CN117476555A - Display panel, manufacturing method thereof and display device - Google Patents

Abstract

The application discloses a display panel, a manufacturing method thereof and a display device. The manufacturing method comprises the following steps: sequentially manufacturing a shading layer, a buffer layer, a dielectric layer, a metal layer, a passivation layer and a flat layer on a glass substrate, etching the metal layer to form a plurality of common wirings, and covering the common wirings by the passivation layer; the flat layer is arranged at the climbing positions corresponding to the two sides of the shading layer, and the passivation layer is exposed in the clearance area. The thickness of the flat film layer in the clearance area is thinned through the exposure development process, so that when the flat film layer in the full coverage area and the clearance area is etched, the flat film layer in the full coverage area can be ensured to remain to form the flat layer on the basis of ensuring that the flat film layer in the clearance area is removed, thereby avoiding the passivation layer from being etched by HF, further avoiding the metal layer from being etched by Ag acid, avoiding the phenomenon of broken wires of the metal layer, and improving the reliability and the product qualification rate of the display panel.

Description

Display panel, manufacturing method and display device thereof

Technical field

The present application relates to the field of display technology, and specifically to a display panel, a manufacturing method thereof, and a display device.

Background technique

With the development of display technology, display devices such as smartphones are becoming more and more popular, and the screen sizes produced are getting larger and larger. In the current production process of large-size display panels, a light-shielding layer, a buffer layer, a dielectric layer, a metal layer, a passivation layer and a flat layer are sequentially produced on a glass substrate. The metal layer forms a common wiring. The existing structure, due to the use of The thick Cu process produces the light-shielding layer and the metal layer. The thickness of the light-shielding layer is 8300 angstroms and the thickness of the metal layer is 8500 angstroms. Since the common traces climb on the light-shielding layer (LS), there is a semi-mask ( The flat layer (PLN) produced above the common traces using the Half tone method, the film thickness specification of the flat layer is required to be greater than 0.3um. Due to the large fault difference, after the flat layer is leveled, the film thickness of the flat layer at the climbing point is abnormal. When actually making products, the film thickness of the flat layer is less than 0.3um, and the passivation layer in some areas is not covered by the flat layer. This easily causes HF (hydrofluoric acid) to etch away the passivation layer at the climbing position that is not covered by the flat layer, and then when the Ag acid etches the PE (pixel electrode), the Ag acid etches the metal under the passivation layer. layer, causing the metal layer to break.

Contents of the invention

Embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device to solve the problem in the prior art that the thickness of the flat layer at the climbing position of the light-shielding layer is too small, causing the metal layer to be etched by Ag acid, causing the metal layer to break. The problem.

Embodiments of the present application provide a method for manufacturing a display panel, including the steps of: preparing a light-shielding layer on a glass substrate; forming a buffer layer on the light-shielding layer; forming a dielectric layer on the buffer layer; A metal layer is made on the dielectric layer, and the metal layer is etched to form a plurality of common traces; a passivation layer is made on the dielectric layer, and the passivation layer covers the common traces; and a passivation layer is made on the passivation layer The flat film layer forms a full coverage area in the area corresponding to the climbing position on both sides of the light-shielding layer, and forms a clear area in the area between two adjacent full coverage areas; the flat film layer in the full coverage area The thickness of the film layer is greater than the thickness of the flat film layer in the clear area; the flat film layer in the full coverage area and the clear area is etched, and the flat film layer in the clear area is removed and The passivation layer is exposed, and the flat film layer in the full coverage area is thinned to form a flat layer.

In some embodiments, the step of making a flat film layer on the passivation layer includes: making a flat film layer with a uniform thickness on the passivation layer; using a half-mask for the flat film layer in the clearance area. The film plate is exposed and developed so that the film thickness of the flat film layer in the clear area after exposure and development is smaller than the film thickness of the flat film layer in the full coverage area.

In some embodiments, the flat film layer in the full coverage area and the clearance area is etched, the flat film layer in the clearance area is removed and the passivation layer is exposed, and the full coverage area is etched to remove the flat film layer in the clearance area and expose the passivation layer. The step of thinning the flat film layer in the coverage area to form a flat layer includes: etching the flat film layer in the full coverage area and the clearance area, and the etched thickness of the flat film layer is equal to the thickness after exposure and development. The thickness of the flat film layer in the clear area; removing the ash produced by etching the flat film layer, exposing the passivation layer in the clear area, and thinning the flat film layer in the full coverage area Form a flat layer.

In some embodiments, the width of the flat layer in the full coverage area is 3um-20um, and the thickness of the flat layer is 3um-5um.

In some embodiments, after etching the flat film layer in the full coverage area and the clearance area, removing the flat film layer in the clearance area and exposing the passivation layer, the full coverage area is etched. After the step of thinning the flat film layer in the flat layer to form a flat layer, the step further includes: forming a sealant layer on the flat layer.

This application also provides a display panel, which is manufactured using the display panel manufacturing method described above; wherein the display panel includes: a glass substrate; a light-shielding layer disposed on the glass substrate; and a buffer layer disposed on the glass substrate. On the light shielding layer; a dielectric layer is provided on the buffer layer; a metal layer is provided on the dielectric layer, the metal layer has a plurality of common wiring lines; a passivation layer is provided on the dielectric layer On the layer, the passivation layer covers the common wiring; a full coverage area is formed in the area corresponding to the climbing position on both sides of the light shielding layer, and a clearance area is formed in the area between two adjacent full coverage areas; it is flat. A layer is provided on the passivation layer, the flat layer is provided in the full coverage area, and the passivation layer is exposed in the clear area.

In some embodiments, the film width of the flat layer in the full coverage area is 3um-20um.

In some embodiments, the film thickness of the flat layer in the full coverage area is 3um-5um.

In some embodiments, the display surface further includes: a sealant layer disposed on the flat layer.

This application also provides a display device, which includes the aforementioned display panel.

In the display panel, its manufacturing method, and the display device provided by the embodiments of the present application, the thickness of the flat film layer in the clearance area is thinned through an exposure and development process, so that the flat film layer in the full coverage area and the clearance area is reduced. When etching the film layer, it is possible to ensure that the flat film layer in the clear area is removed and a flat film layer is retained in the full coverage area to form a flat layer, thereby preventing HF from etching away the passivation layer and thus avoiding Ag acid etching. It can corrode the metal layer, avoid metal layer breakage, and improve the reliability and product qualification rate of the display panel.

Description of the drawings

The technical solutions and other beneficial effects of the present application will be apparent through a detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings.

Figure 1 is a top view of the relative positions of the light shielding layer and the metal layer in the existing display panel;

Figure 2 is a cross-sectional view of an existing display panel;

Figure 3 is a schematic diagram of the common traces being disconnected due to Ag acid etching the metal layer;

Figure 4 is a flow chart of a manufacturing method of a display panel provided by an embodiment of the present application;

Figure 5 is a schematic structural diagram of a flat film layer with uniform thickness formed on the passivation layer according to the embodiment of the present application;

Figure 6 is a schematic structural diagram of the flat film layer provided by the embodiment of the present application after exposure and development;

7 is a schematic structural diagram of the display panel when the passivation layer is exposed after removing the ash generated by etching the flat film layer according to the embodiment of the present application;

FIG. 8 is a top view of the display panel shown in FIG. 7 provided by an embodiment of the present application.

The markings in the picture are as follows:

glass substrate 1,

shading layer 2,

buffer layer 3,

Dielectric layer 4,

Metal layer 5,

Passivation layer 6,

flat layer 7,

Full coverage area 11,

Clearance Zone 12,

Common trace 51,

Flat film layer 71.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of this application.

In the description of the present application, it should be understood that the terms “first” and “second” are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of this application, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.

In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection, or indirect connection through an intermediary, it can be internal connection of two elements or interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In this application, unless otherwise explicitly stated and limited, the term "above" or "below" a first feature on a second feature may include direct contact between the first and second features, or may also include the first and second features. Not in direct contact but through additional characteristic contact between them. Furthermore, the terms "above", "above" and "above" a first feature on a second feature include the first feature being directly above and diagonally above the second feature, or simply mean that the first feature is higher in level than the second feature. “Below”, “under” and “under” the first feature is the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature is less horizontally than the second feature.

The following disclosure provides many different embodiments or examples for implementing the various structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the application. Furthermore, this application may repeat reference numbers and/or reference letters in different examples, such repetition being for the purposes of simplicity and clarity and does not by itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

As mentioned in the background section, please refer to Figures 1 and 2. Figure 1 is a top view of the relative positions of the light shielding layer 2 and the metal layer 5 in the existing display panel, and Figure 2 is a cross-sectional view of the existing display panel. During the production process of the common wiring 51 area of the large-size display panel, as shown in Figure 2, a light-shielding layer 2, a buffer layer 3, a dielectric layer 4, a metal layer 5, and a passivation layer 6 are sequentially produced on the glass substrate 1 and a planar layer 7, wherein the metal layer 5 forms a common trace 51. Due to the large fault difference, after the flat layer 7 is leveled, the film thickness of the flat layer 7 at the climbing point is abnormal, and the passivation layer 6 in some areas is not covered by the flat layer 7 .

As shown in FIG. 3 , FIG. 3 is a schematic diagram of the common trace 51 being disconnected due to Ag acid etching the metal layer 5 . First of all, some areas of the passivation layer 6 are not covered by the flat layer 7, which easily causes HF (hydrofluoric acid) to etch away the passivation layer 6 at the climbing position that is not covered by the flat layer 7, and then etches the passivation layer 6 with the Ag acid. When etching the PE (pixel electrode), Ag acid etches the metal layer 5 under the passivation layer 6, causing the metal layer 5 to break.

In order to solve the above technical problems, embodiments of the present application creatively provide a display panel, a manufacturing method thereof, and a display device. The display panel may be a screen structure of a display device such as a smartphone, a tablet computer, or a display screen.

Example 1

Specifically, please refer to Figure 4. In Embodiment 1 of the present application, a method for manufacturing a display panel is provided, including step S1: forming a light-shielding layer 2 on the glass substrate 1; S2: forming a buffer layer on the light-shielding layer 2. 3; S3. Make a dielectric layer 4 on the buffer layer 3; S4. Make a metal layer 5 on the dielectric layer 4, and etch the metal layer 5 to form a plurality of common traces 51; S5. A passivation layer 6 is formed on the dielectric layer 4, and the passivation layer 6 covers the common wiring 51; S6, a flat film layer 71 is formed on the passivation layer 6, and two layers corresponding to the light-shielding layer 2 are formed. The area at the side climbing position forms a full coverage area 11, and the area between two adjacent full coverage areas 11 forms a clear area 12; the film thickness of the flat film layer 71 in the full coverage area 11 is greater than the clear area. The film thickness of the flat film layer 71 of 12; S7. Etch the flat film layer 71 in the full coverage area 11 and the clearance area 12, remove the flat film layer 71 in the clearance area 12 and expose it. The passivation layer 6 thins the flat film layer 71 of the full coverage area 11 to form a flat layer 7 .

The common traces 51 include gate drive traces led from the GOA unit.

Please refer to FIG. 5 . In this embodiment, the step of forming a flat film layer 71 on the passivation layer 6 includes: forming a flat film layer 71 with a uniform thickness on the passivation layer 6 .

Please refer to Figure 6. In this embodiment, the step of forming a flat film layer 71 on the passivation layer 6 also includes: using a half mask to expose and develop the flat film layer 71 in the clearance area 12, so that The thickness of the flat film layer 71 in the clear area 12 after exposure and development is smaller than the thickness of the flat film layer 71 in the full coverage area 11 .

Please refer to Figures 7 and 8. In this embodiment, the flat film layer 71 in the full coverage area 11 and the clearance area 12 is etched to remove the flat film layer in the clearance area 12. 71 and expose the passivation layer 6, and thin the flat film layer 71 of the full coverage area 11 to form a flat layer 7, including: flattening the flatness of the full coverage area 11 and the clearance area 12 The film layer 71 is etched, and the etched thickness of the flat film layer 71 is equal to the film thickness of the flat film layer 71 in the clearance area 12 after exposure and development; the ash generated by etching the flat film layer 71 is removed, so The passivation layer 6 is exposed in the clear area 12 , and the flat film layer 71 in the full coverage area 11 is thinned to form a flat layer 7 .

The width of the flat layer 7 in the full coverage area 11 is 3um-20um, and the thickness of the flat layer 7 is 3um-5um.

Please refer to FIGS. 7 and 8 . FIG. 7 is a schematic structural diagram of the display panel when the passivation layer 6 is exposed after removing the ash generated by etching the flat film layer 71 . FIG. 8 is a top view of the display panel shown in FIG. 7 .

Referring to Figure 4, after etching the flat film layer 71 in the full coverage area 11 and the clearance area 12, removing the flat film layer 71 in the clearance area 12 and exposing the passivation layer 6, After the step of thinning the flat film layer 71 in the full coverage area 11 to form the flat layer 7 , the step further includes: S8 , forming a sealant layer on the flat layer 7 .

In the above manufacturing method of the display panel, the thickness of the flat film layer 71 in the clear area 12 is reduced through an exposure and development process, thereby etching the flat film layer 71 in the full coverage area 11 and the clear area 12 At this time, it is possible to ensure that the flat film layer 71 in the clearance area 12 is removed and the flat film layer 71 is retained in the full coverage area 11 to form the flat layer 7, thereby preventing HF from etching away the passivation layer 6 and thereby avoiding Ag. The metal layer 5 is etched with acid to avoid disconnection of the metal layer 5 and improve the reliability and product qualification rate of the display panel 100 .

Example 2

Embodiment 2 of the present application also provides a display panel, which is manufactured using the display panel manufacturing method described above.

Referring to Figures 7 and 8, the display panel includes: a glass substrate 1, a light shielding layer 2, a buffer layer 3, a dielectric layer 4, a metal layer 5, a passivation layer 6 and a flat layer 7.

Wherein, the light-shielding layer 2 is provided on the glass substrate 1; the buffer layer 3 is provided on the light-shielding layer 2; the dielectric layer 4 is provided on the buffer layer 3; the metal layer 5 is provided on the dielectric layer 4 On the dielectric layer 4 , the metal layer 5 has a plurality of common traces 51 ; the passivation layer 6 is provided on the dielectric layer 4 , and the passivation layer 6 covers the common traces 51 .

Referring to Figure 7, a full coverage area 11 is formed in the area corresponding to the climbing position on both sides of the light shielding layer 2, and a clearance area 12 is formed in the area between two adjacent full coverage areas 11; the flat layer 7 is provided on the On the passivation layer 6 , the flat layer 7 is provided in the full coverage area 11 , and the passivation layer 6 is exposed in the clear area 12 .

In this embodiment, the width of the flat layer 7 in the full coverage area 11 is 3um-20um, and the thickness of the flat layer 7 is 3um-5um.

In this embodiment, the display surface further includes: a sealant layer disposed on the flat layer 7 .

In the above display panel provided by the embodiment of the present application, the thickness of the flat film layer 71 in the clearance area 12 is reduced through an exposure and development process, so that the flat film layer 71 in the full coverage area 11 and the clearance area 12 is When etching 71, it is possible to ensure that the flat film layer 71 in the clear area 12 is removed and the flat film layer 71 is retained in the full coverage area 11 to form the flat layer 7, thereby preventing the passivation layer 6 from being etched away by HF. This prevents the metal layer 5 from being etched by Ag acid, avoids the phenomenon of disconnection of the metal layer 5, and improves the reliability and product qualification rate of the display panel 100.

Example 3

Embodiment 3 of the present application also provides a display device, which includes the display panel described above. The specific structure of the display panel has been described in detail in the above embodiments and will not be described again here. The display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic paper book, or a television.

In the display device provided by the embodiment of the present application, the thickness of the flat film layer 71 in the clear area 12 is reduced through an exposure and development process, so that the flat film layer 71 in the full coverage area 11 and the clear area 12 is When the layer 71 is etched, it is possible to ensure that the flat film layer 71 in the clearance area 12 is removed and the flat film layer 71 is retained in the full coverage area 11 to form the flat layer 7, thereby preventing the passivation layer 6 from being etched away by HF. , thereby preventing the Ag acid from etching the metal layer 5 and preventing the metal layer 5 from being disconnected, thereby improving the reliability and product qualification rate of the display panel 100 .

In the above embodiments, each embodiment is described with its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

The above is a detailed introduction to a display panel, its manufacturing method, and a display device provided by the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for To help understand the technical solutions and core ideas of this application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications Or substitution does not cause the essence of the corresponding technical solution to depart from the scope of the technical solution of each embodiment of the present application.

Claims (10)

1. A method of manufacturing a display panel, characterized by comprising the steps: Make a light-shielding layer on a glass substrate; Make a buffer layer on the light-shielding layer; making a dielectric layer on the buffer layer; Make a metal layer on the dielectric layer, and etch the metal layer to form a plurality of common traces; Make a passivation layer on the dielectric layer, and the passivation layer covers the common wiring; A flat film layer is made on the passivation layer, a full coverage area is formed in the area corresponding to the climbing position on both sides of the light shielding layer, and a clear area is formed in the area between two adjacent full coverage areas; the full coverage area The film thickness of the flat film layer in the clear area is greater than the film thickness of the flat film layer in the clear area; The flat film layer in the full coverage area and the clear area is etched, the flat film layer in the clear area is removed and the passivation layer is exposed, and the flat film layer in the full coverage area is reduced. Thin to form a flat layer. 2. The method of manufacturing a display panel according to claim 1, wherein the step of forming a flat film layer on the passivation layer includes: Make a flat film layer with uniform thickness on the passivation layer; The flat film layer in the clear area is exposed and developed using a half mask, so that the film thickness of the flat film layer in the clear area after exposure and development is smaller than the film thickness of the flat film layer in the full coverage area. thickness. 3. The manufacturing method of a display panel according to claim 2, wherein the flat film layer in the full coverage area and the clearance area is etched to remove the flat film in the clearance area. layer and expose the passivation layer, and thin the flat film layer in the full coverage area to form a flat layer, including: Etch the flat film layer in the full coverage area and the clear area, and the etched thickness of the flat film layer is equal to the film thickness of the flat film layer in the clear area after exposure and development; The ash produced by etching the flat film layer is removed, the passivation layer is exposed in the clear area, and the flat film layer in the full coverage area is thinned to form a flat layer. 4. The manufacturing method of a display panel according to claim 3, wherein the width of the flat layer in the full coverage area is 3um-20um, and the thickness of the flat layer is 3um-5um. 5. The method of manufacturing a display panel according to claim 1, wherein before etching the flat film layer in the full coverage area and the clear area, the flat film layer in the clear area is removed. and exposing the passivation layer, and thinning the flat film layer in the full coverage area to form a flat layer, further including: A sealant layer is made on the flat layer. 6. A display panel, characterized in that it is manufactured using the display panel manufacturing method according to any one of claims 1 to 5; Wherein, the display panel includes: Glass base board; A light-shielding layer arranged on the glass substrate; A buffer layer, arranged on the light-shielding layer; A dielectric layer is provided on the buffer layer; A metal layer disposed on the dielectric layer, the metal layer having a plurality of common traces; A passivation layer is provided on the dielectric layer, and the passivation layer covers the common wiring; a full coverage area is formed in the area corresponding to the climbing position on both sides of the light shielding layer, and the full coverage area is formed between two adjacent The area between zones forms a clear zone; A flat layer is arranged on the passivation layer, the flat layer is arranged in the full coverage area, and the passivation layer is exposed in the clear area. 7. The display panel according to claim 6, wherein the film width of the flat layer in the full coverage area is 3um-20um. 8. The display panel according to claim 6, wherein the film thickness of the flat layer in the full coverage area is 3um-5um. 9. The display panel of claim 6, further comprising: A sealant layer is provided on the flat layer. 10. A display device, characterized by comprising the display panel according to any one of claims 6 to 9.