CN101662918B - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
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- CN101662918B CN101662918B CN200810304232A CN200810304232A CN101662918B CN 101662918 B CN101662918 B CN 101662918B CN 200810304232 A CN200810304232 A CN 200810304232A CN 200810304232 A CN200810304232 A CN 200810304232A CN 101662918 B CN101662918 B CN 101662918B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
Description
技术领域 technical field
本发明涉及一种散热装置,尤其涉及一种用于对电子元件散热的散热装置。The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from electronic components.
背景技术 Background technique
随着电子产业的快速发展,电子元件(如中央处理器)的高速、高频及集成化使其发热量剧增,为了在有限的空间内高效地带走电子元件所产生的热量,业界通常是在电子元件上加装一散热装置。With the rapid development of the electronic industry, the high-speed, high-frequency and integration of electronic components (such as central processing units) make the calorific value increase dramatically. In order to efficiently remove the heat generated by electronic components in a limited space, the industry usually uses Install a cooling device on the electronic component.
该散热装置通常包括一散热器及一风扇,该散热器用以与电子元件热接触,该风扇通过四角锁螺丝的方式锁设于该散热器的外部,该风扇用以产生低温气流并将电子元件传递至散热器的热量散发至周围的空气中,从而达到散热的目的。然而,上述散热装置中,由于该风扇需通过四角锁螺丝的方式锁设于散热器的外部,从而导致组装过程繁琐,不利于节约成本。因此,需加以改进。The heat dissipation device usually includes a heat sink and a fan. The heat sink is used for thermal contact with the electronic components. The heat transferred to the radiator is dissipated to the surrounding air, thereby achieving the purpose of heat dissipation. However, in the above heat dissipation device, since the fan needs to be locked on the outside of the heat sink by means of four-corner locking screws, the assembly process is cumbersome, which is not conducive to cost saving. Therefore, need to improve.
发明内容 Contents of the invention
有鉴于此,有必要提供一种便于风扇与散热器组装的散热装置。In view of this, it is necessary to provide a cooling device that facilitates the assembly of the fan and the radiator.
一种散热装置,包括散热器及与散热器结合的风扇,所述散热器的顶端形成定位凹槽,且散热器的顶部中间形成收容空间,所述散热器上设有与所述收容空间连通的卡槽,所述风扇包括扇框及设于扇框上的叶轮,所述叶轮收容于所述收容空间内,所述扇框向外凸伸出定位部,所述扇框向下延伸形成固定臂,所述固定臂的自由端设有钩部,所述钩部与卡槽配合,所述定位部收容于定位凹槽内,共同将风扇固定于散热器上。A heat dissipation device, comprising a radiator and a fan combined with the radiator, a positioning groove is formed on the top of the radiator, and a storage space is formed in the middle of the top of the radiator, and a fan communicating with the storage space is formed on the radiator. The fan includes a fan frame and an impeller arranged on the fan frame, the impeller is accommodated in the accommodating space, the fan frame protrudes outward from the positioning part, and the fan frame extends downward to form a The fixed arm is provided with a hook at the free end of the fixed arm, and the hook is matched with the slot, and the positioning part is accommodated in the positioning groove to jointly fix the fan on the radiator.
一种散热装置,包括散热器及与散热器结合的风扇,所述散热器包括若干鳍片,所述鳍片包括本体及由本体向上延伸形成的延伸部,所述延伸部的宽度小于本体的宽度,其中一部分鳍片的延伸部凸出于另一部分鳍片的延伸部,以于散热器的顶端形成定位凹槽,所述鳍片的本体与延伸部之间形成收容空间,所述延伸部上设有与所述收容空间连通的卡槽,所述风扇包括扇框及设于扇框上的叶轮,所述叶轮收容于所述收容空间内,所述扇框向外凸伸出定位部,所述扇框向下延伸形成固定臂,所述固定臂的自由端设有钩部,所述钩部与卡槽配合,所述定位部收容于定位凹槽内,共同将风扇固定于散热器上。A heat dissipation device, including a radiator and a fan combined with the radiator, the radiator includes a plurality of fins, the fins include a body and an extension formed by extending upward from the body, and the width of the extension is smaller than that of the body Width, wherein the extension part of a part of the fins protrudes from the extension part of the other part of the fins to form a positioning groove at the top of the heat sink, a receiving space is formed between the body of the fins and the extension part, and the extension part A card slot communicating with the storage space is provided on the top, the fan includes a fan frame and an impeller arranged on the fan frame, the impeller is accommodated in the storage space, and the fan frame protrudes outward from a positioning portion , the fan frame extends downwards to form a fixed arm, the free end of the fixed arm is provided with a hook, the hook cooperates with the card slot, the positioning part is accommodated in the positioning groove, and jointly fix the fan on the heat dissipation device.
上述散热装置中,由于散热器上设有卡槽,所述风扇的扇框上设有带有钩部的固定臂,因此组装上述散热装置时,只需推压该风扇即可将该风扇安装在散热器上,而无需螺丝锁合,结构简单,组装方便。另外,由于该散热器上还设有定位凹槽,该风扇上设有可收容于定位凹槽内的定位部,因此可防止风扇在组装后产生转动,有利于风扇的定位。其次,该风扇固设于该散热器的收容空间内,使风扇由散热器包围,可充分利用风扇产生的低温气流,以提高散热效率,同时,该风扇的外围的散热器还可充当传统扇框的侧壁的作用,节省了风扇的用料的同时,还可增加风扇的风压。In the above heat dissipation device, since the heat sink is provided with a card slot, and the fan frame of the fan is provided with a fixed arm with a hook, when assembling the above heat dissipation device, the fan can be installed by simply pushing the fan On the radiator, there is no need for screw locking, the structure is simple, and the assembly is convenient. In addition, since the heat sink is provided with a positioning groove, and the fan is provided with a positioning portion that can be accommodated in the positioning groove, it can prevent the fan from rotating after assembly, which is beneficial to the positioning of the fan. Secondly, the fan is fixed in the housing space of the radiator, so that the fan is surrounded by the radiator, and the low-temperature airflow generated by the fan can be fully utilized to improve heat dissipation efficiency. At the same time, the radiator around the fan can also serve as a traditional fan The function of the side wall of the frame not only saves the materials used for the fan, but also increases the wind pressure of the fan.
下面参照附图结合实施例对本发明作进一步的描述。The present invention will be further described below with reference to the accompanying drawings and embodiments.
附图说明 Description of drawings
图1为本发明一较佳实施例的散热装置的立体组装图。FIG. 1 is a three-dimensional assembly view of a heat sink according to a preferred embodiment of the present invention.
图2为图1所示散热装置的分解图。FIG. 2 is an exploded view of the heat sink shown in FIG. 1 .
图3为图1所示散热装置另一形式的分解图。FIG. 3 is an exploded view of another form of the heat sink shown in FIG. 1 .
具体实施方式 Detailed ways
图1所示为本发明一较佳实施例中的散热装置,其用来对一发热电子元件(图未示)如中央处理器进行散热。该散热装置包括一基座10、设于该基座10上的散热器20、与散热器20结合的若干热管30、设于该散热器20中间的一导热柱40(如图2所示)及设于该散热器20上的一风扇50。FIG. 1 shows a heat dissipation device in a preferred embodiment of the present invention, which is used to dissipate heat from a heat-generating electronic component (not shown) such as a central processing unit. The heat dissipation device includes a
请参照图2与图3,该散热器20呈环状,其包括一对第一鳍片组21及一对第二鳍片组23。Referring to FIGS. 2 and 3 , the
每一第一鳍片组21呈扇形,其由若干第一鳍片211堆叠排列而成,每相邻的两第一鳍片211间形成一气流通道212。每一第一鳍片211包括一本体213及一延伸部214。该本体213大致呈方形,所述第一鳍片组21上设有贯穿每一本体213的若干半圆弧形的收容槽215,以分别收容热管30。该延伸部214由该本体213的顶部位于外侧处向上一体延伸形成,该延伸部214的内侧处设有一台阶部216及一卡槽217,该延伸部214位于该台阶部216上方的部位的宽度小于该延伸部214位于该台阶部216下方的部位的宽度,该卡槽217设于该台阶部216的下方,其大致呈三角形,该卡槽217的上侧与台阶部216平行,该卡槽217及台阶部216用来固定该风扇50。该延伸部214于其顶端及台阶部216处分别向前垂直延伸形成一上折边218及一台阶折边219,这些上折边218相互抵靠共同形成第一鳍片组21的顶面228,这些台阶折边219相互抵靠共同形成第一鳍片组21的台阶面229。Each
每一第二鳍片组23具有与第一鳍片组21相似的结构。每一第二鳍片组23由若干第二鳍片231堆叠排列而成,每相邻的两第二鳍片231间形成一气流通道232。每一第二鳍片231包括一本体233及一延伸部234。该本体233大致呈三角形状,该三角形的两直角边分别位于第二鳍片231的顶端与内侧,从而使得当这些第二鳍片231组装在一起形成第二鳍片组23时,该第二鳍片组23的外侧下方形成一开口240,该第二鳍片组23上还设有贯穿每一本体233的一半圆弧形的收容槽235,该收容槽235与开口240连通,以便于组装时热管30由该开口240进入收容槽235中。该延伸部234由该本体233的顶部位于外侧处向上一体延伸形成,该延伸部234的高度小于该第一鳍片组21的延伸部214的高度。该延伸部234的内侧处设有一卡槽237,该卡槽237与第一鳍片组21的卡槽217匹配且位于同一高度。该延伸部234的顶端向前垂直延伸形成一上折边238,这些上折边238相互抵靠共同形成第二鳍片组23的顶面248,该顶面248与第一鳍片组21的台阶面229共面,该顶面248、台阶面229可增加与风扇50安装时的接触面积,从而使受力更为均匀。Each
每一热管30具有一弧形的冷凝段31,所述冷凝段31的其中一部分穿设于第一鳍片组21的收容槽215内,其余部分嵌入至第二鳍片组23的收容槽235内。该导热柱40呈圆柱状,其由导热性良好的材料制成,如铜或铝等,其设于该散热器20的第一、第二鳍片组21、23中间。Each
该风扇50固定于该散热器20上,其包括一扇框51及设于该扇框51上的一叶轮53。该扇框51包括位于中间的一承载座511、位于外围的一固定框512及连接该固定框512与承载座511的若干支撑架513。The
该承载座511用于承载该叶轮53,叶轮53倒挂于承载座511上。该固定框512呈圆环状,其向下垂直延伸形成若干固定臂514,这些固定臂514等间隔设置于该固定框512上,每一固定臂514的自由端设有一钩部515,该钩部515沿固定框512的径向向外凸伸出该固定臂514,该钩部515与该散热器20的第一、第二鳍片组21、23上的卡槽217、237配合,以将风扇50固定于散热器20上。该固定框512的外缘对应第二鳍片组23处径向向外凸伸出一对定位部517,每一定位部517大致呈扇形,其靠近固定框512中心的一端较远离固定框512中心的一端窄,每一定位部517的高度与第一、第二鳍片组21、23的延伸部214、234之间的高度差相等。这些支撑架513均成条状,其用来支撑该承载座511。这些支撑架513中的两个连接于该固定框512对应定位部517的位置,其中一支撑架513上设有一出线槽518,该出线槽518内收容一风扇导线519,以将风扇50与外部电源(图未示)电性连接,以给风扇50供电。The
组装时,所述热管30的冷凝段31穿设于该对第一鳍片组21的收容槽215内,其中热管30的冷凝段31的两端部凸伸出第一鳍片组21外。将第一鳍片组21及热管30置于基座10上,该对第一鳍片组21沿圆周相对设置,且间隔一定距离。该对第二鳍片组23分别由上而下插设于该对第一鳍片组21间形成的空间之内,并使热管30的冷凝段31的两端部由第二鳍片组23的开口240进入,且收容于第二鳍片组23的收容槽235内;所述第一、第二鳍片组21、23交错设置,并合围形成该环状的散热器20,所述第一鳍片组21的台阶面229与第二鳍片组23的顶面248共面,由于第二鳍片组23的延伸部234的高度小于第一鳍片组21的延伸部214的高度,从而使每一第二鳍片组23的上方于第一鳍片组21之间形成一定位凹槽25,该定位凹槽25呈扇形;所述第一、第二鳍片组21、23的卡槽217、237共同形成散热器20的环形的卡槽27。将该导热柱40设于第一、第二鳍片组21、23的中间,使其侧表面与该第一、第二鳍片组21、23的内侧面紧密贴合并焊接在一起。所述第一鳍片组21的本体213与延伸部214、第二鳍片组23的本体233与延伸部234及该导热柱40共同于该散热器20的顶部中间形成一收容空间29,该卡槽27与该收容空间29连通,该第一鳍片组21的台阶部216、台阶面229位于该收容空间29内。将风扇50对准散热器20的收容空间29,且使风扇50的定位部517与散热器20的定位凹槽25对准,向下按压该风扇50,使该风扇50的固定框512的下表面抵顶于该散热器20的第一鳍片组21的台阶面229及第二鳍片组23的顶面248上,并使定位部517的下表面抵顶于该散热器20的第二鳍片组23的顶面248上,且使定位部517恰好收容于定位凹槽25内,该风扇50的固定臂514上的钩部515卡设于该散热器20的卡槽27内,以将风扇50固定于散热器20上,此时,该风扇50的叶轮53收容于该收容空间29内,该风扇50的固定框512的侧表面刚好贴设于该散热器20的内表面上,定位部517的上表面、侧表面刚好不凸出于该散热器20,如图3所示。During assembly, the condensing section 31 of the
上述散热装置中,该风扇50固设于该散热器20的收容空间29内,使风扇50的叶轮53由散热器20包围,可充分利用风扇50产生的低温气流,以提高散热效率,同时,该风扇50的外围的散热器20还可充当传统扇框的侧壁的作用,节省了风扇50的用料的同时,还可增加风扇50的风压。另外,由于该散热器20上设有台阶部216及卡槽27,该风扇50具有固定框512及带有钩部515的固定臂514,因此组装上述散热装置时,只需推压该风扇50即可将该风扇50安装在散热器20上,而无需螺丝锁合,结构简单,组装方便。其次,由于该散热器20上还设有定位凹槽25,该风扇50上设有可定位于定位凹槽25内的定位部517,因此可防止风扇50在组装后产生转动,有利于风扇50的定位,同时还可使风扇50的固定框512不凸出于散热器30,从而为保证风扇导线519不凸出于散热器30的顶面228、防止风扇导线519损伤而设下基础。再次,该散热器20的第一、第二鳍片211、231沿导热柱40的径向排列而成,可使风扇50产生的低温气流由第一、第二鳍片211、231间的气流通道212、232吹向散热器20的四周,在带走散热器20上的热量的同时,还可对散热器20周围的其他发热电子元件进行散热。再次,该散热器20由一对第一鳍片组21及一对第二鳍片组23交错合围形成,便于热管30的弧形冷凝段31穿设于第一、第二鳍片组21、23内。In the above-mentioned heat dissipation device, the
当然,上述散热装置中,该散热器20上的卡槽27也可只设于第一、第二鳍片组21、23的其中之一上,从而使得在制造时只需对需要设置卡槽的鳍片组进行加工,可减少制造工序,降低成本。Of course, in the above-mentioned heat dissipation device, the
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US12/490,277 US20100051232A1 (en) | 2008-08-27 | 2009-06-23 | Heat dissipation apparatus incorporating a fan |
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US8365811B2 (en) * | 2007-12-07 | 2013-02-05 | Nidec Corporation | Heat sink fan |
CN102762081B (en) * | 2012-07-03 | 2015-09-30 | 东莞汉旭五金塑胶科技有限公司 | There is the radiator of built-in fans |
AT515828B1 (en) | 2014-05-23 | 2022-02-15 | Fronius Int Gmbh | Cooling device and inverter housing with such a cooling device |
CN107809878B (en) * | 2016-09-08 | 2020-08-04 | 奇鋐科技股份有限公司 | Water cooling radiator structure |
US10378836B2 (en) * | 2016-09-26 | 2019-08-13 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
CN108871034B (en) * | 2018-06-20 | 2023-11-28 | 江苏英杰电子器件有限公司 | High-strength radiator |
EP4293234A1 (en) | 2022-06-17 | 2023-12-20 | FRONIUS INTERNATIONAL GmbH | Fan, cooling device with such a fan and housing with such a cooling device |
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CN2713637Y (en) * | 2004-07-13 | 2005-07-27 | 鸿富锦精密工业(深圳)有限公司 | Radiator |
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US20100051232A1 (en) | 2010-03-04 |
CN101662918A (en) | 2010-03-03 |
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Effective date of registration: 20170428 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Patentee after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. |