60-100 ℃ and stirring for 10-60 minutes.
3. The preparation method according to claim 1, wherein in the step 1), the diluent and the plasticizer are stirred for 10 to 60 minutes to achieve uniform stirring after the diluent and the plasticizer are added.
4. The production method according to claim 1, wherein in the step 1), the epoxy resin is a bisphenol a type epoxy resin or a bisphenol F type epoxy resin;
the swelling polymerization monomer is 1,4,6, 9-tetraoxaspiro [4,4] nonane, 1,5,7, 11-tetraoxaspiro [5,5] undecane or 3, 9-di (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane.
5. The preparation method according to claim 4, wherein in the step 1), the diluent is one or a mixture of n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether and ethylene glycol diglycidyl ether;
in the step 1), the plasticizer is dimethyl phthalate, dibutyl phthalate or dioctyl phthalate.
6. The method according to claim 1, wherein in the step 2), the curing agent is a low-molecular polyamide.
7. The production method according to claim 1, wherein in the step 2), the curing accelerator is DMP-30 or N, N-dimethylethanolamine.
8. The low-shrinkage two-component epoxy resin adhesive obtained by the preparation method of any one of claims 1-7.
9. The use of the low shrinkage two-part epoxy adhesive of claim 8 to reduce shrinkage after curing.
10. The application of claim 9, wherein the low-shrinkage two-component epoxy resin adhesive is placed at 50-120 ℃ for 1 minute-2 hours to obtain the cured low-shrinkage two-component epoxy resin adhesive.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168427A (en) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| WO2014158705A1 (en) * | 2013-03-13 | 2014-10-02 | 3M Innovative Properties Company | Methods of making low shrinkage and expandable compositions and expandable monomers |
| CN104356990A (en) * | 2014-11-23 | 2015-02-18 | 桂林理工大学 | Preparation method of adhesive for optical spare parts |
| WO2017063406A1 (en) * | 2015-10-16 | 2017-04-20 | 中兴通讯股份有限公司 | Aluminum alloy die-casting member defect repairing agent |
| US20180079915A1 (en) * | 2015-04-24 | 2018-03-22 | Ppg Coatings Europe B.V. | An Intumescent Coating Composition |
| CN108641066A (en) * | 2018-04-17 | 2018-10-12 | 中国科学院化学研究所 | A kind of composition epoxy resin and preparation method thereof |
| CN109337627A (en) * | 2018-10-17 | 2019-02-15 | 烟台德邦科技有限公司 | A kind of high-performance epoxy adhesive of lower shrinkage low stress |
-
2021
- 2021-04-14 CN CN202110402666.XA patent/CN112961637A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168427A (en) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| WO2014158705A1 (en) * | 2013-03-13 | 2014-10-02 | 3M Innovative Properties Company | Methods of making low shrinkage and expandable compositions and expandable monomers |
| CN104356990A (en) * | 2014-11-23 | 2015-02-18 | 桂林理工大学 | Preparation method of adhesive for optical spare parts |
| US20180079915A1 (en) * | 2015-04-24 | 2018-03-22 | Ppg Coatings Europe B.V. | An Intumescent Coating Composition |
| WO2017063406A1 (en) * | 2015-10-16 | 2017-04-20 | 中兴通讯股份有限公司 | Aluminum alloy die-casting member defect repairing agent |
| CN108641066A (en) * | 2018-04-17 | 2018-10-12 | 中国科学院化学研究所 | A kind of composition epoxy resin and preparation method thereof |
| CN109337627A (en) * | 2018-10-17 | 2019-02-15 | 烟台德邦科技有限公司 | A kind of high-performance epoxy adhesive of lower shrinkage low stress |
Non-Patent Citations (3)
| Title |
|---|
| 袁金颖等: "膨胀单体对环氧树脂的改性研究", 《功能高分子学报》 * |
| 袁金颖等: "膨胀单体改性环氧树脂粘合剂", 《粘接》 * |
| 袁金颖等: "膨胀单体的合成及其对环氧树脂的改性研究", 《高分子材料科学与工程》 * |
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