CN116652767A - Thinning machine - Google Patents
Thinning machine Download PDFInfo
- Publication number
- CN116652767A CN116652767A CN202310741957.0A CN202310741957A CN116652767A CN 116652767 A CN116652767 A CN 116652767A CN 202310741957 A CN202310741957 A CN 202310741957A CN 116652767 A CN116652767 A CN 116652767A
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- CN
- China
- Prior art keywords
- grinding wheel
- main shaft
- wafer
- adapter
- thinning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention relates to the technical field of semiconductor processing equipment, in particular to a thinning machine. The thinning machine comprises a machine base, a piece bearing table and a grinding mechanism, wherein the machine base is provided with a loading and unloading station and a processing station, and the piece bearing table is arranged on the machine base in a sliding manner and moves back and forth between the loading and unloading station and the processing station. The grinding mechanism comprises a driving module, a main shaft and a grinding wheel, wherein the grinding wheel is coaxially arranged on the main shaft, and the diameters of the main shaft and the grinding wheel are adjustable; the driving module is in transmission connection with the grinding wheel through the main shaft so as to drive the grinding wheel to lift and rotate at the processing station. The circle center of the projection circle of the grinding wheel on the wafer carrying platform passes through the moving track line of the wafer carrying platform, and the outer edge of the projection circle passes through the circle center of the wafer carrying platform. The thinning machine can replace the main shafts with different diameters and the grinding wheels with different diameters according to actual processing requirements so as to meet the whole-surface processing or local processing requirements of the wafer, realize diversified processing technologies of the thinning machine and improve the universality of the thinning machine.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to a thinning machine.
Background
In the processing of wafers, a thinning machine is an indispensable processing device. The thinning machine performs thinning treatment on the wafer through the grinding wheel.
At present, the grinding wheel of the thinning machine is biased at one side of the wafer supporting table, and the outer edge of the grinding wheel passes through the circle center of the wafer supporting table, so that the grinding wheel can only realize whole-surface thinning or whole-surface polishing on the wafer supporting table. However, with the diversification of wafer processing, when the wafer needs to be locally thinned, for example, a supporting ring structure of 3 mm-4 mm is reserved on the outer ring of the wafer, and then a thinning machine of a specific type needs to be replaced, so that the processing process of the existing thinning machine is single, and the processing requirement of the diversification of the wafer is difficult to meet.
Disclosure of Invention
The invention aims to provide a thinning machine, which solves the technical problems that the existing thinning machine is single in processing technology and is difficult to meet the diversified processing requirements of wafers.
The technical scheme adopted by the invention is as follows:
thinning machine includes:
the machine comprises a machine base and a piece bearing table, wherein the machine base is provided with a loading and unloading station and a processing station, and the piece bearing table is arranged on the machine base in a sliding manner and moves back and forth between the loading and unloading station and the processing station;
the grinding mechanism comprises a driving module, a main shaft and a grinding wheel, wherein the grinding wheel is coaxially arranged on the main shaft, and the diameters of the main shaft and the grinding wheel are adjustable; the driving module is in transmission connection with the grinding wheel through the main shaft so as to drive the grinding wheel to lift and rotate at the processing station;
the center of the projection circle of the grinding wheel on the wafer carrying platform passes through the moving track line of the wafer carrying platform, and the outer edge of the projection circle passes through the center of the wafer carrying platform.
Preferably, the grinding mechanism further comprises an adapter arranged on the main shaft, and the grinding wheels with different diameters are selectively mounted on the adapter.
As the preferred scheme, the adaptor includes adapter and adapter plate, the upper end of adapter plate has the adapter, the adapter set up in on the main shaft, the lower extreme of adapter plate has a plurality of coaxial spacing annular that set up, different diameters the emery wheel is selectively installed in corresponding spacing annular.
As a preferred scheme, the switching disc comprises a main disc body and a plurality of annular plates with different diameters, the annular plates with different diameters are coaxially and convexly arranged on the lower end face of the main disc body, and two adjacent annular plates enclose a corresponding limiting ring groove.
As a preferred solution, the driving module includes:
the box body is arranged on the machine base, and the lifting driving piece is arranged in the box body;
the main shaft is fixedly arranged on the supporting piece, and the lifting driving piece drives the supporting piece to be detachably and slidingly arranged on the box body along the vertical direction.
Preferably, the supporting piece comprises a sliding plate and a locking ring, the locking ring is fixed on the sliding plate, and the main shaft is arranged in the locking ring;
the grinding mechanism further comprises a first sliding rail, the first sliding rail is arranged on the box body along the vertical direction, and the sliding plate is in sliding fit with the first sliding rail.
Preferably, the grinding mechanism further comprises a balancing component, the balancing component is arranged on the box body, and the output end of the balancing component is connected with the supporting piece and synchronously ascends and descends along with the supporting piece so as to tighten the supporting piece.
Preferably, the balance components are two, and the two balance components are symmetrically arranged on two sides of the support piece.
As an optimal scheme, the thinning machine further comprises a screw rod assembly, and the piece bearing table is arranged on the machine base in a sliding manner through the screw rod assembly.
Preferably, the thinning machine further comprises two stop members, and the two stop members are oppositely arranged on two sides of the screw rod assembly along the moving track line so as to respectively limit the two limit bit displacements of the wafer bearing table along the moving track line.
The beneficial effects of the invention are as follows:
according to the thinning machine provided by the invention, after the wafer carrying platform carrying the wafer moves to the processing station, the driving module drives the grinding wheel to descend to the upper surface of the wafer and performs thinning processing or polishing processing on the wafer. Because the circle center of the projection circle of the grinding wheel on the wafer carrying platform passes through the moving track line of the wafer carrying platform, and the outer edge of the projection circle passes through the circle center of the wafer carrying platform, the thinning machine can replace the spindle with different diameters and the grinding wheel with different diameters according to actual processing requirements so as to meet the whole processing or local processing requirements of the wafer, the problem that the thinning machine cannot meet the diversified processing requirements of the wafer due to single processing technology is avoided, the diversified processing technology of the thinning machine is realized, and the universality is improved.
Drawings
FIG. 1 is a schematic view of a thinning machine according to an embodiment of the present invention;
FIG. 2 is a bottom view of a thinning machine according to an embodiment of the present invention;
FIG. 3 is a schematic view of a projection circle of a grinding wheel with a first diameter on a wafer carrier and the structure of the wafer carrier according to an embodiment of the present invention;
FIG. 4 is a schematic view of a projected circle of a grinding wheel with a second diameter on a wafer carrier and the structure of the wafer carrier according to the embodiment of the present invention;
FIG. 5 is a schematic view of a projection circle of a third diameter grinding wheel on a wafer carrier and the structure of the wafer carrier according to the embodiment of the present invention;
FIG. 6 is a schematic diagram of an adaptor according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a second adaptor according to an embodiment of the present invention.
The parts in the figures are named and numbered as follows:
10. projecting a circle; 20. moving the track line;
1. a base; 13. a second slide rail; 14. a stopper; 2. a wafer carrying table; 3. a main shaft; 4. grinding wheel; 5. an adapter; 51. an adapter; 52. a switching disc; 520. a limit ring groove; 521. a main tray body; 522. an annular plate; 6. a case; 7. a support; 71. a slide plate; 72. a locking ring; 8. a first slide rail; 9. a balancing assembly; 91. a balance bracket; 92. and (3) a cylinder.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
At present, the grinding wheel of the thinning machine is biased at one side of the wafer supporting table, and the outer edge of the grinding wheel passes through the circle center of the wafer supporting table, so that the grinding wheel can only realize whole-surface thinning or whole-surface polishing on the wafer supporting table. However, with the diversification of wafer processing, the existing thinning machine has a single processing technology, and is difficult to meet the processing requirements of wafer diversification.
In order to solve the above problems, as shown in fig. 1 to 3, the present embodiment provides a thinning machine, which includes a stand 1, a carrying table 2 and a grinding mechanism, wherein the stand 1 is provided with a loading and unloading station and a processing station, and the carrying table 2 is slidably disposed on the stand 1 and reciprocates between the loading and unloading station and the processing station. The grinding mechanism comprises a driving module, a main shaft 3 and a grinding wheel 4, wherein the grinding wheel 4 is coaxially arranged on the main shaft 3, and the diameters of the main shaft 3 and the grinding wheel 4 are adjustable. The driving module is in transmission connection with the grinding wheel 4 through the main shaft 3 so as to drive the grinding wheel 4 to lift and rotate at the processing station. The center of the projection circle 10 of the grinding wheel 4 on the wafer carrying platform 2 passes through the moving track line 20 of the wafer carrying platform 2, and the outer edge of the projection circle 10 passes through the center A of the wafer carrying platform 2.
After the wafer carrying stage 2 moves to the processing station, the driving module drives the grinding wheel 4 to descend to the upper surface of the wafer and performs thinning processing or polishing processing on the wafer. Because the circle center of the projection circle 10 of the grinding wheel 4 on the carrying platform 2 passes through the moving track line 20 of the carrying platform 2, and the outer edge of the projection circle 10 passes through the circle center A of the carrying platform 2, the thinning machine can replace the spindle 3 with different diameters and the grinding wheel 4 with different diameters according to actual processing requirements so as to meet the whole-surface processing or local processing requirements of the wafer, the problem that the thinning machine cannot meet the diversified processing requirements of the wafer due to single processing technology is avoided, the diversified processing technology of the thinning machine is realized, and the universality is improved.
As shown in fig. 1 and 3, when the wafer stage 2 moves to the loading and unloading station along its moving trajectory line 20 (a broken straight line in fig. 3), a wafer to be processed is placed at the center of the wafer stage 2 by an automatic loading and unloading mechanism such as a robot. The wafer stage 2 is disposed concentrically with the wafer to be carried. When the wafer carrying platform 2 moves to the processing station, the driving module drives the grinding wheel 4 to descend to the upper surface of the wafer and drives the grinding wheel 4 to rotate so as to perform whole or partial thinning or polishing processing on the wafer. After the processing is finished, the driving module drives the grinding wheel 4 to reset, the wafer carrying platform 2 moves to the loading and unloading station again along the moving track line 20, and the mechanical arm takes the processed wafer off the wafer carrying platform 2.
In this embodiment, the thinning machine further includes a screw assembly, and the wafer bearing table 2 is slidably disposed on the base 1 through the screw assembly. The screw rod assembly can accurately control the displacement of the wafer carrying platform 2, and the moving precision of the wafer carrying platform 2 is improved. Since the screw assembly is the prior art, the specific structure of the screw assembly will not be described in detail.
Further, as shown in fig. 1, the thinning machine further includes a second slide rail 13, and the wafer carrier 2 is slidably matched with the second slide rail 13. The second slide rail 13 plays a guiding and limiting role on the reciprocating movement of the wafer bearing platform 2 along the moving track line 20, and the displacement precision of the wafer bearing platform 2 is improved.
As shown in fig. 1, the thinning machine further includes two stop members 14, where the two stop members 14 are disposed on two opposite sides of the screw assembly along the moving track 20, so as to limit the displacement of the wafer carrier 2 along the two extreme positions of the moving track 20. When the wafer carrying platform 2 moves to the loading and unloading station or the processing station along the moving track line 20, the wafer carrying platform 2 is abutted against the corresponding stop piece 14, so that the position deviation of the wafer carrying platform 2 is avoided, and the displacement precision of the wafer carrying platform 2 is further improved.
Specifically, the stopper 14 includes a column fixedly provided on the machine base 1 and a bar extending along the movement trajectory line 20 and fixedly mounted on the column. When the sheet bearing table 2 moves to the upper and lower material stations or the processing stations, the sheet bearing table 2 can be abutted against the end parts of the corresponding baffle rods, so that the baffle rods limit the limit displacement of the sheet bearing table 2.
As shown in fig. 1, the driving module further includes a box 6, a lifting driving member, a rotation driving member and a supporting member 7, wherein the box 6 is disposed on the base 1, and the lifting driving member is disposed in the box 6. The main shaft 3 is fixedly arranged on the supporting piece 7, and the lifting driving piece drives the supporting piece 7 to be detachably and slidingly arranged on the box body 6 along the vertical direction. The rotary driving member drives the grinding wheel 4 to rotate through the spindle 3, so that the grinding wheel 4 thins or polishes the wafer on the wafer carrier 2.
Further, the support 7 includes a slide plate 71 and a locking ring 72, the locking ring 72 is fixed to the slide plate 71, and the spindle 3 is installed in the locking ring 72. The grinding mechanism further comprises a first sliding rail 8, the first sliding rail 8 is arranged on the box body 6 along the vertical direction, and the sliding plate 71 is in sliding fit with the first sliding rail 8. The first slide rail 8 plays a role in guiding and limiting the lifting movement of the slide plate 71, and improves the lifting displacement precision of the main shaft 3 and the grinding wheel 4.
As shown in fig. 1, the grinding mechanism further includes a balancing component 9, the balancing component 9 is disposed on the box 6, and an output end of the balancing component 9 is connected with the supporting member 7 and is lifted synchronously with the supporting member 7 to tighten the supporting member 7. The supporting piece 7 is tensioned through the balance component 9, so that the sum of the weights of the supporting piece 7, the main shaft 3 and the grinding wheel 4 is basically equal to the pulling force of the balance component 9, namely, the grinding wheel 4 can contact the wafer with zero gravity, the wafer is prevented from being damaged due to pressure, and the protection of the wafer is improved.
Further, the two balance components 9 are symmetrically arranged on two sides of the supporting piece 7, so that the supporting piece 7 is uniformly pulled, the levelness of the grinding wheel 4 is ensured, and the processing quality of the grinding wheel 4 is improved.
Specifically, the balance assembly 9 of the present embodiment includes a balance bracket 91 and a cylinder 92, wherein a first end of the balance bracket 91 is fixedly mounted on the top of the case 6, and a second end of the balance bracket 91 extends out of the case 6 to form a cantilever structure. The cylinder seat of the cylinder 92 is pivotally mounted to the second end of the balance bracket 91, and the piston rod of the cylinder 92 is connected to the locking ring 72. The two cylinders 92 jointly tighten the locking ring 72 to balance the sum of the weights of the support 7, the spindle 3 and the grinding wheel 4. When the main shaft 3 and the grinding wheel 4 move up and down in the vertical direction, the piston rod moves up and down synchronously so as to always maintain a tensioning state. In other embodiments, the cylinder 92 may be replaced by a hydraulic cylinder or an electric push rod, and the like, which is not particularly limited herein.
As shown in fig. 3, the diameter of the wafer support 2 is 12 inches, and the diameters of the main shaft 3 and the grinding wheel 4 are 12 inches, so that the grinding wheel 4 can perform whole-surface thinning or whole-surface polishing processing on the wafer support 2. As shown in fig. 4, the diameter of the wafer carrier 2 is 12 inches, the diameter of the spindle 3 may be 12 inches or 8 inches, and the diameter of the grinding wheel 4 is 8 inches, so that the grinding wheel 4 can also perform whole-surface thinning or whole-surface polishing on the wafer carrier 2. As shown in fig. 5, the diameter size of the wafer carrier 2 is 12 inches, the diameter size of the spindle 3 may be 12 inches or 8 inches, and the diameter size of the grinding wheel 4 is smaller than 8 inches (called a small grinding wheel mode), so that the grinding wheel 4 can perform local thinning or local polishing processing on the wafer carrier 2.
In this embodiment, the thinning machine can replace different spindles 3 and grinding wheels 4 with different sizes according to the processing requirements of the wafer, so as to realize serialization and modularization of the thinning machine, and assemble the thinning machine with different configurations. The sizes of the main shaft 3 and the grinding wheel 4 can be flexibly adjusted according to actual processing requirements, so that the processing requirements of wafer diversification are met, and the universality of the thinning machine is improved.
As shown in fig. 1, the grinding mechanism further includes an adapter 5, the adapter 5 being provided on the spindle 3, and grinding wheels 4 of different diameters being selectively mounted on the adapter 5. The grinding wheel 4 is stably mounted with the spindle 3 through the adapter 5. Meanwhile, the adapter piece 5 has certain universality, and can be fixedly installed with grinding wheels 4 with different diameters, so that the replacement operation of the grinding wheels 4 is simple, convenient and feasible, and the replacement efficiency is improved. When the spindle 3 needs to be replaced, the locking ring 72 may be replaced adaptively.
As shown in fig. 6 and 7, the adaptor 5 includes an adaptor 51 and an adaptor plate 52, the adaptor 51 is provided at an upper end of the adaptor plate 52, the adaptor 51 is provided on the spindle 3, the adaptor plate 52 has a plurality of coaxially arranged limiting ring grooves 520 at a lower end thereof, and grinding wheels 4 with different diameters are selectively mounted in the corresponding limiting ring grooves 520. The limit installation of the grinding wheel 4 is realized through the limit ring groove 520, and the stability and the installation efficiency of the grinding wheel 4 are improved.
Further, the adapter plate 52 includes a main plate 521 and a plurality of annular plates 522 with different diameters, the annular plates 522 with different diameters are coaxially and convexly arranged on the lower end surface of the main plate 521, and corresponding limiting ring grooves 520 are enclosed between two adjacent annular plates 522. And a plurality of mounting hole groups are formed in the main disc 521 in a penetrating manner, each mounting hole group comprises a plurality of mounting holes distributed along the circumferential direction of the main disc 521, and each limiting ring groove 520 is internally provided with one mounting hole group. The grinding wheel 4 is clamped with the corresponding limiting ring groove 520 and is fixedly connected with the main disc 521 through the mounting hole group in the limiting ring groove 520, so that the stability and reliability of the installation of the grinding wheel 4 are further improved.
The above embodiments merely illustrate the basic principle and features of the present invention, and the present invention is not limited to the above embodiments, but may be varied and altered without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. Thinning machine, its characterized in that includes:
the machine comprises a machine base (1) and a piece bearing table (2), wherein the machine base (1) is provided with a loading and unloading station and a processing station, and the piece bearing table (2) is arranged on the machine base (1) in a sliding manner and moves back and forth between the loading and unloading station and the processing station;
the grinding mechanism comprises a driving module, a main shaft (3) and a grinding wheel (4), wherein the grinding wheel (4) is coaxially arranged on the main shaft (3), and the diameters of the main shaft (3) and the grinding wheel (4) are adjustable; the driving module is in transmission connection with the grinding wheel (4) through the main shaft (3) so as to drive the grinding wheel (4) to lift and rotate at the processing station;
the center of a projection circle (10) of the grinding wheel (4) on the piece bearing table (2) passes through a moving track line (20) of the piece bearing table (2), and the outer edge of the projection circle (10) passes through the center of the piece bearing table (2).
2. The thinning machine according to claim 1, characterized in that the grinding mechanism further comprises an adapter (5), the adapter (5) being provided on the spindle (3), the grinding wheels (4) of different diameters being selectively mounted on the adapter (5).
3. The thinning machine according to claim 2, characterized in that the adapter (5) comprises an adapter (51) and an adapter disc (52), the adapter (51) is arranged at the upper end of the adapter disc (52), the adapter (51) is arranged on the main shaft (3), a plurality of coaxially arranged limit ring grooves (520) are arranged at the lower end of the adapter disc (52), and grinding wheels (4) with different diameters are selectively arranged in the corresponding limit ring grooves (520).
4. A thinning machine according to claim 3, wherein the switching disc (52) comprises a main disc body (521) and a plurality of annular plates (522) with different diameters, the annular plates (522) with different diameters are coaxially and convexly arranged on the lower end face of the main disc body (521), and corresponding limiting ring grooves (520) are formed between two adjacent annular plates (522).
5. The thinning machine of claim 1, wherein the drive module comprises:
the lifting device comprises a box body (6) and a lifting driving piece, wherein the box body (6) is arranged on the machine base (1), and the lifting driving piece is arranged in the box body (6);
the supporting piece (7), the main shaft (3) is fixedly arranged on the supporting piece (7), and the lifting driving piece drives the supporting piece (7) to detachably slide on the box body (6) along the vertical direction.
6. A thinning machine according to claim 5, characterized in that the support (7) comprises a slide (71) and a locking ring (72), the locking ring (72) being fixed to the slide (71), the spindle (3) being mounted inside the locking ring (72);
the grinding mechanism further comprises a first sliding rail (8), the first sliding rail (8) is arranged on the box body (6) along the vertical direction, and the sliding plate (71) is in sliding fit with the first sliding rail (8).
7. The thinning machine according to claim 5, wherein the grinding mechanism further comprises a balancing assembly (9), the balancing assembly (9) is arranged on the box body (6), and an output end of the balancing assembly (9) is connected with the supporting piece (7) and synchronously ascends and descends along with the supporting piece (7) so as to tighten the supporting piece (7).
8. The ironing machine according to claim 7, characterized in that said balancing assemblies (9) have two, two of said balancing assemblies (9) being symmetrically arranged on both sides of said support (7).
9. The thinning machine according to claim 1, further comprising a screw assembly, by means of which the wafer support table (2) is slidingly arranged on the machine base (1).
10. The thinning machine according to claim 9, further comprising two stop members (14), the two stop members (14) being arranged opposite each other along the movement trajectory (20) on both sides of the screw assembly, so as to limit the two extreme displacements of the wafer-carrying platform (2) along the movement trajectory (20), respectively.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310741957.0A CN116652767A (en) | 2023-06-21 | 2023-06-21 | Thinning machine |
| CN202380013652.6A CN118234597A (en) | 2023-06-21 | 2023-10-31 | Wafer grinding method and wafer grinding machine |
| PCT/CN2023/128093 WO2024259845A1 (en) | 2023-06-21 | 2023-10-31 | Wafer grinding method and wafer grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310741957.0A CN116652767A (en) | 2023-06-21 | 2023-06-21 | Thinning machine |
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| Publication Number | Publication Date |
|---|---|
| CN116652767A true CN116652767A (en) | 2023-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310741957.0A Pending CN116652767A (en) | 2023-06-21 | 2023-06-21 | Thinning machine |
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| Country | Link |
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| CN (1) | CN116652767A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116810528A (en) * | 2023-08-31 | 2023-09-29 | 江苏京创先进电子科技有限公司 | Wafer grinding method and wafer grinding machine |
| CN117260408A (en) * | 2023-11-21 | 2023-12-22 | 江苏京创先进电子科技有限公司 | Grinding wheel dressing method, grinding wheel dressing or not identification system and thinning equipment |
| WO2024259845A1 (en) * | 2023-06-21 | 2024-12-26 | 江苏京创先进电子科技有限公司 | Wafer grinding method and wafer grinding machine |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101121237A (en) * | 2006-08-09 | 2008-02-13 | 株式会社迪思科 | Wafer grinding device |
| JP2016047561A (en) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | Grinding equipment |
| CN106505012A (en) * | 2015-09-04 | 2017-03-15 | 株式会社迪思科 | Grinding wheel and method for grinding workpiece |
| CN208381551U (en) * | 2018-06-12 | 2019-01-15 | 无锡艾睿博环保科技有限公司 | A kind of cleaning equipment Universal flange |
| CN111421412A (en) * | 2020-05-20 | 2020-07-17 | 清华大学 | Grinding workbench and wafer thinning equipment |
| CN211387029U (en) * | 2019-12-23 | 2020-09-01 | 章丘市鹏程锻造有限公司 | Fixing device of flange plate for bench drill |
| CN213164839U (en) * | 2020-07-30 | 2021-05-11 | 华海清科(北京)科技有限公司 | Wafer grinding spindle assembly |
| CN115338717A (en) * | 2022-09-13 | 2022-11-15 | 江苏京创先进电子科技有限公司 | Wafer thinning equipment |
| CN218837087U (en) * | 2022-11-28 | 2023-04-11 | 苏州广林达电子科技有限公司 | Integrated wafer thinning equipment |
| CN219053834U (en) * | 2022-09-23 | 2023-05-23 | 海南千鼎信息科技有限公司 | Full-automatic single-shaft wafer thinning machine |
-
2023
- 2023-06-21 CN CN202310741957.0A patent/CN116652767A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP2016047561A (en) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | Grinding equipment |
| CN106505012A (en) * | 2015-09-04 | 2017-03-15 | 株式会社迪思科 | Grinding wheel and method for grinding workpiece |
| CN208381551U (en) * | 2018-06-12 | 2019-01-15 | 无锡艾睿博环保科技有限公司 | A kind of cleaning equipment Universal flange |
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| WO2024259845A1 (en) * | 2023-06-21 | 2024-12-26 | 江苏京创先进电子科技有限公司 | Wafer grinding method and wafer grinding machine |
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