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CN106028735B - It is a kind of improve thermal diffusivity, intercommunity interaction device - Google Patents

It is a kind of improve thermal diffusivity, intercommunity interaction device Download PDF

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Publication number
CN106028735B
CN106028735B CN201610451284.5A CN201610451284A CN106028735B CN 106028735 B CN106028735 B CN 106028735B CN 201610451284 A CN201610451284 A CN 201610451284A CN 106028735 B CN106028735 B CN 106028735B
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China
Prior art keywords
card
plug
backboard
fan
cabinet
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CN201610451284.5A
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Chinese (zh)
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CN106028735A (en
Inventor
郭志毅
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GUANGZHOU CASA COMMUNICATIONS Ltd
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GUANGZHOU CASA COMMUNICATIONS Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452Mounting of connectors; Switching; Reinforcing of back panels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明提供一种提高散热性、互通性的交互器,包括机柜、置于机柜内的背板、安装在背板上的插卡、安装在机柜内的风扇模块以及电源模块,所述背板上形成有若干插接口,以供安装所述插卡,所述背板上开设有若干通孔,所述插卡插接在背板的前、后板面上,且前、后板面的插卡呈正交对叉结构,并且前、后板面的插卡穿过通孔相插接,实现数字信号的正交以及射频信号的正交。本发明交互器通过插卡与背板呈正交对叉结构连接,实现数字信号的正交以及射频信号的正交,使插卡之间的信号进行切换,实现多个插卡之间任意两个插卡之间的信号互通,并提高该交互器的散热性能,其次,该交互器节省空间、降低成本。

The present invention provides an interactor that improves heat dissipation and interoperability, including a cabinet, a backboard placed in the cabinet, a plug-in card installed on the backboard, a fan module and a power supply module installed in the cabinet, the backboard A number of plug-in ports are formed on it for installing the plug-in card, and a number of through holes are opened on the back board, and the plug-in card is inserted on the front and rear board surfaces of the back board, and the front and rear board surfaces The plug-in cards are in an orthogonal pair-fork structure, and the plug-in cards on the front and rear panels are plugged through the through holes to realize the orthogonality of digital signals and the orthogonality of radio frequency signals. The interchanger of the present invention connects the card and the backplane in an orthogonal cross structure to realize the orthogonality of the digital signal and the orthogonality of the radio frequency signal, so that the signals between the cards can be switched, and any two The intercommunication of signals between each plug-in card and the heat dissipation performance of the interactor are improved. Secondly, the interactor saves space and reduces costs.

Description

一种提高散热性、互通性的交互器An interactor that improves heat dissipation and intercommunication

技术领域technical field

本发明涉及一种通信设备,尤其涉及一种提高散热性、互通性的交互器。The invention relates to a communication device, in particular to an interactor with improved heat dissipation and intercommunication.

背景技术Background technique

通信设备主要是用于作为有线电视机顶盒和Cable modem接入广电网络的通信系统。通信设备输送信号过程中,通信设备中的线卡坏掉时,需将这块线卡原来的信号切换到备份单板上去,并且需要通过风扇模块对通信设备中的各机构散热,以保证通信设备正常工作。现有的通信设备中,两块射频板信号连接时,通过在机箱内设立的一竖立的背板,背板的两个板面上分别设置插接头,两块射频板分别插接到背板两侧的插接头上,与背板垂直,实现两块射频板信号的接通,此种结构由于设立有背板阻挡,不便于风流从机箱的一端流入,从机箱另一端流出,造成通信设备的散热性能不好;其次,连接在背板两侧的两块射频模块为一对一的在同一平面的对接,不可实现一对多的对接,不能有效地达成对其他射频板的信号互通,成本较高,并且占用空间较大。Communication equipment is mainly used as a cable TV set-top box and Cable modem to access the communication system of the broadcasting network. During the signal transmission process of the communication equipment, when the line card in the communication equipment is broken, the original signal of this line card needs to be switched to the backup board, and the fan module needs to be used to dissipate heat from each mechanism in the communication equipment to ensure communication. The device is working normally. In the existing communication equipment, when the signals of two radio frequency boards are connected, a vertical backplane is set up in the case, and plug connectors are respectively arranged on the two board surfaces of the backplane, and the two radio frequency boards are plugged into the backplane respectively. The plug connectors on both sides are perpendicular to the backplane to realize the connection of the signals of the two RF boards. Due to the backplane blocking of this structure, it is not convenient for the wind to flow in from one end of the chassis and flow out from the other end of the chassis, causing communication equipment The heat dissipation performance of the backplane is not good; secondly, the two RF modules connected on both sides of the backplane are one-to-one docking on the same plane, and one-to-many docking cannot be realized, and the signal intercommunication with other RF boards cannot be effectively achieved. The cost is higher and the space occupied is larger.

发明内容Contents of the invention

鉴于以上所述,本发明有必要提供一种散热性能好、且可实现任意多个插卡之间信号互通的交互器。In view of the above, it is necessary for the present invention to provide an interactor that has good heat dissipation performance and can realize signal intercommunication between any number of cards.

本发明提供的技术方案如下:一种提高散热性、互通性的交互器,包括机柜、置于机柜内的背板、安装在背板上的插卡、安装在机柜内的风扇模块以及电源模块,所述背板上形成有若干插接口,以供安装所述插卡,所述背板上开设有若干通孔,所述插卡插接在背板的前、后板面上,且前、后板面的插卡呈正交对叉结构,并且前、后板面的插卡穿过通孔相插接,实现数字信号的正交以及射频信号的正交。The technical solution provided by the present invention is as follows: an interactor that improves heat dissipation and interoperability, including a cabinet, a backplane placed in the cabinet, a plug-in card installed on the backplane, a fan module installed in the cabinet, and a power supply module , the backboard is formed with a number of sockets for installing the cards, the backboard is provided with a number of through holes, the cards are plugged into the front and rear surfaces of the backboard, and the front 1. The cards on the rear panel are in an orthogonal cross structure, and the cards on the front and rear panels are plugged through through holes to realize the orthogonality of digital signals and the orthogonality of radio frequency signals.

进一步的,所述机柜包括柜体,所述背板垂直地安装在柜体内,所述背板分为上板体区与下板体区,上板体区开设有呈排排列的若干上通孔,下板体区开设一下通孔。Further, the cabinet includes a cabinet body, the backboard is vertically installed in the cabinet, the backboard is divided into an upper board body area and a lower board body area, and the upper board body area is provided with several upper passages arranged in rows. Hole, the lower plate body area to open a through hole.

进一步的,所述风扇模块包括风扇转接板以及安装风扇转接板上的若干风扇盒,风扇转接板水平地插接在背板的后板面上,若干风扇盒安装在风扇转接板的上表面以及下表面。Further, the fan module includes a fan adapter plate and several fan boxes installed on the fan adapter plate, the fan adapter plate is horizontally inserted on the rear panel of the backplane, and several fan boxes are installed on the fan adapter plate upper and lower surfaces.

进一步的,所述风扇转接板上开设有导向孔,风扇盒包括盒体以及置于盒体内的风扇,所述盒体的顶壁上设有导向针,以与风扇转接板上的导向孔配合,所述盒体的底壁上开设有导向槽,用以与柜体内表面上形成的导向凸条配合。Further, guide holes are opened on the fan adapter plate, the fan box includes a box body and a fan placed in the box body, and guide pins are provided on the top wall of the box body to align with the guide pins on the fan adapter plate. holes, and guide grooves are provided on the bottom wall of the box to cooperate with the guide protrusions formed on the inner surface of the cabinet.

进一步的,所述盒体的两侧壁一端设有若干通风窗板,两侧壁的另一端形成有背壁,通风窗板在风扇风流的作用下自动打开,在风扇停止时自动垂下关闭。Further, one end of the two side walls of the box body is provided with a number of ventilation louvers, and the other end of the two side walls is formed with a back wall. The ventilation louvers are automatically opened under the action of the fan air flow, and automatically hang down and close when the fan stops.

进一步的,电源模块包括电源安装板以及若干电源,所述电源安装板水平地插接在背板的前板面上,若干电源并排地安装在电源安装板上表面,与背板上的上通孔位置对应,使得上通孔仅对电源模块自带的散热装置吸风,下通孔以使风扇模块对插卡散热时通风。Further, the power supply module includes a power supply installation board and several power supplies. The power supply installation board is horizontally plugged into the front panel of the backplane, and several power supplies are installed side by side on the upper surface of the power supply installation board. The positions of the holes correspond to each other, so that the upper through hole only sucks air for the cooling device that comes with the power module, and the lower through hole allows the fan module to ventilate when cooling the card.

进一步的,所述插接口包括形成在背板前板面的横向插接口以及形成在背板后板面的纵向插接口,所述插卡包括前插卡以及后插卡,所述前插卡对应插接至背板的纵向插接口上,呈纵向插置,所述后插卡对应插接至背板的横向插接口上,呈横向插置,所述前插卡与所述后插卡穿过背板的下通孔呈正交连接。Further, the insertion interface includes a horizontal insertion interface formed on the front surface of the backplane and a longitudinal insertion interface formed on the rear surface of the backplane, and the insertion card includes a front insertion card and a rear insertion card, and the front insertion card corresponds to Plugged into the longitudinal socket of the backplane, inserted vertically, the rear card is correspondingly plugged into the horizontal socket of the backplane, inserted horizontally, the front card and the rear card pass through The lower vias passing through the backplane are orthogonally connected.

进一步的,所述前插卡上设有I/O连接器,I/O连接器与纵向插接口对应连接,所述后插卡上设有FFC/FPC连接器,FFC/FPC连接器与横向插接口对应连接。Further, the front card is provided with an I/O connector, and the I/O connector is correspondingly connected to the longitudinal insertion interface, and the rear card is provided with an FFC/FPC connector, and the FFC/FPC connector is connected to the horizontal The plug interface corresponds to the connection.

进一步的,所述前插卡为十三块线卡,且每一块线卡分别对应插接至背板的纵向插接口上,其中一块为备份单板。Further, the front cards are thirteen line cards, and each line card is correspondingly plugged into the longitudinal socket of the backplane, one of which is a backup single board.

进一步的,所述后插卡包括两块SMM板以及两块RFIO板,SMM板与RFIO板交替插接至背板的横向插接口上,以使线卡和SMM板之间实现数字信号的正交,以及线卡和RFIO板之间实现射频信号的正交。Further, the rear plug-in card includes two SMM boards and two RFIO boards, and the SMM boards and the RFIO boards are alternately plugged into the horizontal plug-in interface of the backplane, so that the normal connection of digital signals is realized between the line card and the SMM board. Orthogonality of RF signals between line cards and RFIO boards.

与现有技术相比,本发明交互器通过插卡与背板呈正交对叉结构连接,实现数字信号的正交以及射频信号的正交,使插卡之间的信号进行切换,实现多个插卡之间任意两个插卡之间的信号互通,并提高该交互器的散热性能,其次,该交互器节省空间、降低成本。Compared with the prior art, the interchanger of the present invention is connected to the backplane in an orthogonal cross structure through the plug-in card to realize the orthogonality of the digital signal and the orthogonality of the radio frequency signal, so that the signals between the plug-in cards can be switched to realize multiple The signal intercommunication between any two cards between two cards, and improve the heat dissipation performance of the interactor, secondly, the interactor saves space and reduces cost.

附图说明Description of drawings

图1是本发明交互器的结构示意图;Fig. 1 is a schematic structural diagram of an interactor of the present invention;

图2是本发明交互器另一视角的结构示意图;Fig. 2 is a structural schematic diagram of another perspective of the interactor of the present invention;

图3是本发明交互器的分解结构示意图;Fig. 3 is a schematic diagram of an exploded structure of an interactor of the present invention;

图4是图3中背板的结构示意图;Fig. 4 is a schematic structural view of the backplane in Fig. 3;

图5是图3中插卡与背板连接的结构示意图;Fig. 5 is a schematic structural diagram of the connection between the plug-in card and the backplane in Fig. 3;

图6是图3中风扇转接板以及电源模块与背板连接的结构示意图;Fig. 6 is a schematic diagram of the connection between the fan adapter board and the power module and the backplane in Fig. 3;

图7是图3中风扇盒的结构示意图;Fig. 7 is a schematic structural view of the fan box in Fig. 3;

图8是图3中风扇盒的另一视角的结构示意图。FIG. 8 is a structural schematic diagram of another viewing angle of the fan box in FIG. 3 .

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合,下面将参考附图并结合实施例来详细说明本发明。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

请参阅图1至图3,本发明提供一种散热性好、互通性佳的交互器,包括机柜10、置于机柜10内的背板20、安装在背板20上的插卡30、安装在机柜10内的风扇模块40以及电源模块50。Referring to Fig. 1 to Fig. 3, the present invention provides an interactor with good heat dissipation and intercommunication, including a cabinet 10, a backplane 20 placed in the cabinet 10, a plug-in card 30 installed on the backplane 20, an installation The fan module 40 and the power module 50 in the cabinet 10 .

机柜10包括柜体11以及安装在柜体11上的盖体12。所述柜体11包括柜体底壁111以及形成在柜体底壁111两侧的柜体侧壁112,柜体底壁111一端形成有导向凸条(图未示),以供安装风扇模块40,侧壁112上开设有若干卡持凸起1121,以便对插卡30卡持并在插接时导向。盖体12上设有加强筋(图未示),以提高盖体12的稳定性。The cabinet 10 includes a cabinet body 11 and a cover body 12 installed on the cabinet body 11 . The cabinet body 11 includes a cabinet body bottom wall 111 and cabinet body side walls 112 formed on both sides of the cabinet body bottom wall 111. One end of the cabinet body bottom wall 111 is formed with a guide protrusion (not shown) for installing a fan module. 40. A plurality of locking protrusions 1121 are provided on the side wall 112, so as to hold the insertion card 30 and guide it during insertion. Ribs (not shown) are provided on the cover body 12 to improve the stability of the cover body 12 .

背板20垂直地安装在柜体11内,将柜体11分成两段空腔,背板20用于供插卡30插置。请参阅图4,背板20的前后板面上设置有若干插接口21,包括形成在背板20前板面的横向插接口211以及形成后板面的纵向插接口212,以便安装插卡30;背板20上开设有若干通孔22,以供风流通过或前后的插卡30对接。本实施例中,背板20分为上板体区与下板体区,上板体区开设有呈排排列的若干通孔221,可视为上通孔;下板体区开设一通孔222,视为下通孔,下通孔222接近占据整个下板体面积。The backboard 20 is vertically installed in the cabinet body 11 and divides the cabinet body 11 into two cavities. The backboard 20 is used for insertion of the plug-in card 30 . Referring to FIG. 4 , several sockets 21 are provided on the front and rear surfaces of the backplane 20 , including a horizontal socket 211 formed on the front surface of the backplane 20 and a longitudinal socket 212 formed on the rear surface, so as to install the plug-in card 30 ; The backplane 20 is provided with a number of through holes 22 for the passage of wind or the docking of the front and rear plug-in cards 30 . In this embodiment, the back plate 20 is divided into an upper plate body area and a lower plate body area. The upper plate body area is provided with a plurality of through holes 221 arranged in rows, which can be regarded as upper through holes; the lower plate body area is provided with a through hole 222. , regarded as the lower through hole, the lower through hole 222 nearly occupies the entire area of the lower plate.

请参阅图3、图5,插卡30连接在背板20的前板面与后板面,前后板面的插卡30呈正交对叉结构连接,以实现数字信号的正交以及射频信号的正交。插卡30包括前插卡31以及后插卡32,前插卡31对应插接至背板20后板面的纵向插接口212上,呈纵向插置;后插卡32对应插接至背板20前板面的横向插接口211上,呈横向插置,后插卡32两侧部对应卡设在柜体侧壁112的卡持凸起1121处,前插卡31与后插卡32正交连接,具体地,前插卡31上设有I/O连接器311以及插头312,前插卡31纵向插置在柜体11内的背板20后板面上,I/O连接器311与纵向插接口212对应连接,后插卡32上设有FFC/FPC连接器321以及插口322,后插卡32横向插置在柜体11内的背板20前板面上,FFC/FPC连接器321与横向插接口211对应插接,前插卡31的插头312穿过背板20的下通孔222,并对应插入至后插卡32的插口322内,使前插卡31与后插卡32正交连接。本实施例中,前插卡31为十三块线卡(图4中所示为其中一块线卡的结构示意图),且每一块线卡分别对应插接至背板20的纵向插接口212上,如果一块线卡损坏,能将这块线卡原来的信号切换到备份单板上去,实现12+1冗余备份,以提高可靠性,降低备份成本、节省空间;后插卡32包括SMM板323以及RFIO板324,SMM板323和RFIO板324各为两块、且交替插接至背板20的横向插接口211上(图4中所示为其中一块SMM板323与一块RFIO板324的结构示意图),以使线卡和SMM板323之间实现数字信号的正交、以及线卡和RFIO板324之间实现射频信号的正交。本实施例中,后插卡32与前插卡31正交连接,如果其中一块前插卡31损坏,能通过后插卡32中的RFIO板324的交射频换芯片将射频信号切换到另外一块前插卡31上,而后插卡RFIO板324对外的射频接口不会由于前插卡31的变化而改变,用户不会感知到前插卡31的切换,在射频同轴线路上用户的cable modem也不会掉线。两块SMM板323与前插卡31都有控制信号的正交,其中一块SMM板323损坏,另一块SMM板323将继续保证控制信号的正常工作,实现SMM板323的1+1冗余备份。Please refer to Fig. 3 and Fig. 5, the plug-in card 30 is connected to the front panel and the rear panel of the backplane 20, and the plug-in cards 30 on the front and rear panels are connected in an orthogonal cross structure, so as to realize the orthogonality of digital signals and the RF signal Orthogonal. The plug-in card 30 includes a front plug-in card 31 and a rear plug-in card 32. The front plug-in card 31 is correspondingly plugged into the longitudinal insertion port 212 on the back panel of the backplane 20, and is inserted vertically; the rear plug-in card 32 is correspondingly plugged into the backplane. 20. On the horizontal insertion interface 211 of the front panel, it is inserted horizontally, and the corresponding cards on both sides of the rear card 32 are located at the holding protrusions 1121 of the side wall 112 of the cabinet body. The front card 31 and the rear card 32 are aligned. Cross-connection, specifically, the front card 31 is provided with an I/O connector 311 and a plug 312, and the front card 31 is longitudinally inserted on the rear panel of the backplane 20 in the cabinet body 11, and the I/O connector 311 Corresponding to the connection with the longitudinal insertion port 212, the rear insertion card 32 is provided with an FFC/FPC connector 321 and a socket 322, and the rear insertion card 32 is inserted horizontally on the front panel of the backplane 20 in the cabinet body 11, and the FFC/FPC connection Connector 321 is correspondingly plugged into the horizontal socket 211, and the plug 312 of the front card 31 passes through the lower through hole 222 of the backplane 20, and is correspondingly inserted into the socket 322 of the rear card 32, so that the front card 31 is connected to the rear card. Cards 32 are connected orthogonally. In this embodiment, the front plug-in cards 31 are thirteen line cards (the structural diagram of one of the line cards is shown in FIG. 4 ), and each line card is correspondingly plugged into the vertical insertion interface 212 of the backplane 20. , if a line card is damaged, the original signal of this line card can be switched to the backup single board to realize 12+1 redundant backup to improve reliability, reduce backup cost and save space; the rear card 32 includes the SMM board 323 and RFIO board 324, the SMM board 323 and the RFIO board 324 are each two pieces, and are alternately plugged into the horizontal socket 211 of the backplane 20 (shown in FIG. 4 is one SMM board 323 and one RFIO board 324 Schematic diagram of the structure), so that the orthogonality of digital signals between the line card and the SMM board 323 and the orthogonality of radio frequency signals between the line card and the RFIO board 324 are realized. In this embodiment, the rear card 32 is orthogonally connected to the front card 31. If one of the front cards 31 is damaged, the RF signal can be switched to another one through the switching chip of the RFIO board 324 in the rear card 32. On the front card 31, the external radio frequency interface of the rear card RFIO board 324 will not change due to the change of the front card 31, and the user will not perceive the switching of the front card 31, and the user's cable modem on the radio frequency coaxial line Also won't drop the line. The two SMM boards 323 and the front card 31 have control signals orthogonal to each other. If one of the SMM boards 323 is damaged, the other SMM board 323 will continue to ensure the normal operation of the control signals and realize the 1+1 redundant backup of the SMM board 323. .

风扇模块40用以对通信设备散热,请参阅图3、图6,风扇模块40包括风扇转接板41以及安装风扇转接板41上的若干风扇盒42。风扇转接板41水平地插接在背板20后板面上且邻近背板20的顶端,以通过背板20与电源模块50连接,风扇转接板41用以挡风并对风扇盒42供电,具体地,风扇转接板41上开设有导向孔(图未示),以便连接风扇盒42;若干风扇盒42安装在柜体11一端与风扇转接板41连接,位于风扇转接板41的上表面以及下表面(结合参阅图1),风扇盒42用以提供风源;请参阅图7、图8,风扇盒42包括盒体421以及置于盒体421内的风扇422(图示中有两个),盒体421包括底壁4211、形成在底壁4211上的两侧壁4212以及盖设在两侧壁4212上的顶壁4213,两侧壁4212一端设有若干通风窗板4214(图示未完全示出,仅示出上端部分),两侧壁4212的另一端形成有背壁4215;具体地,当风扇422转动时,产生风流,通风窗板4214在风流吹动的作用下,自动打开,以便风流进入背板20的下通孔222内;当风扇422停止转动时,通风窗板4214自动垂下,以保持风压平衡。底壁4211上开设有导向槽4216,用以与柜体11上形成的导向凸条配合;顶壁4213相对底壁4211伸出,顶壁4213的伸出端上设有导向针4217,以与风扇转接板41上的导向孔配合,具体地,导向针4217穿入风扇转接板41上的导向孔内,导向槽4216穿插至柜体11形成的导向凸起上,以保证风扇盒42精准的安装在柜体11与风扇转接板41上。背壁4215上设有拉环4218,以方便风扇盒42的拉动。The fan module 40 is used to dissipate heat from the communication equipment. Please refer to FIG. 3 and FIG. 6 . The fan module 40 includes a fan adapter plate 41 and several fan boxes 42 installed on the fan adapter plate 41 . The fan adapter plate 41 is inserted horizontally on the rear surface of the backplane 20 and adjacent to the top of the backplane 20, so as to be connected to the power supply module 50 through the backplane 20. Power supply, specifically, guide holes (not shown) are provided on the fan adapter plate 41, so as to connect the fan box 42; several fan boxes 42 are installed on one end of the cabinet body 11 and connected with the fan adapter plate 41, located on the fan adapter plate 41 upper surface and lower surface (in conjunction with referring to Fig. 1), fan box 42 is in order to provide air source; Please refer to Fig. There are two in the illustration), the box body 421 includes a bottom wall 4211, two side walls 4212 formed on the bottom wall 4211 and a top wall 4213 covered on the two side walls 4212, one end of the two side walls 4212 is provided with a number of ventilation windows Plate 4214 (illustration is not fully shown, only shows the upper part), the other end of two side walls 4212 is formed with back wall 4215; Under the action of the fan, it is automatically opened so that the air flow enters the lower through hole 222 of the back plate 20; when the fan 422 stops rotating, the ventilation window panel 4214 hangs down automatically to maintain the wind pressure balance. Bottom wall 4211 is provided with guide groove 4216, in order to cooperate with the guiding protrusion formed on cabinet 11; The guide hole on the fan adapter plate 41 cooperates, specifically, the guide pin 4217 penetrates in the guide hole on the fan adapter plate 41, and the guide groove 4216 penetrates on the guide protrusion formed by the cabinet body 11, so as to ensure that the fan box 42 Precisely installed on the cabinet body 11 and the fan adapter plate 41. A pull ring 4218 is provided on the back wall 4215 to facilitate the pulling of the fan box 42 .

请参阅图3、图6,电源模块50通过背板20对插卡30以及风扇模块40供电,电源模块50包括电源安装板51以及若干电源52(图中仅示出一个),电源安装板51水平地插接在背板20的另一侧(与风扇转接板41相对的一侧),电源安装板51通过背板20与风扇转接板41连接,以对风扇模块40供电,结合参阅图2,若干电源52并排地安装在电源安装板51上表面且对准背板20上的上通孔221,电源52自带有散热装置,以便上通孔221对电源52自带的散热装置吸风。Referring to Fig. 3 and Fig. 6, the power supply module 50 supplies power to the plug-in card 30 and the fan module 40 through the backplane 20. Horizontally plugged into the other side of the backplane 20 (the side opposite to the fan adapter plate 41), the power supply mounting plate 51 is connected to the fan adapter plate 41 through the backplane 20 to supply power to the fan module 40, refer to Fig. 2, a plurality of power supplies 52 are installed side by side on the upper surface of the power supply mounting plate 51 and aligned with the upper through hole 221 on the back plate 20, the power supply 52 has its own cooling device, so that the upper through hole 221 is equipped with the cooling device of the power supply 52. Suction.

交互器工作时,电源模块50供电,后插卡32的两块SMM板上联接口过来的以太网数据,经过内部的交换芯片,分发到前插卡31的十三块线卡上,经过线卡处理,最后变为同轴射频信号经后插卡32的RFIO板324接入到用户端,同时风扇模块40中的风扇422产生风流,并驱使通风窗板4214自动打开,以便风流进入背板20的通孔22内对该交互器散热,当风扇422停止转动时,通风窗板4214自动垂下,以保持风压平衡。本发明中,风扇转接板41与电源安装板51相对地连接在背板20的前后板面,并且分隔背板20的上板体区域与下板体区域对应的空间,从而将上板体区域与下板体区域对应的空间的热流分开,上通孔221仅对电源模块50自带散热装置吸风,使冷空气不经过上通孔221下面的插卡30,直接进入至电源模块50,如此提高了电源模块50在高温环境下的可靠性,下通孔222以使风扇模块40对插卡30散热时通风,风流方向是从风扇模块40吹至插卡30。When the interoperator is working, the power supply module 50 supplies power, and the Ethernet data from the two SMM on-board interfaces of the rear card 32 are distributed to the thirteen line cards of the front card 31 through the internal switch chip, and then passed through the line cards. Card processing, and finally the coaxial radio frequency signal is connected to the user end through the RFIO board 324 of the rear card 32, and the fan 422 in the fan module 40 generates airflow, and drives the ventilation window plate 4214 to open automatically, so that the airflow enters the backplane The through hole 22 of 20 dissipates heat to the interactor. When the fan 422 stops rotating, the ventilation window panel 4214 hangs down automatically to keep the wind pressure balanced. In the present invention, the fan adapter plate 41 is connected to the front and rear surfaces of the backplane 20 opposite to the power supply mounting plate 51, and separates the space corresponding to the upper board body area and the lower board body area of the back board 20, so that the upper board body The area is separated from the heat flow in the space corresponding to the area of the lower plate body. The upper through hole 221 only sucks air from the cooling device of the power module 50, so that the cold air directly enters the power module 50 without passing through the card 30 below the upper through hole 221. , thus improving the reliability of the power module 50 in a high temperature environment, the lower through hole 222 allows the fan module 40 to ventilate when cooling the plug-in card 30 , and the airflow direction is from the fan module 40 to the plug-in card 30 .

综上所述,本发明交互器通过背板的结构设计,使背板两侧的插卡呈正交对叉结构连接,实现数字信号的正交以及射频信号的正交,以使线卡与SMM板323、RFIO板324之间的信号进行切换,实现多个插卡之间任意两个插卡之间的信号互通,可降低成本、节省空间;其次,由于背板上开设通孔,使得风流前后对流,提高了该交互器的散热性能;通过降低交互器机柜的高度,在运营商相同的机柜空间里可以实现更大的接入容量,同时省去昂贵的高速背板,成本更低,后期维护简单;最后,通过在风扇模块上设计导向针以及与导向针配合的导向孔,以使风扇模块可精准地安装在交互器的机柜上。In summary, through the structural design of the backplane, the interconnector of the present invention enables the cards on both sides of the backplane to be connected in an orthogonal cross structure, realizing the orthogonality of digital signals and the orthogonality of radio frequency signals, so that the line cards and The signals between the SMM board 323 and the RFIO board 324 are switched to realize signal intercommunication between any two cards between multiple cards, which can reduce costs and save space; The front and back convection of the air flow improves the heat dissipation performance of the switch; by reducing the height of the switch cabinet, a larger access capacity can be achieved in the same cabinet space of the operator, while saving the expensive high-speed backplane, and the cost is lower , the post-maintenance is simple; finally, by designing guide pins on the fan module and guide holes matching the guide pins, the fan module can be accurately installed on the cabinet of the switch.

以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。The above is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process conversion made by using the content of the description of the present invention, or directly or indirectly used in other related technical fields, shall be The same reasoning is included in the patent protection scope of the present invention.

Claims (9)

1. the interaction device of a kind of raising thermal diffusivity, intercommunity, including cabinet (10), the backboard (20) being placed in cabinet (10), peace Plug-in card (30) on backboard (20), the blower module (40) in cabinet (10) and power module (50), it is described Several interfaces (21) are formed on backboard (20), for installing the plug-in card (30), it is characterised in that:On the backboard (20) Several through-holes (22) are offered, the plug-in card (30) is plugged in the forward and backward plate face of backboard (20), and the plug-in card of forward and backward plate face (30) orthogonal thereto to pitching structure, and the plug-in card (30) of forward and backward plate face is plugged across through-hole (22), realizes digital signal just Hand over and radiofrequency signal it is orthogonal;The cabinet (10) includes cabinet (11), and the backboard (20) is vertically installed at cabinet (11) in;The blower module (40) includes several fan boxs on Fan Transit Unit (41) and installation Fan Transit Unit (41) (42), Fan Transit Unit (41) is flatly plugged in the rear plate face of backboard (20);It is offered on the Fan Transit Unit (41) Pilot hole, fan box (42) include box body (421) and the fan (422) being placed in box body (421), the box body (421) Roof (4213) is equipped with guide pin (4217), to coordinate with the pilot hole on Fan Transit Unit (41), the box body (421) Guide groove (4216) is offered on bottom wall (4211), to coordinate with the guiding raised line formed on cabinet (11) inner surface.
2. interactive device according to claim 1, it is characterised in that:The backboard (20) is divided into upper plate body area and lower body Area, upper plate body area offer several upper through-holes (221) in row's arrangement, and lower body area opens up a lower through-hole (222).
3. interactive device according to claim 1, it is characterised in that:Several fan boxs (42) are mounted on Fan Transit Unit (41) Upper surface and lower surface.
4. interactive device according to claim 1, it is characterised in that:Two side (4212) one end of the box body (421) is set There are several ventilation luffer boards (4214), the other end of two side (4212) to be formed with back wall (4215), ventilation luffer boards (4214) are in wind It automatically opens under the action of fan (422) is distinguished and admirable, is closed under automatic vertical when fan (422) stop.
5. interactive device according to claim 1, it is characterised in that:The power module (50) includes power supply mounting plate (51) And if supply (52), the power supply mounting plate (51) is flatly plugged on the front face of backboard (20), if supply (52) it is abreast mounted on power supply mounting plate (51) upper surface, it is corresponding with upper through-hole (221) position on backboard (20) so that on Through-hole (221) only to power module (50) carry radiator air draught, lower through-hole (222) so that blower module (40) to plug-in card (30) it divulges information when radiating.
6. interactive device according to claim 2, it is characterised in that:The interface (21) includes before being formed in backboard (20) The transverse splicing mouth (211) of plate face and the longitudinal interface (212) for being formed in backboard (20) plate face afterwards, plug-in card (30) packet Include preceding plug-in card (31) and rear plug-in card (32), the corresponding longitudinal interface (212) for being plugged to backboard (20) of preceding plug-in card (31) On, it is planted in longitudinal direction, rear plug-in card (32) correspondence is plugged on the transverse splicing mouth (211) of backboard (20), is planted in lateral, The preceding plug-in card (31) passes through lower through-hole (222) orthogonal thereto grafting of backboard (20) with the rear plug-in card (32).
7. interactive device according to claim 6, it is characterised in that:The preceding plug-in card (31) is equipped with I/O connector (311), I/O connector (311) is correspondingly connected with longitudinal interface (212), and the rear plug-in card (32) is equipped with FFC/FPC connections Device (321), FFC/FPC connectors (321) are correspondingly connected with transverse splicing mouth (211).
8. interactive device according to claim 7, it is characterised in that:The preceding plug-in card (31) is tridecyne line card, and each Correspondence is plugged on longitudinal interface (212) of backboard (20) block line card respectively, and one of is backup veneer.
9. interactive device according to claim 8, it is characterised in that:After described plug-in card (32) include two pieces of SMM plates (323) with And two pieces of RFIO plates (324), SMM plates (323) replace the transverse splicing mouth (211) for being plugged to backboard (20) with RFIO plates (324) On, it is penetrated so as to be realized between the orthogonal and line card and RFIO plates (324) of realization digital signal between line card and SMM plates (323) Frequency signal it is orthogonal.
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112291640B (en) * 2020-10-30 2022-02-22 迈普通信技术股份有限公司 Orthogonal rack equipment and communication equipment
CN112601431B (en) * 2020-12-29 2022-11-01 杭州迪普科技股份有限公司 Electronic equipment
CN114793414A (en) * 2022-05-24 2022-07-26 湖南无双科技有限公司 Matrix supervisory equipment mounting platform

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203423891U (en) * 2013-07-29 2014-02-05 杭州华三通信技术有限公司 Electronic device
CN203423892U (en) * 2013-05-23 2014-02-05 杭州华三通信技术有限公司 Electronic device
CN204539679U (en) * 2015-04-29 2015-08-05 杭州华三通信技术有限公司 Communication equipment
CN204667289U (en) * 2015-05-04 2015-09-23 深圳市国鑫恒宇科技有限公司 A kind of server

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203423892U (en) * 2013-05-23 2014-02-05 杭州华三通信技术有限公司 Electronic device
CN203423891U (en) * 2013-07-29 2014-02-05 杭州华三通信技术有限公司 Electronic device
CN204539679U (en) * 2015-04-29 2015-08-05 杭州华三通信技术有限公司 Communication equipment
CN204667289U (en) * 2015-05-04 2015-09-23 深圳市国鑫恒宇科技有限公司 A kind of server

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