CN107422918A - Touch-control sensing structure and preparation method thereof - Google Patents
Touch-control sensing structure and preparation method thereof Download PDFInfo
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- CN107422918A CN107422918A CN201710660706.4A CN201710660706A CN107422918A CN 107422918 A CN107422918 A CN 107422918A CN 201710660706 A CN201710660706 A CN 201710660706A CN 107422918 A CN107422918 A CN 107422918A
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- fpc
- touch
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 88
- 230000003287 optical effect Effects 0.000 claims abstract description 44
- 239000004568 cement Substances 0.000 claims abstract description 42
- 239000005357 flat glass Substances 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004425 Makrolon Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- YXIDSOCDWLQVAZ-UHFFFAOYSA-N ethane-1,2-diol;formic acid Chemical compound OC=O.OCCO YXIDSOCDWLQVAZ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Abstract
The present invention relates to a kind of touch-control sensing structure.The touch-control sensing structure includes feature board, the first conductive layer, the second conductive layer, optical cement layer, FPC and cover-plate glass；First conductive layer is arranged on the feature board and side is provided with multiple first pins；Second conductive layer is arranged on first conductive layer and offers pressing groove in side, the multiple first pin is in the pressing groove, the side of second conductive layer is provided with multiple second pins, and the multiple second pin is in the pressing groove and the multiple second pin is integrally located at the side of the multiple first pin；The optical cement layer is arranged on second conductive layer and exposes the pressing groove.The present invention also provides a kind of preparation method of touch-control sensing structure.The making yield of the touch-control sensing structure is higher and producing efficiency is higher.
Description
Technical field
The present invention relates to a kind of touch-control sensing structure and preparation method thereof.
Background technology
Typically conventional touch-control sensing structure includes upper transparency electrode conductive layer and lower floor's transparency electrode conductive layer, it is described on
Transparency electrode conductive layer on lower floor's transparency electrode conductive layer with being printed with wire to form conductive layer, the upper transparent electricity
Pole conductive layer on lower floor's transparency electrode conductive layer by transparent optical glue-line together with being fitted in.In order to realize that touch-control is made
Industry, described two conductive layers are required to press with FPC (flexible printed circuit, flexible PCB).However, this
The FPC of kind touch-control sensing structure needs to be pressed on respectively on described two conductive layers at twice, so easily because extruding modification is made
Line broken circuit on described two conductive layers so that its yield is relatively low, while also causes because the time of both sides pressing is longer
Packaging efficiency is relatively low.
The content of the invention
Based on this, it is necessary to provide and a kind of make the touch-control sensing structure and its making that yield is higher and producing efficiency is higher
Method.
A kind of touch-control sensing structure, including feature board, the first conductive layer, the second conductive layer, optical cement layer, FPC and lid
Glass sheet；First conductive layer is arranged on the feature board and side is provided with multiple first pins；Described second leads
Electric layer is arranged on first conductive layer and offers pressing groove in side, and the multiple first pin is exposed to the pressing
In groove, the side of second conductive layer is provided with multiple second pins, and the multiple second pin is exposed to the pressing groove
In and the multiple second pin be integrally located at the side of the multiple first pin；The optical cement layer is arranged at described
On two conductive layers and expose the pressing groove；The FPC is arranged in the optical cement layer and covers the pressing groove, described
FPC is pressed in the multiple first pin and the multiple second pin, and with the multiple first pin and the multiple
Second pin is electrically connected with；The cover-plate glass is attached in the optical cement layer and covers the FPC.
In a wherein embodiment, first conductive layer includes the first plate body and is embedded at first plate body
The first interior conducting wire, first plate body are arranged on the feature board, and the multiple first pin convexedly stretches in described
The side of one conducting wire.
In a wherein embodiment, the side of first plate body offers exposed groove, and the exposed groove is in institute
State the bottom of pressing groove and connected with the pressing groove, the exposed groove is closed rectangular channel with the pressing groove, described
The width of exposure groove is less than the width of the pressing groove.
In a wherein embodiment, the pressing groove includes the pressing pilot trench of multiple spaced settings, described more
Individual second pin is respectively arranged in the multiple pressing pilot trench, and the exposed groove includes the multiple sudden and violent of multiple spaced settings
Reveal pilot trench, the multiple exposed pilot trench communicates with corresponding pressing pilot trench respectively, and the multiple first pin is respectively arranged at institute
State in multiple exposed pilot trench.
In a wherein embodiment, the exposed groove is the multiple with being filled with adhesive glue in the pressing groove
First pin is coated in the adhesive glue with the multiple second pin.
In a wherein embodiment, second conductive layer includes the second plate body and is embedded at second plate body
The second interior conducting wire, second plate body are arranged on first plate body, and the pressing groove is opened in second plate
The edge of body, the multiple second pin convexedly stretch in the side of second conducting wire.
In a wherein embodiment, the edge of the optical cement layer has corresponding with the pressing groove location
Groove is installed, the installing groove penetrates the side wall of the optical cement layer, and the FPC is embedded in the installing groove.
In a wherein embodiment, the first conducting particles is provided between the FPC and the multiple first pin,
The second conducting particles, the thickness of first plate body and described second are provided between the FPC and the multiple second pin
The summation of the thickness of plate body is less than or equal to the particle diameter of first conducting particles.
A kind of preparation method of touch-control sensing structure as described above, it comprises the following steps：By first conductive layer
It is arranged on the feature board；Second conductive layer is arranged on first conductive layer, makes the multiple first pin
In the pressing groove, make the multiple second pin in the pressing groove and the multiple second pin is whole
Body is located at the side of the multiple first pin；The optical cement layer is arranged on second conductive layer and exposes the pressure
Close groove；The FPC is arranged in the optical cement layer and covers the pressing groove, the FPC is pressed on simultaneously described more
On individual first pin and the multiple second pin, so that the FPC draws with the multiple first pin and the multiple second
Pin is electrically connected with；And the cover-plate glass is attached in the optical cement layer and covers the FPC.
In a wherein embodiment, the side of first conductive layer offers exposed groove, the exposed groove and institute
State pressing groove correspondingly to communicate, the multiple first pin is exposed in the exposed groove, the FPC and the multiple first pin
Between be provided with the first conducting particles, the second conducting particles is provided between the FPC and the multiple second pin.
Because multiple first pins of first conductive layer and multiple second pins of second conductive layer are simultaneously sudden and violent
It is exposed in the pressing groove, therefore the FPC can be disposably pressed on to the multiple first pin and the multiple second
On pin, without carrying out bonding operation twice, circuit is not easily caused because breaking by both sides extruding so that the touch-control sense
The making yield of geodesic structure is higher.In addition, the disposable bonding operation of the FPC is also beneficial to save the time, described touch is improved
Control the producing efficiency of sensing structure.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the touch-control sensing structure of an embodiment.
Fig. 2 is the partial enlarged drawing at II in Fig. 1.
Fig. 3 is the diagrammatic cross-section of the touch-control sensing structure of an embodiment.
Fig. 4 is the partial top view of the touch-control sensing structure of an embodiment.
Fig. 5 is the partial top view of the touch-control sensing structure of another embodiment.
Fig. 6 is the step flow chart of the preparation method of the touch-control sensing structure of an embodiment.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used herein is intended merely to describe the mesh of specific embodiment
, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more related Listed Items
Arbitrary and all combination.
The present invention relates to a kind of touch-control sensing structure.For example, a kind of touch-control sensing structure, including feature board, the first conduction
Layer, the second conductive layer, optical cement layer, FPC and cover-plate glass；First conductive layer is arranged on the feature board and in one
Side is provided with multiple first pins.For example, second conductive layer is arranged on first conductive layer and offered in side
Groove is pressed, for the multiple first pin in the pressing groove, the side of second conductive layer is provided with multiple second
Pin.For example, the multiple second pin in the pressing groove and the multiple second pin be integrally located at it is described
The side of multiple first pins；The optical cement layer is arranged on second conductive layer and exposes the pressing groove.For example, institute
State FPC to be arranged in the optical cement layer and cover the pressing groove, the FPC is pressed on the multiple first pin and described
In multiple second pins, and it is electrically connected with the multiple first pin and the multiple second pin.For example, the cover plate
Glass is attached in the optical cement layer and covers the FPC.And for example, a kind of touch-control sensing structure, including feature board, first lead
Electric layer, the second conductive layer, optical cement layer, FPC and cover-plate glass.For example, first conductive layer is arranged at the feature board
Above and in side it is provided with multiple first pins；Second conductive layer is arranged on first conductive layer and opened up in side
There is pressing groove, the multiple first pin is in the pressing groove.For example, the side of second conductive layer be provided with it is more
Individual second pin, the multiple second pin in the pressing groove and the multiple second pin be integrally located at it is described
The side of multiple first pins.For example, the optical cement layer is arranged on second conductive layer and exposes the pressing groove；Institute
State FPC to be arranged in the optical cement layer and cover the pressing groove, the FPC is pressed on the multiple first pin and described
In multiple second pins, and it is electrically connected with the multiple first pin and the multiple second pin.For example, the cover plate
Glass is attached in the optical cement layer and covers the FPC.
It is conductive to refer to Fig. 1 to Fig. 3, a kind of touch-control sensing structure 100, including feature board 10, the first conductive layer 20, second
Layer 30, optical cement layer 40, FPC50 and cover-plate glass 60；First conductive layer is arranged on the feature board and in described
Itself side of first conductive layer is provided with multiple first pins 21；Second conductive layer is arranged on first conductive layer simultaneously
Pressing groove 31 is offered in the second conductive layer itself side, the multiple first pin is in the pressing groove, institute
The side for stating the second conductive layer is provided with multiple second pins 32, the multiple second pin in the pressing groove and
The multiple second pin is integrally located at the side of the multiple first pin, that is, the multiple first pin is integrally located at one
Side, the multiple second pin are integrally located at opposite side；The optical cement layer is arranged on second conductive layer and exposes institute
Pressing groove is stated, i.e., described optical cement layer is arranged on second conductive layer and the optical cement layer does not cover the pressing
Groove；The FPC is arranged in the optical cement layer and covers the pressing groove, and the FPC is pressed on the multiple first pin
And in the multiple second pin, and be electrically connected with the multiple first pin and the multiple second pin；The lid
Glass sheet is attached in the optical cement layer and covers the FPC.
Because multiple first pins of first conductive layer and multiple second pins of second conductive layer are simultaneously sudden and violent
It is exposed in the pressing groove, therefore the FPC can be disposably pressed on to the multiple first pin and the multiple second
On pin, without carrying out bonding operation twice, circuit is not easily caused because breaking by both sides extruding so that the touch-control sense
The making yield of geodesic structure is higher.In addition, the disposable bonding operation of the FPC is also beneficial to save the time, described touch is improved
Control the producing efficiency of sensing structure.And divide both sides pressing lamination again, easily cause pair of the first conductive layer and the second conductive layer
Position error, and the disposable bonding operation of the present invention can avoid bit errors, improve and make precision.
For example, also referring to Fig. 4, for the ease of the multiple first pin of exposure, first conductive layer includes the
One plate body 22 and the first conducting wire being embedded in first plate body, first plate body are arranged at the feature board
On, the multiple first pin convexedly stretches in the side of first conducting wire.The side of first plate body offers exposure
Groove 24, the exposed groove are in the bottom of the pressing groove and connected with the pressing groove, the exposed groove and the pressing groove
It is closed rectangular channel, the width of the exposed groove is less than the width of the pressing groove.Due to being set on first plate body
There is exposed groove, the exposed groove connects with the pressing groove, hence in so that the multiple first pin can be relatively easily sudden and violent
It is exposed in the pressing groove.
For example, referring to Fig. 5, in order to prevent line short, conductive barriers are improved, the pressing groove includes multiple mutual
Spaced pressing pilot trench 311, the multiple second pin are respectively arranged in the multiple pressing pilot trench, the exposed groove
Multiple exposed pilot trench 241 including multiple spaced settings, the multiple exposed pilot trench press pilot trench phase with corresponding respectively
Logical, the multiple first pin is respectively arranged in the multiple exposed pilot trench.The exposed groove in the pressing groove with filling out
Filled with adhesive glue, the multiple first pin is coated in the adhesive glue with the multiple second pin.Described second leads
Electric layer includes the second plate body 33 and the second conducting wire being embedded in second plate body, second plate body are arranged at institute
State on the first plate body, the pressing groove is opened in the edge of second plate body, and the multiple second pin convexedly stretches in described the
The side of two conducting wires.Because the pressing groove includes the pressing pilot trench of multiple spaced settings, the exposed groove includes
Multiple exposed pilot trench of multiple spaced settings, therefore the multiple first pin can be caused to be isolated, the multiple
Two pins mutually completely cut off, it is therefore prevented that the conducting short circuit of circuit.
For example, install the FPC for convenience, the edge of the optical cement layer has relative with the pressing groove location
The installing groove 41 answered, the installing groove penetrate the side wall of the optical cement layer, and the FPC is embedded in the installing groove.It is described
The first conducting particles 71 is provided between FPC and the multiple first pin, is set between the FPC and the multiple second pin
It is equipped with the second conducting particles 72, the summation of the thickness of first plate body and the thickness of second plate body is less than or equal to described
The particle diameter of first conducting particles.For example, the multiple first conducting particles is wrapped in institute with the multiple second conducting particles
State in adhesive glue, the adhesive glue is anisotropic conductive adhesive paste, or the adhesive glue can also replace with anisotropy conducting particles.
For example, multiple golden fingers 51 are provided with the FPC, for electrical with the multiple first pin and the multiple second pin
Connection.Due to being offered in the optical cement layer in the corresponding installing groove of the pressing groove location, therefore can utilize described
Install groove and take in the FPC, the FPC is pressed on the multiple first pin and the multiple second pin with facilitating.
And the multiple first conducting particles is advantageous to turn on the multiple first pin and the FPC, the multiple second conductive particle
Son is advantageous to turn on the multiple second pin and the FPC.The bonding pin is then advantageous to position the multiple first conduction
Particle and the multiple second conducting particles.
For example, in order to improve the FPC and the multiple first pin conduction property, first conductive layer with it is described
Second conductive layer directly contacts, without being bonded by adhesive glue.For example, the thickness of the touch-control sensing structure is respectively less than 100
Micron.The thickness of the optical cement layer is less than 50 microns.The thickness of the adhesive glue is less than 50 microns.First conductive layer
Thickness is less than 50 microns.The thickness of second conductive layer is less than 10 microns.For example, the feature board is substrate layer, the work(
The thickness of energy plate is less than 50 microns.The feature board (polyethylene terephthalate, can be gathered to benzene two by PET
Formic acid ethylene glycol fat), PC (polycarbonate, makrolon), PI (polyimide, polyimides), or PEN
(polyethylene glycol naphthalate, PEN) etc. can flexility thin-film material be made.It is logical
Cross above-mentioned setting so that the summation of the thickness of first plate body and the thickness of second plate body is less than or equal to described first
The particle diameter of conducting particles so that the conducting particles can be in close contact the FPC and the multiple first pin, and then improve
The FPC and the multiple first pin connective stability.
For example, a kind of preparation method of touch-control sensing structure, for making touch-control sensing knot described in any of the above-described embodiment
Structure.For example, the preparation method includes the correlation step corresponding to the structure of touch-control sensing structure described in any of the above-described embodiment.
Referring to Fig. 6, a kind of preparation method of touch-control sensing structure as described above, it comprises the following steps：
In step S101, first conductive layer is arranged on the feature board；
In step S102, second conductive layer is arranged on first conductive layer, makes the multiple first to draw
Pin exposed to it is described pressing groove in, make the multiple second pin exposed to it is described pressing groove in and the multiple second pin
It is integrally located at the side of the multiple first pin；
In step S103, the optical cement layer is arranged on second conductive layer and exposes the pressing groove；
In step S104, the FPC is arranged in the optical cement layer and covers the pressing groove, by the FPC
It is pressed on simultaneously in the multiple first pin and the multiple second pin, so that the FPC and the multiple first pin
And the multiple second pin is electrically connected with；And
In step S105, the cover-plate glass is attached in the optical cement layer and covers the FPC.
For example, the side of first conductive layer offers exposed groove, groove is corresponding communicates for the exposed groove and the pressing,
The multiple first pin is exposed in the exposed groove, is provided with first between the FPC and the multiple first pin and is led
Charged particle, the second conducting particles is provided between the FPC and the multiple second pin.It is appreciated that the preparation method
Also include following examples：Set or combine or assemble the structure of touch-control sensing structure described in above-mentioned any embodiment.
Because multiple first pins of first conductive layer and multiple second pins of second conductive layer are simultaneously sudden and violent
It is exposed in the pressing groove, therefore the FPC can be disposably pressed on to the multiple first pin and the multiple second
On pin, without carrying out bonding operation twice, circuit is not easily caused because breaking by both sides extruding so that the touch-control sense
The yield of the preparation method of geodesic structure is higher.In addition, the disposable bonding operation of the FPC is also beneficial to save the time, improve
The producing efficiency of the preparation method of the touch-control sensing structure.
For example, in general F/F (film, film) structure touch sensing, printing is added for upper and lower transparency electrode inductive layer
Wire, transparency electrode inductive layer composition up and down is bonded with transparent OCA (optical clear adhesive, optical cement).FPC points
Bonding (pressing) more than twice, easily bad order or line broken circuit caused by extruding modification, cause yield Loss (no
It is good), it can also influence processing time.For example, general contact panel processing procedure is more numerous and diverse.The error of upper and lower plates fitting can reduce
Bonding yield.Advantages of the present invention：1st, disposable Bonding reduces tact time (production time per piece) ＆cost (cost)；
2nd, without tolerance caused by fitting up and down；3rd, prevent aqueous vapor from entering, lift production reliability.Bonding area (pressing region) are
One closed area, F/F structure touch sensings, Bonding pad (pressing pad) are directly turned on conducting particles.F/F frameworks
Touch sensing, without then glue between both (the first conductive layer and second conductive layers), and thickness is less than 100 microns, its
Bonding area are a closed area.OCA thickness is less than 50 microns, ACF (Anisotropic Conductive
Adhesive, anisotropic conductive adhesive paste) or ACP (Anisotropic Conductive particle, anisotropy conducting particles)
Thickness be less than 50 microns, Conductive particle (conducting particles) particle diameter is less than 60 microns, the first plate body and second
Plate body is transparent photosensitive type material, and the thickness of the second conductive layer is less than 10 microns, and the thickness of the first conductive layer is less than 50 microns.
Substrate be PET, PC, PI, PEN etc. can flexility thin-film material, thickness is less than 50 microns.Touch sensor (touch-control sensor)
Conducting wire (i.e. the first pin or second pin) is respectively present in the first conductive layer and the second conductive layer, and touch sensor are led
Electric line is directly turned on FPC with conducting particles, and the first conductive layer is attached on substrate.The wherein thickness of the first conductive layer
It is less than or equal to the particle diameter of conducting particles with the thickness of the second conductive layer, can after the bonding area of the second conductive layer are exposed
(pressing pilot trench) is open for enclosed type whole district opening or single pad (pad).
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that the ordinary skill people for this area
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. touch-control sensing structure, it is characterised in that including feature board, the first conductive layer, the second conductive layer, optical cement layer, FPC and cover-plate glass；First conductive layer is arranged on the feature board and side is provided with multiple first pins；Second conductive layer is arranged on first conductive layer and offers pressing groove, the multiple first pin in side In the pressing groove, the side of second conductive layer is provided with multiple second pins, and the multiple second pin is sudden and violent It is exposed in the pressing groove and the multiple second pin is integrally located at the side of the multiple first pin；The optical cement layer is arranged on second conductive layer and exposes the pressing groove；The FPC is arranged in the optical cement layer and covers the pressing groove, and the FPC is pressed on the multiple first pin And in the multiple second pin, and be electrically connected with the multiple first pin and the multiple second pin；The cover-plate glass is attached in the optical cement layer and covers the FPC.
- 2. touch-control sensing structure according to claim 1, it is characterised in that first conductive layer include the first plate body with And the first conducting wire in first plate body is embedded at, first plate body is arranged on the feature board, the multiple First pin convexedly stretches in the side of first conducting wire.
- 3. touch-control sensing structure according to claim 2, it is characterised in that the side of first plate body offers exposure Groove, the exposed groove are in the bottom of the pressing groove and connected with the pressing groove, and the exposed groove and the pressing groove are equal For closed rectangular channel, the width of the exposed groove is less than the width of the pressing groove.
- 4. touch-control sensing structure according to claim 3, it is characterised in that the pressing groove includes multiple spaced set The pressing pilot trench put, the multiple second pin are respectively arranged in the multiple pressing pilot trench, and the exposed groove includes multiple Multiple exposed pilot trench of spaced setting, the multiple exposed pilot trench communicates with corresponding pressing pilot trench respectively, the multiple First pin is respectively arranged in the multiple exposed pilot trench.
- 5. touch-control sensing structure according to claim 3, it is characterised in that the exposed groove in the pressing groove with filling out Filled with adhesive glue, the multiple first pin is coated in the adhesive glue with the multiple second pin.
- 6. touch-control sensing structure according to claim 3, it is characterised in that second conductive layer include the second plate body with And the second conducting wire in second plate body is embedded at, second plate body is arranged on first plate body, the pressure The edge that groove is opened in second plate body is closed, the multiple second pin convexedly stretches in the side of second conducting wire.
- 7. touch-control sensing structure according to claim 6, it is characterised in that the edge of the optical cement layer has and institute The corresponding installing groove of pressing groove location is stated, the installing groove penetrates the side wall of the optical cement layer, and the FPC is embedded at described Install in groove.
- 8. touch-control sensing structure according to claim 7, it is characterised in that the FPC and the multiple first pin it Between be provided with the first conducting particles, be provided with the second conducting particles between the FPC and the multiple second pin, described first The summation of the thickness of plate body and the thickness of second plate body is less than or equal to the particle diameter of first conducting particles.
- 9. a kind of preparation method of touch-control sensing structure as claimed in claim 1, it comprises the following steps：First conductive layer is arranged on the feature board；Second conductive layer is arranged on first conductive layer, the multiple first pin is exposed to the pressing groove In, make the multiple second pin in the pressing groove and the multiple second pin is integrally located at the multiple the The side of one pin；The optical cement layer is arranged on second conductive layer and exposes the pressing groove；The FPC is arranged in the optical cement layer and covers the pressing groove, the FPC is pressed on simultaneously the multiple On first pin and the multiple second pin, so that the FPC and the multiple first pin and the multiple second pin It is electrically connected with；AndThe cover-plate glass is attached in the optical cement layer and covers the FPC.
- 10. the preparation method of touch-control sensing structure as claimed in claim 9, it is characterised in that the one of first conductive layer Side offers exposed groove, and groove is corresponding communicates for the exposed groove and the pressing, and the multiple first pin is exposed to the exposure In groove, the first conducting particles is provided between the FPC and the multiple first pin, the FPC draws with the multiple second The second conducting particles is provided between pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710660706.4A CN107422918B (en) | 2017-08-04 | 2017-08-04 | Touch sensing structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710660706.4A CN107422918B (en) | 2017-08-04 | 2017-08-04 | Touch sensing structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107422918A true CN107422918A (en) | 2017-12-01 |
| CN107422918B CN107422918B (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710660706.4A Expired - Fee Related CN107422918B (en) | 2017-08-04 | 2017-08-04 | Touch sensing structure and manufacturing method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102103428A (en) * | 2009-12-18 | 2011-06-22 | 群康科技(深圳)有限公司 | Flexible circuit board combining method of touch display device and touch display device |
| CN102141865A (en) * | 2010-02-02 | 2011-08-03 | 展触光电科技股份有限公司 | Single-layer projected capacitive touch panel and manufacturing method thereof |
| JP2015197872A (en) * | 2014-04-03 | 2015-11-09 | 株式会社東海理化電機製作所 | input device |
| CN105425998A (en) * | 2015-11-12 | 2016-03-23 | 上海卓易科技股份有限公司 | Capacitive touch screen with FPC test line |
| CN105700747A (en) * | 2016-01-08 | 2016-06-22 | 宸美（厦门）光电有限公司 | Jointing method of curved touch panel and flexible circuit board |
| CN106648202A (en) * | 2016-09-30 | 2017-05-10 | 南昌欧菲显示科技有限公司 | Electronic equipment, touch display screen, touch component and touch conducting film |
| CN106775120A (en) * | 2017-01-16 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of contact panel and touch control display apparatus |
-
2017
- 2017-08-04 CN CN201710660706.4A patent/CN107422918B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102103428A (en) * | 2009-12-18 | 2011-06-22 | 群康科技(深圳)有限公司 | Flexible circuit board combining method of touch display device and touch display device |
| CN102141865A (en) * | 2010-02-02 | 2011-08-03 | 展触光电科技股份有限公司 | Single-layer projected capacitive touch panel and manufacturing method thereof |
| JP2015197872A (en) * | 2014-04-03 | 2015-11-09 | 株式会社東海理化電機製作所 | input device |
| CN105425998A (en) * | 2015-11-12 | 2016-03-23 | 上海卓易科技股份有限公司 | Capacitive touch screen with FPC test line |
| CN105700747A (en) * | 2016-01-08 | 2016-06-22 | 宸美（厦门）光电有限公司 | Jointing method of curved touch panel and flexible circuit board |
| CN106648202A (en) * | 2016-09-30 | 2017-05-10 | 南昌欧菲显示科技有限公司 | Electronic equipment, touch display screen, touch component and touch conducting film |
| CN106775120A (en) * | 2017-01-16 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of contact panel and touch control display apparatus |
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| Publication number | Publication date |
|---|---|
| CN107422918B (en) | 2020-12-08 |
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