CN114126229A - Laser drilling method and machining equipment - Google Patents
Laser drilling method and machining equipment Download PDFInfo
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- CN114126229A CN114126229A CN202111375310.8A CN202111375310A CN114126229A CN 114126229 A CN114126229 A CN 114126229A CN 202111375310 A CN202111375310 A CN 202111375310A CN 114126229 A CN114126229 A CN 114126229A
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- 238000005553 drilling Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000003754 machining Methods 0.000 title abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 184
- 238000012545 processing Methods 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 154
- 239000002344 surface layer Substances 0.000 claims description 81
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The application provides a laser drilling method and processing equipment, wherein the laser drilling method is used for drilling a plate to be processed, and the plate to be processed comprises a first material layer and a second material layer which are arranged in a stacked mode. The laser drilling method comprises the following steps: and burning through the second material layer by using a second laser. The first material layer is burned through using a first laser. Wherein the second material layer has a higher absorptivity to the second laser light than the first material layer. This application utilizes the second material layer to the lower this characteristic of absorptivity of first laser for first laser can reduce the injury to the second material layer when processing first material layer, has guaranteed the processingquality in hole, can also make the machining efficiency who treats different materials on the processing board obtain promoting, and then improves total machining efficiency. The application also provides a machining device which applies the laser drilling method. By adopting the laser drilling method and the processing equipment in the scheme, the quality and the efficiency of laser perforation can be improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of laser drilling processing, in particular to a laser drilling method and processing equipment.
[ background of the invention ]
With the rapid development of the electronic industry, the requirement on the circuit board manufacturing industry is higher and higher, the layer number of the circuit board is more and more, the hole density is increased continuously, and the diameter is reduced continuously.
Generally, the circuit board body includes various materials such as resin, rubber, and copper. Because circuit conductors are present on both sides of the circuit board, there must be adequate electrical connections between the two sides, and the "bridge" between such circuits is called a via. The mechanical drilling machine in the prior art can not meet the requirements of products in terms of productivity and quality when used for machining the micro through holes, and the high-energy and collimation properties of laser drilling provide a convenient way for machining the micro through holes.
However, when a circuit board formed by combining multiple materials is drilled by laser in the prior art, quality defects such as uneven processing, large roundness difference between the light inlet orifice and the light outlet orifice and the like are caused, the overall processing efficiency is not high, and the processing efficiency and the processing quality are affected.
[ summary of the invention ]
In view of this, the present application provides a laser drilling method and a processing apparatus, so as to solve the problems of low processing efficiency and poor processing quality of the laser drilling scheme in the prior art.
The application provides a laser drilling method, which is used for drilling a plate to be processed, wherein the plate to be processed comprises a first material layer and a second material layer which are arranged in a stacked mode. The method comprises the following steps: and burning through the second material layer by using a second laser. Burning through the first material layer using a first laser. Wherein an absorptivity of the second material layer to the second laser light is higher than an absorptivity of the second material layer to the first laser light.
In the above scheme, utilize the second material layer to the lower this characteristic of absorptivity of first laser for first laser can reduce the injury to the second material layer when processing first material layer, has guaranteed the processingquality in hole, can also make the machining efficiency who treats different materials on the processing board obtain promoting, and then improves total machining efficiency. And because different materials have different absorptivity to the same laser, when one material is burned by using a certain laser, even if the laser irradiates another material, the absorptivity of the other material to the laser is not high, so that the influence caused by processing errors is avoided, and the burning accuracy is further improved. In conclusion, the laser drilling method in the scheme can improve the quality and efficiency of laser drilling.
In one possible design, the first material layer is a resin layer, the first laser is an infrared laser, the second material layer is a copper layer, and the second laser is an ultraviolet laser.
In the scheme, because the infrared laser has large spot area and high energy, the processing efficiency of the infrared laser to the resin layer is obviously higher than that of the ultraviolet laser, and the copper has high absorption degree to the ultraviolet laser, so that the resin plate coated with copper on two sides can be quickly burnt through under the irradiation of the infrared laser and the ultraviolet laser, and the processed holes have good quality. In one possible design, the thickness of the first material layer is 100-.
In the scheme, the first material layer within the thickness range can be well burnt through under the irradiation of the first laser and forms a high-quality hole structure.
In one possible design, the thickness of the second material layer is 5-15 μm.
In the scheme, the second material layer within the thickness range can be well burnt through under the irradiation of the second laser and forms a high-quality hole structure.
In one possible design, the firing through the first material layer with the first laser includes:
and irradiating the first material layer with the first laser for multiple times, wherein the focal position of each irradiation is moved in the thickness direction of the first material layer, and the moving direction of the focal position is the same as the irradiation direction of the first laser.
In the above scheme, the first material layer can be burned layer by changing the focusing position of the first laser on the first material layer, so that a hole structure with good surface quality and high uniformity is formed on the first material layer.
In one possible design, the firing through the first material layer with the first laser includes:
the first laser is focused on the first material layer to form a plurality of light spots, and the light spots are arranged around the center of the processing position.
In the scheme, the small light spots are combined into the large light spot, the edge energy of the hole and the energy of the central part of the hole can be uniformly allocated in the hole winding processing mode, and the burr problem caused by the excessively small edge energy is effectively prevented.
In one possible design, the second material layer includes an upper surface layer disposed above the first material layer and a lower surface layer disposed below the first material layer, the first laser and the second laser are both irradiated along a direction in which the upper surface layer is directed to the lower surface layer, and the laser drilling method includes:
and S1, irradiating the upper surface layer by using the second laser and burning through the upper surface layer, wherein the spot diameter formed on the upper surface layer by the second laser is D1. And S2, irradiating the first material layer by using the first laser and burning through the first material layer, wherein the spot diameter formed on the first material layer by the first laser is D2. And S3, irradiating the lower surface layer by using the second laser and burning through the lower surface layer, wherein the spot diameter formed on the lower surface layer by using the second laser is D3. Wherein D2> D1> D3.
In the scheme, the upper surface layer, the first material layer and the lower surface layer are sequentially burnt through, the overall structure and the quality of the upper hole of the plate to be processed are adjusted by controlling the diameter of light spots irradiated on the upper surface layer, the first material layer and the lower surface layer, the surface quality of the processed hole opening is guaranteed to be smooth, the roundness of the hole opening of the light incident surface and the hole opening of the light emergent surface are close, and the hole pattern consistency is high.
In one possible design, the spot diameter formed by the first laser on the first material layer is larger than the spot diameter formed by the second laser on the upper surface layer by 20-30 microns.
In the above aspect, the difference between the spot diameter formed on the first material layer by the first laser and the spot diameter formed on the upper surface layer by the second laser is defined. When the first material layer positioned in the middle layer is processed, the processed hole has good surface quality and high verticality.
The present application further provides a processing apparatus, including: the laser emitting device comprises a first emitting head capable of emitting first laser and a second emitting head capable of emitting second laser. The switching device is arranged below the laser emitting device, is used for moving the plate to be processed, which is placed below the first emitting head, to the position below the second emitting head, and is also used for moving the plate to be processed, which is placed below the second emitting head, to the position below the first emitting head.
In the above scheme, the board to be processed can change position under the first emitting head and the second emitting head of laser emission device under auto-change device's drive for the board to be processed can form the through-hole structure under the alternative irradiation of first laser and second laser, adopts this equipment to carry out spot facing work can improve production efficiency and processingquality.
In a possible design, the processing equipment further comprises a feeding and discharging device and a table board, wherein the table board is arranged below the laser emitting device, and the table board is used for bearing a plate to be processed. The feeding and discharging device is arranged on one side of the table board and used for placing the board to be processed on the table board, and the feeding and discharging device is also used for taking the board to be processed away from the table board.
In the scheme, the automation degree of the drilling process of the plate to be processed is improved by additionally arranging the feeding and discharging device, the labor burden of workers is reduced, and the production efficiency and the production quality are improved.
Additional features and advantages of embodiments of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of embodiments of the present application. The objectives and other advantages of the embodiments of the application will be realized and attained by the structure particularly pointed out in the written description and drawings.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a flowchart of a laser drilling method provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of the drilling of the top surface layer according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating the operation of drilling a first material layer according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating positions of a plurality of light spots when a first material layer is drilled according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating the operation of drilling the lower surface layer according to the embodiment of the present application.
Reference numerals:
100. a plate to be processed; 1. an upper surface layer; 2. a first material layer; 3. a lower surface layer;
the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
When the double-sided copper-clad PCB is directly processed by adopting laser (or a core layer in a multi-layer PCB is processed), the laser beam states of the light incident surface and the light emergent surface are obviously different, the collimation of the light beam of the light incident surface is good, and the energy acting on the surface of a material is balanced; on the light emergent surface, the light beam passes through the processing medium (surface copper foil, FR-4 grade substrate) and becomes partially divergent, and the energy of the light beam is correspondingly attenuated. Therefore, the processing quality (aperture size and roundness of the aperture) of the light incident surface versus the light emitting surface is greatly different. This application is through using different laser type to the different material layers of PCB board for its whole uniformity is better in the drill way after the laser beam machining, and can satisfy large-scale industrial production's demand.
The following describes a specific embodiment of the laser drilling method according to the structure of the laser drilling method provided in the embodiments of the present application.
The application provides a method for laser drilling a board 100 to be processed, wherein the board 100 to be processed comprises a first material layer and a second material layer. The method comprises the following steps: and burning through the second material layer by using a second laser. The first material layer is burned through using a first laser. Wherein an absorptivity of the second material layer to the second laser light is higher than an absorptivity of the second material layer to the first laser light, and an absorptivity of the first material layer to the first laser light may be higher than or equal to an absorptivity of the first material layer to the second laser light.
The board 100 to be processed may be a circuit board (also referred to as a copper clad laminate) commonly used in the electronic industry, and the circuit board mainly includes: the base plate mainly comprises a resin laminated plate consisting of high-molecular synthetic resin and reinforcing materials, the synthetic resin is various in types, phenolic resin, epoxy resin, polytetrafluoroethylene and the like are commonly used, the reinforcing materials are generally paper and cloth, and the reinforcing materials determine the mechanical properties of the base plate, such as dip soldering resistance, bending strength and the like. The copper foil is a key material for manufacturing the copper clad plate, has higher conductivity and good weldability, is easier to etch and drill as the copper foil is thinner, and is particularly suitable for manufacturing high-density printed boards with complicated circuits. The copper clad laminate adhesive is an important factor for firmly covering the copper foil on the substrate, and can be common glue, and the performance of the adhesive determines the peeling strength of the copper clad laminate.
In this embodiment, the board to be processed 100 may be a three-layer structure of "a second material layer, a first material layer, and a second material layer", or may be another structure in which the first material layer and the second material layer are stacked and combined in any order, and an absorption rate of the second material layer to the second laser light is higher than that of the second material layer to the first laser light. The absorptivity of the material to the laser can represent the difficulty of depositing laser energy into the material, and the higher the absorptivity, the more energy is transferred to the material by the laser, and the better the burning effect is. In some embodiments, the processing efficiency of the first material layer processed by the first laser may be higher than that of the first material layer processed by the second laser, so that the overall processing and drilling efficiency may be improved.
When the laser drilling method in this embodiment is adopted, the plate to be processed may be placed horizontally, and the second material layer is irradiated with the second laser, after the second material layer is completely burnt through, the first material layer below the second material layer is exposed, at this time, the first material layer is irradiated with the first laser by switching to the first laser, and in this process, the first laser needs to penetrate through the hole formed by burning through the second laser on the second material layer, so the first laser inevitably contacts with the hole wall of part of the second material layer or other parts, but because the absorption rate of the second material layer to the first laser is not high, so the process does not have a great influence on the hole wall of the second material layer, and the processing quality of the plate to be processed is ensured.
In addition, because the processing efficiency of different types of laser to the same material is different (for example, the processing efficiency of infrared laser to resin is higher than the processing efficiency of ultraviolet laser to resin), the laser with high processing efficiency to the material can be selected as much as possible when the laser is selected, and further the overall drilling speed is improved.
In summary, in the embodiment, different lasers are used for different processing efficiencies of different types of materials, and the specific material is burned by the specific type of laser, so that the processing efficiencies of different materials on the board to be processed are improved, and further the overall processing efficiency is improved. And because different materials have different absorptivity to the same laser, when one material is burned by using a certain laser, even if the laser irradiates another material, the absorptivity of the other material to the laser is not high, so that the influence caused by processing errors is avoided, and the burning accuracy is further improved. In conclusion, the laser drilling method in the scheme can improve the quality and efficiency of laser drilling.
In one embodiment, the first material layer is a resin layer, the first laser is an infrared laser, the second material layer is a copper layer, and the second laser is an ultraviolet laser.
Because copper has high absorption of ultraviolet laser and low absorption of infrared laser, the hole processed by the resin plate with copper coated on both sides under the irradiation of the infrared laser and the ultraviolet laser has good quality. And because the spot area of the infrared laser is large, the energy is high, and the energy is usually higher than that of the ultraviolet laser by one order of magnitude, the processing efficiency of the infrared laser for the first material layer is obviously higher than that of the ultraviolet laser, and thus, the integral drilling speed is improved.
Specifically, the absorption rate of the material differs depending on the wavelength of the laser light, and the inventors found through experiments and analysis that: when the copper foil and the glass cloth have higher absorptivity in an area below 0.3 mu m of ultraviolet light, but greatly slide after entering visible light and infrared light. The resin material can maintain quite high absorptivity in three-segment spectrums (ultraviolet light, visible light and infrared light).
When laser light is incident on the surface of the material, part of the light energy with the energy E0 is reflected, and the rest of the energy is absorbed by the object. According to the principle of conservation of energy, it can be simply written as:
e0 ═ E reflection + E absorption;
both sides of the above formula are obtained by removing E0
1-E reflection/E0 + E absorption/E0-R + ρ
Wherein R is a reflection coefficient and ρ is a surface absorption coefficient.
For laser light incident perpendicularly to the surface of the material, the reflection coefficient is given by the fresnel formula:
R＝∣(n-1)/(n+1)∣2；
wherein n is the refractive index of the material. The refractive index of the material can be determined experimentally, and there are various measurement methods, which are not limited herein. For example: for solid materials, the minimum deflection angle method or the auto-collimation method is commonly used; liquid materials are commonly measured by the critical angle method (abbe refractometer); the gas material is subjected to a higher precision interferometry (Rayleigh interferometer).
Thus, the surface absorption coefficient is: ρ -1-R-1- | (n-1)/(n +1) |2。
Since the refractive index of a material is a function of wavelength, the absorption coefficient of a material is not the same for different wavelengths of laser light, and in general, the shorter the wavelength, the larger the absorption coefficient,
in conclusion, copper has low absorption of infrared laser and high absorption of ultraviolet laser.
In one embodiment, the thickness of the first material layer is 100-400 μm.
The inventor finds through experiments that when the thickness of the first material layer is less than 100 μm, the overall rigidity of the plate to be processed is poor, and the thermal deformation rate is large during laser processing; when the thickness of the first material layer is greater than 400 μm, the transmittance of laser light is deteriorated due to the thicker thickness, and the hole structure formed on the first material layer is easily formed in a funnel shape with a large top and a small bottom due to the attenuation of laser light, resulting in poor quality of roundness and verticality of the entire hole.
When the thickness of the first material layer is between 100-.
In one embodiment, the thickness of the second material layer is 5-15 μm.
The inventor finds through experiments that when the thickness of the second material layer is less than 5 μm, the overall rigidity of the plate to be processed is poor, the second material layer has a large thermal deformation rate during laser processing, and is easy to peel off from the first material layer; when the thickness of the second material layer is greater than 15 μm, the transmittance of the laser is deteriorated due to the thicker thickness, and the hole structure formed on the second material layer is easily formed into a funnel shape with a large top and a small bottom due to the attenuation of the laser, resulting in poor quality of the roundness and verticality of the entire hole.
When the thickness of the second material layer is within 5-15 μm, the second material layer can be burned through well under the irradiation of the second laser and a high-quality hole structure is formed.
In one embodiment, firing through the first material layer with the first laser comprises:
the first material layer is irradiated with the first laser light a plurality of times, and a focus position at each irradiation moves in a thickness direction of the first material layer, and a moving direction of the focus position is the same as an irradiation direction of the first laser light.
Because the energy of the laser at the focusing position is most concentrated, and the thickness of the first material layer is relatively thick, the focusing position of the first laser on the first material layer is continuously changed, specifically, the first laser is focused on the surface of the first material layer closest to the first laser emitting point at the beginning of processing, after a certain time, the part of the first material layer is removed, then the focusing position of the first laser is adjusted to the surface of the first material layer slightly far away from the first laser emitting point, and the part of the material is removed, so that the focusing position is gradually adjusted to burn through all the first material layer.
In this embodiment, the first material layer can be burned layer by changing the focusing position of the first laser on the first material layer, so as to form a hole structure with good surface quality and high uniformity on the first material layer.
In one embodiment, firing through the first material layer 2 using the first laser comprises:
the first laser is focused on the first material layer 2 to form a plurality of light spots, and the plurality of light spots are arranged around the center of the processing position.
Referring to fig. 3 and 4, the size and diameter of the plurality of light spots may be the same or different, and when the plurality of light spots are arranged around the center of the processing position, the edges of the plurality of light spots are fitted into a full circle, and the coverage area of the full circle coincides with the processing position, that is, the aperture size of the intended processing position is directly the same as the full circle fitted by the edges of the plurality of light spots.
In this embodiment, a plurality of small light spots are combined into a large light spot, the defect that the central energy of a single light spot is high and the edge energy is low is avoided, the edge energy of the hole and the energy of the central part of the hole can be uniformly allocated in the hole winding processing mode, and the burr problem caused by the over-small edge energy is effectively prevented.
In one embodiment, referring to fig. 2, 3 and 5, it should be noted that the waist drum shape represents the focusing range of the laser, and the circle at the center of the waist drum shape represents the focusing point of the laser. The second material layer comprises an upper surface layer 1 arranged above the first material layer 2 and a lower surface layer 3 arranged below the first material layer 2, the first laser and the second laser irradiate along the direction of the upper surface layer 1 to the lower surface layer 3, and the laser drilling method comprises the following steps:
s1, referring to fig. 2, the upper surface layer 1 is irradiated by the second laser and burned through, and the spot diameter formed on the upper surface layer 1 by the second laser is D1. S2, referring to fig. 3, the first material layer 2 is irradiated by the first laser and burned through, and the spot diameter formed on the first material layer 2 by the first laser is D2. S3, referring to fig. 5, the lower surface layer 3 is irradiated by the second laser and burned through, and the spot diameter formed on the lower surface layer 3 by the second laser is D3. Wherein D2> D1> D3.
In the embodiment, three-time irradiation is adopted for three layers of materials, the burning advantages of different lasers to different materials are efficiently utilized, and the upper surface layer 1, the first material layer 2 and the lower surface layer 3 are sequentially burnt through, so that the diameter of light spots irradiated on the upper surface layer 1, the first material layer 2 and the lower surface layer 3 is adjusted, specifically, the value of D2 is greater than that of D1, and the influence on the irradiation range of the first laser caused by the attenuation of the first laser penetrating through the hole wall of the upper surface layer 1 is avoided; the value of D3 is smaller than D1, so as to avoid that the second laser light is absorbed by the material of the hole wall on the first material layer 2 when passing through the first material layer 2, and the burning efficiency of the second laser light on the lower surface layer 3 is affected.
The scheme in the embodiment can ensure that the processed orifice has smooth surface quality, the roundness of the orifice of the light incident surface is similar to that of the orifice of the light emergent surface, and the consistency of hole patterns is high.
In one embodiment, the spot diameter formed on the first material layer by the first laser is in a range of 20 to 30 microns larger than the spot diameter formed on the upper surface layer by the second laser. Namely, the spot diameter formed on the first material layer by the first laser is D, the spot diameter formed on the upper surface layer by the second laser is D, and D-D is more than or equal to 20 microns and less than or equal to 30 microns. Alternatively, in one embodiment, in combination with specific experiments, in order to improve the control accuracy, the spot diameter formed on the first material layer by the first laser may be 25 μm larger than the spot diameter formed on the upper surface layer by the second laser.
The difference between the spot diameter formed on the first material layer 2 by the first laser and the spot diameter formed on the upper surface layer 1 by the second laser is defined. When the first material layer 2 positioned in the middle layer is processed, the processed hole has good surface quality and high verticality.
The present application further provides a processing apparatus, including: laser emission device and auto-change over device, laser emission device include can launch the first transmission head of first laser and can launch the second transmission head of second laser. A table top for carrying the plate to be processed may be provided below the laser emitting device. The switching device is arranged below the laser emitting device, is used for moving the plate to be processed, which is placed below the first emitting head, to the position below the second emitting head, and is also used for moving the plate to be processed, which is placed below the second emitting head, to the position below the first emitting head.
The laser emitting device can be any equipment capable of emitting lasers such as ultraviolet laser, infrared laser and the like, the table top can be a workbench, and positioning devices such as positioning pins and the like for positioning the plate to be processed can be arranged on the workbench.
The switching device can be a mechanical arm or an automatic material changing device formed by assembling an air cylinder, an air claw and PLC equipment, can move a plate to be processed, which is placed below the first emission head, to the lower part of the second emission head, and can also move the plate to be processed, which is placed below the second emission head, to the lower part of the first emission head. This action can be performed synchronously to improve the efficiency of the action.
In this implementation, waiting to process the board and can alternate the position below the first transmission head of laser emitter and the second transmission head under auto-change device's drive for waiting to process the board and can form the through-hole structure under the alternate irradiation of first laser and second laser, adopt this equipment to carry out spot facing work can improve production efficiency and processingquality.
In one embodiment, the processing equipment further comprises a feeding and discharging device, the feeding and discharging device is arranged on one side of the table top and is used for placing the plate to be processed on the table top, and the feeding and discharging device is also used for taking the plate to be processed away from the table top.
The feeding and discharging device can adopt a mechanical arm or a manual work, and can rapidly feed and discharge the plate to be processed when in batch production, so that the overall processing efficiency of laser drilling is improved.
The automation degree of waiting to process the board drilling process has been improved through addding unloader in this embodiment, has alleviateed workman's work burden, has improved production efficiency and production quality.
In order to further improve the quality of laser drilling, this application has still made further processing to the structure of handling the board, and it mainly includes:
in this embodiment, the plate to be processed comprises an upper surface layer, a first material layer and a lower surface layer which are sequentially stacked, wherein a first energy absorption part is arranged on the upper surface layer, and a second energy absorption part is arranged on the lower surface layer, and the surface roughness of the first energy absorption part is higher than that of the second energy absorption part.
In the above scheme, the board to be processed can be drilled by using laser, the laser irradiates the board to be processed in the direction of the upper surface layer pointing to the lower surface layer, the laser reaches the lower surface layer after burning through the upper surface layer and the first material layer, the laser is interfered by the hole walls of the burning holes of the upper surface layer and the first material layer, and the laser has certain attenuation so that the burning efficiency and the burning effect on the lower surface layer are poor. In order to avoid the difference of the firing effect of the laser on the upper surface layer and the lower surface layer, the upper surface layer is provided with the first energy absorption part with lower roughness, and the lower surface layer is provided with the second energy absorption part with higher roughness, so that the absorption rate of the second energy absorption part of the second surface layer to the attenuated laser is improved, and further, the quality of holes burned through by the laser on the upper surface layer and the lower surface layer is closer, the aperture difference is small, the roundness difference is small, and the product quality of the plate to be processed is improved.
In one possible design, the upper surface layer and the lower surface layer are copper layers, and the first material layer is a resin layer.
In above-mentioned scheme, the material of upper surface layer and lower surface layer all includes copper, so, can utilize the good and good advantage of laser beam machining nature of electric conductivity of copper, drills to it, and the material on first material layer includes the resin, then can utilize the insulating good, the good characteristics of toughness of resin, guarantees the job stabilization nature and the structural strength who treats the processing board.
In one possible design, the thickness of the upper surface layer is greater than the thickness of the lower surface layer.
In the above scheme, the thickness that has further injectd the upper surface layer is greater than the thickness of lower surface layer, so, in laser drilling process, laser reachs lower surface layer after burning through upper surface layer and first material layer, laser is disturbed by the pore wall of the hole that burns through of upper surface layer and first material layer this moment, laser has certain decay, and thinner lower surface layer is burnt through by laser more easily, utilize the lower surface layer of attenuate to balance the influence after the laser energy decay, the hole quality that has further guaranteed laser to burn through on upper surface layer and lower surface layer is comparatively close, the aperture difference is little, the circularity difference is little.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A laser drilling method is used for drilling a plate to be processed, wherein the plate to be processed comprises a first material layer and a second material layer which are arranged in a stacked mode, and the laser drilling method is characterized by comprising the following steps:
burning through the second material layer using a second laser;
burning through the first material layer using a first laser;
wherein an absorptivity of the second material layer to the second laser light is higher than an absorptivity of the second material layer to the first laser light.
2. The laser drilling method of claim 1, wherein the first material layer is a resin layer, the first laser is an infrared laser, the second material layer is a copper layer, and the second laser is an ultraviolet laser.
3. The laser drilling method as claimed in claim 1 or 2, wherein the thickness of the first material layer is 100-400 μm.
4. The laser drilling method according to claim 1 or 2, wherein the thickness of the second material layer is 5-15 μm.
5. The laser drilling method of claim 1, wherein the burning through the first material layer with the first laser comprises:
and irradiating the first material layer with the first laser for multiple times, wherein the focal position of each irradiation is moved in the thickness direction of the first material layer, and the moving direction of the focal position is the same as the irradiation direction of the first laser.
6. The laser drilling method of claim 1, wherein the burning through the first material layer with the first laser comprises:
the first laser is focused on the first material layer to form a plurality of light spots, and the light spots are arranged around the center of the processing position.
7. The laser drilling method according to claim 1, wherein the second material layer includes an upper surface layer disposed above the first material layer and a lower surface layer disposed below the first material layer, and the first laser and the second laser are both irradiated along the upper surface layer in a direction toward the lower surface layer, the laser drilling method including:
s1, irradiating the upper surface layer by the second laser and burning through the upper surface layer, wherein the spot diameter formed on the upper surface layer by the second laser is D1;
s2, irradiating the first material layer by using the first laser and burning through the first material layer, wherein the spot diameter formed on the first material layer by the first laser is D2;
s3, irradiating the lower surface layer by the second laser and burning through the lower surface layer, wherein the spot diameter formed on the lower surface layer by the second laser is D3;
wherein D2> D1> D3.
8. The laser drilling method of claim 7, wherein the spot diameter formed on the first material layer by the first laser is in a range of 20-30 microns larger than the spot diameter formed on the upper surface layer by the second laser.
9. A processing apparatus to which the laser drilling method according to any one of claims 1 to 8 is applied, characterized by comprising;
the laser emitting device comprises a first emitting head capable of emitting first laser and a second emitting head capable of emitting second laser; and
the switching device is arranged below the laser emitting device, is used for moving the plate to be processed, which is placed below the first emitting head, to the position below the second emitting head, and is also used for moving the plate to be processed, which is placed below the second emitting head, to the position below the first emitting head.
10. The processing equipment as claimed in claim 9, wherein the processing equipment further comprises a loading and unloading device and a table top arranged below the laser emitting device, the table top is used for bearing a plate to be processed, the loading and unloading device is arranged on one side of the table top, the loading and unloading device is used for placing the plate to be processed on the table top, and the loading and unloading device is further used for taking the plate to be processed away from the table top.
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| CN202111375310.8A CN114126229A (en) | 2021-11-19 | 2021-11-19 | Laser drilling method and machining equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302205A (en) * | 2022-08-23 | 2022-11-08 | 上海福讯电子有限公司 | SMT (surface Mount technology) stepped template preparation method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6713719B1 (en) * | 1999-09-30 | 2004-03-30 | Siemens Aktiengesellschaft | Method and device for laser drilling laminates |
| JP2013043292A (en) * | 2011-08-22 | 2013-03-04 | Kao Corp | Method for manufacturing laminated body |
| CN107662050A (en) * | 2016-07-28 | 2018-02-06 | 三星钻石工业股份有限公司 | Laser processing device and laser processing |
| CN109128534A (en) * | 2018-09-20 | 2019-01-04 | 云谷（固安）科技有限公司 | The laser variable-focus cutting technique of multiple film layer mould group |
| CN113271729A (en) * | 2021-05-27 | 2021-08-17 | 武汉铱科赛科技有限公司 | Circuit board through hole drilling method, device and system capable of avoiding hole blockage |
-
2021
- 2021-11-19 CN CN202111375310.8A patent/CN114126229A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6713719B1 (en) * | 1999-09-30 | 2004-03-30 | Siemens Aktiengesellschaft | Method and device for laser drilling laminates |
| JP2013043292A (en) * | 2011-08-22 | 2013-03-04 | Kao Corp | Method for manufacturing laminated body |
| CN107662050A (en) * | 2016-07-28 | 2018-02-06 | 三星钻石工业股份有限公司 | Laser processing device and laser processing |
| CN109128534A (en) * | 2018-09-20 | 2019-01-04 | 云谷（固安）科技有限公司 | The laser variable-focus cutting technique of multiple film layer mould group |
| CN113271729A (en) * | 2021-05-27 | 2021-08-17 | 武汉铱科赛科技有限公司 | Circuit board through hole drilling method, device and system capable of avoiding hole blockage |
Non-Patent Citations (1)
| Title |
|---|
| 王中林等: "《激光加工设备与工艺》", 30 September 2011, 华中科技大学出版社, pages: 11 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302205A (en) * | 2022-08-23 | 2022-11-08 | 上海福讯电子有限公司 | SMT (surface Mount technology) stepped template preparation method |
| CN115302205B (en) * | 2022-08-23 | 2024-05-14 | 上海福讯电子有限公司 | SMT ladder template preparation method |
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