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CN104538388A - Packaging method of LED light source adjustable in color temperature - Google Patents

Packaging method of LED light source adjustable in color temperature Download PDF

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Publication number
CN104538388A
CN104538388A CN201410767169.XA CN201410767169A CN104538388A CN 104538388 A CN104538388 A CN 104538388A CN 201410767169 A CN201410767169 A CN 201410767169A CN 104538388 A CN104538388 A CN 104538388A
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color temperature
fluorescent colloid
temperature zone
fluorescent
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李宗涛
郑秋会
李宏浩
舒路
吴灿标
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Foshan NationStar Optoelectronics Co Ltd
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Foshan NationStar Optoelectronics Co Ltd
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Priority to CN201410767169.XA priority Critical patent/CN104538388A/en
Priority to PCT/CN2015/070649 priority patent/WO2016090726A1/en
Publication of CN104538388A publication Critical patent/CN104538388A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供了一种色温可调的LED光源的封装方法,包括:提供基板,所述基板被划分为多个封闭区域,所述多个封闭环形区域构成了至少一个色温区;在基板上安装LED芯片,且每个环形区域内都具有至少一个LED芯片;在LED芯片表面涂覆荧光胶体,其中,当相邻的两个封闭区域位于不同的色温区时,其中一个封闭区域的荧光胶体的粘度高于另一个封闭区域的荧光胶体的粘度,且最外侧的封闭区域的荧光胶体的粘度高于相邻的环形区域的荧光胶体的粘度,最外侧的环形区域涂覆荧光胶体的高度大于内侧任一环形区域涂覆荧光胶体的高度。从而能够通过高粘度和低粘度的荧光胶体来实现不同色温区域的划分,既节省了制造成本,又大大节省了封装加工的时间。

The present invention provides a packaging method of an LED light source with adjustable color temperature, comprising: providing a substrate, the substrate is divided into a plurality of closed areas, and the plurality of closed annular areas constitute at least one color temperature zone; LED chips, and each annular area has at least one LED chip; the surface of the LED chip is coated with fluorescent colloid, wherein, when two adjacent closed areas are located in different color temperature zones, the fluorescent colloid in one of the closed areas The viscosity is higher than that of the fluorescent colloid in another closed area, and the viscosity of the fluorescent colloid in the outermost closed area is higher than that of the adjacent annular area, and the height of the outermost annular area coated with fluorescent colloid is greater than that of the inner side The height of any annular area coated with fluorescent colloid. Therefore, the division of different color temperature regions can be realized through high-viscosity and low-viscosity fluorescent colloids, which not only saves manufacturing costs, but also greatly saves time for packaging and processing.

Description

色温可调的LED光源的封装方法Packaging method of LED light source with adjustable color temperature

技术领域technical field

本发明涉及半导体技术领域,更具体地说,涉及一种色温可调的LED光源的封装方法。The invention relates to the technical field of semiconductors, in particular to a packaging method for an LED light source with adjustable color temperature.

背景技术Background technique

随着LED(Light-Emitting Diode,发光二极管)照明发展的日新月异,传统单一色温的LED光源已无法满足高端照明用户的需求,因此,色温可调的LED光源已经成为人们广泛关注的产品之一。由于色温可调的LED光源能够根据用户的需求输出特定色温,因此,能够为用户提供丰富的照明体验,是未来LED照明发展的重要方向之一。With the rapid development of LED (Light-Emitting Diode, light-emitting diode) lighting, the traditional LED light source with a single color temperature can no longer meet the needs of high-end lighting users. Therefore, the LED light source with adjustable color temperature has become one of the products that people pay close attention to. Because the LED light source with adjustable color temperature can output a specific color temperature according to the needs of users, it can provide users with a rich lighting experience, which is one of the important directions for the development of LED lighting in the future.

现有的色温可调的LED光源大多采用COB(chip on board)封装方式进行封装,在封装的过程中会利用挡墙将LED芯片分成若干个不同的色温区域,然后在不同的色温区域填充不同的荧光胶体,并通过控制电路控制不同色温区域的亮度来达到调节色温的目的。Most of the existing LED light sources with adjustable color temperature are packaged in COB (chip on board) packaging. Fluorescent colloid, and through the control circuit to control the brightness of different color temperature areas to achieve the purpose of adjusting the color temperature.

但是,由于上述色温可调的LED光源利用挡墙将LED芯片分成了若干个不同的色温区域,因此,封装后的LED光源的不同色温区域之间会具有缝隙,导致LED光源的气密性较差,影响LED光源的质量和性能。However, since the above-mentioned LED light source with adjustable color temperature uses a retaining wall to divide the LED chip into several different color temperature regions, there will be gaps between the different color temperature regions of the packaged LED light source, resulting in poor airtightness of the LED light source. Poor, affecting the quality and performance of the LED light source.

发明内容Contents of the invention

有鉴于此,本发明提供了一种色温可调的LED光源的封装方法,以解决现有技术中由于采用挡墙而导致的LED光源的气密性较差,影响LED光源的质量和性能的问题。In view of this, the present invention provides a packaging method of an LED light source with adjustable color temperature to solve the problem of poor airtightness of the LED light source caused by the use of a retaining wall in the prior art, which affects the quality and performance of the LED light source. question.

为实现上述目的,本发明提供如下技术方案:To achieve the above object, the present invention provides the following technical solutions:

一种色温可调的LED光源的封装方法,包括:A packaging method for an LED light source with adjustable color temperature, comprising:

提供基板,所述基板被划分为多个封闭环形区域,所述多个封闭环形区域构成了至少一个色温区;providing a substrate, the substrate is divided into a plurality of closed annular regions, and the plurality of closed annular regions constitute at least one color temperature zone;

在所述基板上安装LED芯片,所述LED芯片与所述基板电连接,且每个所述环形区域内都具有至少一个LED芯片;Installing LED chips on the substrate, the LED chips are electrically connected to the substrate, and each of the annular regions has at least one LED chip;

在所述LED芯片表面涂覆荧光胶体,其中,当相邻的两个环形区域位于不同的色温区时,其中一个环形区域的荧光胶体的粘度高于另一个环形区域的荧光胶体的粘度,最外侧的环形区域的封装高度大于内侧任一环形区域的封装高度。Fluorescent colloid is coated on the surface of the LED chip, wherein, when two adjacent annular regions are located in different color temperature zones, the viscosity of the fluorescent colloid in one annular region is higher than that in the other annular region, and finally The packaging height of the outer annular area is greater than that of any inner annular area.

优选的,将所述多个封闭环形区域划分为至少一个色温区的过程包括:Preferably, the process of dividing the plurality of closed annular areas into at least one color temperature zone includes:

将所述多个封闭环形区域中位于中心的环形区域和与所述中心的环形区域间隔排列的环形区域划分为第一色温区,将其他环形区域划分为第二色温区。Among the plurality of closed annular areas, the central annular area and the annular areas spaced apart from the central annular area are divided into the first color temperature zone, and the other annular areas are divided into the second color temperature zone.

优选的,在所述基板上安装LED芯片的过程包括:Preferably, the process of installing LED chips on the substrate includes:

将位于所述第一色温区内且位于同一环形区域内的LED芯片串联形成LED芯片串,并将所述第一色温区内不同环形区域的LED芯片串并联后与第一正电极和第一负电极电连接;The LED chips located in the first color temperature zone and in the same annular area are connected in series to form an LED chip string, and the LED chip strings in different annular areas in the first color temperature area are connected in parallel to the first positive electrode and the first positive electrode. Negative electrode electrical connection;

将位于所述第二色温区内且位于同一环形区域内的LED芯片串联形成LED芯片串,并将所述第二色温区内不同环形区域的LED芯片串并联后与第二正电极和第二负电极电连接。LED chips located in the second color temperature zone and in the same annular area are connected in series to form LED chip strings, and the LED chip strings in different annular areas in the second color temperature area are connected in parallel to the second positive electrode and the second The negative electrode is electrically connected.

优选的,当最外侧环形区域位于所述第二色温区时,在所述LED芯片表面涂覆荧光胶体的过程包括:Preferably, when the outermost annular region is located in the second color temperature zone, the process of coating the fluorescent colloid on the surface of the LED chip includes:

在所述第二色温区的LED芯片表面涂覆第二荧光胶体;Coating a second fluorescent colloid on the surface of the LED chip in the second color temperature zone;

在所述第一色温区的LED芯片表面涂覆第一荧光胶体,所述第二荧光胶体的粘度大于所述第一荧光胶体的粘度。The surface of the LED chip in the first color temperature zone is coated with a first fluorescent colloid, and the viscosity of the second fluorescent colloid is greater than that of the first fluorescent colloid.

优选的,所述第二荧光胶体的粘度大于20PaS。Preferably, the viscosity of the second fluorescent colloid is greater than 20PaS.

优选的,所述第二荧光胶体中混合的荧光粉主要为硅酸盐红色荧光粉或氮化物红色荧光粉中的一种或者两种的混合物。Preferably, the phosphor mixed in the second fluorescent colloid is mainly one or a mixture of silicate red phosphor or nitride red phosphor.

优选的,所述第一荧光胶体中混合的荧光粉主要为铝酸盐或硅酸盐黄色荧光粉的一种或两种混合物。Preferably, the fluorescent powder mixed in the first fluorescent colloid is mainly one or a mixture of aluminate or silicate yellow fluorescent powder.

优选的,所述封闭区域为圆形环或方形环。Preferably, the closed area is a circular ring or a square ring.

优选的,所述基板的材质为陶瓷或金属。Preferably, the material of the substrate is ceramic or metal.

优选的,所述LED芯片为蓝光芯片或者为蓝光芯片和红光芯片的组合。Preferably, the LED chip is a blue chip or a combination of a blue chip and a red chip.

与现有技术相比,本发明所提供的技术方案具有以下优点:Compared with the prior art, the technical solution provided by the present invention has the following advantages:

本发明所提供的色温可调的LED光源的封装方法,基板被划分为多个封闭环形区域,所述多个封闭环形区域构成了多个色温区,由于当相邻的两个环形区域位于不同的色温区时,其中一个环形区域的荧光胶体的粘度高于另一个环形区域的荧光胶体的粘度,因此,相邻两个环形区域能够通过高粘度和低粘度的荧光胶体来实现不同色温区域的划分,从而不需要采用挡墙来划分色温区域,既节省了制造成本,又避免了挡墙的存在而导致的LED光源的气密性差,影响LED光源的质量和性能的问题;In the packaging method of the LED light source with adjustable color temperature provided by the present invention, the substrate is divided into a plurality of closed annular regions, and the plurality of closed annular regions constitute a plurality of color temperature regions, because when two adjacent annular regions are located at different In the color temperature zone, the viscosity of the fluorescent colloid in one annular area is higher than the viscosity of the fluorescent colloid in the other annular area. Therefore, the two adjacent annular areas can use high-viscosity and low-viscosity fluorescent colloids to achieve different color temperature areas. Division, so that there is no need to use a retaining wall to divide the color temperature area, which not only saves manufacturing costs, but also avoids the poor airtightness of the LED light source caused by the existence of the retaining wall, which affects the quality and performance of the LED light source;

并且,本发明所提供的色温可调的LED光源的封装方法,由于最外侧的环形区域涂覆荧光胶体的高度大于内侧任一环形区域涂覆荧光胶体的高度,因此,在涂覆内侧环形区域的荧光胶体的过程中,可以通过重力的作用使荧光胶体自然流平,大大节省了封装加工的时间。Moreover, in the packaging method of the LED light source with adjustable color temperature provided by the present invention, since the height of the fluorescent colloid coated on the outermost annular area is greater than the height of any inner annular area coated with fluorescent colloid, therefore, when coating the inner annular area In the process of the fluorescent colloid, the fluorescent colloid can be naturally leveled by the action of gravity, which greatly saves the time of packaging and processing.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

图1为本发明的一个实施例提供的色温可调的LED光源的封装方法流程图;Fig. 1 is a flow chart of a packaging method for an LED light source with adjustable color temperature provided by an embodiment of the present invention;

图2为本发明的一个实施例提供的LED光源的一种环形区域划分图;Fig. 2 is a kind of circular area division diagram of the LED light source provided by one embodiment of the present invention;

图3为本发明的一个实施例提供的LED光源的另一种环形区域划分图;Fig. 3 is another annular area division diagram of an LED light source provided by an embodiment of the present invention;

图4为本发明的一个实施例提供的LED光源的LED芯片分布图;FIG. 4 is a distribution diagram of LED chips of an LED light source provided by an embodiment of the present invention;

图5为本发明的一个实施例提供的第二色温区涂覆第二荧光胶体后的LED光源的平面图;Fig. 5 is a plan view of an LED light source coated with a second fluorescent colloid in a second color temperature zone provided by an embodiment of the present invention;

图6为本发明的一个实施例提供的第二色温区涂覆第二荧光胶体后的LED光源的侧面图;Fig. 6 is a side view of the LED light source after coating the second fluorescent colloid in the second color temperature zone provided by an embodiment of the present invention;

图7为本发明的一个实施例提供的第一色温区涂覆第一荧光胶体和第二色温区涂覆第二荧光胶体后的LED光源的平面图;Fig. 7 is a plan view of an LED light source after coating the first fluorescent colloid in the first color temperature zone and the second fluorescent colloid in the second color temperature zone according to an embodiment of the present invention;

图8为本发明的一个实施例提供的第一色温区涂覆第一荧光胶体和第二色温区涂覆第二荧光胶体后的LED光源的侧面图。Fig. 8 is a side view of an LED light source provided by an embodiment of the present invention after the first fluorescent colloid is coated in the first color temperature zone and the second fluorescent colloid is coated in the second color temperature zone.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

本发明的一个实施例提供了一种色温可调的LED光源的封装方法,该方法的流程图如图1所示,包括:An embodiment of the present invention provides a method for packaging an LED light source with adjustable color temperature. The flow chart of the method is shown in Figure 1, including:

S101:提供基板,所述基板被划分为多个封闭区域,所述多个封闭区域构成第一色温区和第二色温区;S101: Provide a substrate, the substrate is divided into a plurality of enclosed areas, and the plurality of enclosed areas constitute a first color temperature zone and a second color temperature zone;

本实施例中,将多个封闭区域划分为至少一个色温区的过程包括:将所述多个封闭区域中位于中心的封闭区域和与所述中心的封闭区域间隔排列的封闭区域划分为第一色温区,将其他封闭区域划分为第二色温区。其中,多个封闭区域可以为如图2所示的圆形环,即多个同心圆构成的封闭的环形区域,也可以为如图3所示的方形环,即多个同心的方形构成的封闭环形区域。本实施例中,基板为陶瓷或金属材质,优选为陶瓷材质。In this embodiment, the process of dividing the plurality of closed areas into at least one color temperature zone includes: dividing the closed area located in the center among the plurality of closed areas and the closed areas arranged at intervals with the central closed area into the first The color temperature zone divides other closed areas into the second color temperature zone. Among them, the plurality of closed areas can be a circular ring as shown in Figure 2, that is, a closed annular area formed by a plurality of concentric circles, or a square ring as shown in Figure 3, that is, a plurality of concentric squares. Close the ring area. In this embodiment, the substrate is made of ceramic or metal, preferably ceramic.

具体地,如图2所示,基板被划分为了6个封闭环形区域,即第一环形区域1、第二环形区域2、第三环形区域3、第四环形区域4、第五环形区域5和第六环形区域6,则第一环形区域1、第三环形区域3和第五环形区域5构成第一色温区A,第二环形区域2、第四环形区域4和第六环形区域6构成第二色温区B。Specifically, as shown in Figure 2, the substrate is divided into six closed annular areas, namely the first annular area 1, the second annular area 2, the third annular area 3, the fourth annular area 4, the fifth annular area 5 and The sixth annular area 6, the first annular area 1, the third annular area 3 and the fifth annular area 5 form the first color temperature area A, and the second annular area 2, the fourth annular area 4 and the sixth annular area 6 form the sixth annular area Two color temperature zone B.

S102:在所述基板上安装LED芯片,每个所述环形区域内都具有至少一个LED芯片;S102: Install LED chips on the substrate, each of the annular regions has at least one LED chip;

本实施例中,在制作基板的过程中,已经按照预先划分的色温区以及环形区域,在基板中制作了相应的导电线路等,以便进行LED芯片的安装。安装LED芯片后的基板结构如图4所示,所述LED芯片位于多个环形区域内,所述LED芯片与所述基板电连接,每个所述环形区域内都具有至少一个LED芯片。这些LED芯片之间采用金线电性连接,在其他实施例中,LED芯片为倒装芯片,不需要金线。In this embodiment, in the process of manufacturing the substrate, corresponding conductive circuits and the like have been fabricated in the substrate according to the pre-divided color temperature zones and annular regions, so as to install the LED chips. The structure of the substrate after installing the LED chips is shown in FIG. 4 , the LED chips are located in a plurality of annular areas, the LED chips are electrically connected to the substrate, and each of the annular areas has at least one LED chip. These LED chips are electrically connected by gold wires, and in other embodiments, the LED chips are flip-chips without gold wires.

本实施例提供的基板还具有用于LED芯片和控制电路电连接的电极对,并且,电极对的个数和色温区的个数相等。如图4所示,当基板包括两个色温区时,基板包括两个电极对,即包括第一正电极10和第一负电极11组成的第一电极对以及第二正电极20和第二负电极21组成的第二电极对。The substrate provided in this embodiment also has electrode pairs for electrical connection between the LED chip and the control circuit, and the number of electrode pairs is equal to the number of color temperature zones. As shown in Figure 4, when the substrate includes two color temperature zones, the substrate includes two electrode pairs, that is, the first electrode pair consisting of the first positive electrode 10 and the first negative electrode 11 and the second positive electrode 20 and the second electrode pair. The second electrode pair composed of the negative electrode 21.

基于此,在所述基板上安装LED芯片的过程包括:将位于所述第一色温区内且位于同一环形区域内的LED芯片串联形成LED芯片串,并将所述第一色温区内不同环形区域的LED芯片串并联后与第一正电极和第一负电极电连接,例如,将第一环形区域1内的LED芯片相互串联构成第一LED芯片串,将第三环形区域3内的LED芯片相互串联构成第三LED芯片串,将第五环形区域5内的LED芯片相互串联构成第五LED芯片串,然后将第一LED芯片串、第三LED芯片串和第五LED芯片串并联后与第一正电极10和第一负电极11电连接;Based on this, the process of installing LED chips on the substrate includes: connecting LED chips located in the first color temperature zone and in the same annular area in series to form LED chip strings, and connecting different annular rings in the first color temperature area The LED chips in the area are connected in series and parallel to the first positive electrode and the first negative electrode. For example, the LED chips in the first annular area 1 are connected in series to form the first LED chip string, and the LED chips in the third annular area 3 are connected in series. The chips are connected in series to form the third LED chip string, and the LED chips in the fifth annular area 5 are connected in series to form the fifth LED chip string, and then the first LED chip string, the third LED chip string and the fifth LED chip string are connected in parallel. Electrically connected with the first positive electrode 10 and the first negative electrode 11;

将位于所述第二色温区内且位于同一环形区域内的LED芯片串联形成LED芯片串,并将所述第二色温区内不同环形区域的LED芯片串并联后与第二正电极和第二负电极电连接,具体连接过程与第一色温区相同,在此不再赘述。LED chips located in the second color temperature zone and in the same annular area are connected in series to form LED chip strings, and the LED chip strings in different annular areas in the second color temperature area are connected in parallel to the second positive electrode and the second The negative electrode is electrically connected, and the specific connection process is the same as that of the first color temperature zone, and will not be repeated here.

由于不同的色温区内的LED芯片与不同的电极对相连,因此,可以通过与不同电极对相连的控制电路,控制不同色温区的电压或电流大小,从而以此来调节LED光源的色温。本实施例中的LED芯片为蓝光芯片或者为蓝光芯片和红光芯片的组合。Since LED chips in different color temperature regions are connected to different electrode pairs, the voltage or current in different color temperature regions can be controlled through control circuits connected to different electrode pairs, thereby adjusting the color temperature of the LED light source. The LED chip in this embodiment is a blue light chip or a combination of a blue light chip and a red light chip.

安装完成LED芯片之后,需要在所述LED芯片表面涂覆荧光胶体,并且,当相邻的两个环形区域位于不同的色温区时,需要保证其中一个环形区域的荧光胶体的粘度高于另一个环形区域的荧光胶体的粘度;具体地,当最外侧环形区域位于所述第二色温区时,在所述LED芯片表面涂覆荧光胶体的过程包括:After the LED chip is installed, it is necessary to coat the fluorescent colloid on the surface of the LED chip, and when two adjacent annular areas are located in different color temperature zones, it is necessary to ensure that the viscosity of the fluorescent colloid in one of the annular areas is higher than that of the other. The viscosity of the fluorescent colloid in the annular area; specifically, when the outermost annular area is located in the second color temperature zone, the process of coating the fluorescent colloid on the surface of the LED chip includes:

S103:在第二色温区的LED芯片表面涂覆第二荧光胶体;S103: coating the second fluorescent colloid on the surface of the LED chip in the second color temperature zone;

S104:在第一色温区的LED芯片表面涂覆第一荧光胶体,第二荧光胶体的粘度大于第一荧光胶体的粘度。S104: Coating the first fluorescent colloid on the surface of the LED chip in the first color temperature zone, the viscosity of the second fluorescent colloid is greater than the viscosity of the first fluorescent colloid.

本实施例中,同一色温区的不同环形区域的荧光胶体的粘度相同,当然,本发明并不仅限于此,在其他实施例中,同一色温区的不同环形区域的荧光胶体的粘度也可不同。In this embodiment, the viscosities of the fluorescent colloids in different annular regions in the same color temperature zone are the same. Of course, the present invention is not limited thereto. In other embodiments, the viscosities of the fluorescent colloids in different annular regions in the same color temperature zone may also be different.

其中,第二色温区B涂覆第二荧光胶体后的LED光源的平面图如图5所示,第二色温区B涂覆第二荧光胶体后的LED光源的侧面图如图6所示,第一色温区A涂覆第一荧光胶体和第二色温区B涂覆第二荧光胶体后LED光源的平面图如图7所示,第一色温区A涂覆第一荧光胶体和第二色温区B涂覆第二荧光胶体后LED光源的侧面图如图8所示。Among them, the plan view of the LED light source coated with the second fluorescent colloid in the second color temperature zone B is shown in Figure 5, and the side view of the LED light source coated with the second fluorescent colloid in the second color temperature zone B is shown in Figure 6. The plane view of the LED light source after coating the first fluorescent colloid in the first color temperature zone A and the second fluorescent colloid in the second color temperature zone B is shown in Figure 7. The first color temperature zone A is coated with the first fluorescent colloid and the second color temperature zone B A side view of the LED light source after coating the second fluorescent colloid is shown in FIG. 8 .

如图6和图8所示,第二色温区B内第六环形区域6的荧光胶体的高度大于第二色温区B内第四环形区域4和第二环形区域2的荧光胶体的高度,这样,在第一色温区A内第一环形区域1、第三环形区域3和第五环形区域5涂覆低粘度的第一荧光胶体时,由于低粘度的第一荧光胶体具有很强的流动性,因此,会在重力的作用下自然流平,实现第一色温区的统一点胶,一体成型,从而不需要对第一色温区A点胶,大大节省了封装时间。且由于最外侧涂覆的是高粘度的荧光胶体以及涂覆荧光胶体高度最高,里面任一区域里的荧光胶体流平后就不会溢出。As shown in Figures 6 and 8, the height of the fluorescent colloid in the sixth annular area 6 in the second color temperature zone B is greater than the height of the fluorescent colloid in the fourth annular area 4 and the second annular area 2 in the second color temperature zone B, so that , when the first annular region 1, the third annular region 3 and the fifth annular region 5 in the first color temperature zone A are coated with the low-viscosity first fluorescent colloid, because the low-viscosity first fluorescent colloid has strong fluidity , Therefore, it will naturally level under the action of gravity, realize the uniform dispensing of the first color temperature zone, and form an integral body, so that there is no need to dispensing glue in the first color temperature zone A, which greatly saves packaging time. And because the outermost side is coated with high-viscosity fluorescent colloid and the height of the coated fluorescent colloid is the highest, the fluorescent colloid in any area inside will not overflow after being leveled.

本实施例中,第四环形区域4的荧光胶体的高度等于第二环形区域2的荧光胶体的高度,在其他实施例中,第四环形区域4的荧光胶体的高度可以不等于第二环形区域2的荧光胶体的高度,本发明并不仅限于此。In this embodiment, the height of the fluorescent colloid in the fourth annular area 4 is equal to the height of the fluorescent colloid in the second annular area 2. In other embodiments, the height of the fluorescent colloid in the fourth annular area 4 may not be equal to that of the second annular area. The height of the fluorescent colloid is 2, and the present invention is not limited thereto.

此外,所述第二荧光胶体的粘度大于20PaS。并且,所述第二荧光胶体中混合的荧光粉主要为硅酸盐红色荧光粉或氮化物红色荧光粉中的一种或者两种的混合物,具有稳定优异的发光性能,使得光源具有良好的光照效果;所述第一荧光胶体中混合的荧光粉主要为铝酸盐或硅酸盐黄色荧光粉的一种或两种混合物,有利于提高光源的调色效果和能力,提高产品的质量。In addition, the viscosity of the second fluorescent colloid is greater than 20PaS. Moreover, the fluorescent powder mixed in the second fluorescent colloid is mainly silicate red fluorescent powder or nitride red fluorescent powder or a mixture of two, which has stable and excellent luminous performance, so that the light source has good illumination Effect: The fluorescent powder mixed in the first fluorescent colloid is mainly one or two mixtures of aluminate or silicate yellow fluorescent powder, which is conducive to improving the color matching effect and ability of the light source and improving the quality of the product.

当然,在本发明的其他实施例中,当最外侧环形区域位于所述第一色温区时,在所述LED芯片表面涂覆荧光胶体的过程包括:在所述第一色温区的LED芯片表面涂覆第一荧光胶体;在所述第二色温区的LED芯片表面涂覆第二荧光胶体,所述第一荧光胶体的粘度大于所述第二荧光胶体的粘度。Of course, in other embodiments of the present invention, when the outermost annular region is located in the first color temperature zone, the process of coating the fluorescent colloid on the surface of the LED chip includes: the surface of the LED chip in the first color temperature zone Coating the first fluorescent colloid; coating the surface of the LED chip in the second color temperature zone with the second fluorescent colloid, the viscosity of the first fluorescent colloid is greater than the viscosity of the second fluorescent colloid.

其中,所述第一色温区的第一荧光胶体的粘度大于20PaS。并且,所述第一荧光胶体中混合的荧光粉主要为硅酸盐红色荧光粉或氮化物红色荧光粉中的一种或者两种的混合物;所述第二荧光胶体中混合的荧光粉主要为铝酸盐或硅酸盐黄色荧光粉的一种或两种混合物。Wherein, the viscosity of the first fluorescent colloid in the first color temperature zone is greater than 20 PaS. Moreover, the phosphor powder mixed in the first fluorescent colloid is mainly silicate red phosphor powder or nitride red phosphor powder or a mixture of both; the phosphor powder mixed in the second fluorescent colloid is mainly One or two mixtures of aluminate or silicate yellow phosphors.

本实施例提供的色温可调的LED光源的封装方法,将基板划分为多个封闭环形区域,将所述多个封闭环形区域划分为多个色温区,由于当相邻的两个环形区域位于不同的色温区时,其中一个环形区域的荧光胶体的粘度高于另一个环形区域的荧光胶体的粘度,因此,相邻两个环形区域能够通过高粘度和低粘度的荧光胶体来实现不同色温区域的划分,从而不需要采用挡墙来划分色温区域,既节省了制造成本,又避免了挡墙的存在而导致的LED光源的气密性差,影响LED光源的质量和性能的问题;The packaging method of the LED light source with adjustable color temperature provided in this embodiment divides the substrate into a plurality of closed annular areas, and divides the plurality of closed annular areas into a plurality of color temperature areas, because when two adjacent annular areas are located In different color temperature zones, the viscosity of the fluorescent colloid in one annular area is higher than that in the other annular area. Therefore, two adjacent annular areas can use high-viscosity and low-viscosity fluorescent colloids to achieve different color temperature areas. Therefore, there is no need to use a retaining wall to divide the color temperature area, which not only saves the manufacturing cost, but also avoids the poor airtightness of the LED light source caused by the existence of the retaining wall, which affects the quality and performance of the LED light source;

并且,本发明所提供的色温可调的LED光源封装方法,由于最外侧的环形区域涂覆荧光胶体的高度大于内侧任一环形区域涂覆荧光胶体的高度,因此,在涂覆内侧环形区域的荧光胶体的过程中,可以通过重力的作用使荧光胶体自然流平,大大节省了封装加工的时间。Moreover, in the LED light source packaging method with adjustable color temperature provided by the present invention, since the height of the fluorescent colloid coated on the outermost annular area is greater than the height of any inner annular area coated with fluorescent colloid, therefore, the coating of the inner annular area During the process of fluorescent colloid, the fluorescent colloid can be naturally leveled by the action of gravity, which greatly saves the time of packaging and processing.

本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other. The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1.一种色温可调的LED光源的封装方法,其特征在于,包括:1. A method for encapsulating an LED light source with adjustable color temperature, comprising: 提供基板,所述基板被划分为多个封闭区域,所述多个封闭区域构成了至少一个色温区;providing a substrate, the substrate is divided into a plurality of enclosed areas, and the plurality of enclosed areas constitute at least one color temperature zone; 在所述基板上安装LED芯片,所述LED芯片与所述基板电连接,且每个所述封闭区域内都具有至少一个LED芯片;Installing LED chips on the substrate, the LED chips are electrically connected to the substrate, and each of the enclosed areas has at least one LED chip; 在所述LED芯片表面涂覆荧光胶体,其中,当相邻的两个封闭区域位于不同的色温区时,其中一个封闭区域的荧光胶体的粘度高于另一个封闭区域的荧光胶体的粘度,最外侧的封闭区域涂覆荧光胶体的高度大于内侧任一封闭区域涂覆荧光胶体的高度。Fluorescent colloid is coated on the surface of the LED chip, wherein, when two adjacent enclosed areas are located in different color temperature zones, the viscosity of the fluorescent colloid in one enclosed area is higher than that in the other enclosed area, and most The height of the fluorescent colloid coated on the outer closed area is greater than the height of any inner closed area coated with fluorescent colloid. 2.根据权利要求1所述的方法,其特征在于,将所述多个封闭区域划分为至少一个色温区的过程包括:2. The method according to claim 1, wherein the process of dividing the plurality of enclosed areas into at least one color temperature zone comprises: 将所述多个封闭环形区域中位于中心的封闭区域和与所述中心的封闭区域间隔排列的封闭区域划分为第一色温区,将其他封闭区域划分为第二色温区。The central closed area and closed areas spaced apart from the central closed area among the plurality of closed annular areas are divided into a first color temperature zone, and the other closed areas are divided into a second color temperature zone. 3.根据权利要求2所述的方法,其特征在于,在所述基板上安装LED芯片的过程包括:3. The method according to claim 2, wherein the process of installing LED chips on the substrate comprises: 将位于所述第一色温区内且位于同一封闭区域内的LED芯片串联形成LED芯片串,并将所述第一色温区内不同封闭区域的LED芯片串并联后与第一正电极和第一负电极电连接;LED chips located in the first color temperature zone and in the same enclosed area are connected in series to form LED chip strings, and the LED chip strings in different enclosed areas in the first color temperature area are connected in parallel to the first positive electrode and the first positive electrode. Negative electrode electrical connection; 将位于所述第二色温区内且位于同一封闭区域内的LED芯片串联形成LED芯片串,并将所述第二色温区内不同环形区域的LED芯片串并联后与第二正电极和第二负电极电连接。LED chips located in the second color temperature zone and in the same enclosed area are connected in series to form LED chip strings, and the LED chip strings in different annular areas in the second color temperature zone are connected in parallel to the second positive electrode and the second The negative electrode is electrically connected. 4.根据权利要求3所述的方法,其特征在于,当最外侧环形区域位于所述第二色温区时,在所述LED芯片表面涂覆荧光胶体的过程包括:4. The method according to claim 3, wherein when the outermost annular region is located in the second color temperature zone, the process of coating the fluorescent colloid on the surface of the LED chip comprises: 在所述第二色温区的LED芯片表面涂覆第二荧光胶体;Coating a second fluorescent colloid on the surface of the LED chip in the second color temperature zone; 在所述第一色温区的LED芯片表面涂覆第一荧光胶体,所述第二荧光胶体的粘度大于所述第一荧光胶体的粘度。The surface of the LED chip in the first color temperature zone is coated with a first fluorescent colloid, and the viscosity of the second fluorescent colloid is greater than that of the first fluorescent colloid. 5.根据权利要求4所述的方法,其特征在于,所述第二荧光胶体的粘度大于20PaS。5. The method according to claim 4, characterized in that the viscosity of the second fluorescent colloid is greater than 20PaS. 6.根据权利要求5所述的方法,其特征在于,所述第二荧光胶体中混合的荧光粉主要为硅酸盐红色荧光粉或氮化物红色荧光粉中的一种或者两种的混合物。6 . The method according to claim 5 , wherein the fluorescent powder mixed in the second fluorescent colloid is mainly one or a mixture of silicate red fluorescent powder or nitride red fluorescent powder. 7.根据权利要求4所述的方法,其特征在于,所述第一荧光胶体中混合的荧光粉主要为铝酸盐或硅酸盐黄色荧光粉的一种或两种混合物。7. The method according to claim 4, wherein the fluorescent powder mixed in the first fluorescent colloid is mainly one or a mixture of aluminate or silicate yellow fluorescent powder. 8.根据权利要求1所述的方法,其特征在于,所述封闭区域为圆形环或方形环。8. The method according to claim 1, wherein the closed area is a circular ring or a square ring. 9.根据权利要求1所述的方法,其特征在于,所述基板的材质为陶瓷或金属。9. The method according to claim 1, wherein the material of the substrate is ceramic or metal. 10.根据权利要求1所述的方法,其特征在于,所述LED芯片为蓝光芯片或者为蓝光芯片和红光芯片的组合。10. The method according to claim 1, wherein the LED chip is a blue light chip or a combination of a blue light chip and a red light chip.
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