CN109413839A - A kind of method and system reducing EMI by putting capacitance positions - Google Patents
A kind of method and system reducing EMI by putting capacitance positions Download PDFInfo
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- CN109413839A CN109413839A CN201811186685.8A CN201811186685A CN109413839A CN 109413839 A CN109413839 A CN 109413839A CN 201811186685 A CN201811186685 A CN 201811186685A CN 109413839 A CN109413839 A CN 109413839A
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- emi
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- impedence
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of method and systems that EMI is reduced by putting capacitance positions, comprising: the grid that S1, setting EMI capacitor optimize places different EMI decoupling capacitors in different grids；S2, compare Performance and Cost, obtain the choice of Performance and Cost；S3, compare Impedence and Frequency, obtain the choice of Impedence and Frequency；S4, different simulation results are obtained according to different capacitors, choose optimal value.This programme can meet system requirements with least capacitor under the premise of guaranteeing EMI effect, the problem of from EMI angle research pcb board grade, analyze the influence of various circuit structures, PCB physical structure, driving source and observation position to EMI, it is able to solve plate grade EMI problem, and then ensure that the safety of entire server operation, pass through the test of CCC.It solves and lacks parameter study to capacitor for reducing electromagnetic interference in the prior art, realize through the parasitic parameter of simulation result acquisition capacitor, effectively reduce electromagnetic interference.
Description
Technical field
The present invention relates to circuit signal technical field, especially a kind of method that EMI is reduced by putting capacitance positions
With system.
Background technique
For a long time, the various noises generated on pcb board are reduced using bypass and decoupling capacitor always, due to cost phase
To lower, using being easy, can be selected there are also a series of magnitude, capacitor is usually to be used to reduce electromagnetic interference on circuit board
(EMI) main devices.Due to parasitic parameter have important influence, therefore capacitor selection than its capacity selection more
It is important.There are many method for manufacturing capacitor, and manufacturing process determines the size of parasitic parameter.
Electro instrument noise can be caused by many different modes.In digital circuit, these noises are mainly by switching regulator collection
At circuit, produced by power supply and adjuster, and then mainly generated by oscillator and amplifying circuit in radio circuit.Either
These interference on power supply and ground level or on signal wire itself, which will all be formed the work of system, to be influenced, and in addition can also
Generate radiation.
But it in the prior art, is lacked about the parasitic parameter of capacitor, optimal capacitor cannot be provided for specific problem
Effect of optimization.
Summary of the invention
The object of the present invention is to provide a kind of method and systems that EMI is reduced by putting capacitance positions, it is intended to solve
Lack the parameter study to capacitor for reducing electromagnetic interference in the prior art, realizes the parasitism for obtaining capacitor by simulation result
Parameter effectively reduces electromagnetic interference.
To reach above-mentioned technical purpose, the present invention provides a kind of method that EMI is reduced by putting capacitance positions, packets
Include following steps:
The grid that S1, setting EMI capacitor optimize, places different EMI decoupling capacitors in different grids；
S2, compare Performance and Cost, obtain the choice of Performance and Cost；
S3, compare Impedence and Frequency, obtain the choice of Impedence and Frequency；
S4, different simulation results are obtained according to different capacitors, choose optimal value.
Preferably, the choice of the Performance and Cost specifically:
Under the conditions of meeting Performance, Cost selects minimum.
Preferably, the choice of the Impedence and Frequency specifically:
Under the conditions of identical Frequency, Impedence selects minimum.
Preferably, the EMI decoupling capacitor size is 100nF or 10nF.
The present invention also provides a kind of system for reducing EMI by putting capacitance positions, the system comprises:
Grid setup module is placed different EMI in different grids and is gone for the grid of EMI capacitor optimization to be arranged
Coupling capacitor；
Cost performance accepts or rejects module, for comparing Performance and Cost, obtains the choice of Performance and Cost；
Module is accepted or rejected in impedance, for comparing Impedence and Frequency, obtains Impedence's and Frequency
It accepts or rejects；
Optimal selection module chooses optimal value for obtaining different simulation results according to different capacitors.
Preferably, the choice of the Performance and Cost specifically:
Under the conditions of meeting Performance, Cost selects minimum.
Preferably, the choice of the Impedence and Frequency specifically:
Under the conditions of identical Frequency, Impedence selects minimum.
Preferably, the EMI decoupling capacitor size is 100nF or 10nF.
The effect provided in summary of the invention is only the effect of embodiment, rather than invents all whole effects, above-mentioned
A technical solution in technical solution have the following advantages that or the utility model has the advantages that
Compared with prior art, the grid that the present invention is optimized by setting EMI capacitor is placed different in different grids
EMI decoupling capacitor, be comprehensively compared Performance and Cost and Impedence and Frequency, obtain
The choice of Performance and Cost and the choice of Impedence and Frequency, so that it is determined that decoupled when optimal value
The information such as placement position and size of type.In entire circuit board of server system, the electromagnetic performance of mainboard be must satisfy, this
Scheme can meet system requirements with least capacitor under the premise of guaranteeing EMI effect, from EMI angle research pcb board grade
Problem analyzes the influence of various circuit structures, PCB physical structure, driving source and observation position to EMI, is able to solve plate grade EMI
Problem, and then ensure that the safety of entire server operation, pass through the test of CCC.It solves in the prior art for reducing electricity
Magnetic disturbance lacks the parameter study to capacitor, realizes the parasitic parameter that capacitor is obtained by simulation result, and it is dry to effectively reduce electromagnetism
It disturbs.
Detailed description of the invention
Fig. 1 is a kind of method flow diagram that EMI is reduced by putting capacitance positions provided in the embodiment of the present invention；
Fig. 2 is the grid schematic diagram that setting EMI optimizes provided in the embodiment of the present invention；
Fig. 3 is the curve synoptic diagram that Performance provided in the embodiment of the present invention and Cost is accepted or rejected；
Fig. 4 is the curve synoptic diagram that Impedence provided in the embodiment of the present invention and Frequency is accepted or rejected；
Fig. 5 is a kind of system structure frame that EMI is reduced by putting capacitance positions provided in the embodiment of the present invention
Figure.
Specific embodiment
In order to clearly illustrate the technical characterstic of this programme, below by specific embodiment, and its attached drawing is combined, to this
Invention is described in detail.Following disclosure provides many different embodiments or example is used to realize different knots of the invention
Structure.In order to simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.In addition, the present invention can be with
Repeat reference numerals and/or letter in different examples.This repetition is that for purposes of simplicity and clarity, itself is not indicated
Relationship between various embodiments and/or setting is discussed.It should be noted that illustrated component is not necessarily to scale in the accompanying drawings
It draws.Present invention omits the descriptions to known assemblies and treatment technology and process to avoid the present invention is unnecessarily limiting.
It is provided for the embodiments of the invention a kind of method that EMI is reduced by putting capacitance positions with reference to the accompanying drawing
It is described in detail with system.
As shown in Figure 1, the embodiment of the invention discloses a kind of methods that EMI is reduced by putting capacitance positions, including
It operates below:
The grid that S1, setting EMI capacitor optimize, places different EMI decoupling capacitors in different grids；
S2, compare Performance and Cost, obtain the choice of Performance and Cost；
S3, compare Impedence and Frequency, obtain the choice of Impedence and Frequency；
S4, different simulation results are obtained according to different capacitors, choose optimal value.
The purpose of EMI capacitor optimization is the capacitor by minimum number or cost, reduces the resonance due to power plane
Bring EMI radiation.Many designers lean on the rule of thumb, for example largely use 100nF or 10nF, avoid EMI, but such
Design was often design, and there is no enough spaces in many cases, to put so much capacitor.
The grid of EMI capacitor optimization is set, as shown in Fig. 2, the grid generated is shown in power plane with white box,
It will be placed among these grids, the type of capacitor, size has been respectively set and put in the EMI decoupling capacitor placed later
Then position carries out wave simulation.The EMI decoupling capacitor size is 100nF or 10nF.
By capacitance profile in different grids, the first row first row, the second row first row, second of difference within a grid
Row secondary series, the third line third column, select to obtain different performance and capacitor cost by this four capacitor differences
Value, as shown in figure 3, by the way that performance and capacitor cost value, available performance and capacitor is comprehensively compared
The choice of cost, is more likely to the whole EMI effect of circuit in Performance, and Cost be then be more likely to price at
Present aspect can obtain the different comparison figures of different Performance VS Cost when constantly choosing capacitance positions.
When in practice, often under the conditions of meeting Performance, the lower Cost the better, i.e. selection minimum.
Impedence and Frequency is comprehensively compared, as shown in figure 4, by the available Performance of the figure and
The choice of Frequency, in figure dark parts be continue to optimize it is advanced, light color be final choice optimization, due to hindering greatly
The anti-radiation that can be seriously affected in terms of high-speed line signal quality, power supply _ ground level impedance, EMI, therefore in actual circuit can will
In impedance control to prescribed limit, i.e., under the conditions of identical Frequency, Impedence selects minimum.
The grid that the embodiment of the present invention is optimized by setting EMI capacitor places different EMI decouplings in different grids
Performance and Cost and Impedence and Frequency is comprehensively compared in capacitor, obtains Performance and Cost
Choice and Impedence and Frequency choice, so that it is determined that the placement position and type that decouple when optimal value are big
The information such as small.In entire circuit board of server system, the electromagnetic performance of mainboard be must satisfy, and this programme can guarantee EMI
Meet system requirements with least capacitor under the premise of effect, the problem of from EMI angle research pcb board grade, analyzes various circuits
The influence of structure, PCB physical structure, driving source and observation position to EMI is able to solve plate grade EMI problem, and then ensure that whole
The safety of a server operation, passes through the test of CCC.It solves and lacks in the prior art for reducing electromagnetic interference to capacitor
Parameter study realizes the parasitic parameter for obtaining capacitor by simulation result, effectively reduces electromagnetic interference.
As shown in figure 5, the embodiment of the invention also discloses a kind of system for reducing EMI by putting capacitance positions, institute
The system of stating includes:
Grid setup module is placed different EMI in different grids and is gone for the grid of EMI capacitor optimization to be arranged
Coupling capacitor；
Cost performance accepts or rejects module, for comparing Performance and Cost, obtains the choice of Performance and Cost；
Module is accepted or rejected in impedance, for comparing Impedence and Frequency, obtains Impedence's and Frequency
It accepts or rejects；
Optimal selection module chooses optimal value for obtaining different simulation results according to different capacitors.
Comprehensive comparison performance and capacitor cost value, the choice of available performance and capacitor cost,
The whole EMI effect of circuit is more likely in Performance, and Cost is then in terms of being more likely to Costco Wholesale, not
The different comparison figures of different Performance VS Cost can be obtained when disconnected selection capacitance positions.In practice
When middle, often under the conditions of meeting Performance, the lower Cost the better, i.e. selection minimum.
Impedence and Frequency is comprehensively compared, passes through the figure available Performance's and Frequency
Accept or reject, in figure dark parts be continue to optimize it is advanced, light color be final choice optimization, since big impedance can seriously affect
Radiation in terms of high-speed line signal quality, power supply _ ground level impedance, EMI, therefore in actual circuit can be by impedance control to rule
Determine in range, i.e., under the conditions of identical Frequency, Impedence selects minimum.
The EMI decoupling capacitor size is 100nF or 10nF.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (8)
1. a kind of method for reducing EMI by putting capacitance positions, which comprises the following steps:
The grid that S1, setting EMI capacitor optimize, places different EMI decoupling capacitors in different grids；
S2, compare Performance and Cost, obtain the choice of Performance and Cost；
S3, compare Impedence and Frequency, obtain the choice of Impedence and Frequency；
S4, different simulation results are obtained according to different capacitors, choose optimal value.
2. a kind of method for reducing EMI by putting capacitance positions according to claim 1, which is characterized in that described
The choice of Performance and Cost specifically:
Under the conditions of meeting Performance, Cost selects minimum.
3. a kind of method for reducing EMI by putting capacitance positions according to claim 1, which is characterized in that described
The choice of Impedence and Frequency specifically:
Under the conditions of identical Frequency, Impedence selects minimum.
4. a kind of method for reducing EMI by putting capacitance positions according to claim 1 to 3, feature
It is, the EMI decoupling capacitor size is 100nF or 10nF.
5. a kind of system for reducing EMI by putting capacitance positions, which is characterized in that the system comprises:
Grid setup module places different EMI decoupling electricity for the grid of EMI capacitor optimization to be arranged in different grids
Hold；
Cost performance accepts or rejects module, for comparing Performance and Cost, obtains the choice of Performance and Cost；
Module is accepted or rejected in impedance, for comparing Impedence and Frequency, obtains the choice of Impedence and Frequency；
Optimal selection module chooses optimal value for obtaining different simulation results according to different capacitors.
6. a kind of system for reducing EMI by putting capacitance positions according to claim 5, which is characterized in that described
The choice of Performance and Cost specifically:
Under the conditions of meeting Performance, Cost selects minimum.
7. a kind of system for reducing EMI by putting capacitance positions according to claim 5, which is characterized in that described
The choice of Impedence and Frequency specifically:
Under the conditions of identical Frequency, Impedence selects minimum.
8. according to a kind of system for reducing EMI by putting capacitance positions, feature described in claim 5-7 any one
It is, the EMI decoupling capacitor size is 100nF or 10nF.
Priority Applications (1)
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| CN201811186685.8A CN109413839A (en) | 2018-10-10 | 2018-10-10 | A kind of method and system reducing EMI by putting capacitance positions |
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| CN201811186685.8A CN109413839A (en) | 2018-10-10 | 2018-10-10 | A kind of method and system reducing EMI by putting capacitance positions |
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Citations (4)
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| US6706974B2 (en) * | 2002-01-18 | 2004-03-16 | Intel Corporation | Plane splits filled with lossy materials |
| CN1967838A (en) * | 2005-10-21 | 2007-05-23 | E.I.内穆尔杜邦公司 | A package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry and methods of forming thereof |
| US20070279880A1 (en) * | 2006-06-06 | 2007-12-06 | Samtec, Inc. | Power distribution system for integrated circuits |
| CN102236728B (en) * | 2010-04-30 | 2013-08-07 | 国际商业机器公司 | Integrated circuit design method and design simulation system |
-
2018
- 2018-10-10 CN CN201811186685.8A patent/CN109413839A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6706974B2 (en) * | 2002-01-18 | 2004-03-16 | Intel Corporation | Plane splits filled with lossy materials |
| CN1967838A (en) * | 2005-10-21 | 2007-05-23 | E.I.内穆尔杜邦公司 | A package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry and methods of forming thereof |
| US20070279880A1 (en) * | 2006-06-06 | 2007-12-06 | Samtec, Inc. | Power distribution system for integrated circuits |
| CN102236728B (en) * | 2010-04-30 | 2013-08-07 | 国际商业机器公司 | Integrated circuit design method and design simulation system |
Non-Patent Citations (1)
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| 宋磊: "基于Optimize PI的高速电路板电源完整性优化设计", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
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Application publication date: 20190301 |