CN110265539A - A kind of corronil film thermocouple and preparation method thereof - Google Patents
A kind of corronil film thermocouple and preparation method thereof Download PDFInfo
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- CN110265539A CN110265539A CN201910453155.3A CN201910453155A CN110265539A CN 110265539 A CN110265539 A CN 110265539A CN 201910453155 A CN201910453155 A CN 201910453155A CN 110265539 A CN110265539 A CN 110265539A
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- 238000002360 preparation method Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000010408 film Substances 0.000 claims abstract description 39
- 238000012545 processing Methods 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000010409 thin film Substances 0.000 claims abstract description 8
- 238000003672 processing method Methods 0.000 claims abstract description 5
- 238000009413 insulation Methods 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 9
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 206010037660 Pyrexia Diseases 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 10
- 238000009529 body temperature measurement Methods 0.000 description 9
- 239000012528 membrane Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000010956 nickel silver Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000007170 pathology Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
- H10N19/101—Multiple thermocouples connected in a cascade arrangement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention provides a kind of processing methods of corronil film thermocouple.The present invention carries out corronil filming processing on special insulation substrate, the metal module thermocouple for measuring temperature that single corronil-copper is connected is processed into continuous thin film, and carry out multilayer build-up according to actual needs.Under same temperature measuring condition, potential difference will be measured and amplified at double, the result for precisely detecting slight temperature difference may be implemented.The present invention also interconnects the insulating substrate multilayer for modifying film thermocouple, realizes multiple thermocouple series connection, realizes small temperature difference detection, can be used for requiring more highly sensitive temperature difference detection.
Description
Technical field
The invention belongs to field of semiconductor devices, it is related to a kind of processing method of corronil film thermocouple, and should
Application of the film thermocouple in precise temperature measurement field.
Background technique
It is all not to the monitoring of temperature, adjustment and control in multiple fields such as industrial production, aerospace, electric heating instruments
It can or lack, wherein usually carrying out temperature detection using pyroelectric phenomena.Under normal conditions, temperature measurement can be used and measured matter
The direct way of contact cordless can be used to carry out temperature measurement in the case where being difficult to obtain or inconvenience obtains.Thermocouple
It is the main means of contact type temperature measuring because of the advantages that temperature detection range is wide, fast response time, high cost performance.
It is had the following advantages using thermocouple temperature measurement:
(1) thermometric accuracy is higher.The work grade error range of common k type thermocouple is in ± 0.4%t or so, II grades of mistakes
Poor range is in ± 0.75%t.
(2) structure is relatively easy.Constituent element includes electrode, connecting terminal, insulator, sheath etc..
(3) rapid dynamic response speed.Excessive thermal inertia is not likely to produce during thermometric.
(4) signal can transmit at a distance.Extensively with DCS system fit applications, it is convenient for centralized detecting and automatic control.
It (5) can local thermometric.Suitable for delicate elements thermometric.
Detection characteristic using the thermocouple of different metal material is also different, it is contemplated that thermocouple element uses extensive
Property, it needs to consider thermocouple material from many aspects such as cost, performances.
Copper-corronil thermocouple can be applied at low temperature, and temperature measurement range is -250~300 DEG C, have preferable
Stability and sensitivity, and low in cost, high mechanical strength, resistance to pressure is good, can be processed to elongate in the present case
It is widely used in the fields such as industry.The description of its key property can see the table below:
In thermocouple practical application, because need to prevent circuit from thering is super-high-current to pass through, lead to other pyroelectric effects or heat
Galvanic couple element and its conducting wire IR decline, the input impedance of voltage measurement element is than thermocouple element and its resistance of extended line
Greatly.Therefore the voltage that metallic thermocouple element generates is not high, and generally 10~80uV/ DEG C, this requires measurement thermocouple outputs
Element to have sufficiently high resolution ratio.
The thermo-electromotive force as caused by thermocouple only has millivolt level, and small voltage need to be capable of measuring by corresponding to measuring cell
And small voltage change is differentiated, for temp measuring system or corresponding temperature control system, as can more accurate resolution is small
The change of voltage, it will be able to the precise degrees of testing result be substantially improved.
For the thermocouple application scenarios for needing to detect small temperature difference, a kind of heat that can precisely detect the subtle temperature difference
Galvanic couple element is necessary.Such as in aerospace field, the thermocouple temperature measurement element of aircraft utilization, by temperature difference and variation
Distinguish aircraft altitude and barometric information；It is thin by biology such as the thermocouple temperature measurement element that temperature check field, detection sensor use
Micro- Temperature changing carries out pathology judgement or data collection；Such as high thermal conductivity instrument, need accurate temperature variation data as experiment
Data etc..
In conclusion this field need it is a kind of can accurately detect the subtle temperature difference and it is at low cost, can volume production thermocouple.
Summary of the invention
The object of the present invention is to provide a kind of highly sensitive corronil film thermocouples that can be used for measuring small temperature difference.
The basic principle of thermocouple temperature measurement is that two different metallic conductors are connected and are formed into a loop according to pyroelectric effect,
When both ends are there are that when temperature gradient, can generate electromotive force, and then formation electric current in circuit, i.e., there are electronic at thermocouple temperature measurement both ends
Gesture --- thermo-electromotive force, that is, Bei Saike effect.
Two kinds of metallic conductors of A, B of unlike material are joined end to end to form closed circuit, such as two tie point (T1, T2) no
Together, then thermoelectrical potential E (t is generated in the loop1, t2), form thermocurrent.
At the node of two kinds of metals, due to electrons spread result and generate contact potential difference, hot end and；Enable end
Total contact potential difference are as follows:
Same conductor both ends temperature difference generates potential difference, and in Thermocouple Circuit, two kinds of total Thomsons of metal are electronic
Gesture are as follows:
The electromotive force that thermocouple generates is made of the total contact potential and total Thomson potential of two kinds of conductors, it may be assumed that
To sum up, after the material of composition thermocouple determines, the relationship of electromotive force and the temperature difference can behave as following form:
EAB=C (t2-t1)+d(t2-t1)2
Wherein, t2It is hot-side temperature, i1It is cold junction temperature, and C and d are galvanic couple constants, size depends on thermocouple material
Material.When rough measure, first approximation can use:
EAB=C (t2-t1)
Wherein, C is thermoelectric coefficient (galvanic couple constant), only related with the composition property of two kinds of metals of thermocouple, in number
Being equal to generated thermoelectromotive force, unit when the two contact point temperature difference are 1 DEG C in value is mV/ DEG C.
The towering series connection of N group thermocouple list can be measured thermoelectromotive force in the identical temperature difference by this patent are as follows:
E′AB=C (t2-t1)·N
It can be seen that single thermocouple unit, because Δ t is too small, leads to E when measuring small temperature differenceABNumerical value is also too small,
It easily leads to error or influences device sensitivity；This patent modifies the series connection of thermocouple unit on the same substrate, and can realize more
Laminar substrate interconnection, single number of tuples is bigger, can obtain E 'ABAlso bigger, the electromotive force under small temperature difference can be clearly measured, to measure
Corresponding temperature difference value guarantees device sensitivity.
The copper that this patent uses-corronil thermocouple, temperature is every to change 10 DEG C, and thermoelectromotive force about changes 40 μ V, makes
Electromotive force can be changed from μ V and be promoted to mV at double by the filming serial connection technology provided with this patent, can be by thermocouple spirit
Sensitivity is promoted at double.
Another object of the present invention is to provide a kind of processing methods of corronil film thermocouple.
The preparation method of corronil film thermocouple of the invention is taken, and the technical scheme comprises the following steps:
(1) in substrate surface magnetron sputtering corronil；
(2) circuit etching is processed in substrate surface；
(3) in substrate surface selectively covering ink, expose selected corronil region；
(4) the corronil region electro-coppering exposed in substrate surface；
(5) removal ink processing is carried out to substrate, obtains the concatenated corronil film thermocouple of multiple thermocouple units.
PET, Pl, PTFE, ceramics can be used to be used as substrate for substrate in the present invention, and substrate has insulation attribute.
Solder mask can be used in ink in the present invention.
In step (1) of the present invention, incited somebody to action in substrate surface magnetron sputtering corronil using DPC ceramic membrane circuit technology
Substrate does pretreatment cleaning, is incorporated into corronil in sputter on substrate in the way of film specialized fabrication technology-vacuum coating
Layer.
In step (1) of the present invention, the atomic fraction of nickel element is 10~90, preferably 44 in the copper-nickel alloy.
In step (2) of the present invention, circuit etching is processed in substrate surface, using exposure, development, etches, go membrane process complete
It is made at graphical route.
In step (4) of the present invention, the copper facing is using plating, Brush Plating mode copper facing.
In step (5) of the present invention, the removal ink processing is the ink removed on substrate using chemical corrosion method, used
Corrosive liquid is lye, preferably potassium hydroxide.
The beneficial effects of the present invention are:
(1) film thermocouple is compared with conventional thermocouple, and it is excellent to have that time constant is small, reaction speed is fast, thermal capacity is small etc.
Point can more rapidly and accurately measure fine temperature variation all the time.
(2) it is designed using film serialization, realizes multiple thermocouple unit series connection, it is sensitive that temperature detection greatly improved
Degree.
(3) the film processed thermocouple on insulating substrate, at low cost, easy volume production reduces thermoelectricity, it can be achieved that multilayer interconnection
The volume of even element is further simplified its structure, can be used for accurate device.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure does simple introduction, it should be understood that the following drawings illustrates only the section Example scheme of this patent, therefore is not construed as
Restriction to range for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other relevant drawings.
Fig. 1 is conventional thermocouples；
Fig. 2 is to remove the cupro-nickel outside line range in substrate surface magnetron sputtering corronil, and circuit etching and close
Gold；
Fig. 3 is to expose selected corronil region in substrate surface selectively covering ink；
Fig. 4 is the corronil region electro-coppering exposed in substrate surface；
Fig. 5 is to carry out removal ink processing to substrate, obtains corronil film thermocouple.
Specific embodiment
For a better understanding of the present invention, below with reference to the embodiment content that the present invention is furture elucidated, but it is of the invention
Content is not limited solely to the following examples.The present invention can have various embodiments, and can adjust and change wherein
Become.It should be understood, however, that: there is no the intentions that the various embodiments by this patent are limited to specific embodiment disclosed herein, but
This patent should be interpreted as covering all adjustment in the spirit and scope for the various embodiments for falling into this patent, equivalent and/
Or optinal plan.
A kind of processing method of corronil film thermocouple, comprising the following steps:
(1) in substrate surface magnetron sputtering corronil；
(2) circuit etching is processed in substrate surface；
(3) in substrate surface selectively covering ink, expose selected corronil region；
(4) the corronil region electro-coppering exposed in substrate surface；
(5) removal ink processing is carried out to substrate, obtains the concatenated corronil film thermocouple of multiple thermocouple units.
Preferably, in step (1), the substrate material is selected: PET, PI, PTFE, ceramics etc..
Preferably, in step (1), the atomic fraction of nickel element is 10~90 in the copper-nickel alloy；It is further preferred that
The atomic fraction of nickel element is 44 in the copper-nickel alloy.
Preferably, in step (3), the ink material selection solder mask.
Preferably, in step (4), the copper facing is using plating, Brush Plating mode copper facing；It is further preferred that described
Copper facing uses plating mode.
In step (5), the removal ink processing is using the ink on chemical corrosion method removal substrate, corrosive liquid used
For lye.
Preferably, the lye is potassium hydroxide.
The contents of the present invention are described in further detail below by way of specific embodiment.
Embodiment 1
The processing of Airplane detection thermocouple:
As shown in Fig. 2~Fig. 5, corronil-Copper thin film thermocouple preparation process are as follows:
(1) in ceramic base plate surface magnetron sputtering corronil (CuNi44), using DPC ceramic membrane circuit technology, by base
Plate does pretreatment cleaning, is incorporated into albata layer in sputter on substrate in the way of film specialized fabrication technology-vacuum coating；
(2) circuit etching is processed in ceramic base plate surface, using exposure, development, etches, membrane process is gone to complete graphical line
Road production；
(3) in ceramic base plate surface selectively covering solder mask, expose selected corronil region；
(4) the corronil region electro-coppering exposed in ceramic base plate surface；
(5) removal ink processing is carried out to ceramic substrate using potassium hydroxide solution, obtains multiple thermocouple unit series connection
Corronil film thermocouple.
Embodiment 2
The processing of human skin simulation thermocouple:
As shown in Fig. 2~Fig. 5, corronil-Copper thin film thermocouple preparation process are as follows:
(1) in flexible PI substrate surface magnetron sputtering corronil (CuNi44), using DPC thin film circuit technique, by substrate
Pretreatment cleaning is done, is incorporated into albata layer in sputter on substrate in the way of film specialized fabrication technology-vacuum coating；
(2) process circuit etching in flexible PI substrate surface, using exposure, development, etch, to go membrane process to complete graphical
Route production；
(3) in flexible PI substrate surface selectively covering solder mask, expose selected corronil region；
(4) the corronil region electro-coppering exposed in flexible PI substrate surface；
(5) removal ink processing is carried out to flexible PI substrate using potassium hydroxide solution, obtains multiple thermocouple unit strings
The corronil film thermocouple of connection.
Embodiment 3
The processing of differential thermal analyzer DSC thermocouple:
As shown in Fig. 2~Fig. 5, corronil-Copper thin film thermocouple preparation process are as follows:
(1) in ceramic base plate surface magnetron sputtering corronil (CuNi44), using DPC ceramic membrane circuit technology, by base
Plate does pretreatment cleaning, is incorporated into albata layer in sputter on substrate in the way of film specialized fabrication technology-vacuum coating；
(2) circuit etching is processed in ceramic base plate surface, using exposure, development, etches, membrane process is gone to complete graphical line
Road production；
(3) in ceramic base plate surface selectively covering solder mask, expose selected corronil region；
(4) the corronil region electro-coppering exposed in ceramic base plate surface；
(5) removal ink processing is carried out to ceramic substrate using potassium hydroxide solution, obtains multiple thermocouple unit series connection
Corronil film thermocouple.
(6) the monolithic corronil film thermocouple substrate processed is connected using lead, obtains the thin of multilayer build-up
Film thermocouple element.
Embodiment 4
The thermal conductivity instrument detection processing of multilayer build-up thermocouple:
As shown in Fig. 2~Fig. 5, corronil-Copper thin film thermocouple preparation process are as follows:
(1) in PI substrate surface magnetron sputtering corronil (CuNi44), using DPC thin film circuit technique, before substrate is done
Processing cleaning, is incorporated into albata layer in sputter on substrate in the way of film specialized fabrication technology-vacuum coating；
(2) circuit etching is processed in PI substrate surface, using exposure, development, etches, membrane process is gone to complete graphical route
Production；(3) in PI substrate surface selectively covering solder mask, expose selected corronil region；
(4) the corronil region electro-coppering exposed in PI substrate surface；
(5) removal ink processing is carried out to PI substrate using potassium hydroxide solution, it is concatenated obtains multiple thermocouple units
Corronil film thermocouple.
(6) the monolithic corronil film thermocouple substrate processed is connected using lead, obtains the thin of multilayer build-up
Film thermocouple element.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the embodiments can also be by appropriately combined, formation those skilled in the art
The other embodiments that member is understood that.The technical detail being not described in detail in the present invention can pass through appointing in this field
One prior art is realized.Particularly, all technical characterstics being not described in detail can pass through any prior art reality in the present invention
It is existing.
Claims (8)
1. a kind of corronil film thermocouple, which is characterized in that the copper-nickel alloy firm thermocouple is arranged in special insulation
Substrate surface is composed in series by single film thermocouple unit, and it is corronil that temperature end, which connects bright spot, and low-temperature end connects bright spot
For copper.
2. corronil film thermocouple according to claim 1, which is characterized in that the single film thermocouple unit
It is connected to form by corronil and Copper thin film.
3. corronil film thermocouple according to claim 1, which is characterized in that nickel element in the copper-nickel alloy
Atomic fraction is 10~90.
4. corronil film thermocouple according to claim 3, which is characterized in that nickel element in the copper-nickel alloy
Atomic fraction preferably 44.
5. corronil film thermocouple according to claim 1, which is characterized in that the special insulation substrate be PET,
At least one of PI, PTFE, ceramics.
6. a kind of method for preparing Claims 1 to 5 the copper-nickel alloy firm thermocouple, which is characterized in that including following step
It is rapid:
(1) in substrate surface magnetron sputtering corronil；
(2) circuit etching is processed in substrate surface；
(3) in substrate surface selectively covering ink, expose selected corronil region；
(4) the corronil region electro-coppering exposed in substrate surface；
(5) removal ink processing is carried out to substrate, obtains the concatenated corronil film thermocouple of multiple thermocouple units.
7. the preparation method of corronil film thermocouple according to claim 6, it is characterised in that: the step (2)
In line pattern processing method be at least one of photoresist, dry film, photosensitive-ink.
8. the preparation method of corronil film thermocouple according to claim 6, it is characterised in that: the step (3)
In the ink used be preferably solder mask.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111595477A (en) * | 2020-05-28 | 2020-08-28 | 南昌欧菲显示科技有限公司 | Film type thermocouple, temperature sensor and intelligent wearable device |
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| US20080163916A1 (en) * | 2006-10-25 | 2008-07-10 | Kabushiki Kaisha Toshiba | Thermoelectric conversion module and thermoelectric conversion apparatus |
| CN101217176A (en) * | 2007-12-27 | 2008-07-09 | 江门金谷电子工业有限公司 | Temperature difference power-generating device |
| JP2014077783A (en) * | 2012-09-18 | 2014-05-01 | Ricoh Co Ltd | Thermocouple, thermopile, infrared sensor and method of producing infrared sensor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111595477A (en) * | 2020-05-28 | 2020-08-28 | 南昌欧菲显示科技有限公司 | Film type thermocouple, temperature sensor and intelligent wearable device |
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