CN107660063B - Electronic component - Google Patents
Electronic component Download PDFInfo
- Publication number
- CN107660063B CN107660063B CN201710610949.7A CN201710610949A CN107660063B CN 107660063 B CN107660063 B CN 107660063B CN 201710610949 A CN201710610949 A CN 201710610949A CN 107660063 B CN107660063 B CN 107660063B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- capacitor
- electrode
- housing
- interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 claims abstract description 91
- 238000010079 rubber tapping Methods 0.000 claims abstract description 4
- 230000001629 suppression Effects 0.000 abstract description 22
- 238000001228 spectrum Methods 0.000 abstract description 3
- 230000000295 complement effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention relates to an electronic component (1) having at least one multilayer printed circuit board (2) and a printed circuit board housing (6). At least one capacitor interference suppression device (9) is used to divert interference signals. The capacitor interference suppression device (9) has at least one interference suppression capacitor (10) having two capacitor electrodes (7, 8). The first capacitor electrode is electrically conductively connected to the circuit board housing (6) as a housing electrode (7). The other capacitor electrode is a section of the conductive layer (L) of the multilayer circuit board (2) as a circuit board layer electrode (8). An electronic component is obtained in which the tapping off of high-frequency interference signals is improved and undesired impedances are avoided. The electronic component may provide a capacitor having a wide effective frequency spectrum.
Description
Technical Field
The invention relates to an electronic component having a multilayer circuit board, a circuit board housing and a capacitor interference suppression device.
Background
Such a member is known from EP 1244341 a 2.
Disclosure of Invention
The object of the invention is to improve a component of the type mentioned at the outset in such a way that the diversion of high-frequency interference signals is improved and undesired impedances are avoided. Furthermore, capacitors with a wide effective frequency spectrum should be provided according to a feasible solution.
This object is achieved according to the invention by an electronic component as follows:
an electronic component, having:
-at least one multi-layer circuit board,
-a circuit-board housing,
at least one capacitor interference suppression device for tapping off interference signals,
wherein the capacitor interference rejection device has at least one interference rejection capacitor with two capacitor electrodes,
wherein the first capacitor electrode is electrically conductively connected as a housing electrode to the circuit board housing and the further capacitor electrode is a section of a conductive layer of the multilayer circuit board as a circuit board layer electrode,
wherein the electrode through openings of the housing electrodes are penetrated by a fastening element embodied in a conductive manner for fastening the multilayer circuit board on the circuit board housing,
the electronic component has a plurality of interference-free capacitors each having a housing electrode and a layer electrode, the fastening element being embodied as a fastening pin having a pin axis, the housing electrodes having different radial extensions with respect to the pin axis.
The circuit-board layer electrodes of the interference suppression capacitors of the capacitor interference suppression device are embodied as sections of one of the conductive layers of the multilayer circuit board. The interference-free capacitor implemented according to the invention has no separate electrodes, for example, which lead out of the multilayer printed circuit board. In addition to such a decoupling capacitor having a printed circuit board layer electrode according to the invention, at least one further decoupling capacitor having a printed circuit board electrode which is separate and in particular leads from the multilayer printed circuit board can also be used. Such additional interference-free capacitors may be implemented as Surface Mounted Devices (SMD) or as Through-Hole Technology (THT) capacitors. Thus, the interference suppression capacitors according to the invention and those not according to the invention can be combined with one another. High-frequency interference, i.e. interference having a frequency of >1MHz, is either conducted out of the multilayer printed circuit board or conducted into the multilayer printed circuit board with a low impedance, i.e. with an impedance of >100 milliohms, in the electronic component and in the system environment thereof by means of the capacitor interference suppression device.
The interference-free capacitors according to the invention can be arranged at a very small distance from the contact points between the housing potential and the potential of the conductive layers of the multilayer circuit board. The high-frequency interference signal can then be diverted over a very short path.
The parasitic properties of the interference-free capacitor according to the invention, in particular the impedance causing the interference, are avoided. High-frequency interference signals confined locally can be conducted away with low impedance. The interference suppression capacitor according to the invention can be located in particular directly in the contact region between the housing potential and the respective conductor layer potential of the multilayer printed circuit board.
The electrode through-openings of the housing electrodes enable a secure fastening of the multilayer circuit board on the circuit board housing. The fastening element, which is embodied in a conductive manner, is configured to pass through the electrode through-openings of the housing electrodes, and thus enables the fastening of the multilayer circuit board on the circuit board housing.
According to a preferred embodiment of the invention, the housing electrode is integrated into a layer of the multilayer circuit board. This integration of the housing electrodes enables a particularly advantageous arrangement of the interference-resistant capacitor. The housing electrode itself can be embodied as a section of the circuit-board layer.
The plurality of interference suppression capacitors provides a particularly effective interference suppression of the component. The plurality of antijam capacitors may be complementary in terms of their effective spectrum of frequencies.
According to a preferred embodiment of the invention, the fastening element passes through an electrode through opening of a plurality of housing electrodes of the interference-free capacitor. This arrangement results in a plurality of housing electrodes at the potential of the circuit board housing.
The different radial extensions of the housing electrodes result in interference-free capacitors which are complementary in their action. The fastening bolt can be embodied as a fastening screw.
According to a preferred embodiment of the invention, the interference-free capacitors are arranged symmetrically with respect to the electrode through-openings of the housing electrodes; alternatively, the interference suppression capacitors are arranged symmetrically with respect to a center plane of the multilayer printed circuit board, which center plane extends parallel to one of the conductive layers of the multilayer printed circuit board.
According to a further preferred embodiment of the invention, the interference-free capacitor is arranged asymmetrically with respect to the electrode through-opening of the housing electrode.
Symmetrical and asymmetrical capacitor arrangements have proven particularly suitable depending on the interference suppression requirements. A targeted asymmetric anti-interference capacitor arrangement provides, for example, an improved diversity of capacitance values.
According to a preferred embodiment of the invention, the at least one interference-suppression capacitor is implemented as a plate capacitor. AsThe construction of the plate capacitor is particularly cost-effective in production. Alternatively, the interference-free capacitor can also be embodied as a planar capacitor
Or a line capacitor (leitsunsondenator).
According to a preferred embodiment of the invention, the housing electrode and the circuit-board layer electrode of each interference-free capacitor overlap in a plane, viewed in a direction perpendicular to the board plane of the multilayer circuit board. Such a face overlap
A particularly simple construction of the interference-free capacitor is provided.
According to a preferred embodiment of the invention, at least one of the housing electrodes covers the entire multilayer circuit board. Such housing electrodes result in the interference-free capacitor being able to have a particularly large capacitance.
Drawings
Embodiments of the invention are explained in detail below with the aid of the figures. The sole figure 1 shows a section through an electronic component.
Detailed Description
The electronic component 1 includes a multilayer circuit board 2. The multilayer Circuit Board 2 is implemented as a Printed Circuit Board (PCB). The latter has a plurality of (N) conductive layers L1, L2. So that there are a total of N circuit board layers L. In each two adjacent conductive layers Ln、Ln+1With insulating layers 3 of dielectric respectively arranged in between.
The multilayer circuit board 2 is fastened to a circuit board housing 6 of the component 1 via a fastening element 4 in the form of a fastening screw having a threaded bolt 5. The fastening element 4 is connected to the circuit board housing 6 in a conductive manner.
Wherein each circuit board layer LnEach having at least one housing electrode section 7nAnd a circuit board electrode section 8nWherein the index n runs from 1 up to the circuit-board layer LnThe total number of (2) N.
The component 1 has a capacitor interference suppression device 9 for tapping off interference signals. The capacitor interference suppressor 9 has a plurality of interference suppressing capacitors 10n、n+1Respectively arranged on the circuit board layer LnAnd Ln+1In the meantime. The capacitor interference unit 9 has two circuit board layers L1Of the housing electrode section 71And a circuit board layer L2Of the circuit board electrode section 82Between the anti-interference capacitors 101、2. Similarly, in the housing electrode sections 7, respectivelynAnd a circuit board electrode section 8n-1Or 8n+1The capacitor interference suppression device 9 has a further interference suppression capacitor pair 10n-1、nOr 10n、n+1。
Thus, each anti-interference capacitor 10n、n+1All have adjacent circuit board layers Ln、Ln+1 Two capacitor electrodes 7, 8. A first of these two capacitor electrodes is connected as a housing electrode 7 in an electrically conductive manner to the circuit board housing 6 via the fastening element 4. The other capacitor electrode as a circuit-board electrode 8 is a circuit-board layer L of the multilayer circuit board 2nOf (2) a section of (a).
The housing electrode section 7 and the circuit board electrode section 8 are embodied as copper layers. Between which sections of the insulating layer 3 are arranged in each case in order to complete the interference suppression capacitor 10.
In terms of arrangement and radial extension, the housing electrode 7nArranged mirror-symmetrically with respect to a middle plane m perpendicular to the bolt axis 12. Thus, the case electrode 7N-2With and housing electrode 73Equally radially extending and for example housing electrode 71With and housing electrode 7NThe same radial extension.
Furthermore, a capacitor 10 for interference suppressionn、n+1On the one hand, symmetrically with respect to the pin axis 12 and, on the other hand, symmetrically with respect to the mid-plane m. For example, two interference-free capacitors 10 are therefore provided1、2With the same spacing relative to the pin axis 12. In addition, two anti-interference capacitors 10 are provided1、2Mirrored about the mid-plane m, with two corresponding interference-free capacitors 10N-1、N。
Viewed in a direction perpendicular to the board plane of the multilayer printed circuit board 2, i.e. along the pin axis 12 or perpendicular to the center plane m, each of the interference-free capacitors 10 is presentn、n-1The two electrodes 7, 8 overlap. This overlap a is directed to the interference-free capacitor 10 shown at the upper left in the drawing1、2Schematically shown.
In an embodiment not shown, at least one of the housing electrodes 7nCovering the entire multilayer circuit board 2. The housing electrode 7nThus coinciding with the circuit board layer and for which there are no circuit board electrode sections.
Alternatively or in addition to the implementation of the interference suppression capacitors 10 as plate capacitors, these may be implemented as area capacitors or line capacitors and integrated into the multilayer printed circuit board 2.
In a further alternative variant of the capacitor interference suppression device, an interference suppression capacitor of the type of the interference suppression capacitor 10 is provided, which is arranged in a targeted manner asymmetrically with respect to the pin axis 12 or with respect to the mid-plane m.
List of reference numerals
1 structural component
2 multilayer circuit board
3 insulating layer
4 fastening element
5 bolt
6 circuit board shell
7 casing electrode
8 circuit board layer electrode
9 capacitor anti-jamming device
10 anti-interference capacitor
11 electrode through opening
12 bolt axis
m middle plane
L circuit board layer
Total number of N circuit board layers
A overlap
Claims (9)
1. An electronic component (1) having:
-at least one multilayer circuit board (2),
-a circuit board housing (6),
-at least one capacitor interference rejection device (9) for tapping off interference signals,
-wherein the capacitor interference rejection device (9) has at least one interference rejection capacitor (10) with two capacitor electrodes (7, 8),
-wherein a first capacitor electrode is electrically conductively connected as a housing electrode (7) to the circuit board housing (6), and a further capacitor electrode is a section of a conductive layer (L) of the multilayer circuit board (2) as a circuit board layer electrode (8),
-wherein the electrode through openings (11) of the housing electrodes (7) are penetrated by a conductively embodied fastening element (4) for fastening the multilayer circuit board (2) on the circuit board housing (6),
characterized in that the electronic component (1) has a plurality of housing electrodes (7) eachn) And a layer electrode (8)n+1) Is connected to the capacitor (10)n、n+1) Wherein the fastening element (4) is embodied as a fastening bolt having a bolt axis (12), wherein the housing electrode (7) is formed as a housing electrode1、72；72、73；71、73) Have different radial extensions with respect to the bolt axis (12).
2. The electronic component according to claim 1, characterized in that the housing electrode (7) is integrated into a layer (L) of the multilayer circuit board (2).
3. Electronic component according to claim 1, characterised in that the fastening element (4) passes through a plurality of housing electrodes (7) of the interference-free capacitor (10)n) Electrode through opening (11)n)。
4. Electronic component according to one of claims 1 to 3, characterized in that the interference-free capacitor (10) is connected to the housing electrode (7)n) Electrode through opening (11)n) Are symmetrically arranged.
5. The electronic component according to one of claims 1 to 3, characterized in that the interference-free capacitor (10) is arranged symmetrically with respect to a middle plane (m) of the multilayer circuit board (2) which extends parallel to one of the conductive layers (L) of the multilayer circuit board (2).
6. The electronic component according to one of claims 1 to 3, characterized in that the interference-free capacitor (10) is arranged asymmetrically with respect to an electrode through opening (11) of the housing electrode (7).
7. Electronic component according to one of claims 1 to 3, characterized in that at least one interference-free capacitor (10) is embodied as a plate capacitor.
8. The electronic component according to any of claims 1 to 3, wherein the housing electrode (7) and the circuit-board layer electrode (8) of each anti-interference capacitor are overlapping seen in a direction perpendicular to the board plane of the multilayer circuit board (2).
9. The electronic component according to any of claims 1 to 3, characterized in that at least one of the housing electrodes (7) covers the entire multilayer circuit board (2).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016213699.2 | 2016-07-26 | ||
| DE102016213699.2A DE102016213699A1 (en) | 2016-07-26 | 2016-07-26 | Electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107660063A CN107660063A (en) | 2018-02-02 |
| CN107660063B true CN107660063B (en) | 2022-05-03 |
Family
ID=60951098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710610949.7A Active CN107660063B (en) | 2016-07-26 | 2017-07-25 | Electronic component |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107660063B (en) |
| DE (1) | DE102016213699A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020210966A1 (en) * | 2020-08-31 | 2022-03-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | EMC filter for a control unit |
| KR20220140979A (en) * | 2021-04-12 | 2022-10-19 | 삼성전자주식회사 | Electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060044913A (en) * | 2004-03-30 | 2006-05-16 | 엔이씨 도낀 가부시끼가이샤 | Printed wiring board and its manufacturing method |
| CN102821540A (en) * | 2012-07-26 | 2012-12-12 | 泰州市赛福电子有限公司 | Printed circuit board capable of inhibiting electromagnetic interference |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10113912B4 (en) * | 2001-03-21 | 2006-09-28 | Siemens Ag | Electronic device |
-
2016
- 2016-07-26 DE DE102016213699.2A patent/DE102016213699A1/en not_active Withdrawn
-
2017
- 2017-07-25 CN CN201710610949.7A patent/CN107660063B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060044913A (en) * | 2004-03-30 | 2006-05-16 | 엔이씨 도낀 가부시끼가이샤 | Printed wiring board and its manufacturing method |
| CN102821540A (en) * | 2012-07-26 | 2012-12-12 | 泰州市赛福电子有限公司 | Printed circuit board capable of inhibiting electromagnetic interference |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102016213699A1 (en) | 2018-02-01 |
| CN107660063A (en) | 2018-02-02 |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |