CN110190037A - Preparation method of heat sink, heat sink and mobile terminal - Google Patents

Abstract

The invention discloses a preparation method of a heat dissipation piece, the heat dissipation piece and a mobile terminal, wherein the preparation method comprises the following steps: coating a graphene composite dispersion liquid on the surface to be coated of the heat dissipation piece, wherein the graphene composite dispersion liquid comprises graphene powder, a binder and a solvent; and carrying out curing operation on the graphene composite dispersion liquid so as to form a heat dissipation coating on the heat dissipation piece. The heat dissipation coating is made of graphene composite dispersion liquid, and the adopted process is a coating process, so that even if an uneven structure exists on the surface of the heat dissipation piece, the heat dissipation coating can be fully attached to the uneven structure, the heat dissipation coating is not prone to deformation, the heat dissipation effect of the heat dissipation coating is improved, and the mobile terminal is not prone to damage due to overheating.

Description

Preparation method of heat sink, heat sink and mobile terminal

technical field

The invention relates to the technical field of product manufacturing, in particular to a method for preparing a heat sink, a heat sink and a mobile terminal.

Background technique

With the continuous development of the mobile terminal industry, ultra-thinning has become one of the development directions of the mobile terminal. The ultra-thinning of the mobile terminal means that more components must be accommodated in the small space inside the mobile terminal, and the components will generate a lot of heat when they work. If the heat cannot be dissipated in time, it will cause the mobile terminal to be easily Corruption occurs.

Taking the multiple chips integrated on the circuit board of the mobile terminal as an example, as the functions of the mobile terminal are continuously upgraded, the power of these chips is also increasing, and the heat generated is getting higher and higher. In order to prevent the chip from being damaged due to excessive temperature and improve the user's temperature experience when holding the mobile terminal, a heat dissipation structure can be added around the chip, for example, a graphite heat dissipation film can be added on the battery cover or the main upper bracket, and the graphite heat dissipation The membrane can be fixed to the battery cover or the main upper bracket by sticking.

However, since the part where the graphite heat dissipation film is installed may have an uneven structure, the graphite heat dissipation film will also be deformed at the uneven structure, resulting in the deterioration of the heat dissipation effect of the graphite heat dissipation film, causing the mobile terminal to easily appear due to overheating. damage.

Contents of the invention

The invention discloses a method for preparing a heat sink, a heat sink and a mobile terminal, so as to solve the problem that the mobile terminal is easily damaged due to overheating.

In order to solve the above problems, the present invention adopts the following technical solutions:

A method for preparing a heat sink, the method comprising:

Coating graphene composite dispersion liquid on the surface to be coated of described heat sink, described graphene composite dispersion liquid comprises graphene powder, binding agent and solvent;

A curing operation is performed on the graphene composite dispersion liquid, so that a heat dissipation coating is formed on the heat dissipation element.

A heat dissipation piece, the heat dissipation piece is prepared by the above-mentioned preparation method, the heat dissipation coating is provided on the heat dissipation piece, and the heat dissipation coating is a graphene composite formed by mixing graphene powder, a binder and a solvent The dispersion is made.

A mobile terminal, the mobile terminal includes a main board and the above-mentioned heat sink, the heat sink includes at least one of a main upper bracket, a battery cover, a shield cover on the main board, a shield cover under the main board, and a display screen, wherein the The main board is located between the battery cover and the main upper bracket, and the main board upper shielding cover and the main main board lower shielding cover are respectively arranged on two side surfaces of the main board.

The technical scheme adopted in the present invention can achieve the following beneficial effects:

The surface of the heat sink made by the preparation method disclosed in the present invention is provided with a heat dissipation coating, which is made of graphene composite dispersion. Since the adopted process is a coating process, even if there is The uneven structure can also achieve a sufficient fit between the heat dissipation coating and the uneven structure, so that the heat dissipation coating is not easy to deform, thereby improving the heat dissipation effect of the heat dissipation coating, making it difficult for the mobile terminal to be damaged due to overheating. Corruption occurs.

Description of drawings

The accompanying drawings described here are used to provide a further understanding of the present invention, and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute improper limitations to the present invention. In the attached picture:

Fig. 1 is a schematic flow diagram of the preparation method disclosed in the embodiment of the present invention;

2 is a schematic flow diagram of a preparation method disclosed in another embodiment of the present invention;

FIG. 3 is a schematic diagram of a partial structure of a mobile terminal disclosed in an embodiment of the present invention;

FIG. 4 is a schematic diagram of a partial structure of a mobile terminal disclosed in another embodiment of the present invention;

FIG. 5 is a schematic diagram of a partial structure of a mobile terminal disclosed in another embodiment of the present invention;

Fig. 6 is a schematic diagram of a partial structure of a mobile terminal disclosed in yet another embodiment of the present invention.

Explanation of reference signs:

110-Main board, 120-Main upper bracket, 130-Battery cover, 140-Mainboard upper shielding cover, 150-Mainboard lower shielding cover, 160-Chip, 170-Heat conducting part, 200-Heat dissipation coating.

Detailed ways

In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

The embodiment of the present invention discloses a method for preparing a heat sink, and the heat sink may be a part of a mobile terminal. It should be noted that, as shown in FIG. 3 , the heat sink may include at least one of the main upper bracket 120, the battery cover 130, the upper shielding cover 140 of the main board, the lower shielding cover 150 of the main board and the display screen, and the mobile terminal also includes a main board 110 , the main board 110 is located between the battery cover 130 and the main upper bracket 120 , and the main board upper shielding cover 140 and the main board lower shielding cover 150 are respectively arranged on the two side surfaces of the main board 110 . Certainly, the heat sink is not limited to the components mentioned here, and may also be other heat-generating components or components around the heat-generating components. For example, the heat sink may also include shielding covers, speakers and other components arranged on the sub-board.

As shown in Figure 1, the preparation method disclosed in the embodiment of the present invention may specifically include:

S100. Coat the graphene composite dispersion liquid on the surface to be coated of the heat sink. The graphene composite dispersion liquid includes graphene powder, a binder and a solvent.

The surface to be coated of the heat sink can be a partial surface of the heat sink, or the entire surface of the heat sink, can be a single side surface of the heat sink, or can be both sides of the heat sink. For example, when the heat sink includes the main upper bracket 120, as shown in FIG. One; when the heat sink includes the shield cover 140 on the main board, as shown in Figure 4, the surface to be coated can be the side surface of the shield cover 140 on the main board away from the main board 110; when the heat sink includes the shield cover 150 under the main board, As shown in Figure 4, the surface to be coated can be the side surface of the lower shielding cover 150 of the main board away from the main board 110; One side surface of the motherboard 110 . In a specific embodiment, the various ways described here can be freely combined to achieve better effects, for details, refer to the structure shown in FIG. 6 .

The graphene powder can be dispersed and modified so that the graphene powder can finally form a layered structure after being mixed with a binder and a solvent. The graphene composite dispersion liquid can be an ionic dispersion liquid or a non-ionic dispersion liquid. When the graphene composite dispersion liquid is an ionic dispersion liquid, the dispersant used can be sodium dodecylbenzene sulfonate (sodium dodecyl benzene sulfonate, SDBS) and sodium deoxycholate, and the corresponding solvent is an alkaline solution, For example, a mixed solution formed of potassium hydroxide + sodium nitrate + potassium permanganate. When the graphene composite dispersion liquid is a non-ionic dispersion liquid, the dispersant used can be polyvinylpyrrolidone (polyvinyl pyrrolidone, PVP), and the corresponding solvent can be a dimethylformamide solvent (N, N-Dimethylformamide, DMF ), N-methylpyrrolidone solvent (N-Methylpyrrolidone, NMP) or ethanol solvent. The solvent mentioned here can itself contain a binder to make it sticky to a certain extent. If the adhesive performance is to be improved, an additional binder can be added. Specifically, the binder may be epoxy resin, phenolic resin or the like.

S110 , performing a solidification operation on the graphene composite dispersion, so that a heat dissipation coating 200 is formed on the heat dissipation element.

That is to say, the graphene composite dispersion coated on the heat dissipation element becomes the heat dissipation coating 200 after solidification, and the heat dissipation coating 200 has excellent thermal conductivity, so its heat dissipation performance is better. Specifically, the thermal conductivity of the heat dissipation coating 200 in the horizontal direction can reach 1400-2000 W/m·K, and the thermal conductivity in the vertical direction can reach 15-20 W/m·K, which is superior to the existing graphite heat dissipation film.

When the preparation method disclosed in the present invention is adopted, a heat dissipation coating 200 is formed on the surface of the heat sink, and the heat dissipation coating 200 is made of a graphene composite dispersion. The uneven structure can also achieve sufficient bonding between the heat dissipation coating 200 and the uneven structure, so that the heat dissipation coating 200 is not easily deformed, thereby improving the heat dissipation effect of the heat dissipation coating 200, making it difficult for the mobile terminal Damage due to overheating.

At the same time, the thickness of the heat dissipation coating 200 formed in the embodiment of the present invention is thinner, and the space occupied by the heat dissipation coating 200 is smaller, so it is more conducive to the development of a thinner mobile terminal. Specifically, the heat dissipation coating 200 has a thickness of about 0.01mm, which is smaller than the existing graphite heat dissipation film. In addition, the heat dissipation coating 200 is formed on the surface of the heat dissipation element through a coating process, so the bonding force formed between the heat dissipation coating 200 and the heat dissipation element is relatively large, and the heat dissipation coating 200 is not easy to separate from the heat dissipation element, thereby preventing After the heat dissipation coating 200 is separated from the heat sink, the problem of circuit short circuit is caused; similarly, since the heat dissipation coating 200 is formed on the surface of the heat sink through the coating process, the heat dissipation coating 200 has basically no requirements for the shape and flatness of the heat sink. Therefore, the heat dissipation coating 200 can be applied to various heat dissipation elements, and its application range is wider. In addition, the cost of this heat dissipation coating 200 is relatively low.

As shown in FIG. 2, in an optional embodiment, before step S100 described above, it may also include:

S101 , performing surface treatment on the surface to be coated of the heat sink.

The purpose of the surface treatment here is to provide better conditions for the combination of the graphene composite dispersion and the heat sink, for example, the surface treatment can realize the cleaning, grinding and other treatment content of the surface to be coated. Optionally, considering that the cleanliness of the surface to be coated has a crucial impact on the combination of the graphene composite dispersion and the heat sink, this step specifically includes: using a cleaning agent to soak and clean the surface to be coated of the heat sink , the cleaning agent includes at least one of ethanol, acetone, and alkaline solution, and of course, other substances with cleaning functions may also be included. After cleaning, impurities, oil stains and other substances on the surface to be coated of the heat sink can be removed, so that the combination between the heat sink and the graphene composite dispersion is more sufficient.

In a further embodiment, as shown in FIG. 2, after step S110, it may also include:

S120 , performing purification treatment on the heat dissipation coating 200 .

The surface of the cured heat dissipation coating 200 may also be adsorbed with impurities, oil and other substances, and the heat dissipation coating 200 usually has peculiar smell, so purifying the heat dissipation coating 200 can not only clean the surface of the heat dissipation coating 200 , can also remove the peculiar smell of the heat dissipation coating 200, so that the user experience when using the mobile terminal is better.

Optionally, in order to optimize the effect of cleaning the heat dissipation coating 200, the above step S120 may specifically include: soaking and cleaning the heat dissipation coating 200 with a cleaning agent, the cleaning agent includes at least One, of course, can also include other substances that have a cleaning function. It should be noted that when cleaning the heat dissipation coating 200 , since the heat dissipation element has been integrated with the heat dissipation coating 200 , the heat dissipation element and the heat dissipation coating 200 are actually soaked and cleaned at the same time.

There are many specific ways to implement the curing operation on the graphene composite dispersion. In order to improve the curing effect, optionally, the implementation of the curing operation on the graphene composite dispersion specifically includes: implementing a curing operation on the graphene composite dispersion using a baking process . In a specific embodiment, when the heat sink and the graphene composite dispersion are baked, the baking temperature can be set at about 90° C., an inert gas protection is required during the baking process, and the baking time is set at about 24 hours. After setting in this way, the water in the graphene composite dispersion will be fully volatilized, so that the graphene composite dispersion will be more firmly solidified on the surface of the heat sink.

Based on the preparation method described in any of the above embodiments, the embodiment of the present invention also discloses a heat sink, which is prepared by using the preparation method described in any of the above embodiments. As shown in FIGS. 3-6 , the heat dissipation element is provided with a heat dissipation coating 200 , and the heat dissipation coating 200 is made of a graphene composite dispersion formed by mixing graphene powder, a binder and a solvent. With reference to the foregoing, the heat dissipation coating 200 has a better heat dissipation effect, occupies a smaller space, and has a wider application range. Therefore, after using the heat dissipation coating 200, most of the components in the mobile terminal can be used. The heat dissipation coating 200 is shaped so that it is not easily damaged due to overheating, the user's experience when holding the mobile terminal is better, and the thickness of the mobile terminal can be set smaller.

As mentioned above, the surface to be coated of the heat sink can be a partial surface of the heat sink or the entire surface of the heat sink. When these two arrangements are adopted, the area covered by the heat sink coating 200 is different, and the resulting There are also differences in the cooling effect. In order to further improve the heat dissipation effect of the heat dissipation coating 200, the edge of the heat dissipation coating 200 may be flush with the edge of the heat dissipation element. In other words, the heat dissipation coating 200 covers as much as possible the entire surface of the heat dissipation element where the heat dissipation coating 200 can be disposed, so that the disposition area of the heat dissipation coating 200 is larger, thereby achieving a better heat dissipation effect.

In an optional embodiment, the number of layers of the heat dissipation coating 200 formed on the same side surface of the heat dissipation element can be one, two, three or even more layers. When the number of layers of the heat dissipation coating 200 increases, each The heat dissipation effect brought by the heat dissipation coating 200 is better. Therefore, in order to improve the heat dissipation effect, at least two layers of heat dissipation coating 200 can be arranged on the same side surface of the heat dissipation element. However, when the number of layers of the heat dissipation coating 200 increases, the thicknesses of the heat dissipation coatings 200 will also superimpose thereupon, so the number of layers of the heat dissipation coating 200 formed on the surface of the same side of the heat dissipation element can be set to two or three layers. , so that the heat dissipation effect of the heat dissipation coating 200 is improved without occupying too much space.

Based on the heat dissipation element described in any one of the above embodiments, an embodiment of the present invention further discloses a mobile terminal, which includes a main board 110 and the heat dissipation element described in any one of the above embodiments.

Optionally, the motherboard 110 of the mobile terminal is provided with a plurality of chips 160. In order to dissipate the heat generated by the chips 160 during operation to a greater extent, a heat conduction part 170 can be pasted on the chip 160. The heat conduction part 170 can specifically include Structures such as thermally conductive gel or silica gel, the thermally conductive part 170 has a heat dissipation capability, thereby realizing heat dissipation of the chip 160 . At this time, the shielding cover 140 on the motherboard is in contact with a part of the chips 160 and the heat conduction part 170, and the shielding cover 150 under the motherboard is in contact with another part of the chips 160 and the heat conduction part 170, so the heat dissipation is increased on the shielding cover 140 on the motherboard and the shielding cover 150 under the motherboard. When the coating 200 is used, the heat dissipation coating 200 can assist the heat conduction part 170 to dissipate heat, so that the temperature of the chip 160 can be kept in a lower range.

The mobile terminal disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an e-book reader or a wearable device. Certainly, the mobile terminal may also be other devices, which is not limited in this embodiment of the present invention.

The above-mentioned embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments do not contradict each other, they can be combined to form a better embodiment. Considering the brevity of the text, here No longer.

The above descriptions are only examples of the present invention, and are not intended to limit the present invention. Various modifications and variations of the present invention will occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the scope of the claims of the present invention.

Claims (10)

1. A preparation method of heat sink, characterized in that, said preparation method comprises: Coating graphene composite dispersion liquid on the surface to be coated of described heat sink, described graphene composite dispersion liquid comprises graphene powder, binding agent and solvent; A curing operation is performed on the graphene composite dispersion liquid, so that a heat dissipation coating is formed on the heat dissipation element. 2. preparation method according to claim 1, is characterized in that, also comprises before coating the graphene composite dispersion liquid on the surface to be coated of described heat sink: Surface treatment is carried out on the surface to be coated of the heat sink. 3. The preparation method according to claim 2, characterized in that, performing surface treatment on the surface to be coated of the heat sink, specifically comprising: using a cleaning agent to soak and clean the surface to be coated of the heat sink, the The cleaning agent includes at least one of ethanol, acetone and alkaline solution. 4. preparation method according to claim 1, is characterized in that, implements curing operation to described Graphene composite dispersion liquid, so that after forming heat dissipation coating on described heat sink also comprises: Purify the heat dissipation coating. 5. The preparation method according to claim 4, wherein purifying the heat-dissipating coating comprises: soaking and cleaning the heat-dissipating coating with a cleaning agent, the cleaning agent comprising ethanol, At least one of acetone and alkaline solution. 6. The preparation method according to claim 1, characterized in that, implementing a solidification operation on the graphene composite dispersion liquid specifically comprises: implementing a curing operation on the graphene composite dispersion liquid by using a baking process. 7. A heat sink, said heat sink is prepared by the preparation method described in any one of claims 1-6, characterized in that said heat sink is provided with a heat dissipation coating, said heat dissipation coating It is made of graphene composite dispersion formed by mixing graphene powder, binder and solvent. 8. The heat dissipation element according to claim 7, wherein the edge of the heat dissipation coating is flush with the edge of the heat dissipation element. 9. The heat dissipation element according to claim 7, wherein at least two layers of the heat dissipation coating are provided on the same side surface of the heat dissipation element. 10. A mobile terminal, characterized in that the mobile terminal comprises a main board and the heat sink according to any one of claims 7-9, the heat sink includes a main upper bracket, a battery cover, a shield cover on the main board, At least one of the lower shielding cover of the main board and the display screen, wherein the main board is located between the battery cover and the main upper bracket, and the upper shielding cover of the main board and the lower shielding cover of the main board are respectively arranged on the on both sides of the motherboard.