CN111106018B - Method for forming metal electrode in packaging process - Google Patents
Method for forming metal electrode in packaging process Download PDFInfo
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- CN111106018B CN111106018B CN201811282483.3A CN201811282483A CN111106018B CN 111106018 B CN111106018 B CN 111106018B CN 201811282483 A CN201811282483 A CN 201811282483A CN 111106018 B CN111106018 B CN 111106018B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The present disclosure relates to a method for forming a metal electrode in a packaging process, comprising the steps of: s100: selecting a carrier as a package carrier for carrying a package, wherein the carrier can be peeled off from the package and reused in the package carrier; s200: processing the carrier sheet to enable a part of area of the carrier sheet to form a first area where a medium thinner than the carrier sheet is attached and at least another part of area of the carrier sheet to be electroplated to form a second area where a metal electrode is attached; when the bearing sheet is stripped relative to the packaging body, the metal electrode belongs to the packaging body; the medium includes any one of: release film, transition plating layer, or other medium capable of forming weak bonding force with the package body or the carrier sheet. Therefore, the method for forming the metal electrode in the packaging process and the matched process thereof are simpler, more environment-friendly and lower in cost.
Description
Technical Field
The disclosure belongs to the field of electronics, and particularly relates to a method for forming a metal electrode in a packaging process.
Background
The integrated circuit industry is a fundamental and leading industry of the information-oriented society, wherein the packaging and testing of various integrated circuits is an important part of the entire industry chain. In terms of packaging technology, the main stream of packaging technology mostly adopts the HDI technology route, which is mainly characterized by the formation of micro-via and fine circuit, however, the equipment and technology of the technology route have high threshold, large investment, need to match with a dedicated carrier substrate, and the size and thickness are limited by the material specification, and the method for forming the electrode therein has a very large demand for metal.
How to design a simpler, more environment-friendly and lower-cost method for forming electrodes in the packaging process and a matching process thereof is a technical problem which needs to be solved urgently in the packaging industry.
Disclosure of Invention
In view of the deficiencies of the prior art, the present disclosure discloses a method for forming a metal electrode in a packaging process, comprising the steps of:
s100: selecting a carrier as a package carrier for carrying a package, wherein the carrier can be peeled off from the package and reused in the package carrier;
s200: processing the carrier sheet to enable a part of area of the carrier sheet to form a first area where a medium thinner than the carrier sheet is attached and at least another part of area of the carrier sheet to be electroplated to form a second area where a metal electrode is attached; when the bearing sheet is stripped relative to the packaging body, the metal electrode belongs to the packaging body; the medium includes any one of: release film, transition plating layer, or other medium capable of forming weak bonding force with the package body or the carrier sheet.
Through the technical scheme, the novel method for forming the metal electrode in the packaging process is realized, the structure is simple, the characteristic that the bearing sheet and the metal electrode are stripped is achieved, the production efficiency can be improved, the cost is reduced, and the environment is protected.
Drawings
FIG. 1-1 is a schematic view of one embodiment of the present disclosure;
FIGS. 1-2 are schematic diagrams of one embodiment of the present disclosure;
FIGS. 1-3 are schematic structural views of another embodiment of the present disclosure;
FIGS. 1-4 are schematic structural views of another embodiment of the present disclosure;
FIG. 2 is a schematic view of another embodiment of the present disclosure;
FIG. 3 is a schematic view of another embodiment of the present disclosure;
FIG. 4-1 is a schematic view of another embodiment of the present disclosure;
FIG. 4-2 is a schematic view of another embodiment of the present disclosure;
4-3 are schematic diagrams of another embodiment of the present disclosure;
FIG. 5-1 is a schematic view of another embodiment of the present disclosure;
FIG. 5-2 is a schematic view of another embodiment of the present disclosure;
5-3 are schematic diagrams of another embodiment of the present disclosure;
FIGS. 5-4 are schematic diagrams of another embodiment of the present disclosure;
FIG. 6 is a schematic structural diagram of another embodiment of the present disclosure;
FIG. 7-1 is a schematic structural diagram of another embodiment of the present disclosure;
FIG. 7-2 is a schematic structural diagram of another embodiment of the present disclosure;
FIGS. 7-3 are schematic structural views of another embodiment of the present disclosure;
FIG. 8-1 is a schematic structural diagram of another embodiment of the present disclosure;
FIG. 8-2 is a schematic structural diagram of another embodiment of the present disclosure;
FIGS. 8-3 are schematic structural views of another embodiment of the present disclosure;
FIGS. 8-4 are schematic structural views of another embodiment of the present disclosure;
FIG. 9-1 is a schematic structural diagram of another embodiment of the present disclosure;
FIG. 9-2 is a schematic structural diagram of another embodiment of the present disclosure;
fig. 9-3 are schematic structural views of another embodiment of the present disclosure.
Detailed Description
The following is a more particular description of the preferred embodiments of the invention, as illustrated in the accompanying drawings, from which the features and advantages of the invention will be apparent.
Referring to fig. 1-1, in one embodiment, a method of forming a metal electrode in a packaging process is disclosed, comprising the steps of:
s100: selecting a carrier as a package carrier for carrying a package, wherein the carrier can be peeled off from the package and reused in the package carrier;
s200: processing the carrier sheet to enable a part of area of the carrier sheet to form a first area where a medium thinner than the carrier sheet is attached and at least another part of area of the carrier sheet to be electroplated to form a second area where a metal electrode is attached; when the bearing sheet is stripped relative to the packaging body, the metal electrode belongs to the packaging body; the medium includes any one of: release film, transition plating layer, or other medium capable of forming weak bonding force with the package body or the carrier sheet.
It can be understood that the above embodiments implement a novel method for forming a metal electrode in a packaging process, which has a simple structure and a characteristic of peeling a carrier sheet from the metal electrode. Referring to fig. 1-2 through 1-4, schematic diagrams of corresponding package structures after the above embodiments are implemented are illustrated.
The bearing sheet can be repeatedly utilized until the indexes such as physical or electrical performance and the like do not meet the packaging requirement any more, so the overall cost of the technical scheme is greatly reduced. Because the medium is thinner than the carrier sheet, the medium is attached, and the metal electrode is attached, when the medium includes any one of the following: when the release film, the transition coating or other media which can form weak bonding force with the packaging body or the bearing sheet, the method has the technical effects of simple structure, improvement of packaging efficiency, reduction of cost and more environmental protection.
It can be understood that, in the case of the medium, it is thinner than the carrier sheet on the one hand, and on the other hand, it needs to form a weak bonding force with the package or the carrier sheet to facilitate peeling of the carrier sheet relative to the package, and specific examples are as follows:
(1) when the carrier sheet is peeled off with respect to the package, if the medium is of a type that can form a weak bonding force with the package, the medium will be in a separated state with the carrier sheet from the package, for example, in the case where the medium is the above-mentioned release film: the release film medium is combined with the carrier sheet in a liquid state and is solidified, and the bonding force of the solidified release film when the solidified release film is bonded with other substances (such as a packaging body) belongs to the category of weak bonding force. The release film may include various different types of release films.
(2) When the carrier sheet is peeled off from the package, if the medium is of a type that can form a weak bonding force with the carrier sheet, the medium will be separated from the carrier sheet along with the package, for example, in the case where the medium is the above-mentioned transition plating layer: because of the characteristics of the plating process, the bonding force between the bearing sheet and the transition plating layer belongs to the category of weak bonding force, so that after the bearing sheet is stripped relative to the packaging body, the transition plating layer can still belong to the packaging body, the transition plating layer and the packaging body can still be adhered together, and the transition plating layer and the bearing sheet are in a separated state. The transition plating layer may be formed by gold plating, silver plating, nickel plating, copper plating, or the like, and preferably, the transition plating layer is formed by copper plating.
(3) Naturally, when the medium is thinner than the carrier sheet and belongs to other media that can form a weak bonding force with the package or the carrier sheet, then the medium at this time is also beneficial for the carrier sheet to be peeled relative to the package, or the medium and the carrier sheet can still be adhered together after peeling, or the medium and the package can still be adhered together after peeling.
It can be understood that the carrier sheet is a base, and the first region and the second region are all located above the carrier sheet, and theoretically, the top of the first region and the top of the second region can be used for carrying the package. When the carrier sheet is peeled off with respect to the package, the carrier sheet shown in fig. 1-2 to fig. 1-4 may be the side to be actively peeled off, and the package may also be the side to be actively peeled off. The package includes various different packaging forms of the integrated circuit. The first region and the second region are used for facilitating the formation of the electrode corresponding region and the non-electrode corresponding region in the packaging process.
In another embodiment, the height of the metal electrode and the thickness of the dielectric can be designed according to the requirements of a specific package. In addition, according to different designs, the height of the metal electrode can be slightly higher/lower than the thickness of the medium, can be obviously higher/lower than the thickness of the medium, and can be even.
In another embodiment, the metal electrode may include a variety of electrode forms.
In another embodiment, if the side of the metal electrode contacting the carrier sheet is used as the bottom surface, the other side of the metal electrode opposite to the bottom surface, i.e. the surface of the metal electrode, may be further surface-treated according to the package requirements, such as: gold plating, silver plating, tin plating, coarsening, oxidation prevention, passivation treatment, protective layer covering and the like. More preferably, the surface of the metal electrode may be subjected to die bonding, wire bonding, welding, plastic sealing, or the like.
In another embodiment, the metal electrode is formed by electroplating on the carrier sheet.
Although the above-mentioned embodiments use electroplating to form the electrodes, this does not mean that only electroplating can be used, depending on whether there are other ways in the technology development process to form the electrodes on the carrier sheet, such as growing electrodes or spraying electrodes.
It can be understood that there is a situation: when the release film is used as a medium, if the release film covers all the areas of the carrier sheet in advance, the release film of the area needing electroplating can be removed firstly, the carrier sheet is exposed, and the metal electrode is electroplated on the carrier sheet. Naturally, the thickness of the dielectric layer is determined according to the thickness of the required plating layer, but the dielectric property of electroplating is required to be satisfied; if the plating layer required by the metal electrode is relatively thick, a layer of photosensitive material such as a dry film or a wet film can be covered on the release film, the region required to be plated is exposed in an exposure and development mode, and then the region exposed on the bearing sheet is plated to form the metal electrode. Similarly, there is also a case: when the transition plating layer is used as a medium, if the transition plating layer covers all areas of the bearing sheet in advance, the metal electrode can be formed by electroplating in the following way: firstly, covering a layer of dry film type photosensitive material on the transition plating layer corresponding to the electroplating area, exposing and developing, then removing the transition plating layer in an etching mode to expose the corresponding electroplating area on the bearing sheet, and then electroplating the exposed area on the bearing sheet to form the metal electrode.
In another embodiment, after step S200, the method further comprises the steps of:
s300: attaching an insulating layer to the medium in the first region; and when the bearing sheet is stripped relative to the packaging body, the insulating layer is attached to the packaging body. Referring to fig. 2, a schematic diagram of a corresponding package structure after the embodiment is implemented is illustrated.
It will be appreciated that the insulating layer is required for the packaging process, which is common in packaging processes, but not for all packaging processes. The present embodiment is intended to emphasize: under the condition of needing the insulating layer, after the bearing sheet is stripped, the insulating layer can still be connected with and belongs to the packaging body. This means that the present disclosure can be used to: and packaging the package body containing the insulating layer.
More preferably, at least a portion of the insulating layer is attached to the metal electrode. It is clear that the solution disclosed in the present disclosure can be used for multilayer designs in packaging processes when provided with an insulating layer, more specific examples being detailed later. In view of the foregoing description of other embodiments, it can be understood that the method for forming electrodes disclosed in the present disclosure can be applied to a multi-layer process of a package, and still provide a carrier sheet with a characteristic of easy peeling.
In another embodiment of the present invention, the substrate is,
and when the bearing sheet is stripped relative to the packaging body, the metal electrode belongs to the packaging body.
With respect to this embodiment, it means that, with the embodiments disclosed in the present disclosure, after the carrier sheet is peeled off, the metal electrode is still integrated with the package body, that is, the metal electrode can still be connected to and attached to the package body. This just illustrates the excellent effect of the present embodiment: the peelable carrier sheet can improve packaging efficiency and reduce cost.
In another embodiment of the present invention, the substrate is,
the metal electrode comprises a first attachment, and when the bearing sheet is peeled relative to the packaging body, the first attachment belongs to the packaging body.
It is understood that the first attachment on the metal electrode can be any reasonable attachment on the metal electrode in the packaging process of the integrated circuit, including various attachment possibilities such as glue, film, insulating layer, bonding wires, IC, etc. As with the previous embodiment, this embodiment is intended to emphasize: after the carrier sheet is peeled off, the related attachments can still be connected and belonged to the packaging body.
In another embodiment, the carrier sheet is in the form of a tape. It will be appreciated that the carrier sheet may be of any shape convenient for manufacture, and the strip shape is advantageous for pipelining. Preferably, in another embodiment, the length direction of the carrier sheet is in a closed loop mode.
It will be appreciated that the carrier sheet is generally rectangular in shape, extending in the transverse direction, and the carrier sheet has two sides, the length direction being the long side. When the length direction of the bearing sheet is in a closed loop mode, uninterrupted production is facilitated, and the efficiency of subsequent packaging is greatly improved.
In another embodiment of the present invention, the substrate is,
the carrier sheet comprises any one of the following components: stainless steel with low thermal expansion coefficient, or other metals with thermal expansion coefficient matched with the plastic package resin.
It can be understood that the carrier sheet is selected in this embodiment. For the embodiment, the carrier sheet is selected by the thermal expansion coefficient, so as to overcome the negative influence of thermal expansion in the packaging process. It should be noted that, according to the foregoing description of the basic solutions and the principles of the present disclosure, as the technology develops, the present disclosure does not exclude non-metal materials as the carrier sheet.
More preferably, the insulating layer includes a second attachment thereon, and the second attachment belongs to the package after the carrier sheet is peeled off from the package. It will be appreciated that the second attachment on the insulating layer may be any reasonable attachment on the insulating layer including various attachment possibilities such as glue, film, electrodes, bonding wires, ICs, etc. during the packaging process of the integrated circuit. As with the previous embodiments, this embodiment is intended to emphasize: after the carrier sheet is peeled off, the related attachments can still be connected and belonged to the packaging body.
In another embodiment, after step S200, the method further comprises the steps of:
s400: selecting a third area between different metal electrodes in the second area as a bridging position, and attaching an insulating base film at the bridging position;
s500: and attaching conductive paste to the insulating base film.
The insulating layer may be further attached with a conductive paste to meet the requirements of some packaging processes. Referring to fig. 3, a corresponding structural schematic is illustrated.
More preferably, the conductive paste may be an electroplatable conductive paste.
Referring to fig. 4-1, in another embodiment, in a packaging process without an insulating layer, the solution disclosed in the present disclosure may enable the metal electrode and the release film to be attached on the carrier sheet, the adhesive is continuously attached on the metal electrode and the release film (corresponding to the first region and the second region), and the substrate is further attached on the adhesive.
Referring to fig. 4-2 and 4-3, respectively, it is schematically shown that in the packaging process with the insulating layer, a conductive paste is further attached on the insulating layer, and the conductive paste is preferably an electroplatable conductive paste: the carrier sheet is attached with a metal electrode and a release film, and the metal electrode, the release film (corresponding to the first region and the second region) are sequentially attached with an insulating layer, electroplatable conductive paste and glue, and a substrate is further attached on the glue.
It can be seen that in the case shown in fig. 4-2, 4-3, the conductive paste or the electroplatable conductive paste not only covers the insulating layer but also can make a crossover between the metal electrode and the metal electrode. The three metal electrodes shown in fig. 4-2 are not named as a first metal electrode, a second metal electrode, and a third metal electrode from left to right, and it is obvious that the conductive paste bridges between the first metal electrode and the third metal electrode.
With respect to the two embodiments set forth herein in the text of fig. 4-2, 4-3 and the accompanying drawings, it is noted that: the insulating layer may be used for electrical isolation, and the conductive paste over the insulating layer enables electrical communication across both ends of the insulating layer due to the crossover between the different metal electrodes. At this time, the corresponding embodiment is obviously advantageous for realizing the packaging of the double-sided circuit.
In another embodiment, in order to meet certain packaging requirements, the conductive paste and the metal electrode may be further subjected to pattern plating, i.e., patterning the surfaces of the conductive paste and the metal electrode. It can be understood that the metal layer obtained by the pattern plating can be electrically connected to the bottom of the metal electrode (i.e. the portion of the metal electrode contacting the carrier sheet, which can be referred to as the bottom electrode) or other electrodes required to be connected according to the package requirements. Preferably, in another embodiment, the patterned relevant surface may be further processed according to the packaging requirement: metal thickening, surface treatment, etching and the like.
For the above embodiments, further pattern plating can improve the electrical conductivity and surface characteristics of the cross-over region, reduce resistivity, and improve the conductive surface, which is especially important in high frequency application environment, especially when the skin effect is significant.
In another embodiment of the present invention, the substrate is,
the release film can be further attached with a third attachment, and when the carrier sheet is peeled relative to the packaging body, the third attachment belongs to the packaging body. It can be understood that the third attachment on the release film can be any reasonable attachment on the release film in the packaging process of the integrated circuit, including various attachment possibilities of photosensitive film, dry film, insulating film, glue, electrode, bonding wire, IC, etc. As with the previous embodiments, this embodiment is intended to emphasize: after the carrier sheet is peeled off, the related attachments can still be connected and belonged to the packaging body.
In another embodiment, when various types of films, such as a photosensitive film or a dry film or an insulating film, are included on the release film, the above various types of films on the release film may be further processed by exposure, development, or laser burning, so that: preferably, the metal electrode in the second region is formed by electroplating as described above.
Further, in another embodiment, the above films on the release film can be further processed as follows:
first, the photosensitive film, the dry film or the insulating film is removed;
secondly, covering an insulating coating on the release film;
thirdly, carrying out metallization treatment on the insulating coating to obtain a metal layer on the release film;
thirdly, communicating the metal layer on the release film with a bottom electrode, wherein the bottom electrode refers to the part of the metal electrode, which is contacted with the carrier sheet;
thirdly, patterning the metal layer on the release film, thickening, surface treating and etching the metal of the metal layer on the release film;
and thirdly, carrying out packaging processes such as die bonding, wire welding, plastic packaging and the like on the metal layer on the release film.
It can be appreciated that the above embodiments are examples of further processing scenarios for release films.
In another embodiment, fig. 5-1 illustrates a case where the third sticker on the release film is a dry film and the metal electrode is a conventional electrode, and illustrates a case of 3 metal electrodes.
In another embodiment, fig. 5-2 illustrates a case where the third adhesive on the release film is resin and the metal electrode belongs to a profile electrode, and illustrates a case of 2 metal electrodes, wherein each metal electrode includes a portion of the bottom electrode and a remaining metal pillar portion having a pillar shape except for the bottom electrode, which are described in many places above.
In another embodiment, fig. 5-3 illustrate a case where the third adhesive on the release film is a dry film and the metal electrodes belong to the profile electrode, and illustrate a case of 2 metal electrodes, wherein each metal electrode includes a portion of the bottom electrode and a remaining metal pillar portion having a pillar shape except the bottom electrode.
In another embodiment, fig. 5-4 illustrate a case where the third attachment on the release film comprises a resin and a dry film on the resin and a chip pad on the dry film, and the metal electrodes belong to a profile electrode, and illustrate a case of 2 metal electrodes, wherein each metal electrode comprises a portion of a bottom electrode, a portion of a top electrode flush with the chip pad, and the remaining metal pillar portion in a pillar shape between the bottom electrode and the top electrode, and the chip pad is located between the top electrodes of the 2 metal electrodes, and the dry film on the resin is located between the chip pad and each top electrode.
In another embodiment, fig. 6 illustrates a case where the technical solution of the present disclosure is used for chip packaging. The third attachment on the release film comprises resin and plastic package resin attached to the resin, the plastic package resin is used for packaging the chip on the chip base, the plastic package resin is also attached to the 2 metal electrodes, and each metal electrode comprises a bottom electrode and a top electrode. In addition, bonding leads are connected between the chip and the 2 top electrodes.
In addition, in fig. 6, the chip base and the top electrode both have two transverse ends, wherein the plastic package resin is included between one end of the chip base and one end of the top electrode at the opposite end thereof. And, each end of the chip base and the top electrode includes two upper and lower protruding portions and a recessed portion between the two upper and lower protruding portions, which can be understood as being for better bonding with the mold resin.
The above further schematic diagrams and embodiments illustrate in detail how the package carrier of the present disclosure can be used in related application scenarios in the field when the dielectric is a release film. When the carrier sheet is peeled therefrom, the release film tends to follow the carrier sheet.
The following illustrates, by means of other embodiments and schematic diagrams, how the package carrier according to the present disclosure can be used in related application scenarios in the field when the medium is a transition plating layer. When the carrier sheet is peeled off, the transition plating tends to follow the package.
In another embodiment, fig. 7-1 illustrates a case where the deposit on the transition plating layer is a dry film and the metal electrode is a conventional electrode, and illustrates a case of 3 metal electrodes.
In another embodiment, fig. 7-2 illustrates a case where the deposit on the transition plating layer is a resin and the metal electrode is a conventional electrode, and illustrates a case of 3 metal electrodes. In contrast, in another embodiment, FIGS. 7-3 illustrate the case of a shaped electrode, such as a T-shaped electrode, and illustrate the case of 3 metal electrodes.
In another embodiment, FIG. 8-1 illustrates the carrier sheet of FIG. 7-3 after it has been peeled away; FIG. 8-2 further illustrates the removal of the overplate in another embodiment; FIGS. 8-3 illustrate a packaged chip, bonded wire, in another embodiment; fig. 8-4 illustrates, in another embodiment, the chip package further completed with a molding resin as shown in fig. 8-3.
In another embodiment, fig. 9-1 illustrates a case where the attachment on the transition plating layer is resin, the metal electrodes belong to the shaped electrodes, and a case where the chip package is completed by using the molding resin, wherein each metal electrode includes not only a T-shaped electrode but also a portion of the bottom electrode and a remaining metal pillar portion having a pillar shape other than the bottom electrode, which are described in the foregoing paragraphs. In another embodiment, fig. 9-2 shows the package after the carrier is peeled off, and the transition plating layer is still attached to the package. Fig. 9-3 illustrate the package after further removal of the overplate in another embodiment.
From the foregoing fig. 7-3 to fig. 8-4, it can be understood that the present disclosure may first strip the carrier sheet and remove the transition plating layer, and then perform chip packaging and bonding wires; 9-1-9-3, the present disclosure may also continue with the chip packaging and bonding wires without peeling the carrier sheet first, and finally with the carrier sheet peeled and the overplate removed. In fact, for the embodiments of the release film described above, the carrier sheet and the release film can be peeled off first, and the package can be completed first and then the carrier sheet and the release film can be peeled off. This is advantageous for the division of the industry, which means that the packages can be provided to the customer after the carrier has been peeled off by the supplier of the supply chain, or the mixed product together with the package carrier and the packages can be delivered directly to the customer and the carrier peeled off by the customer.
For the above embodiments, even if two layers of different attachments cannot be achieved in the conventional process capability (mainly referring to the line width and line pitch), if the electrical connection relationship between different electrodes is still not achieved, then it is considered to add the layer of attachments to achieve the electrical connection between different electrodes. That is, in theory, each attachment described above may be two to N layers, where N is a positive integer. Thus, the technical scheme of the present disclosure can be used for RGB LED packages, BGA-like IC packages, and the like. In addition, it should be noted that, as mentioned above, the insulating layer can be used to realize a multi-layer design, and if a reasonable design is made, electrode layers can be designed on the bottom and the upper portion of the insulating layer, and each electrode layer can be realized by electroplating. That is, the insulating layer, each attachment, and the like of the present disclosure may have a multi-layer structure, and may be used to achieve electrical communication between different electrodes. Similarly, the attachment on the metal electrode may have a multi-layer structure, and further, the metal electrode and the insulating layer may overlap and be spaced to form a multi-layer structure, such as an insulating layer on which the metal electrode is disposed, and an insulating layer on which the metal electrode is disposed, or: a metal electrode, an insulating layer on the metal electrode, and a metal electrode on the insulating layer.
It should be noted that, for the various embodiments described above, when the carrier sheet is peeled off from the metal electrode or the insulating layer or the attachment or some kind of package, an adhesive transfer may be used to transfer the metal electrode or the insulating layer or the attachment or some kind of package onto the transfer, and for example, the bonding and the transfer may be implemented as follows: (1) using a pressure sensitive adhesive of sufficient viscosity; (2) using UV viscosity-reducing adhesive with enough viscosity, and irradiating UV light after the transfer is completed to reduce the viscosity of the UV adhesive; (3) heating, bonding and transferring by using a hot melt adhesive, wherein the hot melt adhesive is not sticky at normal temperature after the transfer is finished; (4) and (4) adhering and transferring by using a thermosetting hot melt adhesive, and heating and curing the hot melt adhesive after the transfer is finished.
Together with all the electrodes described above, the present disclosure allows to effectively control the equal layer thickness of each electrode layer, thereby saving the metal required for electroplating considerably compared to the prior art, especially in high frequency application scenarios. In addition, the carrier sheet of the present disclosure does not require a thicker copper layer for support, and also significantly saves metal.
The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and general changes and substitutions by those skilled in the art within the technical scope of the present disclosure should be included in the protection scope of the present disclosure.
Claims (10)
1. A method for forming a metal electrode in a packaging process comprises the following steps:
s100: selecting a carrier as a package carrier for carrying a package, wherein the carrier can be peeled off from the package and reused in the package carrier;
s200: processing the carrier sheet to enable a part of area of the carrier sheet to form a first area where a medium thinner than the carrier sheet is attached and at least another part of area of the carrier sheet to be electroplated to form a second area where a metal electrode is attached; when the bearing sheet is stripped relative to the packaging body, the metal electrode belongs to the packaging body; the medium includes any one of: release film, transition coating, or other medium capable of forming weak bonding force with the packaging body or the bearing sheet;
the media is thinner than the carrier sheet, and needs to form a weak bonding force with the package or the carrier sheet to facilitate the peeling of the carrier sheet relative to the package.
2. The method of claim 1, wherein,
the bearing sheet is in a strip shape.
3. The method of claim 1, wherein:
the long direction of the bearing sheet is in a closed loop mode.
4. The method of claim 1, wherein:
the carrier sheet comprises any one of the following components: stainless steel with low thermal expansion coefficient, or other metals with thermal expansion coefficient matched with the plastic package resin.
5. The method of claim 1, wherein after step S200, further comprising the steps of:
s300: attaching an insulating layer to the medium in the first region; and when the bearing sheet is stripped relative to the packaging body, the insulating layer is attached to the packaging body.
6. The method of claim 1, wherein after step S200, further comprising the steps of:
s400: selecting a third area between different metal electrodes in the second area as a bridging part, and attaching an insulating base film at the bridging part;
s500: and attaching conductive paste to the insulating base film.
7. The method of claim 1, wherein:
the metal electrode can be attached with a first attachment, and when the bearing sheet is peeled relative to the packaging body, the first attachment belongs to the packaging body.
8. The method of claim 5, wherein:
and a second attachment can be attached to the insulating layer, and when the carrier sheet is peeled off relative to the packaging body, the second attachment belongs to the packaging body.
9. The method of claim 7 or 8, wherein:
the attachment has a multi-layer structure.
10. The method of claim 1, wherein:
the carrier sheet is peeled off using an adhesive transfer.
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| CN201811256541 | 2018-10-26 | ||
| CN2018112565415 | 2018-10-26 |
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| CN102386104A (en) * | 2010-09-01 | 2012-03-21 | 群成科技股份有限公司 | Quad flat non-leaded package method |
| CN102386107A (en) * | 2010-09-01 | 2012-03-21 | 群成科技股份有限公司 | Quad flat non-leaded package method and structure manufactured by same |
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