CN109411578A

CN109411578A - A kind of LED chip and LED module

Info

Publication number: CN109411578A
Application number: CN201811014549.0A
Authority: CN
Inventors: 罗红波
Original assignee: HC Semitek Corp
Current assignee: HC Semitek Corp
Priority date: 2018-08-31
Filing date: 2018-08-31
Publication date: 2019-03-01

Abstract

The invention discloses an LED chip and a module, belonging to the technical field of semiconductors. The LED chip includes n light-emitting regions, n=2 or n=4, the n light-emitting regions are distributed in a matrix, and the n light-emitting regions are independent of each other, the n light-emitting regions share a negative electrode, and each light-emitting region includes a positive. When n=2, the LED chip provided by the present invention only needs to weld 3 electrodes, while the prior art needs to weld 4 electrodes; when n=4, the LED chip provided by the present invention only needs to weld 5 electrodes, and In the prior art, 8 electrodes need to be welded. It can be seen from this that in the case of having an equal number of light-emitting areas, the LED chips provided by the present invention require fewer electrodes to be welded, and require less space for bonding wires, so the interval between the LED chips can be set to be smaller, It is not necessary to reduce the volume of the LED chip, it can meet the requirements of the small pitch of the pixel points in the LED module, and at the same time, the cost of the bonding wire can be reduced.

Description

A kind of LED chip and LED module

Technical field

The present invention relates to technical field of semiconductors, in particular to a kind of LED chip and LED module.

Background technique

In light emitting diode (English: Light Emitting Diode, referred to as: LED) in application field, LED module because The features such as its super brightness, low-power consumption, long service life, simple installation, is widely used in advertising lamp box, mark signboard, a surname Pass the places such as Warning Mark.With gradualling mature for LED module technology, application range will more extensively.

Most-often used in LED module is exactly chip on board encapsulation (English: Chip on Bboard, referred to as: COB) skill Art.In existing COB encapsulation technology, LED chip conduction or non-conductive adhesive are usually adhered to printed circuit board (English Text: Printed Circuit Board, referred to as: PCB) on, the electrical connection that wire bonding realizes LED chip is then carried out, and LED chip and bonding wire are encapsulated with glue.Every group of red, green, blue three-color LED chip side by side, forms a pixel on pcb board Point, many a pixels are arranged on pcb board in matrix form, form array of display.Wherein, the LED chip of COB encapsulation is carried out It is single-chip, i.e., each only one luminous zone of LED chip, each luminous zone includes an anode and a cathode, often Need to leave enough bonding wire spaces between a LED chip.

In the implementation of the present invention, the inventor finds that the existing technology has at least the following problems:

As the pixel spacing in LED module becomes small, the pixel that LED module needs to accommodate in unit area More and more, each pixel is made of three LED chips, and the interval between each LED chip is constant, therefore each picture Interval between vegetarian refreshments is constant, to accommodate more pixels in unit area, can only reduce the volume of LED chip, from And reduce the volume of each pixel, to accommodate more pixels.And the volume of LED chip is smaller, the difficult processing of LED chip It spends bigger.

Summary of the invention

The embodiment of the invention provides a kind of LED chip and LED modules, without reducing the volume of LED chip, can meet The small pitch requirements of pixel in LED module.The technical solution is as follows:

In a first aspect, providing a kind of LED chip, the LED chip includes n luminous zone, n=2 or n=4, the n It being distributed between a luminous zone in matrix, and mutually indepedent between the n luminous zone, the n luminous zone shares a cathode, Each luminous zone includes an anode.

Further, the LED chip includes that substrate, N-type layer, n luminescent layer, n P-type layer, n anode and one are negative Pole；

When the LED chip is formal dress or inverted structure, over the substrate, the n shine for the N-type layer setting Layer is arranged in the one side far from the substrate of the N-type layer, and mutually indepedent between the n luminescent layer, described negative Pole is arranged in the one side far from the substrate of the N-type layer, and the cathode is located at the middle part of the n luminescent layer, institute It states n P-type layer to be located on the n luminescent layer, the n anode is located in the n P-type layer.

Further, as n=4,4 luminous zones are arranged side by side two-by-two, and as n=2,2 luminous zones are arranged side by side.

When the LED chip is vertical structure, over the substrate, the n luminescent layer is all provided with for the N-type layer setting It sets in the one side far from the substrate of the N-type layer, and mutually indepedent between the n luminescent layer, the n P-type layer It is located on the n luminescent layer, the n anode is located in the n P-type layer, and the cathode is arranged described In the one side far from the N-type layer of substrate.

Further, as n=4,4 light emitting regions are arranged side by side two-by-two, alternatively, 4 luminous zones are arranged side by side；Work as n When=2,2 luminous zones are arranged side by side.

Further, when the LED chip is formal dress or inverted structure, the LED chip is blue-light LED chip or green Light LED chip；When the LED chip is vertical structure, the LED chip is red LED chip.

Second aspect, provides a kind of LED module, and the LED module includes multiple LED cores as described in relation to the first aspect Piece, the luminous zone in multiple LED chips are distributed in matrix, the LED module include at least one arrange the first LED submodule group, At least one arranges the 2nd LED submodule group and at least one arranges the 3rd LED submodule group, and the first LED submodule group includes being arranged side by side Multiple first LED chips, the 2nd LED submodule group include multiple second LED chips being arranged side by side, the 3rd LED Mould group includes the multiple third LED chips being arranged side by side, first LED chip, second LED chip and the third The luminescent color of LED chip is all different.

Further, first LED chip and second LED chip include 4 be arranged side by side two-by-two shine Area；The third LED chip includes the luminous zone of 2 or 4 arrangements that are arranged side by side, and described at least one arranges the first LED submodule group It arranges the 2nd LED submodule group with described at least one to be arranged alternately, and adjacent the first LED submodule group and the 2nd LED The 3rd LED submodule group described in a row is equipped between mould group.

Further, first LED chip, second LED chip and the third LED chip include 2 simultaneously The luminous zone that arrangement is set, the first LED submodule group, the 2nd LED submodule group and the 3rd LED submodule group are alternately set It sets.

The third aspect, provides a kind of LED module, and the LED module includes multiple LED cores as described in relation to the first aspect Piece, the LED module include at least one arranging the first LED submodule group and at least one and arranging the 2nd LED submodule group, and described at least one arranges the One LED submodule group and described at least one is arranged the 2nd LED submodule group and is arranged alternately；

The first LED submodule group is identical with the structure of the 2nd LED submodule group, and the first LED submodule group includes The first LED chip of at least one being arranged side by side, at least one second LED chip and at least one third LED chip, and it is described LED chip in first LED submodule group is arranged according to the sequence period of the first LED chip, the second LED chip and third LED chip Column；

The luminescent color of first LED chip, second LED chip and the third LED chip is all different, institute Stating the first LED chip, second LED chip and the third LED chip includes 4 luminous zones being arranged side by side two-by-two, Or first LED chip, second LED chip and the third LED chip include 2 be arranged side by side shine Area；

The central axes of the first LED submodule group differ three luminous zones with the central axes of the 2nd LED submodule group Distance.

Technical solution provided in an embodiment of the present invention has the benefit that

By the way that a kind of LED chip is arranged, which includes n luminous zone, is distributed between n luminous zone in matrix, and Mutually indepedent between n luminous zone, n luminous zone shares a cathode, and each luminous zone includes an anode.Work as n=2 When, LED chip provided by the invention only needs to weld 3 electrodes, and in the prior art, 2 LED chips need to weld 4 electricity Pole；As n=4, LED chip provided by the invention only needs to weld 5 electrodes, and in the prior art, 4 LED chips need Weld 8 electrodes.It follows that LED chip provided by the invention needs to weld in the case where the luminous zone with equal amount The number of electrodes connect is less, then the bonding wire space needed is smaller, and therefore, smaller, nothing can be set in the interval between LED chip The volume of LED chip need to be reduced, the small pitch requirements of the pixel in LED module can be met, while bonding wire can also be reduced Cost.

Detailed description of the invention

To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other Attached drawing.

Fig. 1 is a kind of structural schematic diagram of LED chip provided in an embodiment of the present invention；

Fig. 2 is the sectional view of LED chip shown in FIG. 1；

Fig. 3 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention；

Fig. 4 is the sectional view of LED chip shown in Fig. 3；

Fig. 5 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention；

Fig. 6 is the sectional view of LED chip shown in fig. 5.

Fig. 7 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention；

Fig. 8 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention；

Fig. 9 is a kind of structural schematic diagram of LED module provided in an embodiment of the present invention；

Figure 10 and Figure 11 is the partial structure diagram of Fig. 9；

Figure 12 is the structural schematic diagram of another LED module provided in an embodiment of the present invention；

Figure 13 and Figure 14 is the partial structure diagram of Figure 12；

Figure 15 is the structural schematic diagram of another LED module provided in an embodiment of the present invention；

Figure 16 is the partial structure diagram of Figure 15；

Figure 17 is the structural schematic diagram of another LED module provided in an embodiment of the present invention；

Figure 18 to Figure 21 is the partial structure diagram of Figure 17.

Specific embodiment

To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention Formula is described in further detail.

Embodiment one

The embodiment of the invention provides a kind of LED chip, Fig. 1 is a kind of knot of LED chip provided in an embodiment of the present invention Structure schematic diagram, as shown in Figure 1, the LED chip 100 includes being distributed between 4 independences of luminous zone 110,4 luminous 110 in matrix, And it is mutually indepedent between 4 luminous zones 110,4 luminous zones 110 share a cathode 120, and each luminous zone 110 includes one A positive 130.

In an implementation of the embodiment of the present invention, as shown in Figure 1,4 luminous zones 110 are arranged side by side two-by-two, LED Chip 100 is formal dress or inverted structure.

Fig. 2 is the sectional view of LED chip shown in FIG. 1, as shown in Fig. 2, the LED chip 100 includes substrate 101, N-type layer 102,4 anodes 130 of P-type layer 104,4 of luminescent layer 103,4 and a cathode 120.

Specifically, N-type layer 102 is arranged on substrate 101, and 4 luminescent layers 103 are arranged at the separate substrate of N-type layer 102 In 101 one side, and it is mutually indepedent between 4 luminescent layers 103, the one of the separate substrate 11 of N-type layer 102 is arranged in cathode 120 On face, and cathode 120 is located at the middle part of 4 luminescent layers 103, and 4 P-type layers 104 are located on 4 luminescent layers 103, and 4 just Pole 130 is located in 4 P-type layers 104.

In the present embodiment, LED chip 100 is blue-light LED chip or green LED chip.

In another implementation of the embodiment of the present invention, 4 luminous zones are arranged side by side two-by-two, and LED chip is vertical Structure.

In specific implementation, substrate 101 can select Sapphire Substrate, and N-type layer 102 can be to mix the GaN layer of Si, shine Layer 103 may include the InGaN well layer and GaN barrier layer being arranged alternately in multiple periods, and P-type layer 104 can be to mix the GaN layer of Mg.

Fig. 3 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention, as shown in figure 3, the LED chip 200 include that 4 luminous zones 210,4 luminous zone 210 is arranged side by side two-by-two, and between 4 luminous zones 210 independently of each other, 4 are sent out Light area 210 shares a cathode (not shown), and each luminous zone 210 includes an anode 220.

Fig. 4 is the sectional view of LED chip shown in Fig. 3, as shown in figure 4, the LED chip 200 includes substrate 201, N-type layer 202,4 anodes 220 of P-type layer 204,4 of luminescent layer 203,4 and a cathode 230.

Specifically, N-type layer 202 is arranged on substrate 201, and 4 luminescent layers 203 are arranged at the separate substrate of N-type layer 202 In 201 one side, 4 P-type layers 204 are located on 4 luminescent layers 203, and 4 anodes 220 are located at 4 P-type layers 204 On.Cathode 230 is arranged in the one side of separate N-type layer 202 of substrate 201.

In the present embodiment, LED chip 200 is red LED chip.

In another implementation of the embodiment of the present invention, 4 luminous zones are arranged side by side, and LED chip is vertical structure.

In specific implementation, substrate 101 can be GaAs layers, and N-type layer 102 can be to mix the AlInP layer of Si, luminescent layer 103 may include the AlGaInP well layer and AlGaInP barrier layer being arranged alternately in multiple periods, and P-type layer 104 can be to mix Mg's AlInP layers.

Fig. 5 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention, as shown in figure 5, the LED chip 300 are arranged side by side including 4 luminous zones 310,4 luminous zone 310, and mutually indepedent between 4 luminous zones 310,4 luminous zones 310 share a cathode (not shown), and each luminous zone 310 includes an anode 320.

Fig. 6 is the sectional view of LED chip shown in fig. 5, as shown in fig. 6, the LED chip 300 includes substrate 301, N-type layer 302,4 anodes 320 of P-type layer 304,4 of luminescent layer 303,4 and a cathode 330.

Specifically, N-type layer 302 is arranged on substrate 301, and 4 luminescent layers 303 are arranged at the separate substrate of N-type layer 302 In 301 one side, 4 P-type layers 304 are located on 4 luminescent layers 303, and 4 anodes 320 are located at 4 P-type layers 304 On.Cathode 330 is arranged in the one side of separate N-type layer 302 of substrate 301.

In the present embodiment, LED chip 300 is red LED chip.

It is required that in specific implementation, it can be by etching technics, so that LED chip forms 4 luminous zones, 4 shine It is mutually indepedent between area.

The embodiment of the present invention is by being arranged a kind of LED chip, which includes 4 luminous zones, between 4 luminous zones It is distributed in matrix, and mutually indepedent between 4 luminous zones, 4 luminous zones share a cathode, and each luminous zone includes one Anode.LED chip provided by the invention only needs to weld 5 electrodes, and in the prior art, 4 LED chips need to weld 8 Electrode.It follows that LED chip provided by the invention needs the electricity welded in the case where the luminous zone with equal amount Number of poles is less, then the bonding wire space needed is smaller, therefore, the interval between LED chip can be set it is smaller, without reduce The volume of LED chip, can meet the small pitch requirements of the pixel in LED module, while can also reduce bonding wire cost.

Embodiment two

The embodiment of the invention provides a kind of LED chips, essentially identical with the structure of the LED chip of the offer of embodiment one, The difference is that in the present embodiment, LED chip includes 2 luminous zones, Fig. 7 be it is provided in an embodiment of the present invention another The structural schematic diagram of LED chip, as shown in fig. 7, the LED chip 400 includes 2 luminous zones 410 of luminous zone 410,2 and arranges It sets, and mutually indepedent between 2 luminous zones 410,2 luminous zones 410 share a cathode 420, and each luminous zone 410 includes One anode 430.

In an implementation of the embodiment of the present invention, LED chip 400 is formal dress or inverted structure.It is shown in Fig. 7 The sectional view of LED chip is identical as Fig. 2, and for details, reference can be made to Fig. 2 and Fig. 2 associated descriptions.

In the present embodiment, LED chip 400 is blue-light LED chip or green LED chip.

In another implementation of the embodiment of the present invention, LED chip is vertical structure.

Fig. 8 is the structural schematic diagram of another LED chip provided in an embodiment of the present invention, as shown in figure 8, the LED chip 500 include that 2 luminous zones 510,2 luminous zone 510 is arranged side by side, and 2 luminous zones 510 share a cathode and (do not show in figure Out), each luminous zone 510 includes an anode 520.

The sectional view of LED chip shown in Fig. 8 is identical as Fig. 4, and for details, reference can be made to Fig. 4 and Fig. 4 associated descriptions.

In the present embodiment, LED chip 500 is red LED chip.

It is required that in specific implementation, it can be by etching technics, so that LED chip forms 2 luminous zones, 2 shine It is mutually indepedent between area.

The embodiment of the present invention is by being arranged a kind of LED chip, which includes 2 luminous zones, between 2 luminous zones It is distributed in matrix, and mutually indepedent between 2 luminous zones, 2 luminous zones share a cathode, and each luminous zone includes one Anode.LED chip provided by the invention only needs to weld 3 electrodes, and in the prior art, 2 LED chips need to weld 4 Electrode.It follows that LED chip provided by the invention needs the electricity welded in the case where the luminous zone with equal amount Number of poles is less, then the bonding wire space needed is smaller, therefore, the interval between LED chip can be set it is smaller, without reduce The volume of LED chip, can meet the small pitch requirements of the pixel in LED module, while can also reduce bonding wire cost.

Embodiment three

The embodiment of the invention provides a kind of LED module, which uses COB encapsulation technology, and LED module includes more A LED chip as in embodiment one or embodiment two, Fig. 9 is that a kind of structure of LED module provided in an embodiment of the present invention is shown It is intended to, as shown in figure 9, the luminous zone in multiple LED chips is distributed in matrix, LED module arranges the first LED submodule including at least one Group 600, at least one arranges the 2nd LED submodule group 700 and at least one and arranges the 3rd LED submodule group 800.First LED submodule group 600 includes Multiple first LED chips 610 being arranged side by side, the 2nd LED submodule group 700 include multiple second LED chips being arranged side by side 710, the 3rd LED submodule group 800 includes the multiple third LED chips 810 being arranged side by side.First LED chip 610, the second LED core Piece 710 and the luminescent color of third LED chip 810 are all different.

First LED chip 610 and the second LED chip 710 include 4 luminous zones being arranged side by side two-by-two, third LED core Piece 810 includes 2 luminous zones that are arranged side by side.At least one, which arranges the first LED submodule group 600 and at least one, arranges the 2nd LED submodule group 700 It is arranged alternately, and is equipped with one between adjacent the first LED submodule group 600 and the 2nd LED submodule group 700 and arranges the 3rd LED submodule group 800。

Figure 10 and Figure 11 is the partial structure diagram of Fig. 9, as shown in Figure 10 and Figure 11, in the present embodiment, the first LED Chip 610 is that vertical structure, the second LED chip 710 and third LED chip are formal dress or inverted structure.First LED chip 610 It glows, 710 blue light-emitting of the second LED chip, 810 green light of third LED chip, the region A1 and the area Figure 11 Zhong A2 in Figure 10 Domain is respectively a pixel.

Figure 12 is the structural schematic diagram of another LED module provided in an embodiment of the present invention, and as shown in figure 12, the present invention is real The structure for applying example and the LED module in embodiment shown in Fig. 9 is essentially identical, the difference is that third LED chip 810 includes 4 luminous zones being arranged side by side.

Figure 13 and Figure 14 is the partial structure diagram of Figure 12, as shown in Figure 13 and Figure 14, in the present embodiment, first LED chip 610 and the second LED chip 710 are formal dress or inverted structure, and third LED chip 810 is vertical structure.First LED core 610 green light of piece, 710 blue light-emitting of the second LED chip, third LED chip 810 glow.In the region B1 and Figure 14 in Figure 13 The region B2 be respectively a pixel.

Figure 15 is the structural schematic diagram of another LED module provided in an embodiment of the present invention, and as shown in figure 15, the present invention is real The structure for applying example and the LED module in embodiment shown in Fig. 9 is essentially identical, the difference is that the first LED chip 610, Two LED chips 710 and third LED chip 810 include 2 luminous zones being arranged side by side.First LED submodule group 600, second LED submodule group 700 and the 3rd LED submodule group 800 are arranged alternately.

Figure 16 is the partial structure diagram of Figure 15, and as shown in figure 16, in the present embodiment, the first LED chip 610 is vertical Straight structure, the second LED chip 710 and third LED chip 810 are formal dress or inverted structure, and the first LED chip 610 glows, the Two LED chips, 710 blue light-emitting, 810 green light of third LED chip.The region C1 and the region C2 in Figure 16 are respectively a pixel.

It should be noted that in the present embodiment, the first LED chip, the second LED chip and third LED chip can be Any one in vertical structure, formal dress or inverted structure.

For the embodiment of the present invention by the way that a kind of LED module is arranged, the LED chip in the LED module includes n luminous zone, and n is a It is distributed between luminous zone in matrix, and mutually indepedent between n luminous zone, n luminous zone shares a cathode, each luminous zone It include an anode.As n=2, LED chip provided by the invention only needs to weld 3 electrodes, and in the prior art, 2 LED chip needs to weld 4 electrodes；As n=4, LED chip provided by the invention only needs to weld 5 electrodes, and existing skill In art, 4 LED chips need to weld 8 electrodes.It follows that in the case where the luminous zone with equal amount, the present invention The number of electrodes that the LED chip of offer needs to weld is less, then the bonding wire space needed is smaller, therefore, between LED chip between It is smaller every what be can be set, without reducing the volume of LED chip, the small pitch requirements of the pixel in LED module can be met, Bonding wire cost can also be reduced simultaneously.

Example IV

The embodiment of the invention provides a kind of LED module, which uses COB encapsulation technology, and LED module includes more A LED chip as in embodiment one or embodiment two, Figure 17 is the structure of another LED module provided in an embodiment of the present invention Schematic diagram, as shown in figure 17, the LED module arrange the first LED submodule group 600 and at least one including at least one and arrange the 2nd LED submodule Group 700, at least one, which arranges the first LED submodule group 600 and at least one, arranges the 2nd LED submodule group 700 and is arranged alternately.

First LED submodule group 600 is identical with the structure of the 2nd LED submodule group 700.First LED submodule group 600 includes side by side At least one first LED chip 810, at least one second LED chip 820 and at least one third LED chip 830 of arrangement. And the first LED chip in LED submodule group 600 is according to the first LED chip 810, the second LED chip 820 and third LED chip 830 sequence periodic arrangement.

The luminescent color of first LED chip 810, the second LED chip 820 and third LED chip 830 is all different.First LED chip 810, the second LED chip 820 and third LED chip 830 include 4 luminous zones being arranged side by side two-by-two.

As shown in figure 17, the central axes of the first LED submodule group 600 differ three with the central axes of the 2nd LED submodule group 700 The distance of luminous zone.

Figure 18 to Figure 21 is the partial structure diagram of Figure 17, as shown in Figure 18 to Figure 21, in the present embodiment, first LED chip 810 can be vertical structure, and the second LED chip 820 and third LED chip 830 are formal dress or inverted structure.First LED chip 810 glows, 820 blue light-emitting of the second LED chip, 830 green light of third LED chip.The region D1, figure in Figure 18 The region D4 in the region D3 and Figure 21 in the region D2, Figure 20 in 19 is respectively a pixel.

It should be noted that in embodiments of the present invention, the first LED chip 810, the second LED chip 820 and the 3rd LED Chip 830 can be any one in vertical structure, formal dress or inverted structure.

In another implementation of the embodiment of the present invention, the first LED chip 810, the second LED chip 820 and third LED chip 830 can also include 2 luminous zones being arranged side by side.

The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.

The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims

1. An LED chip, characterized in that the LED chip comprises n light-emitting regions, n=2 or n=4, the n light-emitting regions are distributed in a matrix, and the n light-emitting regions are distributed in a matrix. Independent of each other, the n light-emitting regions share a negative electrode, and each of the light-emitting regions includes a positive electrode.

2. The LED chip according to claim 1, wherein the LED chip comprises a substrate, an N-type layer, n light-emitting layers, n P-type layers, n positive electrodes and a negative electrode;

When the LED chip is a front-loading or flip-chip structure, the N-type layer is arranged on the substrate, and the n light-emitting layers are arranged on the side of the N-type layer that is away from the substrate, The negative electrode is arranged on the side of the N-type layer away from the substrate, and the negative electrode is located in the middle of the n light-emitting layers, and the n P-type layers are respectively located on the n light-emitting layers , the n positive electrodes are respectively located on the n P-type layers.

3 . The LED chip according to claim 2 , wherein when n=4, the four light-emitting regions are arranged side by side, and when n=2, the two light-emitting regions are arranged side by side. 4 .

4. The LED chip according to claim 1, wherein the LED chip comprises a substrate, an N-type layer, n light-emitting layers, n P-type layers, n positive electrodes and a negative electrode;

When the LED chip has a vertical structure, the N-type layer is disposed on the substrate, the n light-emitting layers are all disposed on the side of the N-type layer away from the substrate, and the N-type layer is disposed on the substrate. The n light-emitting layers are independent of each other, the n P-type layers are respectively located on the n light-emitting layers, the n positive electrodes are respectively located on the n P-type layers, and the negative electrode is disposed on the lining on the side of the bottom away from the N-type layer.

5 . The LED chip according to claim 1 , wherein when n=4, the four light-emitting regions are arranged side by side, or, the four light-emitting regions are arranged side by side; when n=2, the two light-emitting regions are arranged side by side. 6 . Arranged side by side.

6. The LED chip according to any one of claims 1 to 5, characterized in that, when the LED chip is a positive or flip-chip structure, the LED chip is a blue LED chip or a green LED chip; When the LED chip is a vertical structure, the LED chip is a red light LED chip.

7. An LED module, characterized in that the LED module comprises a plurality of LED chips according to any one of claims 1 to 5, and the light-emitting areas in the plurality of LED chips are distributed in a matrix, so The LED module includes at least one row of first LED submodules, at least one row of second LED submodules, and at least one row of third LED submodules, and the first LED submodule includes a plurality of first LED submodules arranged side by side. an LED chip, the second LED sub-module includes a plurality of second LED chips arranged side by side, the third LED sub-module includes a plurality of third LED chips arranged side by side, the first LED chip, the The light-emitting colors of the second LED chip and the third LED chip are different.

8 . The LED module according to claim 7 , wherein the first LED chip and the second LED chip each comprise 4 light-emitting regions arranged side by side; the third LED chip comprises 2 One or four light-emitting areas arranged side by side, the at least one row of the first LED sub-modules and the at least one row of the second LED sub-modules are alternately arranged, and the adjacent first LED sub-modules and A row of the third LED sub-modules is arranged between the second LED sub-modules.

9 . The LED module according to claim 7 , wherein the first LED chip, the second LED chip and the third LED chip all comprise two light-emitting regions arranged side by side, and the first LED chip An LED sub-module, the second LED sub-module and the third LED sub-module are alternately arranged.

10. An LED module, wherein the LED module comprises a plurality of LED chips according to any one of claims 1 to 5, and the LED module comprises at least one row of first LED sub-modules and at least one row of second LED sub-modules, the at least one row of first LED sub-modules and the at least one row of second LED sub-modules are alternately arranged;

The first LED sub-module and the second LED sub-module have the same structure, and the first LED sub-module includes at least one first LED chip, at least one second LED chip and at least one first LED chip arranged side by side. Three LED chips, and the LED chips in the first LED sub-module are periodically arranged in the order of the first LED chip, the second LED chip and the third LED chip;

The luminous colors of the first LED chip, the second LED chip and the third LED chip are all different, and the first LED chip, the second LED chip and the third LED chip all include 4 two light-emitting regions arranged side by side, or the first LED chip, the second LED chip and the third LED chip all include two light-emitting regions arranged side by side;

The central axis of the first LED sub-module is different from the central axis of the second LED sub-module by a distance of three light-emitting areas.