CN110191798A - Composite board method for processing blind hole, composite board and shell - Google Patents
Composite board method for processing blind hole, composite board and shell Download PDFInfo
- Publication number
- CN110191798A CN110191798A CN201780084025.6A CN201780084025A CN110191798A CN 110191798 A CN110191798 A CN 110191798A CN 201780084025 A CN201780084025 A CN 201780084025A CN 110191798 A CN110191798 A CN 110191798A
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- substrate
- hole
- composite board
- blind hole
- processing
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- 239000002131 composite material Substances 0.000 title claims abstract description 79
- 238000012545 processing Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 238000004080 punching Methods 0.000 claims abstract description 29
- 238000005096 rolling process Methods 0.000 claims description 23
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000012790 confirmation Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000004880 explosion Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 206010054949 Metaplasia Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
Landscapes
- Punching Or Piercing (AREA)
- Laminated Bodies (AREA)
Abstract
A kind of composite board method for processing blind hole, the composite board include first substrate (10) and the second substrate (12), which comprises punching is on first substrate (10) to form through-hole (11)；The first substrate (10) for forming through-hole (11) is bonded with the second substrate (12) to form the composite board with blind hole.This method can be realized quick blind hole machining, while reduce the processing cutting output of subsequent numerically-controlled machine tool, can be realized for the high-efficiency and low-cost requirement produced in enormous quantities.
Description
The present invention relates to plate manufacturing technology field more particularly to a kind of composite board method for processing blind hole, composite board and shell.
Composite board is a kind of novel material with superperformance, can realize the function that homogenous material cannot achieve in conjunction with the advantages of different materials.By taking stainless steel/aluminum alloy composite board as an example, stainless steel material has the advantages that high intensity, the advantages of aluminium alloy has the advantages that thermal conductivity carefully, and two kinds of plate combinations can obtain combined high-strength and thermal conductive resin, has more application scenarios relative to homogenous material.
Numerically-controlled machine tool (CNC) is mainly used to be processed for the processing of composite board blind hole at present, time-consuming for processing, and processing cost is high, fails to make full use of the advantage in the production in the early stage of composite board.Especially for the production of lot-size metaplasia, blind hole machining is carried out to composite board using CNC, cutting output is big, time-consuming etc. causes processing cost height for processing.
Summary of the invention
The embodiment of the present invention provides a kind of composite board method for processing blind hole, solves the high technical problem of the processing cost of existing composite board blind hole.
A kind of composite board method for processing blind hole, the composite board includes first substrate and the second substrate, which comprises punching is on the first substrate to form through-hole；The first substrate for forming through-hole is bonded with the second substrate to form the composite board with blind hole.
Wherein, the punching on the first substrate forms the step of through-hole and includes,
First time punching is carried out to form precompressed through-hole to first substrate, and obtains and forms the blanking after precompressed through-hole；
The precompressed through-hole of the first substrate is punched out to form the through-hole, the aperture of the through-hole is greater than the aperture of the precompressed through-hole；
The blanking is put into and is fixed in the through-hole.
Wherein, described be bonded the first substrate for forming through-hole with the second substrate to form the composite board step with blind hole includes removing the blanking of the through-hole, is rolled to the first substrate for removing the blanking with the second substrate.
Wherein, it is fixed between the blanking and the through-hole by antitack agent.
Wherein, described be bonded the first substrate for forming through-hole with the second substrate to form the laminating type of the composite board with blind hole includes rolling, explosion method or welding.
Wherein, the first substrate and the second substrate are made of metal material, and the hardness of the first substrate is less than the hardness of the second substrate.
Wherein, the first substrate is aluminium alloy layer；The second substrate is stainless steel layer.
Wherein, further include the steps that the composite board progress CNC milling machine processing to being formed with blind hole.
Wherein, further include the steps that carrying out the composite board after progress CNC milling machine processing surface treatment and residue cleaning.
Wherein, before punching is on the first substrate to form through-hole for step, further include the steps that the size of the through-hole obtained to the blind hole size and punching that form the composite board with blind hole carries out size relationship confirmation.
Composite board described herein, including first substrate and the second substrate being bonded with first substrate and the blind hole set on first substrate formed by the composite board method for processing blind hole.
Shell described herein is made of the composite board with blind hole.
Composite board blind hole machining side described herein carries out roughing to plate by hole-punching method and is rolling at through-hole, it can be realized quick blind hole machining, the processing cutting output for reducing subsequent numerically-controlled machine tool simultaneously can be realized for the high-efficiency and low-cost requirement produced in enormous quantities.
To describe the technical solutions in the embodiments of the present invention more clearly, the drawings to be used in the embodiments are briefly described below, apparently, drawings in the following description are only some embodiments of the invention, for those of ordinary skill in the art, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic diagram of the process of composite board method for processing blind hole of the invention, and which includes processing substrate and equipment.
Fig. 2 is composite board method for processing blind hole flow chart shown in FIG. 1.
Fig. 3 is the flow chart of the further method of composite board method for processing blind hole shown in Fig. 2.
Fig. 4 is the schematic diagram of the process of the further method of composite board method for processing blind hole shown in Fig. 3, and which includes processing substrate and equipment.
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is clearly and completely described.
The present invention provides a kind of composite board method for processing blind hole and composite board, the application of composite board method for processing blind hole in mobile phone composite board rear shell, the blind hole machining of computer composite board shell and other composite boards.The production in shells such as mobile phone, computers of the composite board application.
Referring to Fig. 1, composite board described in the present embodiment includes first substrate 10 and the second substrate 12, the first substrate 10 is made with the second substrate 12 of metal material, and the hardness of the first substrate 10 is less than the hardness of the second substrate 11.Because the low sheet fabrication through-hole of hardness is easier, efficiency is more preferable, and sheet fabrication through-hole with high hardness is high to the hardness requirement of cutter, and processing efficiency is low.Specifically, the first substrate 10 is aluminium alloy；The second substrate 12 is stainless steel.
Referring to Figure 2 together, the composite board method for processing blind hole includes:
Step S1, punching is on first substrate 10 to form through-hole 11.Through-hole 11 in this step is processed to be formed using punching apparatus.
The first substrate 10 for forming through-hole 11 is bonded with the second substrate 12 to form the composite board with blind hole 13 by step S2.
Specifically, described be bonded the first substrate 10 for forming through-hole 11 with the second substrate 12 to form the laminating type of the composite board with blind hole 13 includes rolling, explosion method or welding.In the present embodiment by taking rolling as an example, as shown in Figure 1.It will be punched out for first substrate 10 made of aluminium alloy；The size of through-hole is set according to the size relationship of the through-hole formed after deforming after preset blind hole size and rolling.Then by the first substrate 10 for being formed with through-hole 11 and rolling equipment 50 is put into for the second substrate 12 made of stainless steel being rolled by roller 51, first substrate 10 and the second substrate 12 exist
Deform extension on 51 rotating direction of roller of rolling equipment, and one end of the through-hole is closed by the second substrate 12 and forms blind hole 13, and the composite board 100 after rolling has blind hole 13, and diameter of blind hole is greater than the diameter of the through-hole.
After above-mentioned steps, further include the steps that accurately processing blind hole to the progress of composite board 100 CNC milling machine (CNC) processing with blind hole 13 is formed.
Further include the steps that carrying out the composite board 100 after progress CNC milling machine processing surface treatment and residue cleaning.Certainly, the step of (CNC) processing, surface treatment and residue are cleared up is depending on working environment, if control and operation and environment are very reliable in the operation of rolling, it is convenient to omit these steps.The process that this method is related to mainly includes the design of punching plates, the punching processing to plate, the finishing with porose composite board rolling and composite board blind hole.The equipment being related to has punching apparatus, rolling equipment and CNC process equipment.
Before step S1 progress, further include the steps that the size of the through-hole obtained to the blind hole size and punching that form the composite board with blind hole carries out size relationship confirmation.Specifically, composite board is experimentally rolled, the composite board with blind hole is formed again by above-mentioned steps S1 and step S2, in forming process, the clear size of opening of first substrate is with default blind hole size according to the mobility of plate, the deformation etc. of deflection, thickness, hole is estimated, then punching again.In next step, the size for the through-hole that the blind hole size of the composite board for being equipped with blind hole and step S1 are obtained by punching is subjected to size relationship confirmation, the size of the preset blind hole close to needs of blind hole to a greater extent after can rolling in this way.
Composite board blind hole machining side described herein carries out roughing to plate by hole-punching method and is rolling at through-hole, finishing is realized by the CNC of selectivity afterwards, scheme realizes the roughing and finishing of blind hole using CNC compared to the prior art, punching processing is more efficient compared to CNC roughing, it can be realized quick blind hole machining, reduce the processing cutting output of subsequent numerically-controlled machine tool simultaneously, cost is lower, can be realized for the high-efficiency and low-cost requirement produced in enormous quantities.
As shown in figure 3, further, the composite board method for processing blind hole step S1 further include:
Step S11 carries out first time punching to first substrate 10 to form precompressed through-hole 101, and obtains and form the blanking 102 after precompressed through-hole 101；
Step S12 is punched out the precompressed through-hole 101 of the first substrate 10 to form the through-hole 11, and the aperture of the through-hole 11 is greater than the aperture of the precompressed through-hole 101；
The blanking 102 is put into and is fixed in the through-hole 11 by step S13.
Step S2 includes step S14, and the blanking of the through-hole is removed, and is rolled to the first substrate for removing the blanking with the second substrate.In this method, by the blanking of through-hole interior installing hole before rolling, it is capable of the precision of limited hole rolling deformation, blind hole shape is accurately controlled, further promotes subsequent fine machining accuracy.
As shown in Figure 4.First time punching will be carried out for first substrate 10 made of aluminium alloy；To form precompressed through-hole 101, the size of the through-hole that precompressed through-hole 101 obtains as needed is set, and the size of through-hole is set according to the size relationship of the through-hole formed after deforming after preset blind hole size and rolling.Then the precompressed through-hole 101 of the first substrate 10 is punched out and extends out the size of precompressed through-hole 101 and forms the through-hole 11, facilitate and the blanking 102 that first time punching obtains is placed back in into punching position, i.e., be put into the blanking 102 and be fixed in the through-hole 11.
By the first substrate 10 for being fixed with blanking 102 and rolling equipment is put into for the second substrate 12 made of stainless steel rolls, first substrate 10, blanking 102 and through-hole 11 deform on rolling rotating direction with the second substrate 12, and the composite board with blanking 102 is formed, then blanking 102 is removed.Wherein, it is fixed between the blanking 102 and the through-hole 11 by antitack agent.That is, the blanking 102 of the through-hole 11 is removed, rolling is carried out to the first substrate 10 and the second substrate 12 that remove the blanking and forms the composite board with blind hole.Postprocessing working procedures are finally carried out, post-processing can
To process, be surface-treated comprising CNC, residue cleaning etc., optionally carry out.Certainly, the step of (CNC) processing, surface treatment and residue are cleared up is depending on working environment, if control and operation and environment are very reliable in the operation of rolling, it is convenient to omit these steps.The process that this method is related to mainly includes the design of punching plates, the punching processing to plate, the finishing with porose composite board rolling and composite board blind hole.The equipment being related to has punching apparatus, rolling equipment and CNC process equipment.
The application also provides a kind of shell, and shell is made of the composite board with blind hole；The shell is the shells such as mobile phone, computer.And large area blind hole is primarily to processing battery compartment region, avoids milling battery compartment bring increased costs in mobile phone battery cover.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art, various improvements and modifications may be made without departing from the principle of the present invention, and these modifications and embellishments are also considered to be within the scope of the present invention.
Claims (12)
- A kind of composite board method for processing blind hole, the composite board include first substrate and the second substrate, which is characterized in that the described method includes: punching is on the first substrate to form through-hole；The first substrate for forming through-hole is bonded with the second substrate to form the composite board with blind hole.
- Composite board method for processing blind hole as described in claim 1, which is characterized in that the punching on the first substrate forms the step of through-hole and includes,First time punching is carried out to form precompressed through-hole to first substrate, and obtains and forms the blanking after precompressed through-hole；The precompressed through-hole of the first substrate is punched out to form the through-hole, the aperture of the through-hole is greater than the aperture of the precompressed through-hole；The blanking is put into and is fixed in the through-hole.
- Composite board method for processing blind hole as claimed in claim 2, it is characterized in that, it is described to be bonded the first substrate for forming through-hole with the second substrate to form the composite board step with blind hole and include, the blanking of the through-hole is removed, the first substrate for removing the blanking is rolled with the second substrate.
- Composite board method for processing blind hole as claimed in claim 3, which is characterized in that fixed between the blanking and the through-hole by antitack agent.
- Composite board method for processing blind hole as claimed in claim 3, which is characterized in that described be bonded the first substrate for forming through-hole with the second substrate to form the laminating type of the composite board with blind hole includes rolling, explosion method or welding.
- Composite board method for processing blind hole as described in any one in claim 1-5, which is characterized in that the first substrate and the second substrate are made of metal material, and the hardness of the first substrate is less than the hardness of the second substrate.
- Composite board method for processing blind hole as claimed in claim 6, which is characterized in that the first substrate is aluminium alloy layer；The second substrate is stainless steel layer.
- Composite board method for processing blind hole as described in any one in claim 1-5, which is characterized in that further include the steps that the composite board progress CNC milling machine processing to being formed with blind hole.
- Composite board method for processing blind hole as claimed in claim 8, which is characterized in that further include the steps that carrying out the composite board after progress CNC milling machine processing surface treatment and residue cleaning.
- Composite board method for processing blind hole as described in claim 1, it is characterized in that, before punching is on the first substrate to form through-hole for step, further include the steps that the size of the through-hole obtained to the blind hole size and punching that form the composite board with blind hole carries out size relationship confirmation.
- A kind of composite board, which is characterized in that including first substrate and the second substrate being bonded with first substrate and the blind hole set on first substrate formed by composite board method for processing blind hole described in claim 1-10.
- A kind of shell, which is characterized in that be made of the composite board with blind hole described in claim 11.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710061367 | 2017-01-25 | ||
| CN2017100613678 | 2017-01-25 | ||
| PCT/CN2017/084946 WO2018137297A1 (en) | 2017-01-25 | 2017-05-18 | Method for machining blind hole for composite plate, composite plate, and housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110191798A true CN110191798A (en) | 2019-08-30 |
Family
ID=62977904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780084025.6A Pending CN110191798A (en) | 2017-01-25 | 2017-05-18 | Composite board method for processing blind hole, composite board and shell |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110191798A (en) |
| WO (1) | WO2018137297A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114249600A (en) * | 2021-12-29 | 2022-03-29 | 中国航空制造技术研究院 | Ceramic matrix composite blind hole structure forming method |
| CN114476369A (en) * | 2022-03-01 | 2022-05-13 | 联宝(合肥)电子科技有限公司 | Composite board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1116558A (en) * | 1997-06-24 | 1999-01-22 | Daido Steel Co Ltd | Clad plate and manufacture thereof |
| CN1211344A (en) * | 1996-02-15 | 1999-03-17 | 东洋钢钣株式会社 | Cladding material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269863A (en) * | 2015-05-18 | 2017-01-04 | 刘君才 | A kind of roll blind hole cellular board and the method doing composite honeycomb board with it |
| CN205255628U (en) * | 2015-11-20 | 2016-05-25 | 上海华源复合新材料有限公司 | Three -dimensional composite sheet of aluminium |
| CN105563934B (en) * | 2015-12-28 | 2018-08-28 | 安泰天龙（天津）钨钼科技有限公司 | Multilayer S-CMC materials with holes and preparation method thereof |
-
2017
- 2017-05-18 CN CN201780084025.6A patent/CN110191798A/en active Pending
- 2017-05-18 WO PCT/CN2017/084946 patent/WO2018137297A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1211344A (en) * | 1996-02-15 | 1999-03-17 | 东洋钢钣株式会社 | Cladding material |
| JPH1116558A (en) * | 1997-06-24 | 1999-01-22 | Daido Steel Co Ltd | Clad plate and manufacture thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114249600A (en) * | 2021-12-29 | 2022-03-29 | 中国航空制造技术研究院 | Ceramic matrix composite blind hole structure forming method |
| CN114476369A (en) * | 2022-03-01 | 2022-05-13 | 联宝(合肥)电子科技有限公司 | Composite board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018137297A1 (en) | 2018-08-02 |
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Effective date of registration: 20210426 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Applicant after: Honor Device Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Applicant before: HUAWEI TECHNOLOGIES Co.,Ltd. |
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Application publication date: 20190830 |