CN114253918A - Method for processing first measurement and retest information of wafer through STDF file - Google Patents
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- 238000012545 processing Methods 0.000 title claims abstract description 12
- 238000012360 testing method Methods 0.000 claims abstract description 42
- 238000013101 initial test Methods 0.000 claims abstract description 4
- 230000000007 visual effect Effects 0.000 claims description 3
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Abstract
The invention discloses a method for processing first measurement and retest information of a wafer through an STDF file, which comprises the following steps: s100, linking to the STDF file according to the storage path of the STDF file; s200, reading the STDF file according to the storage path, searching fields corresponding to initial test and retest according to the specification of the STDF file, and reading data of the fields, wherein the fields at least comprise a field related to test time, a field related to BIN and a field related to DIE coordinates; and S300, outputting the information of the first wafer test and the retest of the wafer according to the data of the field. The invention abandons the method which is easy to make mistakes and has low efficiency in the prior art, is more rapid and convenient, is not easy to make mistakes, and is convenient for operators to rapidly and accurately carry out statistics and analysis on the first measurement information and the retest information.
Description
Technical Field
The invention belongs to the field of wafer testing, and particularly relates to a method for processing first test information and retest information of a wafer through an STDF file.
Background
The main purpose of wafer testing is to unpackage the tested bad chips, thereby reducing the packaging cost. In the field of wafer testing, Probe cards (probecard) are the intermediary between a wafer and a tester. The probe card is typically placed directly on the probe station prober and connected to the tester with wires. The purpose of the probe card is to provide the connection between the chip and the tester and to complete the wafer test. FIG. 1 illustrates related equipment and a MAP during a wafer test session in the prior art.
The most important Data specification of the wafer Test Data in this field is stdf (standard Test Data file), i.e. standard Test Data file, published by Teradyne in 1985, which has been developed for over 30 years so far and is very mature. The STDF file contains summary information and test results of all test items. The STDF file adopts a uniform format/specification to store all types of test data generated by CP or FT chip tests, and solves the problem that the test data formats generated by different brands of test machines in the chip test industry are not uniform, so that in the semiconductor industry, both tester suppliers, chip test companies and chip design companies pay great attention to the use of the STDF file.
However, it is precisely the STDF that contains all types of test data and features belonging to binary files rather than plaintext characters, and the size of the STDF file may be GB as the wafer test proceeds. In the prior art, if an operator wants to statistically analyze the first test and retest conditions of a wafer through an STDF file, the STDF file needs to be loaded through analysis software, at this time, file loading interruption may be caused by an excessively large file, even if loading the STDF file after repeated times is successful, data related to the first test and retest of the wafer in the STDF file can only be read according to the analysis software for each die of the binary file, and data related to the first test and retest of the wafer in a large amount of data are selected, and then further analysis is performed by using other analysis tools according to the selected data or MAP is established by using other tools according to the selected data.
The following table 1 illustrates exemplary data fields of mir (master Information record) in STDF file specification version 4:
TABLE 1
In addition to the MIRs exemplified in table 1 above, MPRs, PTRs, FTRs, MRRs, and the like are included in the STDF file. Therefore, the STDF file is almost always wrapped and is likely to be too large in size with the wafer test operation, and even if the information in the STDF file can be read in plain text after the STDF file is manually loaded into the parsing software, time is likely to be wasted because the STDF file is loaded repeatedly and successfully, or data is likely to be mistaken when the data is viewed due to visual fatigue.
Therefore, a technical scheme for processing first measurement information and second measurement information, which is efficient and not prone to errors, is needed to be established according to the STDF file.
Disclosure of Invention
In view of this, the present invention provides a method for processing first measurement and retest information of a wafer through an STDF file, the method comprising the steps of:
s100, linking to the STDF file according to the storage path of the STDF file;
s200, reading the STDF file according to the storage path, searching fields corresponding to initial test and retest according to the specification of the STDF file, and reading data of the fields, wherein the fields at least comprise a field related to test time, a field related to BIN and a field related to DIE coordinates;
and S300, outputting the information of the first wafer test and the retest of the wafer according to the data of the field.
Preferably, the first and second liquid crystal materials are,
in step S300, when information is output, a corresponding MAP is generated.
Preferably, the first and second liquid crystal materials are,
and the MAP shows the corresponding coordinates of the first measured area, the second measured area and the corresponding BIN value.
Preferably, the first and second liquid crystal materials are,
the first measured MAP is displayed above the retested MAP in a visual manner, and the first measured MAP and the retested MAP are presented to the operator in an up-down arrangement.
Preferably, the first and second liquid crystal materials are,
in step S200, during the reading process, all fields irrelevant to the fields are skipped to accelerate reading of data useful for first test and retest in the STDF file.
Preferably, the first and second liquid crystal materials are,
in step S200, during reading, reading is performed in a manner of preventing overflow of reading of the large file.
Preferably, the first and second liquid crystal materials are,
the MAP includes the following data: original quadrant, current quadrant, minimum coordinate MinXY, maximum coordinate MaxXY, angle, BIN type.
The invention has the following technical effects:
through the scheme, the method for directly loading the complete STDF file in the prior art, which possibly needs to be loaded for multiple times and needs to be combined with manual operation and various different analysis software, is abandoned, and compared with the prior art, the method is quicker and more convenient, is not easy to make mistakes, and is convenient for operators to carry out statistics and analysis on the first measurement information and the retest information of the wafer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a wafer testing process in the prior art;
FIG. 2 is a schematic diagram of a processing device and its modules explained in one embodiment of the invention;
FIG. 3 is a schematic representation of the method of reading an STDF by a corresponding device in accordance with an embodiment of the present invention;
FIG. 4 is a schematic representation of the method as performed by a corresponding apparatus in one embodiment of the invention;
fig. 5 is a schematic illustration of the method as performed by a corresponding apparatus in one embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 5 of the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
In one embodiment, the present invention discloses a method for processing wafer first test and second test information through an STDF file, the method comprising the steps of:
s100, linking to the STDF file according to the storage path of the STDF file;
s200, reading the STDF file according to the storage path, searching fields corresponding to initial test and retest according to the specification of the STDF file, and reading data of the fields, wherein the fields at least comprise a field related to test time, a field related to BIN and a field related to DIE coordinates;
and S300, outputting the information of the first wafer test and the retest of the wafer according to the data of the field.
For the embodiment, even if the STDF file is large, the invention only searches for some specific fields and processes information according to the data of the fields, which not only can avoid the problem of loading error caused by directly loading the STDF file in the prior art, but also can fully utilize the data processing technology to improve the inefficiency problem of processing the first test and the second test information by manpower and various kinds of software in the art.
Preferably, the first and second liquid crystal materials are,
in step S300, when information is output, a corresponding MAP is generated.
Preferably, the first and second liquid crystal materials are,
and the MAP shows the corresponding coordinates of the first measured area, the second measured area and the corresponding BIN value.
Preferably, the first and second liquid crystal materials are,
the first measured MAP is displayed above the retested MAP in a visual manner, and the first measured MAP and the retested MAP are presented to the operator in an up-down arrangement.
Preferably, the first and second liquid crystal materials are,
in step S200, during the reading process, all fields irrelevant to the fields are skipped to accelerate reading of data useful for first test and retest in the STDF file.
Preferably, the first and second liquid crystal materials are,
in step S200, during reading, reading is performed in a manner of preventing overflow of reading of the large file.
Preferably, the first and second liquid crystal materials are,
the MAP includes the following data: original quadrant, current quadrant, minimum coordinate MinXY, maximum coordinate MaxXY, angle, BIN type.
More preferably, it is a mixture of more preferably,
the method for preventing the large file reading overflow comprises the following steps: reading the header file line by line according to the specification of the STDF file; and/or, dividing the STDF file into a plurality of small files according to the specification of the STDF file; and/or, according to the specification of the STDF file, a plurality of threads read all the fields and process asynchronously according to the thread pool; and/or reading all the fields of the STDF in a streaming way and simultaneously filtering the fields which are not needed so as to obtain all the fields and the like according to the specification of the STDF file.
More preferably, it is a mixture of more preferably,
step S200 is performed in the background.
Referring to fig. 2, it discloses an apparatus for processing the wafer first measurement and second measurement information by STDF file of the present invention, said apparatus comprising:
a reading and analyzing module, configured to read the STDF file according to the storage path, find fields corresponding to the first test and the retest according to the specification of the STDF file, and read data of the fields, where the fields at least include a field related to test time, a field related to BIN, and a field related to DIE coordinates;
and the output display module is used for outputting and displaying the information of the first measurement and the retest of the wafer according to the data of the field.
With further reference to fig. 3, fig. 4 illustrates the relevant user interaction and result presentation when the apparatus performs the method of the present invention. In order to avoid the trouble of inputting a file storage path, in the apparatus, a designated STDF file may be selected by a select file function, and then a LOAD function may be selected, so that the file is read and output in fig. 4. It can be found that when there is no retest information, only the first measured MAP is displayed.
Further referring to fig. 5, if after reading the STDF file, the MAPs of two graphs are displayed, it is described that a retest condition occurs in a partial region of the physical wafer corresponding to the current STDF file, and the MAP is displayed in the manner of fig. 5, where the upper region 1 is the MAP measured first; the lower region 2 is the region where retesting occurs.
Preferably, the first and second liquid crystal materials are,
the MAP graphs of the first measurement and the second measurement can be further exported into an excel file format.
The excel file format is preferred, and the following characteristics of excel are utilized exactly and fully: the location of each cell may correspond to the coordinates of the MAP, the contents of the cells may represent the test results, and the cells may be highlighted in different colors.
In conclusion, the method disclosed by the invention abandons the method that the complete STDF file is directly loaded in the prior art, which may need to be loaded for multiple times and needs to be combined with manual operation and various different analysis software.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (7)
1. A method for processing first measurement and retest information of a wafer through an STDF file comprises the following steps:
s100, linking to the STDF file according to the storage path of the STDF file;
s200, reading the STDF file according to the storage path, searching fields corresponding to initial test and retest according to the specification of the STDF file, and reading data of the fields, wherein the fields at least comprise a field related to test time, a field related to BIN and a field related to DIE coordinates;
and S300, outputting the information of the first wafer test and the retest of the wafer according to the data of the field.
2. The method of claim 1, wherein, preferably,
in step S300, when information is output, a corresponding MAP is generated.
3. The method of claim 2, wherein,
and the MAP shows the corresponding coordinates of the first measured area, the second measured area and the corresponding BIN value.
4. The method of claim 2, wherein,
the first measured MAP is displayed above the retested MAP in a visual manner, and the first measured MAP and the retested MAP are presented to the operator in an up-down arrangement.
5. The method of claim 1, wherein,
in step S200, during the reading process, all fields irrelevant to the fields are skipped to accelerate reading of data useful for first test and retest in the STDF file.
6. The method of claim 1, wherein,
in step S200, during reading, reading is performed in a manner of preventing overflow of reading of the large file.
7. The method of claim 2, wherein,
the MAP includes the following data: original quadrant, current quadrant, minimum coordinate MinXY, maximum coordinate MaxXY, angle, BIN type.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118501670A (en) * | 2024-07-17 | 2024-08-16 | 杭州长川科技股份有限公司 | Wafer retest method, wafer test system, test machine and readable storage medium |
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Cited By (1)
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| CN118501670A (en) * | 2024-07-17 | 2024-08-16 | 杭州长川科技股份有限公司 | Wafer retest method, wafer test system, test machine and readable storage medium |
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