CN105025656A - PCB reducing assembling and welding thickness and manufacture method of PCB - Google Patents
PCB reducing assembling and welding thickness and manufacture method of PCB Download PDFInfo
- Publication number
- CN105025656A CN105025656A CN201510442743.9A CN201510442743A CN105025656A CN 105025656 A CN105025656 A CN 105025656A CN 201510442743 A CN201510442743 A CN 201510442743A CN 105025656 A CN105025656 A CN 105025656A
- Authority
- CN
- China
- Prior art keywords
- heavy stand
- pcb
- thickness
- pcb board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000002520 cambial effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 102100024080 CASP8-associated protein 2 Human genes 0.000 abstract 2
- 101000910382 Homo sapiens CASP8-associated protein 2 Proteins 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a PCB reducing assembling and welding thickness and a manufacture method of the PCB. The PCB is provided with a sink table used for holding IC devices. The sink table is arranged at a position away from connection holes and/or lines of an inner layer of the PCB. The IC devices are CPUs, FLASHs or ICs. The manufacture method of the PCB includes (1) performing circuit board wiring and determining the thickness of a circuit board and positions of the IC devices; (2) determining the depth and the position of the sink table; (3) forming the sink table hole in a sink table forming layer according to the size and the position of the sink table; and (4) laminating a non-sink-table forming layer and performing integral lamination of the non-sink-table forming layer and the sink-table forming layer. According to the invention, in a condition that the size of a cell phone is limited, by arranging the sink table in the PCB and by arranging devices having comparatively greater heights such as CPUs, FLASHs and ICs on the sink table, the size in structural thickness is reduced substantially.
Description
Technical field
The invention belongs to pcb board technical field, relate to a kind of structure of pcb board and the manufacture method of pcb board.
Background technology
The mobile phone of current main flow row, the thickness of mobile phone complete machine, brand degree, quality requirements are all in continuous lifting, and for meeting the demand of outward appearance ID, the thickness of main flow mobile phone is more and more thinner, and the difficulty for the reliability requirement of structural design is increasing.
And for current Mobile phone PCB, IC class device is mounted on the surface of pcb board, it is many that the thickness of the pcb board after welding equipment increases, and handset structure design difficulty strengthens.
Background technology
For the mounting structure solving existing paster and PCB is difficult to the technical problem of the thickness requirement meeting mobile phone, the invention provides and a kind ofly reduce pcb board of welding equipment thickness and preparation method thereof.
Technical solution of the present invention is as follows:
Reduce a pcb board for welding equipment thickness, its special character is: described pcb board is provided with heavy stand, and described heavy stand is for placing IC class device, and connecting hole and or the circuit of pcb board internal layer are avoided in the position of described heavy stand.
Above-mentioned IC class device is CPU or FLASH or IC.
Reduce a manufacture method for the pcb board of welding equipment thickness, its special character is: comprise the following steps:
1) carry out wiring board wiring, determine the thickness of wiring board and the setting position of IC class device;
2) according to the integral thickness requirement of the circuit board after welding equipment and the setting position of IC class device, the degree of depth and the position of heavy stand is determined; Except the flaggy be electrically connected with installed IC class device, heavy stand and the cambial circuit of all the other heavy stands and connecting hole should be independent of each other;
3) heavy stand is formed layer carries out heavy stand perforate making according to the size of heavy stand and position;
4) non-heavy stand is formed layer and carry out pressing, non-heavy stand formation layer and heavy stand are formed layer and carries out overall pressing.
Above-mentioned steps 4) in the making of heavy stand perforate be under clean room environment, CNC washes while siphon away with the pneumatic equipment of suction burr/burr.
Above-mentioned steps 5) when carrying out overall pressing, with suction glue brush/suction gluing equipment, unnecessary glue is siphoned away in time.
When pressing, each layer does location hole or optical locating point, locates during in order to do the pressing of PCB stratum.
Compared with prior art, advantage is in the present invention:
1, the present invention is under handset structure dimension limit environment, utilizes PCB to do the mode of heavy stand, relatively high device is attached to the position of heavy plate, as CPU/FLASH/IC etc., saves the size in structural thickness direction greatly.
2, the present invention is while the solution mobile phone gauge limit, and reduce the component thickness after paster, generalization is very high.
3, the invention provides the manufacture method of a kind of PCB with heavy stand, the method is simple.
Accompanying drawing explanation
Fig. 1 is pcb board paster three-dimensional view angle figure of the present invention;
Fig. 2 is pcb board paster plane graph of the present invention;
Fig. 3 is the schematic wiring diagram of layer 1-7 in embodiment of the present invention PCB;
Fig. 4 is the schematic wiring diagram of 8-10 layer in embodiment of the present invention PCB;
Figure 5 shows that the aperture layer corresponding to table 1 arranges figure;
Fig. 6 is the pressing flow chart of 10 laminates.
Wherein Reference numeral is: 00-PCB mainboard, 01-heavy stand, the device that 02-paster is relatively high.
Embodiment
Below in conjunction with accompanying drawing, the present invention is elaborated.
As shown in Figure 1: [00] is the PCB mainboard of mobile phone, the signal line of interior of mobile phone is all responsible at PCB mainboard, and general general thickness is 0.6mm-1.2mm; [01] be the heavy stand that the PCB mainboard of mobile phone does, heavy stand size accounts for 1/3 of mainboard thickness, and namely heavy stand will have 0.2mm-0.4mm; [02] be the device that paster is relatively high, being not limited to is CPU/FLASH etc.
For 10 laminates, the present invention is described in detail below.
Following table 1 is the pcb board layer diagram of the embodiment of the present invention 10 laminate.Do not do the pcb board layer on 10 layer of 3 rank in chip (the contour chip of CPU/FLASH) position, only do 7 layers, so thickness can control the thickness at 0.6mm.
Table 1
The aperture layer of Fig. 5 corresponding to table 1 arranges figure, and its mesopore 03 represents the hole between stratum 1/2, can connect the InfoLine between 1 to 2 layer.Similar have hole between 2/3 layer, hole between 3/4 layer, hole between 4/7 layer, hole between 7/8 layer, hole between 8/9 layer, hole between 9/10 layer, hole between 1/10 layer.Illustrate: the hole between 4/7 layer can connect the InfoLine before 4,5,6,7 layers, as 8,9,10 layers have been done heavy stand, both do not walk InfoLine in this position, do not do hole and connect, to dodge process, ensure the integrality of pcb board circuit.
Figure 3 shows that the cabling wiring of layer 1-7, cabling and heavy stand on the different layers, do not interfere with each other mutually.Figure 4 shows that the cabling wiring of 8-10 layer, cabling is when 8-10 layer, and cabling avoids position of opening, does not affect circuit signal and performance.
A kind of manufacture method reducing the pcb board of welding equipment thickness provided by the present invention, comprises the following steps:
1) carry out wiring board wiring, determine the thickness of wiring board and the setting position of IC class device;
2) according to the integral thickness requirement of the circuit board after welding equipment and the setting position of IC class device, the degree of depth and the position of heavy stand is determined; Except the flaggy be electrically connected with installed IC class device, heavy stand and the cambial circuit of all the other heavy stands and connecting hole should be independent of each other;
4) heavy stand is formed layer carries out heavy stand perforate making according to the size of heavy stand and position;
5) non-heavy stand is formed layer and carry out pressing, non-heavy stand formation layer and heavy stand are formed layer and carries out overall pressing.
Fig. 6 is the pressing flow chart of 10 laminates, and first 7 layers is the pressing of complete board type, carries out after CNC washes cutting plate material, then is pressed into an entirety, structure can meet heavy stand for latter 3 layers.
Heavy stand position is done by PCB stratum, and edge must be neat, without any burr/burr etc.Require that the Whole PC B sheet material after pressing is in good order.Before requiring pressing, stratum must be neat, and without any burr/burr, after pressing, stratum must be neat, without any burr/burr, and excessive glue.(overflow glue refer to that glue is when pressing, spills pcb board layer gap), but as pectin use amount very little, have pressing unreliable, namely have crack phenomenon.
In order to make heavy stand position, edge must be neat, and without any burr/burr, processing scheme of the present invention is:
1, pressing leading edge is neat: with CNC wash can accomplish neatly extraordinary.
2, pressing is front without any burr/burr: under clean room environment, and CNC washes while siphon away with the pneumatic equipment inhaling burr/burr.
3, with suction glue brush/suction gluing equipment, unnecessary glue is siphoned away in time during pressing, namely can ensure without outstanding glue, better can accomplish that again edge glueds joint and touch better characteristic.
The contrast of prior art and technical solution of the present invention:
Prior art: PCB thickness is 0.9mm thickness, and CPU height is 1.0mm is 1.95mm (wherein having the tin cream thickness of meeting 0.05mm) after paster.
Technical scheme of the present invention: PCB thickness is 0.9mm thickness (do heavy stand process 1/3 height, namely the local location of CPU is 0.6mm), and CPU height is 1.0mm is 1.65mm (wherein having the tin cream thickness of meeting 0.05mm) after paster.CPU difference in height after contrast paster, reduces 0.3mm.
Claims (6)
1. reduce a pcb board for welding equipment thickness, it is characterized in that: described pcb board is provided with heavy stand, described heavy stand is for placing IC class device, and connecting hole and or the circuit of pcb board internal layer are avoided in the position of described heavy stand.
2. reduce according to claim 1 welding equipment thickness pcb board, it is characterized in that: described IC class device is CPU or FLASH or IC.
3. reduce a manufacture method for the pcb board of welding equipment thickness, it is characterized in that: comprise the following steps:
1) carry out wiring board wiring, determine the thickness of wiring board and the setting position of IC class device;
2) according to the integral thickness requirement of the circuit board after welding equipment and the setting position of IC class device, the degree of depth and the position of heavy stand is determined; Except the flaggy be electrically connected with installed IC class device, heavy stand and the cambial circuit of all the other heavy stands and connecting hole should be independent of each other;
3) heavy stand is formed layer carries out heavy stand perforate making according to the size of heavy stand and position;
4) non-heavy stand is formed layer and carry out pressing, non-heavy stand formation layer and heavy stand are formed layer and carries out overall pressing.
4. reduce according to claim 3 welding equipment thickness the manufacture method of pcb board, it is characterized in that: step 3) in the making of heavy stand perforate be under clean room environment, CNC washes while siphon away with the pneumatic equipment of suction burr/burr.
5. the manufacture method of the pcb board of reduction welding equipment thickness according to claim 4, is characterized in that: step 4) when carrying out overall pressing, with suction glue brush/suction gluing equipment, unnecessary glue is siphoned away in time.
6. reduce according to claim 3 or 4 or 5 welding equipment thickness the manufacture method of pcb board, it is characterized in that: when pressing, each layer does location hole or optical locating point, locates during in order to do the pressing of PCB stratum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510442743.9A CN105025656A (en) | 2015-07-24 | 2015-07-24 | PCB reducing assembling and welding thickness and manufacture method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510442743.9A CN105025656A (en) | 2015-07-24 | 2015-07-24 | PCB reducing assembling and welding thickness and manufacture method of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105025656A true CN105025656A (en) | 2015-11-04 |
Family
ID=54415245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510442743.9A Pending CN105025656A (en) | 2015-07-24 | 2015-07-24 | PCB reducing assembling and welding thickness and manufacture method of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105025656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040533A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | Camera module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6324067B1 (en) * | 1995-11-16 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and assembly of the same |
| CN1697596A (en) * | 2004-05-12 | 2005-11-16 | 宏连国际科技股份有限公司 | Circuit board with sink holes |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102833947A (en) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | Mobile communication terminal, embedded PCB (printed circuit board) structure and processing method of embedded PCB structure |
| CN205142666U (en) * | 2015-07-24 | 2016-04-06 | 西安乾易企业管理咨询有限公司 | Reduce PCB board that dress welded thickness |
-
2015
- 2015-07-24 CN CN201510442743.9A patent/CN105025656A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6324067B1 (en) * | 1995-11-16 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and assembly of the same |
| CN1697596A (en) * | 2004-05-12 | 2005-11-16 | 宏连国际科技股份有限公司 | Circuit board with sink holes |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102833947A (en) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | Mobile communication terminal, embedded PCB (printed circuit board) structure and processing method of embedded PCB structure |
| CN205142666U (en) * | 2015-07-24 | 2016-04-06 | 西安乾易企业管理咨询有限公司 | Reduce PCB board that dress welded thickness |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040533A (en) * | 2017-06-12 | 2018-12-18 | 宁波舜宇光电信息有限公司 | Camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108231852B (en) | Preparation method of display panel | |
| CN104661436B (en) | Printed circuit board blind slot processing method | |
| CN109121294A (en) | Circuit board structure and electronic equipment | |
| CN102045948B (en) | Method for manufacturing PCB (printed Circuit Board) by adopting non-flowing prepreg to press metal substrate | |
| CN102006721A (en) | Substrate of printed circuit board and manufacturing method thereof | |
| CN105163527A (en) | A kind of manufacturing method of semi-flexible circuit board | |
| CN110337199A (en) | A kind of method of Rigid Flex high-precision modeling | |
| CN205142666U (en) | Reduce PCB board that dress welded thickness | |
| CN105025656A (en) | PCB reducing assembling and welding thickness and manufacture method of PCB | |
| CN204721708U (en) | A kind of two-layer printed circuit board of resistance to bending | |
| CN102869208A (en) | Method for controlling depth of two-sided inserting blind hole of printed circuit board | |
| CN103552392B (en) | A kind of transactional cards opens greatly the production method of built-in thermoprint metal forming | |
| CN206920755U (en) | Full joint tool | |
| CN204180377U (en) | The pressing structure of cavity circuit plate | |
| CN105451469B (en) | A kind of preparation method of circuit edge connector | |
| CN203457406U (en) | Flexible circuit board capable of being bent for 90 degrees | |
| CN209845427U (en) | Single-layer or multi-layer die-cut flexible circuit board | |
| CN203311395U (en) | Capacitive touch screen with three-dimensional via hole | |
| CN111405415A (en) | Electronic device | |
| CN207443219U (en) | A kind of PCB of side attachment component | |
| CN201322816Y (en) | Mobile phone camera bracket capable of preventing adhesive spilling over | |
| CN205793635U (en) | The attachment structure of pcb board | |
| CN107580427A (en) | A kind of preparation method of thin plate HDI plates | |
| CN209517628U (en) | A kind of rigidity is without glass photoelectricity printed board | |
| CN104981114B (en) | Processing method and circuit board of suspended golden fingers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170608 Address after: 710077 Shaanxi city of Xi'an province high tech Zone No. 211 HUanpu Ba Lu day Valley Industrial Park C Building 5 floor Applicant after: XI'AN YIPU COMMUNICATION TECHNOLOGY CO., LTD. Address before: 710075, Shaanxi, Xi'an hi tech Zone, two North Road Crystal International Building No. 21002, room 2 Applicant before: Xi'an Qianyi Enterprise Management Consultation Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151104 |
|
| RJ01 | Rejection of invention patent application after publication |