CN103394820A - Tin-bismuth-silver lead-free welding alloy and preparing method thereof - Google Patents
Tin-bismuth-silver lead-free welding alloy and preparing method thereof Download PDFInfo
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- CN103394820A CN103394820A CN2013102731045A CN201310273104A CN103394820A CN 103394820 A CN103394820 A CN 103394820A CN 2013102731045 A CN2013102731045 A CN 2013102731045A CN 201310273104 A CN201310273104 A CN 201310273104A CN 103394820 A CN103394820 A CN 103394820A
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Abstract
Provided are tin-bismuth-silver lead-free welding alloy and a preparing method thereof. The welding alloy is composed of tin, bismuth, silver, zinc and indium as the weight ratio 5-15 to 10-20 to 15-20 to 40-55 to 1-5. The raw materials are mixed to form metal alloy mixture, then the metal alloy mixture is vacuum melted and remelted, and finally the remelted alloy is mixed with tin and bismuth according to the weight ratio of 2-10 to 15-20 to 65-75 to be vacuum melted again. The appropriate amount of indium with the low melting point and the hardness is added into ordinary tin-bismuth-silver lead-free welding alloy. Thus, the melting point and the brittleness of the welding alloy are reduced, the wettability and the ductility are improved, the comprehensive performance of the welding alloy is improved, meanwhile the cost is reduced, and the application prospect is wide. In addition, the preparing method is simple in process and a little in used equipment.
Description
Technical field
The invention belongs to the metal alloy technical field of composite materials, particularly relate to a kind of tin-bismuth-silver series lead-free solder Alloy And Preparation Method.
Background technology
In the evolution of solder alloy, the tin-lead solder alloy is top quality, cheap welding material always, no matter is that welding quality or the reliability of postwelding can both reach instructions for use; But along with the reinforcement of mankind's environmental consciousness, " lead " and compound thereof are to the harm of human body and the pollution of environment is more and more paid attention to by the mankind.In February, 2003, European countries proposed progressively to ban the use of lead and other poisonous elements, to reduce the harm of the harmful components such as plumbous and halogen to human health and living environment.Worldwide under the main trend of protection of the environment; limit and forbid the use of lead; become the inexorable trend of solder alloy development; according to market trend just in time and use " leadless welding alloy "; can make enterprise catch better the market opportunity; improve enterprise competitiveness, therefore the research of " leadless welding alloy " just progressively becomes global focus at present.
The tin-bismuth-silver series solder alloy is the more leadless welding alloy of a kind of present research, but can run into the problem that intermetallic compound exerts an influence to welding performance and reliability in using this solder alloy welding process.reason is that most leadless welding alloys have separating out of intermetallic compound in process of production, therefore the interfacial reaction of solder alloy and metal substrate will be inevitable, and along with the development of multicomponent solder alloy, adding of new constituent element, the possibility that forms intermetallic compound also can increase, also likely cause simultaneously the variation of existing morphology of intermetallic compound structure, thereby cause scolder institutional framework and phase composition to change, these all will seriously affect welding performance, major defect shows that fusing point is higher, fragility and density are large, wettability is poor, cost is higher, result causes combination property not good.Therefore, how overcoming existing tin bismuth is the shortcoming that scolder exists, and is the important topic of pendulum in face of those skilled in the art.
Summary of the invention
, in order to address the above problem, the object of the present invention is to provide a kind of tin-bismuth-silver series lead-free solder Alloy And Preparation Method of good combination property.
In order to achieve the above object, tin-bismuth-silver series lead-free solder alloy provided by the invention is to be mixed into the metal alloy mixture by tin, silver, bismuth, zinc and indium with the weight ratio of 5-15: 10-20: 15-20: 40-55: 1-5, then through vacuum melting with heavily refine, the alloy after heavily refining finally with make through vacuum melting again after tin, bismuth mix with the weight ratio of 2-10: 15-20: 65-75.
The purity of described tin, silver, bismuth, zinc and indium is 99.99%.
The device that described vacuum melting is adopted is the high vacuum arc-melting furnace.
The device that described heavy refining is adopted is vacuum tube furnace.
The preparation method of tin-bismuth-silver series lead-free solder alloy provided by the invention comprises the following step that carries out in order:
1) being 99.99% tin, silver, bismuth, zinc and indium with purity is mixed into the metal alloy mixture with the weight ratio of 5-15: 10-20: 15-20: 40-55: 1-5;
2) above-mentioned metal alloy mixture is put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 10-80kPa, while electromagnetic agitation metal alloy mixture, melt back 2-5 time, each 0.5-3 hour;
3) the metal alloy mixture after above-mentioned melting is put into vacuum tube furnace, start to pass into argon gas, with the speed of 1-10 ℃/min, be warmed up to 200-400 ℃, insulation 10-50min, then be down to room temperature with the speed of 1-10 ℃/min, so that the metal alloy mixture is heavily refined;
4) the metal alloy mixture after above-mentioned heavy refining is mixed with the weight ratio of 2-10: 15-20: 65-75 with tin, bismuth, then put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 10-80kPa, again carry out melting 0.5-3h, namely can be made into described tin-bismuth-silver series lead-free solder alloy.
Tin-bismuth-silver series lead-free solder alloy provided by the invention is to have added fusing point and the low appropriate indium of hardness in common tin bismuth-silver series lead-free solder alloy, therefore can reduce fusing point and the fragility of solder alloy, improve wettability, ductility, improved the combination property of solder, also can reduce costs simultaneously, therefore have broad application prospects.In addition, this preparation method process is simple, and use equipment is less.
Description of drawings
Fig. 1 is the main crystal grain situation of the tin-bismuth-silver series lead-free solder alloy schematic diagram that the embodiment of the present invention is prepared.
The specific embodiment
The fusing point of indium (In) is 156.6 ℃, is also low silvery white and slightly nattier blue metallized metal of a kind of hardness ratio lead, and plasticity is strong,, because it has lower fusing point, therefore adds after solder alloy fusing point and the fragility that can reduce solder alloy.In addition, solder alloy is increased at the spreading area of substrate, thereby improve the wettability of solder alloy, the density of solder alloy is reduced to some extent.In addition, the fusion enthalpy of indium itself is lower, and this also can make the fusion enthalpy decrease to some degree of solder alloy.Because phosphide atom and tin (Sn) atomic number approach, both structure is close, and in solder alloy fusing and reflow process, indium is the position of tin atom in compound between alternative metals progressively, and compound between formation Ag-Sn-In or Cu-Sn-In metalloid.After adding a small amount of indium, indium can solid solution in matrix, causes the reinforcement of solder alloy, therefore also can make the ductility of solder alloy obtain to a certain extent raising.Therefore adopt the combination property that adds appropriate indium can improve solder in traditional tin-bismuth-silver series solder alloy, reduce fusing point when reducing the solder alloy cost, reduce fragility, improve wettability, optimize the performance of tin-bismuth-silver series solder alloy.
Below in conjunction with the drawings and specific embodiments, tin-bismuth-silver series lead-free solder Alloy And Preparation Method provided by the invention is elaborated.
Embodiment 1:
With purity be 99.99% tin, silver, bismuth, zinc and indium with 5: 15: 20: the weight ratio of 55: 5 is mixed into the metal alloy mixture;
2) above-mentioned metal alloy mixture is put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 50kPa, while electromagnetic agitation metal alloy mixture, melt back 3 times, each 1h;
3) the metal alloy mixture after above-mentioned melting is put into vacuum tube furnace, start to pass into argon gas, with the speed of 5 ℃/min, be warmed up to 300 ℃, insulation 30min, then be down to room temperature with the speed of 5 ℃/min, so that the metal alloy mixture is heavily refined;
4) the metal alloy mixture after above-mentioned heavy refining is mixed with the weight ratio of 5: 20: 75 with tin, bismuth, then put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 50kPa, again carry out melting 2h, namely can be made into described tin-bismuth-silver series lead-free solder alloy.
Fig. 1 illustrates the main crystal grain situation of tin-bismuth-silver series lead-free solder alloy that the present embodiment is prepared, and wherein 1 is phosphide atom, and 2 is AgZn3 crystal grain.
Embodiment 2:
With purity be 99.99% tin, silver, bismuth, zinc and indium with 10: 10: 20: the weight ratio of 50: 5 is mixed into the metal alloy mixture;
2) above-mentioned metal alloy mixture is put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 45kPa, while electromagnetic agitation metal alloy mixture, melt back 4 times, each 1.5h;
3) the metal alloy mixture after above-mentioned melting is put into vacuum tube furnace, start to pass into argon gas, with the speed of 8 ℃/min, be warmed up to 350 ℃, insulation 35min, then be down to room temperature with the speed of 8 ℃/min, so that the metal alloy mixture is heavily refined;
4) the metal alloy mixture after above-mentioned heavy refining is mixed with the weight ratio of 8: 17: 75 with tin, bismuth, then put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 45kPa, again carry out melting 1.5h, namely can be made into described tin-bismuth-silver series lead-free solder alloy.
Embodiment 3:
With purity be 99.99% tin, silver, bismuth, zinc and indium with 7.5: 15.5: 20: the weight ratio of 51.5: 4.5 is mixed into the metal alloy mixture;
2) above-mentioned metal alloy mixture is put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 55kPa, while electromagnetic agitation metal alloy mixture, melt back 5 times, each 3h;
3) the metal alloy mixture after above-mentioned melting is put into vacuum tube furnace, start to pass into argon gas, with the speed of 9 ℃/min, be warmed up to 400 ℃, insulation 30min, then be down to room temperature with the speed of 9 ℃/min, so that the metal alloy mixture is heavily refined;
4) the metal alloy mixture after above-mentioned heavy refining is mixed with the weight ratio of 3: 18: 69 with tin, bismuth, then put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 55kPa, again carry out melting 3h, namely can be made into described tin-bismuth-silver series lead-free solder alloy.
Claims (5)
1. tin-bismuth-silver series lead-free solder alloy, it is characterized in that: described tin-bismuth-silver series lead-free solder alloy is to be mixed into the metal alloy mixture by tin, silver, bismuth, zinc and indium with the weight ratio of 5-15: 10-20: 15-20: 40-55: 1-5, then through vacuum melting with heavily refine, the alloy after heavily refining finally with make through vacuum melting again after tin, bismuth mix with the weight ratio of 2-10: 15-20: 65-75.
2. tin-bismuth-silver series lead-free solder alloy according to claim 1, it is characterized in that: the purity of described tin, silver, bismuth, zinc and indium is 99.99%.
3. tin-bismuth-silver series lead-free solder alloy according to claim 1, it is characterized in that: the device that described vacuum melting is adopted is the high vacuum arc-melting furnace.
4. tin-bismuth-silver series lead-free solder alloy according to claim 1, it is characterized in that: the device that described heavy refining is adopted is vacuum tube furnace.
5. the preparation method of a tin-bismuth-silver series lead-free solder alloy as claimed in claim 1, it is characterized in that: described preparation method comprises the following step that carries out in order:
1) being 99.99% tin, silver, bismuth, zinc and indium with purity is mixed into the metal alloy mixture with the weight ratio of 5-15: 10-20: 15-20: 40-55: 1-5;
2) above-mentioned metal alloy mixture is put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 10-80kPa, while electromagnetic agitation metal alloy mixture, melt back 2-5 time, each 0.5-3 hour;
3) the metal alloy mixture after above-mentioned melting is put into vacuum tube furnace, start to pass into argon gas, with the speed of 1-10 ℃/min, be warmed up to 200-400 ℃, insulation 10-50min, then be down to room temperature with the speed of 1-10 ℃/min, so that the metal alloy mixture is heavily refined;
4) the metal alloy mixture after above-mentioned heavy refining is mixed with the weight ratio of 2-10: 15-20: 65-75 with tin, bismuth, then put into the high vacuum arc-melting furnace, be evacuated to vacuum and reach 10-80kPa, again carry out melting 0.5-3h, namely can be made into described tin-bismuth-silver series lead-free solder alloy.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN113146092A (en) * | 2021-03-19 | 2021-07-23 | 湖南大学 | Sn-Bi-In-Zn alloy lead-free solder and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010038093A1 (en) * | 1999-09-17 | 2001-11-08 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| CN101564803A (en) * | 2008-07-15 | 2009-10-28 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN101862925A (en) * | 2010-05-17 | 2010-10-20 | 天津大学 | Tin-bismuth-silver series lead-free solder and preparation method |
| CN102152021A (en) * | 2011-01-25 | 2011-08-17 | 天津大学 | Lead-free solder for hot dipping of solar battery and preparation method thereof |
-
2013
- 2013-07-02 CN CN2013102731045A patent/CN103394820A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010038093A1 (en) * | 1999-09-17 | 2001-11-08 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| CN101564803A (en) * | 2008-07-15 | 2009-10-28 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN101862925A (en) * | 2010-05-17 | 2010-10-20 | 天津大学 | Tin-bismuth-silver series lead-free solder and preparation method |
| CN102152021A (en) * | 2011-01-25 | 2011-08-17 | 天津大学 | Lead-free solder for hot dipping of solar battery and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN104148822B (en) * | 2014-07-28 | 2016-06-01 | 北京卫星制造厂 | A kind of low temperature brazing material |
| CN113146092A (en) * | 2021-03-19 | 2021-07-23 | 湖南大学 | Sn-Bi-In-Zn alloy lead-free solder and preparation method and application thereof |
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Application publication date: 20131120 |