CN115423811B - Method and device for registering welding spots on chip - Google Patents
Method and device for registering welding spots on chip Download PDFInfo
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Abstract
The invention provides a method and a device for registering welding spots on a chip. According to the invention, a small amount of welding spots of various appearance types in the chip are registered, then all welding spots which are qualified for examination are automatically found out from the chip by using the welding spot information of the pre-registered welding spots and the pin mark information of the pin marks associated with the welding spots, and the welding spot information of the qualified welding spots and the pin mark information of the qualified pin marks are registered, so that accurate information is provided for subsequent automatic pin mark detection, and the detection precision is improved. The method for registering the welding points on the chip greatly saves the time for establishing the product manufacturing procedure and improves the testing efficiency. The problems of missing registration and multiple registrations caused by manual registration are avoided.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a method and a device for registering welding spots on a chip.
Background
Wafer testing is a very important test step after wafer fabrication is complete.
The wafer test is to perform a probe test on each chip on the chip, and a probe card is mounted on the inspection head, and the probe card has a probe made of gold wire into fine hairs for contacting with the pads on the chip to test the electrical characteristics thereof.
There are many appearance types of welding points on a chip, and the welding points of each appearance type are tested in different modes. Therefore, before the automatic testing and the pin mark detection of the wafer testing, the pads on the chip need to be classified and registered, that is, the pads with different appearance types are stored in respective databases to obtain the qualification of the automatic pin mark detection, so that the automatic pin mark detection can be performed. Currently, the classified registration of the pads on the chip is mainly performed manually. However, a chip has many types of solder joints, and each type of solder joint can reach thousands of solder joints at most, manual registration is time-consuming, and the problem of missing registration or multiple registrations is easy to occur.
Therefore, the present invention provides a method for registering pads on a chip to solve one of the above technical problems.
Disclosure of Invention
The present invention is directed to a method and an apparatus for registering pads on a chip, which can solve at least one of the above-mentioned problems. The specific scheme is as follows:
according to a specific embodiment of the present invention, in a first aspect, the present invention provides a method for registering pads on a chip, including:
obtaining welding spot information of a first welding spot of any appearance type on any chip in a wafer, wherein the first welding spot is a welding spot which is registered in advance and meets a preset first detection condition, and the first welding spot has a first needle mark which meets a preset second detection condition;
acquiring a first image through a camera, wherein the first image is matched with first area position information photographed by the camera in a preset plane coordinate system, and the first image comprises a welding spot image of a first welding spot and a needle mark image of a first needle mark;
determining pin mark information of the first pin mark based on the first image, and registering the pin mark information of the first pin mark;
determining all second welding points of the appearance type in the chip based on the welding point information of the first welding points and the pin mark information of the first pin marks, acquiring the welding point information of each second welding point, and registering the welding point information of each second welding point so as to detect the pin marks based on the registered welding point information of each second welding point and the registered pin mark information of the first pin marks, wherein the second welding points refer to welding points which are qualified in inspection.
Optionally, the determining needle mark information of the first needle mark based on the first image includes:
and when the welding spot image and the needle mark image in the first image both meet a preset identification condition, determining the needle mark information of the first needle mark based on the needle mark image, and registering the needle mark information of the first needle mark.
Optionally, the determining needle mark information of the first needle mark based on the first image further includes:
when at least one of the welding spot image and the needle mark image in the first image does not meet a preset identification condition, determining the needle mark information of the first needle mark based on a preset needle mark image in a preset image template of the appearance type, and registering the needle mark information of the first needle mark.
Optionally, the determining all second pads of the appearance type in the chip based on the pad information of the first pad and the stitch mark information of the first stitch mark, acquiring pad information of each second pad, and registering the pad information of each second pad includes:
dividing the area of the chip by taking the vision field of the camera as a dividing condition to obtain area images of a plurality of areas and second area position information of each area image in a preset plane coordinate system;
acquiring welding point images of all welding points of the appearance type in any area image and a needle mark image of a needle mark associated with each welding point;
checking the welding spot image of each welding spot based on the welding spot information of the first welding spot to obtain a first checking result, determining the welding spots of which the first checking result meets a preset first checking condition as candidate welding spots,
examining the pin mark image of each pin mark based on the pin mark information of the first pin mark to obtain a second examination result, and determining the pin marks of which the second examination result meets a preset second examination condition as candidate pin marks;
obtaining welding point information corresponding to the candidate welding points based on the welding point image of each candidate welding point and second area position information of the area where the corresponding welding point image is located, and obtaining pin mark information corresponding to the candidate pin marks based on the pin mark image of each candidate pin mark and the second area position information of the area where the corresponding pin mark image is located;
determining candidate position relation information of the candidate welding point and the candidate pin mark in a preset plane coordinate system based on welding point information of any candidate welding point and pin mark information of the candidate pin mark associated with the candidate welding point;
when the candidate position relation information meets a preset third examination condition, determining the candidate welding spot as a second welding spot;
and acquiring the welding spot information of the second welding spots, and registering the welding spot information of each second welding spot.
Optionally, the solder joint information of the first solder joint and the solder joint information of the second solder joint both include: the method comprises the following steps of (1) position information of a welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system;
the pin mark information of the first pin mark includes size information of the pin mark.
The pin mark information of the first pin mark includes size information of the pin mark. According to a second aspect of the present invention, there is provided an apparatus for registering pads on a chip, including:
the first obtaining unit is used for obtaining welding spot information of a first welding spot of any appearance type on any chip in the wafer, wherein the first welding spot is a welding spot which is registered in advance and meets a preset first detection condition, and the first welding spot has a first pin mark which meets a preset second detection condition;
the second acquisition unit is used for acquiring a first image through a camera, wherein the first image is matched with first area position information photographed by the camera in a preset plane coordinate system, and the first image comprises a welding spot image of the first welding spot and a needle mark image of the first needle mark;
a determination unit configured to determine stitch information of the first stitch based on the first image, and register the stitch information of the first stitch;
and the registering unit is used for determining all second welding points of the appearance type in the chip based on the welding point information of the first welding point and the pin mark information of the first pin mark, acquiring the welding point information of each second welding point, and registering the welding point information of each second welding point so as to detect the pin mark based on the registered welding point information of each second welding point and the registered pin mark information of the first pin mark, wherein the second welding point is a welding point which is qualified in inspection.
Optionally, the determining unit includes:
and the first determining subunit is used for determining the needle mark information of the first needle mark based on the needle mark image and registering the needle mark information of the first needle mark when the welding spot image and the needle mark image in the first image both meet a preset identification condition.
Optionally, the determining unit further includes:
and the second determining subunit is used for determining the pin mark information of the first pin mark based on the preset pin mark image in the preset image template of the appearance type and registering the pin mark information of the first pin mark when at least one of the welding point image and the pin mark image in the first image does not meet the preset identification condition.
Optionally, the registration unit includes:
the dividing subunit is used for dividing the chip into areas by taking the visual field of the camera as a dividing condition to obtain area images of a plurality of areas and second area position information of each area image in a preset plane coordinate system;
the acquisition subunit is used for acquiring welding point images of all welding points of the appearance type in any area image and needle mark images of needle marks associated with each welding point;
the first examination subunit is used for examining the welding spot image of each welding spot based on the welding spot information of the first welding spot, obtaining a first examination result, and determining the welding spot of which the first examination result meets a preset first examination condition as a candidate welding spot;
and the number of the first and second groups,
the second examination subunit is used for examining the pin mark image of each pin mark based on the pin mark information of the first pin mark, obtaining a second examination result, and determining the pin marks of which the second examination result meets a preset second examination condition as candidate pin marks;
the obtaining subunit is used for obtaining the welding point information of the corresponding candidate welding point based on the welding point image of each candidate welding point and the second area position information of the area where the corresponding welding point image is located, and obtaining the stitch mark information of the corresponding candidate stitch mark based on the stitch mark image of each candidate stitch mark and the second area position information of the area where the corresponding stitch mark image is located;
the third determining subunit is used for determining candidate position relation information of the candidate welding point and the candidate pin mark in a preset plane coordinate system based on welding point information of any candidate welding point and pin mark information of the candidate pin mark associated with the candidate welding point;
a fourth determining subunit, configured to determine, when the candidate position relationship information satisfies a preset third examination condition, that the candidate welding point is a second welding point;
and the registering subunit is used for acquiring the welding spot information of the second welding spots, registering the welding spot information of each second welding spot and registering the welding spot information of each second welding spot.
Optionally, the welding spot information of the first welding spot and the welding spot information of the second welding spot both include: the method comprises the following steps of (1) position information of a welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system;
the pin mark information of the first pin mark includes size information of the pin mark.
Compared with the prior art, the scheme of the embodiment of the invention at least has the following beneficial effects:
the invention provides a method and a device for registering welding spots on a chip. According to the invention, a small amount of welding spots of various appearance types in the chip are registered, then all welding spots which are qualified for examination are automatically found out from the chip by using the welding spot information of the pre-registered welding spots and the pin mark information of the pin marks associated with the welding spots, and the welding spot information of the qualified welding spots and the pin mark information of the qualified pin marks are registered, so that accurate information is provided for subsequent automatic pin mark detection, and the detection precision is improved. The method for registering the welding points on the chip greatly saves the time for establishing the product manufacturing procedure and improves the testing efficiency. The problems of missing registration and multiple registrations caused by manual registration are avoided.
Drawings
FIG. 1 shows a flow diagram of a method for registration of pads on a chip according to an embodiment of the invention;
FIG. 2 shows a block diagram of elements of an apparatus for registration of pads on a chip, according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a plurality" typically includes at least two.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used to describe embodiments of the present invention, these descriptions should not be limited to these terms. These terms are only used to distinguish one description from another. For example, a first may also be referred to as a second, and similarly, a second may also be referred to as a first, without departing from the scope of embodiments of the present invention.
The words "if", as used herein may be interpreted as "at \8230; \8230whenor" when 8230; \8230when or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising one of 8230, and" comprising 8230does not exclude the presence of additional like elements in articles or devices comprising the element.
It is to be noted that the symbols and/or numerals present in the description are not reference numerals if they are not labeled in the description of the figures.
Two preparation tasks are typically required before wafer testing. The first preparation work is to classify and register all the welding spot information with pin marks on the chip according to the appearance types after the probe insertion, and simultaneously register one pin mark information on each appearance type of welding spot. The registration of the welding spot information means that welding spots with different appearance types are respectively recorded in a database corresponding to the types so as to obtain the qualification of automatic needle mark detection. The registration of the pin mark information means that one piece of pin mark information on welding points with different appearance types is respectively recorded in a pin mark database so as to assist automatic pin mark detection. The second preparation work is to perform automatic needle mark inspection of different types of pads based on the pad information and needle mark information registered in the first preparation work in order to determine whether the probe card is good. Chinese patent document CN104897687A discloses a method for automatic needle mark detection. After the two preparation operations are completed, the wafer test can be performed.
However, the first preparation is currently mainly done manually. However, a chip has many types of solder joints, and each type of solder joint can reach thousands of solder joints at most, manual registration is time-consuming, and the problem of missing registration or multiple registrations is easy to occur. Therefore, the embodiments of the present disclosure provide a method for registering pads on a chip to solve one of the above technical problems.
Alternative embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Example 1
The embodiment provided by the invention is an embodiment of a method for registering a welding spot on a chip. The following describes an embodiment of the present invention in detail with reference to fig. 1.
Step S101, welding point information of first welding points of any appearance type is obtained on any chip in the wafer.
The registration of pads on a chip is an important step in wafer inspection.
The registration of the welding points on the chip refers to the storage of the welding point information of the welding points in the chip, so that the automatic needle mark detection can be carried out through the stored information. In the prior art, the registration of the solder joints on the chip is completed manually, which is time-consuming and prone to missing registration or multiple registration. Therefore, the embodiment of the invention provides a method for registering welding spots on a chip.
In the embodiment of the present invention, the needle mark associated with the welding point means that the needle mark is pricked on the welding point.
The embodiment of the invention classifies the welding spots according to the appearance, for example, the appearance types of the welding spots comprise: circular welding spots, rectangular welding spots, oval welding spots and special-shaped welding spots.
The embodiment of the invention realizes the registration by adopting the method aiming at the welding spot of any one of a plurality of appearance types in the wafer, but does not influence the welding spots of at least one other appearance type and realizes the registration of the welding spot on the chip by adopting the method.
The first welding spots are welding spots which are registered in advance and meet a preset first detection condition, and the first welding spots have first needle marks which meet a preset second detection condition.
The preset first detection condition means that the welding spot can meet a preset welding spot appearance type condition and/or a preset welding spot size condition, for example, the preset welding spot appearance type condition includes: the method comprises the steps of presetting a circular welding spot condition, a rectangular welding spot condition, an oval welding spot condition and a special-shaped welding spot condition. The preset second detection condition is that the needle mark can meet the preset needle mark size condition.
The method of the embodiment of the invention needs to select the first welding point and the first pin mark in advance. And under the condition that the first welding spot and the first stitch mark respectively accord with visual inspection conditions, the welding spot information of the first welding spot is registered in a manual mode. The purpose of registering the first welding point in advance is to check whether the welding point information of other second welding points meets the requirements by taking the welding point information of the first welding point as a standard.
In the test, a probe is inserted into the first welding point by a contact test method, so that the signal of the first welding point is tested in a set environment, and whether the first welding point is normal or not is determined by the signal. Generally, one test probe tests one pad, and thus, the pin marks have a one-to-one correspondence with the pads, one pin mark for each pad.
Optionally, the welding spot information of the first welding spot and the welding spot information of the second welding spot both include: position information of the welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system.
The preset plane coordinate system is parallel to the plane of the chip, and may be a plane coordinate system provided by a customer or a plane coordinate system set in advance before testing.
Optionally, the pin mark information of the first pin mark includes size information of the pin mark. Depth information of the probe into the welding spot can be obtained through the size information of the needle mark.
Step S102, a first image is acquired by a camera.
The first image is matched with first area position information photographed by the camera in a preset plane coordinate system, and the first image comprises a welding spot image of the first welding spot and a needle mark image of the first needle mark.
The field of view of the camera is the area of the wafer that the camera can capture during the capture process. The first region position information is position information of a region where a first visual field to which the first image belongs is projected to a preset plane coordinate system. The first image is an image generated in the first area and includes images of all wafers in the first area.
Step S103, determining stitch information of the first stitch based on the first image, and registering the stitch information of the first stitch.
Since the pad information of the first pad is pre-registered information, this step is used to obtain the stitch mark information.
In some embodiments, the determining needle mark information of the first needle mark based on the first image, the registering the needle mark information of the first needle mark includes:
step S103a, when the welding spot image and the needle mark image in the first image both meet a preset identification condition, determining the needle mark information of the first needle mark based on the needle mark image, and registering the needle mark information of the first needle mark.
The preset identification conditions include: the maximum error between the pixel values in the edge of the welding spot image is within a preset error range, and the difference value between the pixel value in the edge of the welding spot image and the pixel value of the needle mark image is larger than a preset difference threshold value. It can be understood that the color within the edge of the weld image is uniform and the contrast between the color within the edge of the weld image and the color of the pin mark image is relatively large. The preset recognition condition is favorable for recognizing the needle mark image and the welding spot image from the first image.
And identifying the needle mark image of the first needle mark in the first image to obtain the needle mark image of the first needle mark. Size information of the needle mark is obtained by the calculation of the image of the needle mark, and depth information of the needle mark can be obtained by the calculation of the size information of the needle mark.
In other specific embodiments, the determining needle mark information of the first needle mark based on the first image, and registering the needle mark information of the first needle mark further includes:
step S103b, when at least one of the welding spot image and the needle mark image in the first image does not meet a preset identification condition, determining the needle mark information of the first needle mark based on a preset needle mark image in a preset image template of the appearance type, and registering the needle mark information of the first needle mark.
At least one of the welding point image and the needle mark image in the first image does not satisfy a preset identification condition, and it can be understood that the color in the edge of the welding point image is not uniform or the difference between the pixel value in the edge of the welding point image and the pixel value of the needle mark image is less than or equal to a preset difference threshold value, that is, the welding point and/or the needle mark are difficult to identify from the first image. For example, a stripe pattern or an irregular pattern with color change appears in the edge of the image of the welding spot, and the needle mark is not easy to be distinguished from the welding spot in an image recognition mode; alternatively, the needle mark image and the weld image are too small to be recognized. To this end, the present embodiment provides a preset image template. The preset welding spot image and the preset needle mark image in the preset image template both meet the preset identification condition, namely, the color in the edge of the preset image template is uniform, and the difference value between the pixel value in the edge of the welding spot image and the pixel value of the needle mark image is greater than a preset difference threshold value. Reference information required by auditing can be obtained through the preset image template, so that the problem that the reference information required by auditing cannot be generated due to the limitation of image identification is solved.
Step S104, determining all second welding points of the appearance type in the chip based on the welding point information of the first welding point and the needle mark information of the first needle mark, acquiring the welding point information of each second welding point, and registering the welding point information of each second welding point so as to detect the needle mark based on the registered welding point information of each second welding point and the registered needle mark information of the first needle mark.
The second welding spot refers to a welding spot which is qualified for inspection. The qualified welding spots are inspected, namely the welding spot information of the second welding spot is matched with the welding spot information of the first welding spot, and the pin mark information of the pin mark on the second welding spot is matched with the pin mark information of the first pin mark.
This step finds all the second pads that are the same as the appearance type described above and the second pin marks associated with each second pad from the chip, and registers pad information of all the second pads associated with the appearance type described above.
In some embodiments, the determining all second pads of the appearance type in the chip based on the pad information of the first pad and the pin mark information of the first pin mark, acquiring the pad information of each second pad, and registering the pad information of each second pad includes:
and step S104-1, performing area division on the chip by taking the visual field of the camera as a division condition, and obtaining area images of a plurality of areas and second area position information of each area image in a preset plane coordinate system.
The field of view of the camera refers to the area of the camera that can capture the wafer during the capture process. When dividing the area, the chip is divided into areas according to the visual field of the camera. When the area is well divided, the area position of the area is determined.
And step S104-2, acquiring welding point images of all welding points of the appearance type in any area image and a needle mark image of a needle mark associated with each welding point.
And S104-3, checking the welding spot image of each welding spot based on the welding spot information of the first welding spot to obtain a first checking result, determining the welding spot of which the first checking result meets a preset first checking condition as a candidate welding spot, checking the pin mark image of each pin mark based on the pin mark information of the first pin mark to obtain a second checking result, and determining the pin mark of which the second checking result meets a preset second checking condition as a candidate pin mark.
Optionally, the examining the solder joint image of each solder joint based on the solder joint information of the first solder joint may be understood as determining whether each solder joint is consistent with the appearance type of the first solder joint, determining whether each solder joint is consistent with the size information of the first solder joint, and determining whether the position information of each solder joint in a preset plane coordinate system is in a corresponding area of the corresponding solder joint.
The first examination result comprises: the position information of each welding spot in a preset plane coordinate system is in a corresponding area of the corresponding welding spot or in a preset plane coordinate system is not in a corresponding area of the corresponding welding spot.
The preset first examination condition comprises the following steps: the appearance types of the welding spots are consistent, the size information of the welding spots is consistent, and the position information of the welding spots in the preset plane coordinate system is in the corresponding areas of the welding spots.
Optionally, the examining the needle mark image of each needle mark based on the needle mark information of the first needle mark may be understood as determining whether each needle mark is consistent with the size information of the first needle mark.
The second review result includes being consistent with the size information of the first pin mark or being inconsistent with the size information of the first pin mark.
The preset second examination condition includes correspondence with the size information of the needle mark.
The embodiment of the invention takes the welding spot information of the first welding spot and the needle mark information of the first needle mark as one of the standards for auditing other welding spots and needle marks. However, the pad information of the first pad and the pin mark information of the first pin mark are not completely regarded as the standard of the audit. Only the welding spots meeting the preset first examination condition can be determined as candidate welding spots, and the pin marks meeting the preset second examination condition are determined as candidate pin marks.
And step S104-4, obtaining welding point information of the corresponding candidate welding point based on the welding point image of each candidate welding point and the second area position information of the area where the corresponding welding point image is located, and obtaining the stitch mark information of the corresponding candidate stitch mark based on the stitch mark image of each candidate stitch mark and the second area position information of the area where the corresponding stitch mark image is located.
Optionally, the welding spot information of the first welding spot and the welding spot information of the second welding spot both include: position information of the welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system.
The appearance type of the welding spot and/or the size information of the welding spot can be obtained through image recognition, and the position information of the welding spot in the preset plane coordinate system needs to be obtained through the area position information of the area where the welding spot image is located and the position information of the welding spot in the area image.
Optionally, the pin mark information of the first pin mark includes size information of the pin mark.
The size information of the needle mark can be obtained by image recognition.
And step S104-5, determining candidate position relation information of the candidate welding point and the candidate pin marks in a preset plane coordinate system based on the welding point information of any candidate welding point and the pin mark information of the candidate pin marks associated with the candidate welding point.
The candidate position relation information is position relation information between the candidate welding points and the candidate pin marks projected to a preset plane coordinate system.
The characteristic information of the welding spot is recorded in the welding spot information, and the characteristic information of the needle mark is recorded in the needle mark information. The candidate position relation information can be used for associating the welding spot with the pin mark, and whether the welding spot and the pin mark meet the test requirement or not is determined.
And step S104-6, when the candidate position relation information meets a preset third examination condition, determining the candidate welding spot as a second welding spot.
The preset third examination condition is that: the projection of the candidate pin mark is positioned in the projection area of the candidate welding point. And if the candidate position relation information meets a preset third examination condition, determining the candidate welding point as a second welding point.
And step S104-7, acquiring and registering the welding spot information of the second welding spots, and registering the welding spot information of each second welding spot.
The solder joints and the pin marks of each appearance type in the chip can be registered by the above method. After registration, accurate detection conditions are provided for subsequent automatic needle mark detection, and detection precision is improved.
The embodiment of the invention provides a method and a device for registering welding spots on a chip. According to the invention, a small amount of welding spots of various appearance types in the chip are registered, then all welding spots which are qualified for examination are automatically found out from the chip by using the welding spot information of the pre-registered welding spots and the pin mark information of the pin marks associated with the welding spots, and the welding spot information of the qualified welding spots and the pin mark information of the qualified pin marks are registered, so that accurate information is provided for subsequent automatic pin mark detection, and the detection precision is improved. The method for registering the welding points on the chip greatly saves the time for establishing the product manufacturing process and improves the testing efficiency. The problems of missing registration and multiple registrations caused by manual registration are avoided.
Example 2
The present invention also provides an apparatus embodiment adapted to the above embodiment, for implementing the method steps described in the above embodiment, and the explanation based on the same name and meaning is the same as that of the above embodiment, and has the same technical effect as that of the above embodiment, and is not described again here.
As shown in fig. 2, the present invention provides an apparatus 200 for registering pads on a chip, comprising:
a first obtaining unit 201, configured to obtain solder joint information of a first solder joint of any appearance type on any chip in a wafer, where the first solder joint is a pre-registered solder joint that meets a preset first detection condition, and the first solder joint has a first pin mark that meets a preset second detection condition;
a second obtaining unit 202, configured to obtain a first image through a camera, where the first image is matched with first area position information photographed by the camera in a preset planar coordinate system, and the first image includes a welding spot image of the first welding spot and a needle mark image of the first needle mark;
a determination unit 203 configured to determine needle mark information of the first needle mark based on the first image, and register the needle mark information of the first needle mark;
a registering unit 204, configured to determine all second pads of the appearance type in the chip based on the pad information of the first pad and the pin mark information of the first pin mark, acquire the pad information of each second pad, and register the pad information of each second pad, so as to perform pin mark detection based on the registered pad information of each second pad and the registered pin mark information of the first pin mark, where the second pad is a qualified pad.
Optionally, the determining unit 203 includes:
and the first determining subunit is used for determining the needle mark information of the first needle mark based on the needle mark image and registering the needle mark information of the first needle mark when the welding spot image and the needle mark image in the first image both meet a preset identification condition.
Optionally, the determining unit 203 further includes:
and the second determining subunit is used for determining the needle mark information of the first needle mark based on the preset needle mark image in the preset image template of the appearance type and registering the needle mark information of the first needle mark when at least one of the welding spot image and the needle mark image in the first image does not meet the preset identification condition.
Optionally, the registering unit 204 includes:
the dividing subunit is used for dividing the chip into areas by taking the visual field of the camera as a dividing condition to obtain area images of a plurality of areas and second area position information of each area image in a preset plane coordinate system;
the acquisition subunit is used for acquiring welding point images of all welding points of the appearance type in any area image and a pin mark image of a pin mark associated with each welding point;
the first examination subunit is used for examining the welding spot image of each welding spot based on the welding spot information of the first welding spot, obtaining a first examination result, and determining the welding spot of which the first examination result meets a preset first examination condition as a candidate welding spot;
and the number of the first and second groups,
the second examination subunit is used for examining the pin mark image of each pin mark based on the pin mark information of the first pin mark, obtaining a second examination result, and determining the pin marks of which the second examination result meets a preset second examination condition as candidate pin marks;
the obtaining subunit is used for obtaining the welding point information of the corresponding candidate welding point based on the welding point image of each candidate welding point and the second area position information of the area where the corresponding welding point image is located, and obtaining the pin mark information of the corresponding candidate pin mark based on the pin mark image of each candidate pin mark and the second area position information of the area where the corresponding pin mark image is located;
the third determining subunit is used for determining candidate position relation information of the candidate welding point and the candidate pin mark in a preset plane coordinate system based on welding point information of any candidate welding point and pin mark information of the candidate pin mark associated with the candidate welding point;
a fourth determining subunit, configured to determine, when the candidate position relationship information satisfies a preset third examination condition, that the candidate welding point is a second welding point;
and the registering subunit is used for acquiring the welding spot information of the second welding spots, registering the welding spot information of each second welding spot, and registering the welding spot information of each second welding spot.
Optionally, the welding spot information of the first welding spot and the welding spot information of the second welding spot both include: the method comprises the following steps of (1) position information of a welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system;
the pin mark information of the first pin mark includes size information of the pin mark.
The embodiment of the invention provides a method and a device for registering welding spots on a chip. According to the invention, a small amount of welding spots of various appearance types in the chip are registered, then all welding spots which are qualified for examination are automatically found out from the chip by using the welding spot information of the pre-registered welding spots and the pin mark information of the pin marks associated with the welding spots, and the welding spot information of the qualified welding spots and the pin mark information of the qualified pin marks are registered, so that accurate information is provided for subsequent automatic pin mark detection, and the detection precision is improved. The method for registering the welding points on the chip greatly saves the time for establishing the product manufacturing process and improves the testing efficiency. The problems of missing registration and multiple registrations caused by manual registration are avoided.
Finally, it should be noted that: the embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The system or the device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for registering welding spots on a chip is characterized by comprising the following steps:
obtaining welding spot information of a first welding spot of any appearance type on any chip in a wafer, wherein the first welding spot is a welding spot which is registered in advance and meets a preset first detection condition, and the first welding spot has a first needle mark which meets a preset second detection condition;
acquiring a first image through a camera, wherein the first image is matched with first area position information photographed by the camera in a preset plane coordinate system, and the first image comprises a welding spot image of a first welding spot and a needle mark image of a first needle mark;
determining pin mark information of the first pin mark based on the first image, and registering the pin mark information of the first pin mark;
determining all second welding points of the appearance type in the chip based on the welding point information of the first welding point and the pin mark information of the first pin mark, acquiring the welding point information of each second welding point, and registering the welding point information of each second welding point so as to detect the pin mark based on the registered welding point information of each second welding point and the registered pin mark information of the first pin mark, wherein the second welding point refers to a qualified welding point, the qualified welding point refers to the welding point information of the second welding point matched with the welding point information of the first welding point, and the pin mark information of the pin mark on the second welding point is matched with the pin mark information of the first pin mark.
2. The method of claim 1, wherein determining stitch information for the first stitch based on the first image, registering the stitch information for the first stitch, comprises:
and when the welding spot image and the needle mark image in the first image both meet a preset identification condition, determining the needle mark information of the first needle mark based on the needle mark image, and registering the needle mark information of the first needle mark.
3. The method of claim 2, wherein the determining pin mark information for the first pin mark based on the first image, registering pin mark information for the first pin mark, further comprises:
when at least one of the welding spot image and the needle mark image in the first image does not meet a preset identification condition, determining the needle mark information of the first needle mark based on a preset needle mark image in a preset image template of the appearance type, and registering the needle mark information of the first needle mark.
4. The method of claim 2, wherein determining all second pads of the appearance type in the chip based on the pad information of the first pad and the stitch mark information of the first stitch mark, and obtaining pad information of each second pad, and registering the pad information of each second pad comprises:
dividing the area of the chip by taking the vision field of the camera as a dividing condition to obtain area images of a plurality of areas and second area position information of each area image in a preset plane coordinate system;
acquiring welding point images of all welding points of the appearance type in any area image and a needle mark image of a needle mark associated with each welding point;
checking the welding spot image of each welding spot based on the welding spot information of the first welding spot to obtain a first checking result, determining the welding spots of which the first checking result meets a preset first checking condition as candidate welding spots,
examining the pin mark image of each pin mark based on the pin mark information of the first pin mark to obtain a second examination result, and determining the pin marks of which the second examination result meets a preset second examination condition as candidate pin marks;
obtaining welding point information of corresponding candidate welding points based on the welding point image of each candidate welding point and second area position information of an area where the corresponding welding point image is located, and obtaining pin mark information of corresponding candidate pin marks based on the pin mark image of each candidate pin mark and the second area position information of the area where the corresponding pin mark image is located;
determining candidate position relation information of the candidate welding point and the candidate pin mark in a preset plane coordinate system based on welding point information of any candidate welding point and pin mark information of the candidate pin mark associated with the candidate welding point;
when the candidate position relation information meets a preset third examination condition, determining the candidate welding spot as a second welding spot;
and acquiring the welding spot information of the second welding spots, and registering the welding spot information of each second welding spot.
5. The method of claim 1, wherein the weld point information for the first weld point and the weld point information for the second weld point each comprise: the method comprises the following steps of (1) position information of a welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system;
the pin mark information of the first pin mark includes size information of the pin mark.
6. An apparatus for registering solder joints on a chip, comprising:
the first obtaining unit is used for obtaining welding spot information of a first welding spot of any appearance type on any chip in the wafer, wherein the first welding spot is a welding spot which is registered in advance and meets a preset first detection condition, and the first welding spot has a first pin mark which meets a preset second detection condition;
the second acquisition unit is used for acquiring a first image through a camera, wherein the first image is matched with first area position information photographed by the camera in a preset plane coordinate system, and the first image comprises a welding spot image of the first welding spot and a needle mark image of the first needle mark;
a determination unit configured to determine stitch mark information of the first stitch mark based on the first image, and register the stitch mark information of the first stitch mark;
and the registration unit is used for determining all second welding points of the appearance type in the chip based on the welding point information of the first welding point and the pin mark information of the first pin mark, acquiring the welding point information of each second welding point, and registering the welding point information of each second welding point so as to detect the pin mark based on the registered welding point information of each second welding point and the registered pin mark information of the first pin mark, wherein the second welding point is a welding point which is qualified by inspection, the qualified welding point is that the welding point information of the second welding point is matched with the welding point information of the first welding point, and the pin mark information of the pin mark on the second welding point is matched with the pin mark information of the first pin mark.
7. The apparatus of claim 6, wherein the determining unit comprises:
and the first determining subunit is used for determining the needle mark information of the first needle mark based on the needle mark image and registering the needle mark information of the first needle mark when the welding spot image and the needle mark image in the first image both meet a preset identification condition.
8. The apparatus of claim 7, wherein the determining unit further comprises:
and the second determining subunit is used for determining the needle mark information of the first needle mark based on the preset needle mark image in the preset image template of the appearance type and registering the needle mark information of the first needle mark when at least one of the welding spot image and the needle mark image in the first image does not meet the preset identification condition.
9. The apparatus of claim 7, wherein the registration unit comprises:
the dividing subunit is used for dividing the chip into areas by taking the visual field of the camera as a dividing condition to obtain area images of a plurality of areas and second area position information of each area image in a preset plane coordinate system;
the acquisition subunit is used for acquiring welding point images of all welding points of the appearance type in any area image and needle mark images of needle marks associated with each welding point;
the first examination subunit is used for examining the welding spot image of each welding spot based on the welding spot information of the first welding spot, obtaining a first examination result, and determining the welding spot of which the first examination result meets a preset first examination condition as a candidate welding spot;
and the number of the first and second groups,
the second examination subunit is used for examining the pin mark image of each pin mark based on the pin mark information of the first pin mark, obtaining a second examination result, and determining the pin marks of which the second examination result meets a preset second examination condition as candidate pin marks;
the obtaining subunit is used for obtaining the welding point information of the corresponding candidate welding point based on the welding point image of each candidate welding point and the second area position information of the area where the corresponding welding point image is located, and obtaining the stitch mark information of the corresponding candidate stitch mark based on the stitch mark image of each candidate stitch mark and the second area position information of the area where the corresponding stitch mark image is located;
the third determining subunit is used for determining candidate position relation information of the candidate welding point and the candidate pin mark in a preset plane coordinate system based on welding point information of any candidate welding point and pin mark information of the candidate pin mark associated with the candidate welding point;
a fourth determining subunit, configured to determine, when the candidate position relationship information satisfies a preset third examination condition, that the candidate welding point is a second welding point;
and the registering subunit is used for acquiring the welding spot information of the second welding spots and registering the welding spot information of each second welding spot.
10. The apparatus of claim 6, wherein the weld point information for the first weld point and the weld point information for the second weld point each comprise: the method comprises the following steps of (1) position information of a welding spot, appearance type of the welding spot and/or size information of the welding spot in a preset plane coordinate system;
the stitch mark information of the first stitch mark includes size information of the stitch mark.
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