CN109275277B - Solder mask manufacturing method for preventing small holes of PCB from entering ink - Google Patents
Solder mask manufacturing method for preventing small holes of PCB from entering ink Download PDFInfo
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- CN109275277B CN109275277B CN201811208163.3A CN201811208163A CN109275277B CN 109275277 B CN109275277 B CN 109275277B CN 201811208163 A CN201811208163 A CN 201811208163A CN 109275277 B CN109275277 B CN 109275277B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a solder mask manufacturing method for preventing a small hole of a PCB from entering ink, which comprises the following steps: pasting a film on the production board with the manufactured outer-layer circuit; then, forming a cover hole pattern on the production plate through exposure and development; the hole not to be subjected to solder mask is covered by the cover hole pattern; then baking the production plate; and then ink is sprayed on the production board and solidified to form a solder mask, and finally the film is removed. The method solves the problem of ink hole entering by adopting a method for manufacturing the cover hole graph before solder resistance, and improves the quality of the PCB.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a solder mask manufacturing method for preventing a small hole of a PCB from entering ink.
Background
The conventional manufacturing process of the printed circuit board comprises the following steps: cutting → inner layer pattern → inner layer etching → inner layer AOI → brown oxidation → pressing → drilling → copper deposition → full plate plating → outer layer pattern → pattern plating → outer layer etching → outer layer AOI → solder resist → surface treatment → electric test → FQC → FQA → packaging. The solder mask is a process for coating a layer of solder mask ink on other areas except for a pad, a hole and the like of a client to be welded and a plug-in unit on a PCB with an outer layer circuit, curing the ink and protecting the PCB; the solder resist flow comprises the following steps: from plate → grind plate → silk screen solder resist → pre-bake → exposure → develop → character → post-bake.
The silk-screen solder mask is formed by printing ink on a board surface by adopting a dot blocking net, and the dot blocking net corresponds to a PAD (PAD), a plug-in hole and a test hole so as to prevent the ink from entering the hole during silk-screen printing; however, due to the height difference between the dot blocking net and the plate surface, and the extrusion of a scraper in the silk-screen process, the dot blocking net can generate certain deformation and deviation locally, so that the phenomenon of ink entering holes can be avoided; for some big hole ink inlet holes, the holes can be removed by flushing with developer, but for some small holes (especially for small holes with the hole diameter less than or equal to 0.3 mm), the holes can not be cleaned by developer due to the poor penetration capability. Ink access holes can cause serious quality problems: the ink-adhered part of the hole wall can store liquid medicine in the subsequent surface treatment and other processes, and is easy to absorb moisture and attach dust, so that local corrosion is caused over time to threaten the reliability of the PCB; for some test wells, ink access wells directly affect electrical performance, resulting in test failures.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a solder mask manufacturing method for preventing ink from entering a small hole of a PCB (printed circuit board).
In order to solve the technical problem, the invention provides a solder mask manufacturing method for preventing a small hole of a PCB from entering ink, which comprises the following steps:
s1, pasting a film on the production board with the manufactured outer-layer circuit;
s2, forming a cover hole pattern on the production plate through exposure and development; the hole not to be subjected to solder mask is covered by the cover hole pattern;
s3, baking the production board;
and S4, spraying ink on the production board, curing to form a solder mask, and finally removing the film.
Preferably, in step S1, the production board is subjected to a board grinding process and a super-roughening process in sequence before the film is attached.
Preferably, in step S1, Ra and Rz of the surface roughness of the produced plate are controlled to 0.3-0.6 μm and 2.0-4.0 μm, respectively, during the plate grinding process.
Preferably, in step S1, Ra and Rz of the surface roughness of the produced plate are controlled to 0.2-0.5 μm and 1.5-3.5 μm during the super-roughening treatment.
Preferably, in step S3, the production board is baked at 120 ℃ for 30 min.
Preferably, in step S2, the cover hole pattern covers the holes without solder mask to form individual circular cover films, and the radius of each circular cover film is 0.075mm larger than the radius of the hole covered by the circular cover film.
Preferably, in step S4, the production board is subjected to super-roughening treatment before the ink is sprayed.
Preferably, in step S4, Ra and Rz of the surface roughness of the produced plate are controlled to 0.2-0.3 μm and 1.5-3.0 μm in the super-roughening treatment
Preferably, step S4 is followed by step S5: laser drilling is used in the holes previously covered by the hole pattern.
Preferably, the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil into a whole through a prepreg, and the multi-layer board is subjected to the processes of drilling, copper deposition, full-board electroplating and outer-layer circuit manufacturing in sequence before step S1.
Compared with the prior art, the invention has the following beneficial effects:
the PCB with the outer circuit manufactured is coated with the film again, then the PCB is exposed and developed to form a hole covering graph, the hole covering graph covers all holes which do not allow ink to enter the hole, the films of other parts are removed to expose the surface of the production board, then the solder mask layer is manufactured after the sprayed ink is solidified, and then the film covering the hole is removed, wherein the problem of ink entering the hole is solved by adopting a method for manufacturing the hole covering graph to form a film covering hole before the solder mask; the designed single side of the circular cover film corresponding to each hole is 0.075mm larger than that of the hole, so that the holes are completely covered, and the bonding force between the film and a production plate is guaranteed; because the bonding part of the circular cover film and the production plate is smaller, in order to prevent the circular cover film from falling off in the later-stage treatment, the invention carries out plate grinding and super-roughening treatment on the production plate before film pasting, thereby increasing the bonding force of the production plate and the film and ensuring the bonding force of the circular cover film and the production plate; and the cover hole patterns are reinforced by baking in the later period, so that the binding force of the circular cover film and the production plate is further enhanced.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The embodiment provides a manufacturing method of a circuit board, which comprises a solder mask manufacturing method for preventing a small hole of a PCB from entering ink, and the specific process is as follows:
(1) cutting: the core board is cut according to the dimension of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.075mm, and the thickness of the outer layer copper foil is 1 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring inner layer patterns, coating a photosensitive film on a core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing inner layer line exposure on the core plate by using 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: the core board passes through a vertical blackening process, then the core board and the outer copper foil are pre-laminated together by using prepregs (the copper foil, the prepregs, the core board, the prepregs and the copper foil are arranged from top to bottom in a concrete board arrangement sequence), and then the laminated board is pressed by selecting proper laminating conditions according to the Tg of the board material to form the production board.
(4) And outer layer drilling: and drilling holes on the production plate by using a mechanical drilling mode according to the drilling data.
(5) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.
(6) And electroplating the whole plate: according to the principle of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the whole plate is electroplated for 30min at the current density of 1.1ASF, and the surface copper thickness is more than or equal to 6 mu m.
(7) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer circuit exposure on a production board by using a full-automatic exposure machine and a positive film circuit film and using 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on the production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on a production plate, setting electroplating parameters according to the required finished copper thickness, plating the surface copper thickness to 1OZ, and electroplating tin for 10min at the current density of 1.2ASD, wherein the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(8) Solder resist and silk screen printing of characters: the method for manufacturing the green oil layer on the outer layer of the production plate and silk-screening the characters specifically comprises the following steps:
s1, sequentially carrying out mechanical plate grinding and super-roughening pretreatment on the production plate, and removing oil stains on the surface of the production plate and improving the surface roughness of the production plate so as to enhance the adhesive force between a dry film and the surface of the production plate in the later period; when the plate is ground, Ra in the surface roughness of the produced plate is controlled to be 0.3-0.6 mu m, and Rz is controlled to be 2.0-4.0 mu m; during the super-roughening treatment, Ra in the surface roughness of the production plate is controlled to be 0.2-0.5 mu m, and Rz is controlled to be 1.5-3.5 mu m;
s2, pasting a dry film on the production board;
s3, forming a cover hole pattern on the production plate through exposure and development; the hole covering pattern covers all holes which are not subjected to solder resist (namely, covers holes which do not allow ink to enter holes), other parts of dry films are removed to expose the plate surface of the production plate, so that circular cover films for covering the holes are formed on the production plate, and the radius of each circular cover film is 0.075mm larger than that of the hole covered by the circular cover film;
s4, baking the production plate at 120 ℃ for 30min, and reinforcing the bonding force between the circular cover film and the production plate;
s5, performing super-roughening treatment on the production board, wherein Ra in the surface roughness of the production board is controlled to be 0.2-0.3 mu m, and Rz is controlled to be 1.5-3.0 mu m during the super-roughening treatment; and then, spraying ink at low pressure on a production plate, and forming a solder mask (green oil layer) after prebaking, exposing, developing and postbaking curing in sequence, and finally removing a dry film (circular cover film) originally covering the hole opening.
(9) And laser hole burning: and burning holes in the holes covered by the hole covering patterns (namely the circular cover films) by adopting laser, and burning off a small part of the flaky dry films in the holes by adopting the laser, thereby ensuring that the quality of the holes is good.
(10) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(11) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(12) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(13) FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
(14) And packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (9)
1. A solder mask manufacturing method for preventing a small hole of a PCB from entering ink is characterized by comprising the following steps:
s1, pasting a film on the production board with the manufactured outer-layer circuit;
s2, forming a cover hole pattern on the production plate through exposure and development; the hole not to be subjected to solder mask is covered by the cover hole pattern;
s3, baking the production board;
s4, spraying ink on the production board, curing to form a solder mask, and finally removing the film;
and S5, adopting laser to burn holes in the holes which are covered by the hole covering patterns.
2. The solder mask manufacturing method for preventing the small holes of the PCB from entering the ink as claimed in claim 1, wherein in step S1, the production board is sequentially subjected to a board grinding treatment and a super-roughening treatment before the film is attached.
3. The solder mask making method for preventing ink from entering PCB holes as claimed in claim 2, wherein in step S1, Ra in surface roughness of the produced board is controlled to be 0.3-0.6 μm and Rz in surface roughness of the produced board is controlled to be 2.0-4.0 μm.
4. The solder mask making method for preventing PCB from small hole entering ink as claimed in claim 3, wherein in step S1, Ra in surface roughness of the produced board is controlled to be 0.2-0.5 μm and Rz is controlled to be 1.5-3.5 μm during the super-roughening treatment.
5. The solder mask making method for preventing PCB from small holes entering ink of claim 1, wherein in step S3, the production board is baked for 30min at 120 ℃.
6. The solder mask manufacturing method for preventing a small hole of a PCB from entering ink according to claim 1, wherein in step S2, the cover hole pattern covers the holes which are not subjected to solder mask to form individual circular cover films, and the radius of each circular cover film is 0.075mm larger than that of the hole covered by the circular cover film.
7. The solder mask making method for preventing PCB from small holes entering ink as claimed in claim 1, wherein in step S4, the production board is super-roughened before the ink is sprayed.
8. The solder mask making method for preventing ink from entering PCB holes as claimed in claim 7, wherein in step S4, Ra in surface roughness of the produced board is controlled to be 0.2-0.3 μm and Rz is controlled to be 1.5-3.0 μm during the super-roughening treatment.
9. The method for making solder mask for preventing PCB from entering ink from small hole according to any one of claims 1 to 8, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil into a whole by a prepreg, and the multi-layer board is subjected to the processes of drilling, copper deposition, full-board electroplating and outer circuit making in sequence before step S1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811208163.3A CN109275277B (en) | 2018-10-17 | 2018-10-17 | Solder mask manufacturing method for preventing small holes of PCB from entering ink |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811208163.3A CN109275277B (en) | 2018-10-17 | 2018-10-17 | Solder mask manufacturing method for preventing small holes of PCB from entering ink |
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| CN109275277A CN109275277A (en) | 2019-01-25 |
| CN109275277B true CN109275277B (en) | 2021-02-26 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN110392491B (en) * | 2019-07-26 | 2021-06-04 | 生益电子股份有限公司 | PCB solder mask manufacturing method for preventing residual ink in blind hole |
| CN112040658A (en) * | 2020-10-20 | 2020-12-04 | 东莞森玛仕格里菲电路有限公司 | Method for avoiding BGA area hole blocking |
| CN112752417A (en) * | 2020-11-06 | 2021-05-04 | 龙南骏亚电子科技有限公司 | Method for manufacturing circuit board resistance welding double-sided windowing small hole without allowing ink to enter hole |
| CN112804835B (en) * | 2020-12-30 | 2022-09-30 | 深圳市迅捷兴科技股份有限公司 | Method for preventing gold plate ink inlet hole from causing hole to be copper-free |
| CN112492763B (en) * | 2021-01-14 | 2021-06-01 | 深圳和美精艺半导体科技股份有限公司 | Solder-resisting laser windowing and ink-removing method for packaging substrate |
| CN113068317A (en) * | 2021-03-09 | 2021-07-02 | 深圳市强达电路有限公司 | Back plate solder mask manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186792A (en) * | 1990-11-20 | 1992-07-03 | Nec Toyama Ltd | Printed wiring board and manufacture thereof |
| JPH10294551A (en) * | 1997-04-18 | 1998-11-04 | Hitachi Ltd | Manufacture of printed wiring board |
| CN104540331B (en) * | 2014-12-31 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Printed wiring board solder-resisting manufacturing methods |
| CN107072060A (en) * | 2017-05-25 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of method for solving thin plate circuit dog tooth |
| CN107960017B (en) * | 2017-12-25 | 2020-12-18 | 广州兴森快捷电路科技有限公司 | Processing method of circuit board solder mask |
| CN108449883A (en) * | 2018-03-21 | 2018-08-24 | 深圳崇达多层线路板有限公司 | A kind of surface treatment is the production method for the wiring board that electric nickel gold adds part electricity gold |
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