CN109906017B - cooling unit - Google Patents

Abstract

The present invention provides a heat dissipation unit, comprising a body having an upper surface and a lower surface, at least one heat conducting member having a heat absorbing surface and a heat conducting surface, the heat conducting surface being arranged on the lower surface of the body. With the design of the present invention, the heat dissipation unit of the present invention can be directly attached to a heating element whose height is lower than that of surrounding or adjacent electronic elements or a plurality of heating elements of different heights by means of the at least one heat conducting member, without the need to bend (concave) the heat dissipation unit to damage its internal capillary structure and block the steam channel, thereby achieving a better heat dissipation effect.

Description

cooling unit

technical field

The present invention relates to a heat-dissipating unit, in particular to at least one heat-conducting member combined with the outer surface of a main body for contacting and dissipating heat for a heat-generating element with a height difference due to adjacent electronic elements, so as to effectively achieve a heat-dissipating effect with good heat-dissipation effect. unit.

Background technique

Current mobile devices, personal computers, servers, communication cases or other systems or devices have improved computing performance, and the heat generated by their internal heating elements (such as but not limited to chips) has also increased, and the functions of current electronic equipment have become more and more More and more diverse, there are various heating elements on the substrate. Vapor chamber is a large-scale surface-to-surface heat conduction application. Vapor chamber is a rectangular or non-rectangular shell (or plate), and the inner cavity of the shell has at least one inner wall surface. A capillary structure is provided, and the inside of the casing is filled with working fluid, and one side (heat-receiving surface) of the casing is attached to the heating element to absorb the heat generated by the heating element, so that the liquid working fluid is evaporated into a vapor state , conduct heat to the other side (condensing surface) of the shell, the working fluid in the vapor state is cooled and condensed into a liquid state, and the working fluid in liquid state is then returned to the heating surface by gravity or capillary structure to continue the vapor-liquid cycle, In order to effectively achieve the effect of uniform temperature and heat dissipation, the contact heat conduction area of the uniform temperature plate is large, which is different from the point-to-point heat conduction mode of the heat pipe, so it is suitable for heating elements with a large heating area or a plurality of close distances.

However, in the electronic circuit design of the current substrate, the height of the heating element that needs to be dissipated may be lower than the surrounding or adjacent resistors, capacitors or other passive elements. Plates, loop heat pipes, etc. are difficult to fully attach to the heating element effectively.

Another existing problem is that when there are a plurality of heating elements to be dissipated, the heights of each of the heating elements to be dissipated are different. When using the temperature equalizing plate to dissipate heat from a relatively low-height heating element or a plurality of heating elements with different heights, the heating element of different heights can be attached to the heating element with different heights. However, after bending (concave), the vapor chamber is prone to damage the internal capillary structure (such as capillary structure falling off) and block the steam passage, or the capillary phenomenon fails due to excessive bending, and the water cannot be returned. The heat dissipation effect is reduced or disabled, which in turn causes the temperature of the heating element to be too high.

Therefore, how to solve the above-mentioned problems is the direction that those skilled in the art should strive for.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a heat-dissipating element with a lower height than surrounding or adjacent electronic components or a plurality of heating elements with different heights through at least one heat-conducting member on the outer surface of the body. cooling unit.

In order to achieve the above object, the present invention provides a heat dissipation unit, which is characterized by comprising:

a body having an upper surface and a lower surface; and

At least one heat-conducting member has a heat-absorbing surface and a heat-conducting surface, and the heat-conducting surface is disposed on the lower surface of the main body.

The heat dissipation unit, wherein: the main body and the at least one heat-conducting member are independent elements, respectively, and the heat-conducting surface of the at least one heat-conducting member is correspondingly combined with the lower surface of the main body.

The heat dissipation unit, wherein: the heat conduction surface of the at least one heat conducting member is integrally formed on the lower surface of the body.

The heat dissipation unit, wherein: the body is any one or a combination of any two or more of a heat-conducting substrate, a radiator, a temperature equalizing plate, a heat pipe and a loop heat pipe.

The heat dissipation unit, wherein: the body has a first plate body and a second plate body, the upper surface is located on the outer surface of the first plate body, the lower surface is located on the outer surface of the second plate body, the The first plate body covers the second plate body and defines a chamber together, and the chamber has a capillary structure and a working fluid.

The heat dissipation unit, wherein: the body and the at least one heat conducting member are made of the same material or different materials.

The heat dissipation unit, wherein: the main body and the at least one thermally conductive member are made of metal material or ceramic material, and the metal material is gold, silver, copper, iron, aluminum, stainless steel, titanium, gold alloy, silver alloy, copper alloy , any one of iron alloy, aluminum alloy and titanium alloy material, and the ceramic material is any one of silicon nitride, zirconia and alumina.

The heat dissipation unit, wherein: the main body and the at least one heat-conducting member are combined by soldering, brazing, diffusion bonding, ultrasonic welding, laser welding, gluing, splicing, splicing, sintering and direct copper cladding any combination of methods.

The heat dissipation unit, wherein: the lower surface of the main body has at least one bonding area and at least one non-bonding area, the at least one bonding area is adjacent to the at least one non-bonding area, and the heat conduction surface of the at least one heat conducting member is disposed on the at least one non-bonding area. the at least one bonding area on the lower surface of the body.

The heat dissipation unit, wherein: there are a plurality of heat-conducting members, the heights of the plurality of heat-conducting members are different, the lower surface of the body has a plurality of bonding areas and a plurality of non-bonding areas, the plurality of bonding areas are respectively adjacent to the plurality of non-bonding areas, the plurality of The heat-conducting surfaces of the heat-conducting members are respectively disposed in the plurality of bonding regions, and the heat-absorbing surfaces of the plurality of heat-conducting members are correspondingly attached to a plurality of heating elements with different heights.

The heat dissipation unit, wherein: further comprises at least one bonding medium layer, which is correspondingly disposed between the lower surface of the main body and the heat conduction surface of the at least one thermally conductive member, and the lower surface of the main body is connected by the at least one bonding medium layer. the heat conducting surface of the at least one heat conducting member.

The heat dissipation unit, wherein: the lower surface of the main body has at least one bonding area and at least one non-bonding area, the at least one bonding area is adjacent to the at least one non-bonding area, and the heat conduction surface of the at least one heat conducting member is disposed on the at least one non-bonding area. The at least one bonding area on the lower surface of the main body and the at least one bonding medium layer are correspondingly disposed between the at least one bonding area of the main body and the heat conduction surface of the at least one thermally conductive member.

The heat dissipation unit, wherein: the at least one bonding medium layer is formed on the lower surface of the main body by any one of evaporation, sputtering, and electroplating.

The heat dissipation unit, wherein: the at least one bonding medium layer is any one of a nickel-plated layer, a tin-plated layer and a copper-plated layer.

The heat dissipation unit, wherein: the at least one bonding medium layer and the at least one heat conducting member are bonded by any one of soldering, brazing, diffusion bonding, ultrasonic welding, and laser welding.

The heat dissipation unit, wherein: there are a plurality of heat-conducting members, the heights of the plurality of heat-conducting members are different, the lower surface of the body has a plurality of bonding areas and a plurality of non-bonding areas, the plurality of bonding areas are respectively adjacent to the plurality of non-bonding areas, the plurality of The heat conduction surfaces of the thermally conductive members are respectively arranged in the plurality of bonding regions, and the plurality of bonding medium layers are correspondingly arranged between the plurality of bonding regions on the lower surface of the body and the heat conduction surfaces of the plurality of thermally conductive members, and the heat-absorbing surfaces of the plurality of thermally conductive members face It should be attached to multiple heating elements with different heights.

By virtue of this design of the present invention, the heat dissipation unit of the present invention can be directly attached to the heating element with a lower height than the surrounding or adjacent electronic components or a plurality of heating elements of different heights by virtue of the at least one heat conducting member, without bending (concave) folding. The heat dissipation unit destroys its internal capillary structure and blocks the steam passage, so as to achieve better heat dissipation effect.

The following drawings are intended to facilitate an understanding of the present invention, and are described in detail herein and form a part of specific embodiments. The specific embodiments of the present invention are explained in detail through the specific embodiments herein and with reference to the corresponding drawings, and are used to illustrate the working principle of the invention.

Description of drawings

1 is an exploded perspective view of a first embodiment of a heat dissipation unit of the present invention;

2 is another perspective of an exploded perspective view of the first embodiment of the heat dissipation unit of the present invention;

3 is a combined cross-sectional view of the first embodiment of the heat dissipation unit of the present invention;

FIG. 4 is a combined cross-sectional view of the bonding medium layer of the first embodiment of the heat dissipation unit of the present invention;

5 is an exploded perspective view of a second embodiment of the heat dissipation unit of the present invention;

6 is another perspective of an exploded perspective view of the second embodiment of the heat dissipation unit of the present invention;

7 is a combined cross-sectional view of a second embodiment of the heat dissipation unit of the present invention;

FIG. 8 is a cross-sectional view of the combination of the bonding medium layers of the second embodiment of the heat dissipation unit of the present invention.

Reference numeral description: heat dissipation unit 1; body 11; upper surface 111; lower surface 112; first plate body 113; second plate body 114; chamber 115; capillary structure 116; working fluid 117; Non-bonding areas 119a, 119b; thermally conductive members 12a, 12b; heat absorption surface 121; heat conduction surface 122; bonding medium layers 131, 132;

Detailed ways

The above objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 , which are an exploded perspective view of the first embodiment of the heat dissipation unit of the present invention and another perspective and combined cross-sectional view of the heat dissipation unit. As shown in the figures, the heat dissipation unit 1 of the present invention is applied On a heat source that needs to be dissipated in an electronic device, the heat dissipation unit 1 in this embodiment is contacted and attached to at least one heating element 21 provided on a board (such as a circuit board or a motherboard) 2 of the electronic device. , to dissipate heat from the at least one heating element 21 , and in this embodiment, it is represented as a heating element 21 (such as a central processing unit and a display processing chip) whose height is lower than the surrounding electronic elements 23 . The heating element 21 is not limited to the above-mentioned central processing unit and display processing chip. In specific implementation, the heating element 21 can be selected as a south bridge chip, a north bridge chip, a transistor on a circuit board, or other electronic components that need heat dissipation.

The heat dissipation unit 1 includes a main body 11 and at least one thermally conductive member 12a. In this embodiment, the main body 11 is represented as a vapor chamber. high metal block or alloy block), a radiator (such as an aluminum extrusion radiator or a fin radiator), a heat pipe, a loop heat pipe, etc., or any combination thereof, wherein the at least one thermally conductive member 12a In this embodiment, it is shown as a solid heat conducting block. In this embodiment, the thermally conductive member is shown as one thermally conductive member 12a corresponding to one heating element 21 , but the number of the thermally conductive member and the heating element in this embodiment is not limited to the above one, and its variant embodiments will be described separately. The heights of the heat-conducting members and the heating elements can be designed in advance according to heat dissipation requirements, and the heights of the heat-conducting members and the heating elements can be adjusted.

The aforementioned main body 11 has an upper surface 111 and a lower surface 112 , and since the main body 11 is represented as an isothermal plate, the main body 11 has a first plate body 113 and a second plate body 114 , the upper surface 111 Located on the outer surface of the first plate body 113 , the lower surface 112 is located on the outer surface of the second plate body 114 , the first plate body 113 covers the second plate body 114 and together define a cavity 115 , the cavity The chamber 115 is an air-tight chamber and has a capillary structure 116 and a working fluid 117, the capillary structure 116 representing, for example, any or both of sintered powder, braid, mesh, fiber, and grooves combination of the above.

The lower surface 112 of the main body 11 has at least one bonding region 118a and at least one non-bonding region 119a, the at least one bonding region 118a may be adjacent to or adjacent to the at least one non-bonding region 119a, the at least one bonding region 118a in this embodiment It is shown that one bonding area 118a corresponds to one thermally conductive member 12a, and the at least one non-bonding area 119a is shown in this embodiment as a non-bonding area 119a adjacent to and surrounding the bonding area 118a, and the body 11 is bonded in the bonding area 118a The heat-conducting member 12a absorbs the heat generated when the heating element 21 whose height is lower than the surrounding or adjacent to the electronic element 23 operates. 23. However, the number of bonding regions, non-bonding regions and thermally conductive members in this embodiment is not limited to the above one, and variant embodiments thereof will be described separately. The bonding area 118a and the non-bonding area 119a refer to the area of the lower surface 112 of the main body 11 , and do not refer to additional structures on the lower surface 112 of the main body 11 , and are represented by dashed lines in the drawings. .

The heat-conducting member 12a has a heat-absorbing surface 121 and a heat-conducting surface 122, the heat-absorbing surface 121 and the heat-conducting surface 122 are respectively disposed on the upper and lower sides of the heat-conducting member 12a, and the heat-conducting surface 122 of the heat-conducting member 12a is disposed on the main body The bonding area 118 a of the lower surface 112 of the heat conducting member 12 a is used to conduct the heat absorbed by the heat absorption surface 121 to the body 11 . The heat-absorbing surface 121 of the heat-conducting member 12a is correspondingly attached to the heating element 21, and the height of the heat-conducting member 12a and the heating element 21 after being attached is shown as slightly higher than the electronic elements around the heating element 21 in this embodiment. 23 . In other embodiments, the height of the thermally conductive member 12 a and the heating element 21 after they are attached can also be expressed as being higher than or equal to the height of the electronic elements 23 around the heating element 21 .

The heat dissipation unit 1 is shown in this embodiment as the main body 11 and the thermally conductive member 12a are selected as independent components, respectively, and the heat conduction surface 122 of the thermally conductive member 12a is correspondingly combined with the lower surface 112 of the main body 11 for illustration. The aforementioned main body 11 and the heat conducting member 12a can be represented by the same material or different materials, and the same material can be divided into the same metal material (such as copper, aluminum, stainless steel or titanium material) or the same ceramic material (such as alumina (Al ₂ O 2 ). ₃ ), silicon nitride (Si ₃ N ₄ ) or zirconia (ZrO ₂ )), different materials can be divided into different metal materials or different ceramic materials or different metal and ceramic materials.

When the main body 11 and the thermally conductive member 12a are made of the same metal material such as copper, the first and second plates 113 and 114 of the main body 11 and the thermally conductive member 12a are combined by diffusion bonding. In addition, in other embodiments, the body 11 of the same metal material (such as gold, silver, copper, iron, aluminum, stainless steel or titanium or alloy material) and the thermally conductive member 12a can also be soldered, brazed, ultrasonic Any combination of welding, laser welding, gluing, splicing and splicing.

When the body 11 and the heat conducting member 12a are made of the same ceramic material, such as alumina (Al ₂ O ₃ ), the first and second plates 113 and 114 of the body 11 and the heat conducting member 12a are combined by The sintering method is combined, but not limited to this, in other embodiments, the body of the same ceramic material (alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ) or zirconia (ZrO ₂ )) 11 and the thermally conductive member 12a can also be combined by means of adhesive.

Please refer to FIG. 4 , when the body 11 and the heat conducting member 12a are made of different metal materials, the body 11 and the heat conducting member 12a of different materials are not easily combined together, for example, the body 11 is made of titanium and The heat-conducting member 12a is made of copper, and the titanium material is not easily welded or welded with other metal materials. Therefore, the heat dissipation unit 1 of the present embodiment further includes at least one bonding medium layer 131, and the at least one bonding medium layer 131 is correspondingly disposed between the lower surface 112 of the main body 11 and the heat conduction surface 122 of the at least one thermally conductive member 12a. The lower surface 112 of the main body 11 is connected to the heat conduction surface 122 of the at least one thermally conductive member 12a through the at least one bonding medium layer 131 , and the thermally conductive surface 122 of the at least one thermally conductive member 12a is correspondingly bonded to the at least one of the lower surface 112 of the main body 11 . The bonding area 118a, and the at least one bonding medium layer 131 is correspondingly disposed between the at least one bonding area 118a of the main body 11 and the heat conduction surface 122 of the at least one thermally conductive member 12a.

The at least one bonding medium layer 131 is represented as a bonding medium layer 131 in this embodiment, and corresponds to a bonding region 118a and a thermally conductive member 12a. In other embodiments, the aforementioned bonding medium layers may be designed so that two or more bonding medium layers correspond to more than two bonding regions and thermally conductive members. In other words, the number of the aforementioned bonding medium layers corresponds to the number of corresponding bonding regions and thermally conductive members Cooperate.

The bonding dielectric layer 131 is shown as a nickel plating layer in this embodiment, and the bonding dielectric layer 131 is formed on the bonding region 118 a of the lower surface 112 of the body 11 by electroplating. In other embodiments, the bonding dielectric layer 131 can also be any one of a tin plating layer and a copper plating layer. In addition, the bonding dielectric layer 131 can also be formed on the The bonding area 118 a of the lower surface 112 of the body 11 .

The thermally conductive member 12a is combined with the bonding medium layer 131 on the lower surface 112 of the main body 11 by diffusion bonding, but is not limited to this. In other embodiments, the main body 11 can also be selected from gold, silver, copper, iron , aluminum, stainless steel and alloys, and the heat-conducting member 12a can also be selected from another material of gold, silver, copper, iron, aluminum, stainless steel, titanium and alloys different from the body 11 . In addition, in other embodiments, the body 11 and the thermally conductive member 12a are made of different metal materials (eg, gold, silver, copper, iron, aluminum, stainless steel, titanium, and alloys), and the thermally conductive member 12a can also be made of soft The bonding medium layer 131 on the lower surface 112 of the main body 11 is bonded to the bonding medium layer 131 by any one of welding, brazing, ultrasonic welding and laser welding.

Wherein, when the body 11 and the heat-conducting member 12a are made of different metal materials and ceramic materials, for example, the body 11 is made of aluminum oxide (Al ₂ O ₃ ) and the plurality of heat-conducting members 12a are made of copper, the heat-conducting member 12a passes through The bonding medium layer 131 bonded to the lower surface 112 of the body 11 by diffusion bonding, but not limited to this, in other embodiments, the body 11 can also be represented as silicon nitride (Si ₃ N ₄ ) or zirconia (ZrO ₂ ) any material, and the thermally conductive member 12a can also be represented by any material of gold, silver, iron, aluminum, stainless steel, titanium and alloys.

When, for example, the body 11 is made of copper and the heat-conducting member 12a is made of aluminum oxide (Al ₂ O ₃ ), the heat-conducting member 12a is bonded under the body 11 by means of Direct Bonding Cooper (DBC). Surface 112 .

In addition, in addition to the combination of the main body 11 and the thermally conductive member 12a as independent components, in other embodiments, the thermally conductive surface 122 of the thermally conductive member 12a can also be selected to be integrally formed on the lower surface 112 of the main body 11 .

Therefore, by virtue of the design of the body combined with the heat conducting member of the present invention, the body 11 can pass over the electronic components 23 with a higher height around the heating element 21 in the non-bonding area 119a, so that the body 11 can pass through the bonding area 118a The heat-conducting member 12a absorbs the heat generated by the heating element 21 whose height is lower than that of the surrounding or adjacent electronic components 23, and dissipates the heat rapidly and uniformly, so as to effectively dissipate heat to the heating element 21 with a lower height. In addition, since the body 11 itself does not need to be bent (concave) when dissipating heat from the heating element 21 whose height is lower than that of the surrounding or adjacent electronic elements 23 , the capillary structure in the chamber 115 can be prevented from being damaged. 116 and will not block the steam passage to effectively achieve better heat dissipation. In addition, since the bonding medium layer is formed on the lower surface of the main body, the main body 11 and the thermally conductive member 12a of different materials can achieve a better bonding effect, such as stainless steel, titanium material or ceramic material with higher structural strength The body 11 is formed of a good material, and the heat-conducting member 12a is formed of a material with good thermal conductivity such as copper or aluminum, so that the heat dissipation unit 1 of the present invention can achieve the effects of better structural strength and better thermal conductivity at the same time.

Please refer to FIG. 5 , FIG. 6 , and FIG. 7 , which are an exploded perspective view and another perspective view and a combined cross-sectional view of a heat dissipation unit and a manufacturing method thereof according to the second embodiment of the present invention, and refer to the first, second and third As shown in the figure, part of the structure and function of this embodiment are the same as the above-mentioned first embodiment, so they will not be repeated here, but the difference between this embodiment and the above-mentioned first embodiment is that the heat dissipation unit 1 has a plurality of heat-conducting members 12a, 12b, the plurality of heat-conducting members are represented in this embodiment as two heat-conducting members 12a, 12b with different heights, and correspond to two heating elements 21, 22 with different heights. The number of heat-conducting members and heating elements is not limited to the above two. In other embodiments, the number and height of the aforementioned heat-conducting members and heating elements can be designed in advance according to heat dissipation requirements, and the number and height of the aforementioned heat-conducting members and heating elements can be adjusted, and The number and height of the aforementioned heat-conducting components are matched with the number and height of the corresponding heating elements. high, medium and low height heating elements), and so on.

And the lower surface 112 of the main body 11 has a plurality of bonding regions 118a, 118b and a plurality of non-bonding regions 119a, 119b, the plurality of bonding regions 118a, 118b can be adjacent or adjacent to the plurality of non-bonding regions 119a, 119b, the plurality of bonding regions 118a , 118b in this embodiment are represented as two bonding regions 118a, 118b corresponding to two thermally conductive members 12a, 12b, and the plurality of non-bonding regions 119a, 119b are represented as two non-bonding regions 119a, 119b in this embodiment, the first The non-bonding regions 119a are located between the first bonding region 118a and the second bonding region 118b, and the second non-bonding region 119a is adjacent to and surrounds the first bonding region 118a and the second bonding region 118b. In other embodiments, the aforementioned bonding areas can be designed to be more than three bonding areas corresponding to more than three thermally conductive members. Instead, three or more non-binding regions correspond to three or more binding regions.

The heat conduction surfaces 122 of the plurality of thermally conductive members 12a and 12b are respectively bonded to the plurality of bonding regions 118a and 118b of the main body 11 , that is to say, the heat conduction surface 122 of the first heat conduction member 12a is bonded to the first one of the main body 11 . The bonding area 118a, the heat conduction surface 122 of the second heat-conducting member 12b is bonded to the second bonding area 118b of the body 11, and the heat-conducting surfaces 122 of the plurality of heat-conducting members 12a, 12b are used to absorb the heat absorbed by the heat-absorbing surface 121 Conducted to the body 11 .

In addition, the heat-absorbing surfaces 121 of the two heat-conducting members 12 a and 12 b with different heights are correspondingly attached to the two heating elements 21 and 22 with different heights, that is to say, the height of the first heating element 21 is higher than that of the second heating element 22 . The height of the first heat-conducting element 12a is higher than that of the second heat-conducting element 12b, so that the heat-absorbing surface 121 of the first heat-conducting element 12a is in contact with the first heating element 21, and the second heat-conducting element 121 The heat-absorbing surface 121 of the heat-conducting member 12b is contacted and attached to the second heating element 22 . Therefore, the design is adjusted according to the heights of the plurality of heat-conducting members 12a, 12b along with the heights of the plurality of heating elements 21, 22 attached, so that the plurality of heat-conducting members 12a, 12b are attached to the plurality of heating elements 21, 22. The overall height of the heat-conducting element 12a and the first heating element 21 after they are attached to each other are equal to the height of the second heat-conducting element 12b and the second heating element 22 after they are attached to each other. . The heights of the heat-conducting element 12a and the heating element 21 and the heat-conducting element 12b and the heating element 22 after being attached are higher than and/or equal to the electronic elements 23 around or adjacent to the plurality of heating elements 21 and 22 .

Therefore, by virtue of the design of the body of the present invention combined with the plurality of heat-conducting members, the body 11 is higher than and/or equal to the electronic components 23 around the plurality of heating elements 21 and 22, and simultaneously passes through the plurality of heat-conducting members 12a, 12b absorbs the heat generated by the heating elements 21 and 22 of different heights during operation, and quickly dissipates the heat evenly outward, so as to effectively achieve the effect of heat dissipation for the heating elements 21 and 22 of different heights. In addition, since the body 11 itself does not need to be bent (concave) when dissipating heat from the heating elements 21 and 22 of different heights, the capillary structure 116 in the chamber 115 will not be damaged and the steam will not be blocked. channel to effectively achieve better heat dissipation effect.

Please refer to FIG. 8 , when the main body 11 and the plurality of heat-conducting members 12 a and 12 b are made of different metal materials or the body 11 is made of ceramic material and the plurality of heat-conducting members 12 a and 12 b are made of metal material, please refer to the above-mentioned combination method. The combination manner of FIG. 4 will not be described in detail below.

The above description is only illustrative rather than restrictive for the present invention. Those skilled in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the claims. All will fall within the protection scope of the present invention.

Claims (16)

1. A heat dissipation unit, characterized in that, comprising: a body having an upper surface and a lower surface; and at least one heat-conducting member has a heat-absorbing surface and a heat-conducting surface, and the heat-conducting surface is disposed on the lower surface of the main body; The height of the at least one heat-conducting member is designed to be adjustable according to the height of the at least one heating element to which it is attached, and the overall height of the at least one heat-conducting member and the at least one heating element after being attached is the same, and the The overall height of the at least one heat-conducting member and the at least one heating element after being attached is higher than or equal to the height of the electronic elements around or adjacent to the at least one heating element, and the lower surface of the body has no bends/concave folds. 2 . The heat dissipation unit according to claim 1 , wherein the main body and the at least one thermally conductive member are independent components, respectively, and a heat conduction surface of the at least one thermally conductive member is correspondingly coupled to the lower surface of the main body. 3 . 3 . The heat dissipation unit of claim 1 , wherein the heat conduction surface of the at least one thermally conductive member is integrally formed on the lower surface of the main body. 4 . 4 . The heat dissipation unit of claim 1 , wherein the body is any one or a combination of any two or more of a heat conducting base, a radiator, a vapor chamber, a heat pipe and a loop heat pipe. 5 . 5 . The heat dissipation unit of claim 1 , wherein the body has a first plate body and a second plate body, the upper surface is located on the outer surface of the first plate body, and the lower surface is located on the first plate body. 6 . On the outer surfaces of the two plate bodies, the first plate body covers the second plate body and defines a chamber together, and the chamber has a capillary structure and a working fluid. 6 . The heat dissipation unit of claim 1 , wherein the body and the at least one thermally conductive member are made of the same material or different materials. 7 . 7 . The heat dissipation unit according to claim 1 , wherein the body and the at least one thermally conductive member are made of metal material or ceramic material, and the metal material is gold, silver, copper, iron, aluminum, stainless steel, titanium, Any one of gold alloy, silver alloy, copper alloy, iron alloy, aluminum alloy, titanium alloy, and the ceramic material is any one of silicon nitride, zirconia and alumina. 8. The heat dissipation unit of claim 2, wherein the main body and the at least one thermally conductive member are combined by soldering, brazing, diffusion bonding, ultrasonic welding, laser welding, gluing, embedding, Any combination of splicing, sintering and direct copper cladding. 9 . The heat dissipation unit of claim 1 , wherein the lower surface of the main body has at least one bonding area and at least one non-bonding area, the at least one bonding area is adjacent to the at least one non-bonding area, and the at least one The heat conduction surface of the heat conducting member is disposed on the at least one bonding area on the lower surface of the body. 10. The heat dissipation unit according to claim 9, characterized in that: there are a plurality of heat-conducting members, the plurality of heat-conducting members have different heights, the lower surface of the main body has a plurality of bonding regions and a plurality of non-bonding regions, and the plurality of bonding regions are respectively adjacent to each other. In the plurality of non-bonding areas, the heat conduction surfaces of the plurality of heat-conducting members are respectively disposed in the plurality of bonding areas, and the heat-absorbing surfaces of the plurality of heat-conducting members are correspondingly attached to the plurality of heating elements with different heights. 11 . The heat dissipation unit according to claim 2 , further comprising at least one bonding medium layer correspondingly disposed between the lower surface of the main body and the heat conduction surface of the at least one heat conducting member, and the lower surface of the main body is correspondingly disposed. 12 . The heat conduction surface of the at least one thermally conductive member is connected through the at least one bonding medium layer. 12. The heat dissipation unit of claim 11, wherein the lower surface of the body has at least one bonding area and at least one non-bonding area, the at least one bonding area is adjacent to the at least one non-bonding area, and the at least one bonding area is adjacent to the at least one non-bonding area. The heat conduction surface of the heat conduction member is disposed on the at least one bonding area on the lower surface of the body, and the at least one bonding medium layer is correspondingly disposed between the at least one bonding area of the body and the heat conduction surface of the at least one heat conduction member. 13 . The heat dissipation unit of claim 11 , wherein the at least one bonding medium layer is formed on the lower surface of the body by any one of evaporation, sputtering, and electroplating. 14 . 14. The heat dissipation unit of claim 11, wherein the at least one bonding dielectric layer is any one of a nickel-plated layer, a tin-plated layer, and a copper-plated layer. 15 . The heat dissipation unit of claim 11 , wherein the at least one bonding medium layer and the at least one thermally conductive member are bonded by any one of soldering, brazing, diffusion bonding, ultrasonic welding, and laser welding. 16 . way combined. 16 . The heat dissipation unit according to claim 11 , wherein a plurality of heat-conducting members are provided, the heights of the plurality of heat-conducting members are different, the lower surface of the main body has a plurality of bonding regions and a plurality of non-bonding regions, and the plurality of bonding regions are respectively adjacent to each other. 17 . The plurality of non-bonding areas, the heat conduction surfaces of the plurality of heat-conducting members are respectively disposed in the plurality of bonding areas, the plurality of bonding medium layers are correspondingly disposed between the plurality of bonding areas on the lower surface of the body and the heat conduction surfaces of the plurality of heat-conducting members, the The heat-absorbing surfaces of the plurality of heat-conducting members are correspondingly attached to the plurality of heating elements with different heights.

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