CH718925B1 - Flame-retardant polyamides with high light transmission. - Google Patents

Abstract

The present invention relates to flame-retardant polyamides with high light transmission, which comprise the polyamide units AB/AC/AD/EB/EC/ED/F, where at least the polyamide units AB must be present, the polyamide units AC, AD, EB, EC, ED and F are optional and where the monomer units A, B, C, D, E and F are derived from the following molecules which are present in an amide-bonded form in the polyamide X: A: cycloaliphatic diamines; B: phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3 C. Aliphatic dicarboxylic acids; D: aromatic phosphorus-free dicarboxylic acids; E: acyclic aliphatic diamines; F: α, ω-aminocarboxylic acids, lactams. The invention further relates to flame-retardant molding compositions based on the flame-retardant polyamides and moldings formed from the polyamides or polyamide molding compositions according to the invention.

Description

[0001] The present invention relates to flame-retardant polyamides with high light transmission based on cycloaliphatic diamines and phosphorus-containing aromatic dicarboxylic acids and optionally other polyamide-forming components. The invention also relates to flame-retardant molding compounds based on the flame-retardant polyamides. Both the polyamides and the molding compounds produced from them have very good flame retardancy and exhibit good mechanical and thermal properties. These molding compounds are suitable for producing, in particular, translucent or transparent, flame-retardant moldings for the electrical and electronics industry and for the optics sector, such as housings, housing components or containers. The invention also relates to the use of the polyamides and polyamide molding compounds according to the invention for producing moldings, in particular components for the electrical and electronics industry, for the automotive industry and for the optics sector, in particular in the field of security and surveillance.

[0002] Flame-retardant halogen-free molded parts with a V0 rating according to the UL-94 specification of the Underwriter Laboratories are of particular interest to the electrical and electronics industry. The transparency of such molded parts is an important property. In addition to plastics that are inherently flame-retardant (= inherent flame protection) and plastics coated with a flame retardant, plastics with a reactive flame retardant are also used, i.e. the flame retardant is a component of the plastic and was chemically bonded to it during polymerization. Another option for making plastics flame-retardant is to compound flame-retardant additives. Common additives include nitrogen-based compounds such as melamine and urea, brominated polystyrenes and organophosphorus compounds. Another important requirement for plastics is good mechanical and thermal properties, such as rigidity, impact properties or heat resistance. Particularly with regard to transparent polyamides, it is important to ensure that the glass transition temperature is not reduced too much by the flame retardant used. It is also important that the flame-retardant polyamides and polyamide molding compounds can be processed well, e.g. in injection molding machines, melt spinning and extrusion systems, and that in particular no corrosion occurs on the system components due to the flame retardant. Melamine compounds, in particular melamine cyanurate or melamine polyphosphate, cyanoguanidine, thiourea, magnesium and aluminum hydroxide, halogenated, especially brominated organic compounds, especially in combination with heavy metal salts, phosphorus alone and in combination with halogen-containing compounds or organic phosphorus compounds, in particular alkylphosphinic acids or their salts, are well-known state of the art flame-retardant additives for polymers, especially for polyamides. In addition, the mechanical and physical properties of the polyamides also change in an unfavorable way with increasing amounts of additives. EP 0 659 816 A2 relates to flame-retardant polyamides and molded articles made from them. A trimethylpropanol ester of methylphosphoric acid is proposed as a flame retardant, which apparently has little effect on the transparency of the polyamides and does not show any pronounced formation of deposits during processing or use. However, these flame retardants, which are not entirely harmless to health, can be dissolved or washed out of the molded articles when they come into contact with media such as water, alcohols or other organic solvents. Furthermore, the proposed flame retardants are low-molecular compounds that are dissolved in the transparent polyamide and, due to their plasticizing effect, significantly reduce the glass transition temperature even when small amounts are used. This is why such flame-retardant molding compounds are characterized by a low heat resistance, which significantly limits their area of application. CN 101 735 455 A describes a process for producing aromatic polyoxadiazoles from terephthalic acid, hydrazine and modified isophthalic acid in a solvent, as well as wet-spun flame-resistant, high-temperature-resistant fibers. The modified isophthalic acid has chlorine, bromine or diphenylphosphine oxide or diphenylphosphine sulfide substituents. US 4,837,394 relates to electrostatic toner particles based on a polyester resin, which contains, among other things, a dimethyl isophthalate provided with a phosphonium substituent as a monomer. The quaternary phosphonium groups act as charge carriers in the toner particles. Due to the homogeneous distribution of the charge carriers, a very low content of quaternary phosphonium groups in the range of 10<-9> to 10<-4> mol/g is sufficient to realize an electrostatographic imaging process. However, the amounts of phosphorus are too small to ensure adequate flame retardancy for the underlying polyester resins. US 3,108,991 discloses linear polyamides based on bis(aminoalkyl)alkylphosphines and aliphatic or aromatic dicarboxylic acids as well as aliphatic diamines and bis(carboxyalkyl)alkylphosphine oxides. The polyamides described dissolve in cold or warm water and have low softening temperatures. US 2,646,420 relates to oriented fibers based on linear condensation polymers that contain phosphorus in the polymer chain. In addition to good dyeability, the fibers also exhibit good mechanical properties, in particular high initial strengths and good resilience. In the examples, the phosphorus-containing monomer used is bis(carboxyphenyl)methylphosphine oxide, which is condensed with various glycols or decanediamine. The textile fibers sector is also covered by document US 4,032,517 B, which includes copolyamides containing 0.5 to 7.5% by weight of phosphorus as an integral part of the polymer chains. Bis(carboxyethyl)alkylphosphine oxides, which are polycondensed with hexanediamine and adipic acid, are proposed as phosphorus-containing dicarboxylic acids. The fibers are said to be permanently antistatic, moisture-regulating and flame-resistant. WO 2018 071790 A1 discloses flame-retardant polyamides that contain phosphorus in the polymer chain. The bis(4-methyloxycarbonylphenoxy)phenylphosphine oxide used as a phosphorus-containing monomer is produced from methylparaben and phenylphosphonic acid dichloride. The reaction of this phosphorus-containing dicarboxylic acid with m-xylylenediamine (MXDA) and adipic acid is described. Such a polyamide with 5% by weight of phosphorus-containing dicarboxylic acid has a higher LOI value than MXD6 and achieves the V0 classification for 3.2 mm thick test specimens in the UL94 fire test. JP11286545A describes phosphorus-containing copolyamides with a high glass transition temperature that can be produced by polycondensation in an inert solvent at temperatures of 50 to 200 °C. 2,5-dicarboxyphenylphosphonic acid, 3,5-dicarboxyphenylphosphinic acid and their derivatives are mentioned as phosphorus-bearing monomers. The copolyamides used in the examples based on the dicarboxyphenylphosphinic acids mentioned and the diamine 4,4'-oxydianiline and isophthalic acid as another dicarboxylic acid have glass transition temperatures in the range of 240 to 276 °C and cannot be polycondensed in the melt. The inherently flame-retardant polyamides described above in the prior art, which contain phosphorus in the polymer chain, have poor chemical resistance, are largely soluble in cold or warm water, contain "weak" C-P or C-O-P bonds in the polymer chain and generally have low softening temperatures, in particular low glass transition temperatures. In addition, the proposed polyamide molding compounds have too high a haze and too low a transparency. Dissolved low-molecular compounds, on the other hand, show a pronounced plasticizing effect, greatly reduce the glass transition temperatures and lead to molding compounds with low heat distortion temperature.

DESCRIPTION OF THE INVENTION

[0003] One of the objects of the present invention is to avoid these disadvantages known from the prior art and to provide inherently flame-retardant polyamides and polyamide molding compounds produced therefrom, which are characterized by good mechanical and thermal properties, high surface quality, high heat resistance, good flame retardancy and, in particular, excellent transparency. Preferably, the polyamides and polyamide molding compounds according to the invention should have a fire protection classification V0 according to UL94 for test specimens with a thickness of 0.35 - 3.2 mm, in particular 0.5 mm and/or a light transmission of at least 85% and a haze of at most 7%, determined according to ASTM D 1003-13 (2013) on plates with a thickness of 2 mm.

[0004] This object is achieved according to the invention on the one hand by a polyamide X according to claim 1, which comprises the polyamide units AB/AC/AD/EB/EC/ED/F, wherein at least the polyamide units AB must be present, the polyamide units AC, AD, EB, EC, ED and F are optional and wherein the monomer units A, B, C, D, E and F are derived from the following molecules which are present in an amide-bonded form in the polyamide X: A: Cycloaliphatic diamines; B: Phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3

where the substituents R1, R2 are each independently C1 - C8 alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; C: Aliphatic dicarboxylic acids; D: Aromatic phosphorus-free dicarboxylic acids; E: Acyclic aliphatic diamines; F: α,ω-aminocarboxylic acids, lactams.

[0005] The aromatic dicarboxylic acids of component B are different from the dicarboxylic acids of component C, in particular they are free of phosphorus. The polyamide units mentioned above, e.g. the polyamide units AB, are to be understood as repeat units in polyamide X. In the simplest case, polyamide X is therefore a homopolyamide AB, which only has the repeat units AB, or a copolyamide AB, which has at least two different repeat units AB. In the latter case, at least two different cycloaliphatic diamines A or at least two different phosphorus-containing, aromatic dicarboxylic acids B were used in the production of polyamide X.

[0006] The flame-retardant polyamides X are characterized by a high transparency of at least 85% light transmission and a low haze of at most 7%. The flame retardant used is an integral component of the polyamides according to the invention; it is chemically bonded to the polymer backbone, which means that migration or washout phenomena can be ruled out. Macroscopically, the flame retardant is distributed homogeneously throughout the polymer, so that even small amounts are sufficient to ensure good flame protection. Since the flame retardant according to the invention, component B, is chemically bonded in the polyamide X, no pronounced plasticizing effect occurs, which means that high glass transition temperatures and thus sufficiently high heat resistance can be achieved for most applications.

[0007] The object is also achieved by a process for producing the polyamides according to the invention according to claim 9. The object is also achieved by providing a polyamide molding compound FM according to claim 10, containing the previously described polyamide X, and at least one filler and/or at least one additive and/or at least one polyamide Y different from the polyamide X. This object is further achieved by the moldings according to claim 13, which are at least partially made of a polyamide X or the molding compound FM. Finally, this object is achieved by using the polyamides X according to the invention and by using the polyamide molding compounds FM according to the invention to produce the moldings according to claim 15.

DEFINITIONS OF TERMS

[0008] For the purposes of the present invention, the term "polyamide" (abbreviation PA) is understood to be a generic term which includes homopolyamides and copolyamides. The chosen spellings and abbreviations for polyamides and their monomers correspond to those specified in ISO standard 16396-1 (2015(D)). The abbreviations used therein are used in the following synonyms for the IUPAC names of the monomers, in particular the following abbreviations for monomers occur: T or TPS for terephthalic acid, I or IPS for isophthalic acid, MACM for bis(4-amino-3-methyl-cyclohexyl)methane (also known as 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, CAS No. 6864-37-5), PACM for bis(4-aminocyclohexyl)methane (also known as 4,4'-diaminodicyclohexylmethane, CAS No. 1761-71-3), TMDC for bis(4-amino-3,5-dimethyl-cyclohexyl)methane (also known as 3,3',5,5'-tetramethyl-4,4'-diaminodicyclohexylmethane, CAS No. 65962-45-0). The abbreviation HMDA is used below for 1,6-hexanediamine (also known as hexamethylenediamine). Compared to semi-crystalline polyamides, amorphous polyamides have no or only a very low, barely detectable heat of fusion. In differential scanning calorimetry (DSC) according to ISO 11357 (2013) at a heating rate of 20 K/min, amorphous polyamides preferably show a heat of fusion of less than 5 J/g, particularly preferably of a maximum of 3 J/g, and most particularly preferably of 0 to 1 J/g. Amorphous polyamides do not have a melting point due to their amorphous nature. In addition to a glass transition temperature, microcrystalline polyamides also have a melting point. However, they have a morphology in which the crystallites have such a small dimension that a plate made from them with a thickness of 2 mm is still transparent, i.e. its light transmission is at least 85% and its haze is at most 7%, measured according to ASTM D 1003-13 (2013). Microcrystalline polyamides preferably show a heat of fusion of 5 to 20 J/g in differential scanning calorimetry (DSC) according to ISO 11357 (2013) at a heating rate of 20 K/min. In comparison, semi-crystalline polyamides show a pronounced melting peak in DSC and have a heat of fusion of more than 20 J/g. For the purposes of the present invention, a transparent polyamide is present if its light transmission measured according to ASTM D 1003-13 (2013) on plates with a thickness of 2 mm is at least 85% and its haze is at most 7%. When transparent polyamides are mentioned below, this always refers to amorphous or microcrystalline polyamides that meet the above definitions in terms of transparency and heat of fusion. With regard to the polyamide X according to the invention, the monomers of the dicarboxylic acid and diamine components and of the aminocarboxylic acids, lactams or monofunctional regulators used if necessary form repeat units or end groups in the form of amides through condensation, which are derived from the respective monomers. These generally make up at least 95 mol%, in particular at least 99 mol%, of all repeat units and end groups present in the polyamide. In addition, the polyamide can also have small amounts of other repeat units that can result from degradation or side reactions of the monomers, for example the diamines.

[0009] The polyamide according to the invention is a polyamide X with the polyamide units AB/AC/AD/EB/EC/ED/F, whereby at least the polyamide units AB must be present. This means that the polyamide units AC, AD, EB, EC, ED and F are optional and the polyamide X in the simplest case comprises exclusively the polyamide units AB. The monomer units A, B, C, D, E and F are derived from the following bifunctional molecules, hereinafter also referred to as monomers, which are present in an amide-bonded form in the polyamide X. The monomers for the production of the polyamides X comprise at least the following components A and B, which form the polyamide units AB, and optionally the components C, D, E and F: A: Cycloaliphatic diamines; B phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1 - C8 alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; C: Aliphatic dicarboxylic acids; D: Aromatic, phosphorus-free dicarboxylic acids; E: Acyclic aliphatic diamines; F: α,ω-aminocarboxylic acids, lactams.

[0010] If only a single cycloaliphatic diamine A and a single phosphorus-containing, aromatic dicarboxylic acid B are selected as monomers, the polyamide X is composed of only one polyamide unit AB as repeat units. If two or more different diamines A and/or at least two different dicarboxylic acids B are selected, the polyamide X contains two or more different polyamide units AB. The polyamide units are to be understood as repeat units in the polyamide X. It is preferred if the total diamines used and the total dicarboxylic acids used in the polyamide X are present in a molar ratio of 1.05:1 to 1:1.05, particularly preferably 1.03:1 to 1:1.03 and particularly preferably in a molar ratio of 1:1 in the polyamide X. A preferred embodiment of the present invention provides that the cycloaliphatic diamines A are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)methane (MACM), bis-(4-aminocyclohexyl)methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMDC), 2,2-bis-(4-aminocyclohexyl)propane, 2,2-bis-(4-amino-3-methylcyclohexyl)propane, bis-(4-amino-3-ethylcyclohexyl)methane (EACM), isophoronediamine (5-amino-1,3,3-trimethylcyclohexanemethanamine), 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1,3-bis-(aminomethyl)cyclohexane (BAC), 1,4-bis-(aminomethyl)cyclohexane, 2,5-bis-(aminomethyl)norbornane, 2,6-bis-(aminomethyl)norbornane, 2,5-diaminonorbornane, 2,6-diaminonorbornane, m-xylylenediamine (MXDA), p-xylylenediamine (PXDA) and mixtures thereof. Particularly preferably, the diamines A are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMDC) and mixtures thereof. It is particularly preferred if these diamines have a high bio content, i.e. are based on renewable raw materials. According to a further preferred embodiment, the phosphorus-containing, aromatic dicarboxylic acid B is selected from the group consisting of 3,5-dicarboxyphenyldiphenylphospine oxide, 3,5-dicarboxyphenyldimethylphospine oxide, 3,5-dicarboxyphenyldiethylphospine oxide, 2,4-dicarboxyphenyldiphenylphospine oxide, 2,4-dicarboxyphenyldimethylphospine oxide, 2,4-dicarboxyphenyldiethylphospine oxide. In particular, 3,5-dicarboxyphenyldiphenylphospine oxide is preferred as dicarboxylic acid B. 3,5-dicarboxyphenyldiphenylphospine oxide is a dicarboxylic acid according to formula 1, where the substituents R1 and R2 are phenyl and the substituents R3, R4 and R5 are hydrogen. A further preferred embodiment of the present invention provides that the aliphatic dicarboxylic acids C are selected from the group consisting of cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, adipic acid, 1,7-heptanedioic acid, 1,8-octanedioic acid, 1,9-nonanedioic acid, 1,10-decanedioic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid, 1,14-tetradecanedioic acid, 1,15-pentadecanedioic acid, 1,16-hexadecanedioic acid, 1,17-heptadecanedioic acid, 1,18-octadecanedioic acid, and mixtures thereof. The aliphatic dicarboxylic acids C are particularly preferably selected from the group consisting of dicarboxylic acids having 6 to 16 carbon atoms, in particular adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid and mixtures thereof. Aromatic dicarboxylic acids selected from the group consisting of terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 3,3'-diphenyldicarboxylic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4'-diphenylmethanedicarboxylic acid, 4,4'-diphenylsulfonedicarboxylic acid, 4,4'-diphenylisopropylidonedicarboxylic acid, 1,2-bis(phenoxy)ethane-4,4'-dicarboxylic acid, 2,5-anthracenedicarboxylic acid, 4,4'-p-terphenylenedicarboxylic acid and 2,5-pyridinedicarboxylic acid are preferably used as component D. Terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid and mixtures thereof are particularly preferably used as component D. The aromatic dicarboxylic acids D are particularly preferably selected as a mixture of isophthalic acid and terephthalic acid, wherein the molar ratio of isophthalic acid to terephthalic acid is preferably in the range from 0.5 to 3.0, particularly preferably in the range from 0.8 to 2.5 and especially preferably in the range from 0.9 to 2.0. According to a preferred embodiment, the acyclic aliphatic diamine E is selected from the group consisting of 2-methyl-1,5-pentanediamine, hexanediamine, in particular 1,6-hexanediamine, 2,2,4-trimethyl-1,6-hexamethylenediamine, 2,4,4-trimethyl-1,6-hexamethylenediamine, nonanediamine, in particular 1,9-nonanediamine, 2-methyl-1,8-octanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine and mixtures thereof. The acyclic, aliphatic diamines E are particularly preferably selected from the group consisting of diamines having 6 to 10 carbon atoms, in particular 1,6-hexanediamine, 1,9-nonanediamine, 1,10-decanediamine and mixtures thereof. According to a further preferred embodiment of the present invention, the α,ω-aminocarboxylic acids or the lactams F are selected from the group consisting of caprolactam, undecanolactam, laurolactam, α,ω-aminocaproic acid, α,ω-aminoheptanoic acid, α,ω-aminooctanoic acid, α,ω-aminononanoic acid, α,ω-aminodecanoic acid, α,ω-aminoundecanoic acid (AUA) and α,ω-aminododecanoic acid (ADA), particularly preferred are α,ω-aminoundecanoic acid, caprolactam and laurolactam and mixtures thereof. Furthermore, the polyamides X can contain at least one monofunctional carboxylic acid G1 or monofunctional amine G2 polymerized as monofunctional regulator G. The monofunctional regulators G serve to end-capping the polyamides produced according to the invention. In principle, all monocarboxylic acids G1 that are capable of reacting with at least some of the available amino groups under the reaction conditions of the polyamide condensation are suitable. Suitable monocarboxylic acids G1 are aliphatic monocarboxylic acids, alicyclic monocarboxylic acids and aromatic monocarboxylic acids. These include formic acid, acetic acid, propionic acid, n-, iso- or tert-butyric acid, valeric acid, trimethylacetic acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, undecanoic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, cyclohexanecarboxylic acid, benzoic acid, methylbenzoic acids, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, phenylacetic acid, oleic acid, ricinoleic acid, linoleic acid, linolenic acid, erucic acid, acrylic acid, methacrylic acid and mixtures thereof. The monocarboxylic acid G1 is particularly preferably selected from acetic acid, propionic acid, benzoic acid, stearic acid and mixtures thereof. In a special embodiment, the aliphatic polyamides X contain only acetic acid as the monocarboxylic acid G1 in polymerized form. The polyamides X can contain at least one monoamine G2 in polymerized form. The monoamines G2 serve to end-capping the polyamides produced according to the invention. In principle, all monoamines that are capable of reacting with at least some of the available carboxylic acid groups under the reaction conditions of the polyamide condensation are suitable. Preferred monoamines G2 are aliphatic monoamines. These include methylamine, ethylamine, propylamine, butylamine, hexylamine, heptylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, dibutylamine, cyclohexylamine, dicyclohexylamine and mixtures thereof. The content of the polyamide units AB or the sum of the contents of the polyamide units AB and EB is preferably 1 to 100 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol%, in each case based on the polyamide X with the polyamide units AB/AC/AE/DB/DC/DE/F. The concentration of 100 mol% applies to cases where the phosphorus-containing dicarboxylic acid B is contained exclusively in the polyamide units AB or exclusively in polyamide units AB and EB. Furthermore, preference is given to a polyamide X in which at least one of the following selection groups is selected with respect to components A to F, preferably the selection groups are selected for components A and B, particularly preferably the selection groups are selected for components A, B, C and D and particularly preferably all selection groups are selected simultaneously: A: the cycloaliphatic diamines are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMDC) and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphospine oxide, 3,5-dicarboxyphenyldimethylphospine oxide, 3,5-dicarboxyphenyldiethylphospine oxide, 2,4-dicarboxyphenyldiphenylphospine oxide, 2,4-dicarboxyphenyldimethylphospine oxide, 2,4-dicarboxyphenyldiethylphospine oxide, preferably selected as 3,5-dicarboxyphenyldiphenylphospine oxide, 3,5-dicarboxyphenyldimethylphospine oxide or 3,5-dicarboxyphenyldiethylphospine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphospine oxide; C: the aliphatic dicarboxylic acids are selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid and mixtures thereof; D: the aromatic phosphorus-free dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably selected as a mixture of terephthalic acid and isophthalic acid; E: the acyclic aliphatic diamines are selected from the group consisting of 1,6-hexanediamine, 1,9-nonanediamine, 1,10-decanediamine, preferably selected as 1,6-hexanediamine or 1,10-decanediamine; F: the α,ω-aminocarboxylic acids or the lactams F are selected from the group consisting of α,ω-aminoundecanoic acid, caprolactam and laurolactam and mixtures thereof.

[0011] In a preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB and AC or at least the polyamide units AB and AD or at least the polyamide units AB, AC and AD. In a particularly preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB and AC and wherein the monomer units A, B and C are derived from the following molecules which are present in an amide-bonded form in the polyamide X: A: the cycloaliphatic diamines are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMDC) and mixtures thereof; B: the phosphorus-containing aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide; C: the aliphatic dicarboxylic acids are selected from the group consisting of 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid and mixtures thereof. In a likewise particularly preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB and AD and wherein the monomer units A, B and D are derived from the following molecules which are present in an amide-bonded form in the polyamide X: A: the cycloaliphatic diamines are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)-methane (MACM), bis(4-aminocyclohexyl)-methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)-methane (TMDC) and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably 3,5-dicarboxyphenyldiphenylphosphine oxide is selected; D: the aromatic phosphorus-free dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably mixtures of terephthalic acid and isophthalic acid are selected.

[0012] In a likewise particularly preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB, AC and AD and wherein the monomer units A, B, C and D are derived from the following molecules which are present in an amide-bonded form in the polyamide X: A: the cycloaliphatic diamines are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)-methane (MACM), bis-(4-aminocyclohexyl)-methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)-methane (TMDC) and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, 3,5-dicarboxyphenyldiphenylphosphine oxide is particularly preferably selected; C: the aliphatic dicarboxylic acids are selected from the group consisting of 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid and mixtures thereof; D: the aromatic dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably mixtures of terephthalic acid and isophthalic acid. Preferred is a polyamide X in which the polyamide units AC are selected from the group consisting of the polyamide units MACM10, MACM12, MACM14, MACM16, MACM18, PACM10, PACM12, PACM14, PACM16, PACM18, TMDC10, TMDC12, TMDC14, TMDC16 and TMDC18. Also preferred is a polyamide X in which the polyamide units AD are selected from the group consisting of the polyamide units MACMI, MACMT, PACMI, PACMT, TMDCI and TMDCT. Preference is given, among other things, to a polyamide X which comprises at least the polyamide units AB and AC and/or AD. In this case, the polyamide X is the systems AB/AC, AB/AD and AB/AC/AD, which may also contain diamines E, aminocarboxylic acids/lactams F and/or monofunctional regulators G as additional components. The content of the polyamide units AB is 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 20 to 80 mol% and the content of the polyamide units AC or AD or the sum of AC and AD is 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 20 to 80 mol%, in each case based on the sum of the polyamide units AB, AC and AD. It is also preferred if the polyamide X consists exclusively of the polyamide units AB and AC or AB, AC and F. In this case, the polyamide X is the AB/AC or AB/AC/F system, which can also contain monofunctional regulators G as additional components. The content of polyamide units AB is preferably 1 to 99 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol%, and the content of polyamide units AC is preferably 1 to 99 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol% and the content of polyamide units F is preferably 0 to 50 mol%, particularly preferably 0 to 45 mol% and especially preferably 10 to 40 mol%, in each case based on the sum of the polyamide units AB and AC or AB, AC and F. It is also preferred if the polyamide X consists exclusively of the polyamide units AB and AD or AB, AD and F. In this case, the polyamide X is therefore the AB/AD or AB/AD/F systems, which can also contain monofunctional regulators G as additional components. The content of polyamide units AB is preferably 1 to 99 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol%, and the content of polyamide units AD is preferably 1 to 99 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol% and the content of polyamide units F is preferably 0 to 50 mol%, particularly preferably 0 to 45 mol% and especially preferably 10 to 40 mol%, in each case based on the sum of the polyamide units AB and AD or AB, AD and F. It is also preferred if the polyamide X consists exclusively of the polyamide units AB, AC and AD or AB, AC, AD and F. In this case, the polyamide X is therefore the AB/AC/AD or AB/AC/AD/F systems, which can also contain monofunctional regulators G as additional components. The content of polyamide units AB is preferably 1 to 99 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol%, the content of polyamide units AC is preferably 1 to 98 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol%, the content of polyamide units AD is preferably 1 to 99 mol%, particularly preferably 10 to 90 mol% and especially preferably 20 to 80 mol% and the content of polyamide units F is preferably 0 to 50 mol%, particularly preferably 0 to 45 mol% and especially preferably 10 to 40 mol%, in each case based on the sum of the polyamide units AB, AC and AD or AB, AC, AD and F. Particularly preferred is a polyamide X which exclusively contains the polyamide units AB and AC or exclusively the polyamide units AB and AD or exclusively the polyamide units AB, AC and AD or exclusively the polyamide units AB. Furthermore, a polyamide X is particularly preferred which comprises exclusively the polyamide units AB and AC or exclusively the polyamide units AB and AD or exclusively the polyamide units AB, AC and AD or exclusively the polyamide units AB, and wherein the cycloaliphatic diamines A are selected from the group consisting of bis-(4-amino-3-methyl-cyclohexyl)-methane (MACM) and bis(4-amino-cyclohexyl)methane (PACM) and mixtures thereof, the phosphorus-containing aromatic dicarboxylic acid B is selected as 3,5-dicarboxyphenyldiphenylphosphine oxide, the aliphatic dicarboxylic acids C are selected from the group consisting of 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid and mixtures thereof and the aromatic dicarboxylic acids D are selected from the group consisting of Group consisting of terephthalic acid, isophthalic acid and mixtures thereof. The polyamides according to the invention are characterized by excellent transparency and low haze. It is therefore preferred that the transparency of a plate made from polyamide X with a thickness of 2 mm is equal to or higher than 90%, particularly preferably at least 92% and the haze (cloudiness) is a maximum of 5%, particularly preferably a maximum of 3%, in each case determined according to the ASTM D1003:2013 method with the CIE-C light type. The plates used here preferably have a high-gloss surface, with the arithmetic mean roughness Ra preferably in the range from 0.01 to 0.08 mm, and/or the roughness depth Rz preferably in the range from 0.05 to 1.0 mm, in each case determined according to DIN EN ISO 4287:2010. The polyamides X are preferably amorphous or microcrystalline, i.e. they have a melting enthalpy of preferably less than or equal to 20 J/g, particularly preferably in the range from 0 to 20 J/g and particularly preferably less than 5 J/g. The polyamide X preferably has a solution viscosity ηrel, determined using a solution of 0.5 g of polymer granules in 100 ml of m-cresol at 20 °C according to ISO 307:2007, in the range from 1.4 to 2.5, preferably in the range from 1.4 to 2.0, in particular in the range from 1.45 to 1.85. The polyamides X preferably have a phosphorus content of at least 1.0% by weight, particularly preferably a phosphorus content in the range from 1.5 to 7% by weight and particularly preferably in the range from 1.7 to 4.0% by weight. The polyamides according to the invention have good flame retardancy and preferably have a flame retardancy classification V0, determined according to UL94 (“Tests for Flammability of Plastic Materials for Parts in Devices and Applications” by Underwriters Laboratories) on test specimens measuring 127 × 12.7 × 0.35 mm, 127 × 12.7 × 0.5 mm, 127 × 12.7 × 0.75 mm, 127 × 12.7 × 1.5 mm and 127 × 12.7 × 3.0 mm, which were previously conditioned for 48 hours in a standard climate (23 °C / 50% relative humidity) or stored for 7 days at 70 °C in a convection oven. The polyamides X preferably have a glass transition temperature of 130 to 230 °C, particularly preferably 140 to 200 °C and especially preferably 150 to 190 °C. The preparation of the polyamides X according to the invention preferably comprises a polycondensation reaction between at least one phosphorus-containing, aromatic dicarboxylic acid B according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1 - C8 alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O, and at least one cycloaliphatic diamine A and optionally further monomers C, D, E and F, optionally in the presence of monofunctional regulators G and/or process aids. Preferred process aids are inorganic and organic stabilizers, catalysts and defoamers. Preferred catalysts are phosphorus compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, phenylphosphonic acid, phenylphosphinic acid and/or their salts with mono- to trivalent cations, such as Na, K, Mg, Ca, Zn or Al, and/or their esters, such as triphenyl phosphate, triphenyl phosphite or tris-(nonylphenyl)-phosphite. Hypophosphorous acid and its salts, such as sodium hypophosphite, are particularly preferred as catalysts. The process for producing polyamide X, which comprises at least the polyamide units AB, is preferably carried out in pressure vessels, wherein after mixing the components A and B and optionally further components C, D, E, F, G and optional process aids, a pressure phase at 220 °C to 330 °C with subsequent relaxation at 220 °C to 320 °C, with subsequent degassing at 220 °C to 320 °C and discharge of the polyamide in strand form, cooling, granulation and drying of the granules. The invention also includes the provision of a polyamide molding compound FM containing the polyamide X, and at least one filler and/or at least one additive and/or at least one polyamide Y different from polyamide X. In a preferred embodiment, the polyamide molding compound FM contains the following components, preferably consists of the following components: 20 to 99.99% by weight of polyamide X 0 to 60% by weight of at least one filler T; 0.01 to 60% by weight of at least one additive S different from X and T; where the components S, T and X together make up 100% by weight.

[0013] In a particularly preferred embodiment of the invention, the polyamide molding compound FM contains the following components, preferably consists of the following components: 20 to 100% by weight of a polymer mixture P containing or preferably consisting of 10 to 90% by weight of polyamide X and 10 to 90% by weight of polyamide Y different from polyamide X, preferably selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6/12 or mixtures thereof, the sum of X and Y being 100% by weight of the polymer mixture P; 0 to 60% by weight of at least one filler T; 0 to 60% by weight of at least one additive S different from X, Y and T; where components P, S and T together make up 100% by weight.

[0014] The polymer mixture P particularly preferably consists exclusively of components X and Y. The polyamide Y is a polyamide which is free of polyamide units AB and EB, i.e. does not contain component B. Polyamide Y preferably contains at least one of the polyamide units AC, AD, EC, ED, F. In a preferred embodiment, the polyamide Y contains only polyamide units EC and/or F, i.e. it is an aliphatic polyamide. It is particularly preferred if the polyamide Y is selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6/12 or mixtures thereof. The polyamide molding compounds FM according to the present invention contain the components X and S or X, T and S or P or P and S or P, T and S or preferably consist exclusively of the components X and S or X, T, S or P or P and S or P, T and S, with the proviso that the components X, T, S or P, T, S add up to 100% by weight. The specified ranges of the amounts for the individual components X, T, S or P, T, S are to be understood in such a way that an arbitrary amount can be selected for each of the individual components within the specified ranges, provided that the strict proviso is met that the sum of all components X, T, S or P, T, S adds up to 100% by weight. The phosphorus content of the polymer mixture P is preferably in the range from 0.8 to 6.0% by weight, particularly preferably in the range from 1.2 to 4.5% by weight and especially preferably in the range from 1.5 to 3.5% by weight.

[0015] Component T is a filler which is contained in the polyamide molding compound FM in 0 to 70% by weight. The fillers can be present in both fibrous and particulate form, individually or in a mixture. Component T can therefore contain fibrous fillers (reinforcing agents) or particulate fillers or a mixture of reinforcing agents and particulate fillers. According to a preferred embodiment of the present invention, component T is contained in the polyamide molding compound FM in 10 to 60% by weight, more preferably in 20 to 55% by weight and particularly preferably in 25 to 50% by weight, with these amounts referring to the sum of components X, T, S or the sum of components P, T, S or the total weight of the polyamide molding compound FM. It is particularly preferred if component T consists exclusively of reinforcing agents selected from the group consisting of glass fibers, carbon fibers, boron fibers, aramid fibers, basalt fibers and mixtures thereof. According to a preferred embodiment of the polyamide molding compound according to the invention, component T is formed entirely from glass fibers. The glass fibers used have a cross-sectional area that is either circular (or synonymously round) or non-circular (or synonymously flat), in the latter case the dimensional ratio of the main cross-sectional axis to the secondary cross-sectional axis being at least 2, preferably in the range from 2 to 6. The reinforcement with glass fibers can be carried out with short fibers (e.g. chopped glass with a length of 2 to 50 mm) or continuous fibers (long glass or rovings). In a preferred embodiment, the glass fibers used according to the invention are short glass fibers with a diameter in the range from 6 to 20 µm and preferably from 9 to 12 µm. The glass fibers are in the form of chopped glass with a length of 2 to 50 mm. In particular, E and/or S glass fibers are used according to the invention. However, all other types of glass fibers, such as e.g. B. A, C, D, M, R glass fibers or any mixtures thereof or mixtures with E and/or S glass fibers can be used. The usual sizes for polyamide, such as various aminosilane sizes, are used, with high temperature stable sizes being preferred. For flat glass fibers, i.e. glass fibers with a non-circular cross-sectional area, those with a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis perpendicular to it of at least 2, preferably from 2.5 to 4.5, in particular from 3 to 4 are preferably used. These so-called flat glass fibers have an oval, elliptical, constricted elliptical (so-called cocoon fiber), polygonal, rectangular or almost rectangular cross-sectional area. Another characteristic feature of the flat glass fibers used is that the length of the main cross-sectional axis is preferably in the range from 6 to 40 µm, in particular in the range from 15 to 30 µm, and the length of the secondary cross-sectional axis is in the range from 3 to 20 µm, in particular in the range from 4 to 10 µm. Mixtures of glass fibers with circular and non-circular cross-sections can also be used to reinforce the molding compounds according to the invention, with the proportion of flat glass fibers preferably predominating, i.e. making up more than 50% by weight of the total mass of the fibers. The glass fibers can be provided with a size suitable for thermoplastics, in particular for polyamide, containing an adhesion promoter based on an amino or epoxy silane compound. The flat glass fibers of component T are, for example, preferably selected as E-glass fibers according to ASTM D578-00 with a non-circular cross-section, preferably with a composition of 52 to 62% silicon dioxide, 12 to 16% aluminum oxide, 16 to 25% calcium oxide, 0 to 10% borax, 0 to 5% magnesium oxide, 0 to 2% alkali oxides, 0 to 1.5% titanium dioxide and 0 to 0.3% iron oxide. The glass fibers of component (T) preferably have, as flat E-glass fibers, a density of 2.54 to 2.62 g/cm<3>, a tensile modulus of 70 to 75 GPa, a tensile strength of 3000 to 3500 MPa and an elongation at break of 4.5 to 4.8%, whereby the mechanical properties were determined on individual fibers with a diameter of 10 µm and a length of 12.7 mm at 23 °C and a relative humidity of 50%. Component T can also contain particulate fillers, optionally in surface-treated form, selected from the following group: kaolin, calcined kaolin, aluminum oxide, talc, talc, mica, silicate, quartz, wollastonite, amorphous silica, magnesium carbonate, magnesium hydroxide, chalk, lime, feldspar, solid or hollow glass spheres or ground glass, in particular ground glass fibers, and mixtures of the elements from this group. Microglass spheres with an average diameter in the range of 5 to 100 µm are particularly preferred as fillers, as these tend to give the molded part isotropic properties and thus allow the production of molded parts with low warpage. According to a preferred embodiment of the present invention, component T consists exclusively of a glass filler selected from the group consisting of glass fibers, ground glass fibers, glass particles, glass flakes, glass spheres, hollow glass spheres or combinations of the aforementioned. If glass spheres or glass particles are selected as component T, their average diameter is 0.3 to 100 µm, preferably 0.7 to 30 µm, particularly preferably 1 to 10 µm. Another preferred embodiment of the present invention provides that the type of glass of component T is selected from the group consisting of E-glass, ECR-glass, S-glass, A-glass, AR-glass and R-glass, in particular E- and S-glass, as well as mixtures of these types of glass. According to a preferred embodiment, component T is a high-strength glass fiber or so-called S-glass fiber. This is preferably based on the ternary system silicon dioxide-aluminum oxide-magnesia or on the quaternary system silicon dioxide-aluminum oxide-magnesia-calcium oxide, with a composition of 58 to 70 wt.% silicon dioxide (SiO2), 15 to 30 wt.% aluminum oxide (Al2O3), 5 to 15 wt.% magnesium oxide (MgO), 0 to 10 wt.% calcium oxide (CaO) and 0 to 2 wt.% other oxides, such as zirconium dioxide (ZrO2), boron oxide (B2O3), titanium dioxide (TiO2), iron oxide (Fe2O3), sodium oxide, potassium oxide or lithium oxide (Li2O) being preferred. It is particularly preferred if the high-strength glass fiber has the following composition: 62 to 66 wt.% silicon dioxide (SiO2), 22 to 27 wt.% aluminum oxide (Al2O3), 8 to 12 wt.% magnesium oxide (MgO), 0 to 5 wt.% calcium oxide (CaO), 0 to 1 wt.% other oxides, such as zirconium dioxide (ZrO2), boron oxide (B2O3), titanium dioxide (TiO2), iron oxide (Fe2O3), sodium oxide, potassium oxide and lithium oxide (Li2O).

[0016] The high-strength glass fibers (S-glass fibers) preferably have a tensile strength of at least 3700 MPa, preferably of at least 3800 or 4000 MPa, and/or an elongation at break of at least 4.8%, preferably of at least 4.9 or 5.0% and/or a tensile modulus of elasticity of more than 75 GPa, preferably of more than 78 or 80 GPa, these glass properties being determined on individual fibers (pristine single filaments) with a diameter of 10 µm and a length of 12.7 mm at a temperature of 23 °C and a relative humidity of 50%. The polyamide molding compound (FM) according to the invention contains 0 to 50% by weight of at least one additive as component S, which is different from components X, T and Y. According to a preferred embodiment, the polyamide molding compound (FM) according to the invention contains 0.01 to 50% by weight or 0.01 to 30% by weight and particularly preferably 0.02 to 20% by weight of at least one additive as component S, where these amounts relate to the sum of components X, T, S or the sum of components P, T, S or the total weight of the polyamide molding compound FM. According to a preferred embodiment, component S is selected from the group consisting of lubricants, heat stabilizers, processing stabilizers, processing aids, viscosity modifiers, oxidation retarders, agents against heat decomposition and decomposition by ultraviolet light, UV blockers, lubricants and mold release agents, colorants, in particular dyes, inorganic pigments, organic pigments, plasticizers, flame retardants, impact modifiers and mixtures thereof. To improve the flame retardant properties, the polyamide molding compounds FM can also contain flame retardants as additives, the flame retardant additives preferably being halogen-free. Preferred flame retardant additives are phosphinic acid salts and/or diphosphinic acid salts, which are preferably used together with a synergist, in particular a nitrogen-containing synergist and/or a nitrogen and phosphorus-containing flame retardant, preferably melamine or condensation products of melamine, as particularly preferably selected from the group: melem, melam, melon, reaction products of melamine with polyphosphoric acid, such as melamine polyphosphate, reaction products of condensation products of melamine with polyphosphoric acid or mixtures thereof. In a further embodiment, the synergist is preferably selected as an oxygen-, nitrogen- or sulfur-containing metal compound. Preferred metals are aluminum, calcium, magnesium, barium, sodium, potassium and zinc. Suitable compounds are selected from the group of oxides, hydroxides, carbonates, silicates, borates, phosphates, stannates, alkoxides, carboxylates and combinations or mixtures of these compounds, such as oxide-hydroxides or oxide-hydroxide-carbonates. Examples are magnesium oxide, calcium oxide, aluminum oxide, zinc oxide, barium carbonate, magnesium hydroxide, aluminum hydroxide, boehmite, pseudoboehmite, dihydrotalcite, hydrocalumite, calcium hydroxide, calcium hydroxylapatite, tin oxide hydrate, zinc hydroxide, zinc borate, zinc sulfide, zinc phosphate, sodium carbonate, calcium carbonate, calcium phosphate, magnesium carbonate, basic zinc silicate, zinc stannate. Systems such as calcium stearate, zinc stearate, magnesium stearate, barium stearate, potassium palmitate, magnesium behenate are also possible. Suitable phosphinic acids for the preparation of the phosphinic acid salts according to the invention are, for example, dimethylphosphinic acid, ethylmethylphosphinic acid, diethylphosphinic acid, methyl-n-propylphosphinic acid, methane-di(methylphosphinic acid), ethane-1,2-di(methylphosphinic acid), hexane-1,6-di(methylphosphinic acid), benzene-1,4-di(methylphosphinic acid), methylphenylphosphinic acid, diphenylphosphinic acid. The phosphinic acid salts can be prepared, for example, by reacting the phosphinic acids in aqueous solution with metal carbonates, metal hydroxides or metal oxides, whereby essentially monomeric, and depending on the reaction conditions possibly also polymeric, phosphinic acid salts are formed. The content of these halogen-free flame retardant additives in component S is preferably a maximum of 10% by weight, particularly preferably a maximum of 5% by weight, in each case based on the entire molding compound FM, and the molding compound FM is particularly preferably free of flame retardant additives S. According to a particularly preferred embodiment, the polyamide molding compound FM contains at least one lubricant as component S, which is preferably present in a proportion of 0 to 2% by weight, particularly preferably from 0.01 to 2.0% by weight, particularly preferably from 0.01 to 1.5% by weight and most preferably from 0.02 to 1.0% by weight, in each case based on the total weight of components X, T, S or P, T, S or the molding compound FM. Al, alkali metal, alkaline earth metal salts, esters or amides of fatty acids with 10 to 44 carbon atoms and preferably with 14 to 44 carbon atoms are preferred, with the metal ions Na, Mg, Ca and Al being preferred and Ca or Mg being particularly preferred. Particularly preferred metal salts are Ca stearate and Ca montanate as well as Al stearate. The fatty acids can be monovalent or divalent. Examples include pelargonic acid, palmitic acid, lauric acid, margaric acid, dodecanedioic acid, behenic acid and the particularly preferred stearic acid, capric acid and montanic acid (mixture of fatty acids with 30 to 40 carbon atoms). Alphatic alcohols, which can be monovalent to tetravalent, are also preferred as lubricants. These alcohols are preferably selected from the group consisting of n-butanol, n-octanol, stearyl alcohol, ethylene glycol, propylene glycol, neopentyl glycol, glycerin, pentaerythritol and mixtures thereof, with glycerin and pentaerythritol being preferred. Aliphatic amines, which can be monovalent to trivalent, are also preferred lubricants. Preferred amines are selected from the group consisting of stearylamine, ethylenediamine, propylenediamine, hexamethylenediamine, di(6-aminohexyl)amine and mixtures thereof, with ethylenediamine and hexamethylenediamine being particularly preferred. Preferred esters or amides of fatty acids are selected from the group consisting of glycerol distearate, glycerol tristearate, ethylenediamine distearate, glycerol monopalmitate, glycerol trilaurate, glycerol monobehenate, pentaerythritol tetrastearate and mixtures thereof. Furthermore, white oils or silicone oils can also be used alternatively or additionally. According to a further preferred embodiment, the polyamide molding compound FM contains at least one heat stabilizer as component S, which is preferably contained in a proportion of 0 to 3% by weight, particularly preferably 0.02 to 2.0% by weight, in each case based on the total weight of components X, T, S or P, T, S or of the molding compound FM.

[0017] According to a preferred embodiment, the heat stabilizers are selected from the group consisting of: • Compounds of monovalent or divalent copper, e.g. salts of monovalent or divalent copper with inorganic or organic acids or monovalent or divalent phenols, the oxides of monovalent or divalent copper, or the complex compounds of copper salts with ammonia, amines, amides, lactams, cyanides or phosphines, preferably Cu(I) or Cu(II) salts of hydrohalic acids, hydrocyanic acids or the copper salts of aliphatic carboxylic acids. Particularly preferred are the monovalent copper compounds CuCl, CuBr, CuI, CuCN and Cu2O, as well as the divalent copper compounds CuCl2, CuSO4, CuO, copper(II) acetate or copper(II) stearate. The copper compounds are advantageously used in combination with other metal halides, in particular alkali halides such as NaI, KI, NaBr, KBr, or ammonium halides, the molar ratio of metal halide to copper halide being 0.5 to 20, preferably 1 to 10 and particularly preferably 3 to 7. • Lanthanide compounds selected from the group consisting of acetates, fluorides, chlorides, bromides, iodides, oxide halides, sulfates, nitrates, phosphates, chromates, perchlorates, oxalates, the monochalcogenides of sulfur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulfonates, acetylacetonates, alcoholates, 2-ethylhexanoates of the lanthanides lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium as well as - hydrates of the salts mentioned as well as - mixtures of the compounds mentioned. Cerium or lanthanum compounds are particularly preferred, the use of lanthanum (III) hydroxide, lanthanum (III) oxide hydroxide and cerium tetrahydroxide is particularly preferred here. It is further preferred that the cation of the lanthanide compounds has an oxidation number of +III or +IV. The lanthanide compounds are preferably used in combination with alkali metal halides, alkaline earth metal halides and/or the above-mentioned copper compounds. • Stabilizers based on secondary aromatic amines, these stabilizers preferably being present in an amount of 0.2 to 2, preferably 0.2 to 1.5% by weight, • Stabilizers based on sterically hindered phenols, these stabilizers preferably being present in an amount of 0.1 to 1.5, preferably 0.2 to 1.0% by weight, and • Phosphites and phosphonites, and also • Mixtures of the above-mentioned stabilizers.

[0018] Particularly preferred examples of stabilizers based on secondary aromatic amines that can be used according to the invention are adducts of phenylenediamine with acetone (Naugard A), adducts of phenylenediamine with linolene, Naugard 445, N,N'-dinaphthyl-p-phenylenediamine, N-phenyl-N'-cyclohexyl-p-phenylenediamine or mixtures of two or more thereof. In principle, all compounds with a phenolic structure that have at least one sterically demanding group on the phenolic ring are suitable as sterically hindered phenols. Preferred examples of stabilizers based on sterically hindered phenols that can be used according to the invention are N,N'-hexamethylene-bis-3-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionamide, bis-(3,3-bis-(4'-hydroxy-3'-tert-butylphenyl)-butanoic acid) glycol ester, 2,1'-thioethylbis-(3-(3,5-di.tert-butyl-4-hydroxyphenyl)-propionate, 4-4'-butylidene-bis-(3-methyl-6-tert-butylphenol), triethylene glycol-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)-propionate or mixtures of two or more of these stabilizers. Preferred phosphites and phosphonites are triphenyl phosphite, diphenylalkyl phosphite, phenyldialkyl phosphite, Tris(nonylphenyl)phosphite, trilaurylphosphite, trioctadecylphosphite, distearylphentaerythritol diphosphite, tris(2,4-di-tert-butylphenyl)phosphite, diisodecylpentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methyl-phenyl)pentaerythritol diphosphite, diisodecyloxypentaerythritol diphosphite, bis(2,4-di-tert-butyl-6-methylphenyl)pentaerythritol diphosphite, bis(2,4,6-tris-(tert-butylphenyl))pentaerythritol diphosphite, tristearylsorbitol triphosphite, Tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylenediphosphonite, 6-isooctyloxy-2,4,8,10-tetra-tert-butyl-12H-dibenz-[d,g]-1,3,2-dioxaphosphocine, 6-fluoro-2,4,8,10-tetra-tert-butyl-12-methyl-dibenz[d,g]-1,3,2-dioxaphosphocine, bis(2,4-di-tert-butyl-6-methylphenyl)methylphosphite and bis(2,4-di-tert-butyl-6-methylphenyl)ethylphosphite. In particular, tris[2-tert-butyl-4-thio(2'-methyl-4'-hydroxy-5'-tert-butyl)-phenyl-5-methyl]phenyl phosphite and tris(2,4-di-tert-butylphenyl)phosphite (Irgafos 168) are preferred. A preferred embodiment of the heat stabilizer consists in the combination of organic heat stabilizers (in particular Irgafos 168 and Irganox 1010), a bisphenol A-based epoxy (in particular Epikote 1001) and a copper stabilization based on Cul and Kl. A commercially available stabilizer mixture consisting of organic stabilizers and epoxides is, for example, Irgatec NC66 or Recylobyk 4371. Heat stabilization based exclusively on Cul and Kl is particularly preferred. Examples of oxidation retarders and heat stabilizers include phosphites and other amines (e.g. TAD), hydroquinones, various substituted representatives of these groups and mixtures thereof in concentrations of up to 1% by weight, based on the total weight of components X, T, S or P, T, S or the molding compound FM. UV stabilizers that are generally used in amounts of up to 2% by weight, based on the weight of the polyamide molding compound FM, include various substituted resorcinols, salicylates, benzotriazoles and benzophenones. Inorganic pigments such as titanium dioxide, barium sulfate, zinc oxide, ultramarine blue, iron oxide and carbon black and/or graphite, as well as organic pigments such as phthalocyanines, quinacridones, perylenes and dyes such as nigrosine and anthraquinones can be added as colorants. Component S can also comprise impact modifiers, preferably these are selected from the group consisting of polyolefins, polyolefin copolymers, styrene copolymers, styrene block copolymers, ionic ethylene copolymers, which can be partially neutralized by metal ions, and mixtures thereof. The impact modifiers are preferably functionalized. Core-shell or core-shell(1)-shell(2) impact modifiers can also be used, which preferably have a hard core based on acrylates or methacrylates and a soft, rubbery shell. The polyamide molding compounds FM preferably contain 0 to 35% by weight, particularly preferably 5 to 20% by weight, of impact modifiers. According to a preferred embodiment of the present invention, the impact modifiers of component S are functionalized by copolymerization and/or by grafting. For this purpose, a compound selected from the group consisting of unsaturated carboxylic acids, unsaturated carboxylic acid derivatives and mixtures thereof and/or unsaturated glycidyl compounds is particularly preferably used. This is particularly preferably selected from the group consisting of unsaturated carboxylic acid esters, in particular acrylic acid esters and/or methacrylic acid esters, unsaturated carboxylic acid anhydrides, in particular maleic anhydride, glycidylacrylic acid, glycidylmethacrylic acid, α-ethylacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, aconitic acid, tetrahydrophthalic acid, butenylsuccinic acid and mixtures thereof. If the functionalization of the impact modifiers is carried out by copolymerization, the weight proportion of each individual compound used for functionalization is preferably in the range from 3 to 25 wt.%, particularly preferably from 4 to 20 wt.% and especially preferably from 4.5 to 15 wt.%, in each case based on the total weight of the functionalized impact modifiers S. If the functionalization of the impact modifiers is carried out by grafting, the weight proportion of each individual compound used for functionalization is preferably in the range from 0.3 to 2.5 wt.%, particularly preferably from 0.4 to 2.0 wt.% and especially preferably from 0.5 to 1.9 wt.%, in each case based on the total weight of the functionalized impact modifiers S. The impact modifiers preferably selected are polyolefins or polyolefin copolymers from the group consisting of polyethylene, polypropylene, polybutylene, ethylene-α-olefin copolymers, propylene-α-olefin copolymers, Ethylene-propylene copolymers, ethylene-propylene-diene copolymers and mixtures thereof, where the α-olefins preferably have 3 to 18 carbon atoms. The α-olefins are particularly preferably selected from the group consisting of propene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene and mixtures thereof. Among the ethylene-α-olefin copolymers, ethylene-propylene copolymers, ethylene-1-butene copolymers or ethylene-propylene-1-butene copolymers are preferred. The styrene copolymers are preferably styrene copolymers with a comonomer selected from the group consisting of butadiene, isoprene, acrylate and mixtures thereof. The styrene block copolymers are preferably selected from the group consisting of styrene-butadiene-styrene triblock copolymers (SBS), styrene-isoprene-styrene triblock copolymers (SIS), styrene-ethylene/butylene-styrene triblock copolymers (SEBS), styrene-ethylene/propylene-styrene triblock copolymers (SEPS) and mixtures thereof. The styrene-ethylene/butylene-styrene triblock copolymers are linear triblock copolymers made up of one ethylene/butylene block and two styrene blocks. The styrene-ethylene/propylene-styrene triblock copolymers are linear triblock copolymers made up of one ethylene/propylene block and two styrene blocks. The styrene content in the styrene-ethylene/butylene-styrene or styrene-ethylene/propylene-styrene triblock copolymers is preferably from 20 to 45% by weight, particularly preferably from 25 to 40% by weight and very particularly preferably from 25 to 35% by weight. The ionic ethylene copolymers preferably consist of the monomers selected from the group consisting of ethylene, propylene, butylene, acrylic acid, acrylate, methacrylic acid, methacrylate and mixtures thereof, the acid groups being partially neutralized with metal ions, particularly preferred are ethylene-methacrylic acid copolymers or ethylene-methacrylic acid-acrylate copolymers in which the acid groups are partially neutralized with metal ions. The metal ions used for neutralization are preferably sodium, zinc, potassium, lithium, magnesium ions and mixtures thereof, particularly preferred are sodium, zinc and magnesium ions. The present invention further comprises molded bodies produced from the polyamides X according to the invention or the polyamide molding compound FM or having at least one region or coating made of a polyamide X or of a polyamide molding compound FM, preferably produced by injection molding, injection blow molding, injection compression molding, pultrusion, melt spinning, extrusion or blow molding. These molded bodies are preferably selected from the group consisting of fibers, films, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies, spectacle parts, in particular privacy screens or window panes, housings or components for switches or fuses, sensor elements or sensor covers, components for the security sector or surveillance, camera components, such as lenses, housings or covers, spectacle frames, spectacle frames or spectacle temples, in particular for safety glasses, sports glasses or ski goggles, sports equipment, in particular ski boots, touring ski boots, snowboard boots or helmets, housings, housing parts, frames, protective housings, covers or cladding elements, in particular for electrical devices, electronic devices, electro-optical devices, electro-optical components, connectors, fans, in particular fan wheels, office automation devices, entertainment electronics, portable computers, in particular laptops, notebooks, netbooks and tablet PCs, game consoles, navigation devices, measuring devices, personal digital assistance devices, telecommunications devices, cameras, (wrist) watches, computers, electronic storage devices, Keyboards, music recorders, digital music players (e.g. CD and MP3 players), e-books, mobile phones, smartphones or drones, unpainted visible parts with or without function, in the vehicle interior or trunk, household, mechanical engineering, on electrical devices, electronic devices, household appliances, furniture, in particular fan blades, gear levers, rocker switches, buttons, rotary controls, handles, seat adjustment controls, steering column controls, control levers, controls, drawers, holders for additional devices, cup holders, luggage hooks, covers, light switches, razor heads, scissor parts, threaded rods, in particular for insulin pumps, housings and decorative elements, sanitary components, i.e. with contact with cold/warm/hot aqueous media or hot water or warm water, water meters, water meter housings, and water meter components, including bearings, propellers, pylons, pipes, lines, pipe connectors, fittings, in particular for drinking water applications, valves, fittings, household appliances, hot water heaters, rice cookers, steam cookers, steam irons, parts for tea and Coffee machines, molded bodies in contact with hot water in the water supply, such as hot water tanks in particular, and in heating and cooling systems, in particular oil, gas, wood and solar heating systems as well as heat pumps and room heaters, headlight housings, reflectors, cornering light adjustment, gears, plug connections, connectors. Finally, the invention also includes the use of a polyamide X according to one of claims 1 to 8, or of a polyamide molding compound FM according to one of claims 10 to 12, for producing the previously described molded bodies, in particular in the form of fibers, films, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies, and for coating molded bodies.

WAYS OF IMPLEMENTING THE INVENTION

Measurement methods:

Relative viscosity (solution viscosity ηrel)

[0019] The relative viscosity was determined according to ISO 307 (2007) at 20 °C. For this purpose, 0.5 g of polymer granules were dissolved in 100 ml of m-cresol; the calculation of the relative viscosity (RV) according to RV = t/t0 was carried out in accordance with section 11 of the standard.

Haze,Transparency

[0020] Transparency and haze were measured according to ASTM D1003-13 (2013) on a Haze Gard Plus measuring device from BYK Gardner using 2 mm thick plates (60 mm x 60 mm surface) with CIE illuminant C at 23 °C. An injection mold with a highly polished cavity surface was used to produce the plates (2 mm x 60 mm x 60 mm). The plates were used in the dry state, i.e. after injection molding they were stored for at least 48 hours at 23 °C in a dry environment, i.e. over silica gel.

Melting point (Tm) and enthalpy of fusion (ΔHm)

[0021] The melting point and enthalpy of fusion were determined on the granules according to ISO 11357-3 (2013). The DSC (Differential Scanning Calorimetry) measurements were carried out at a heating rate of 20 K/min.

Glass transition temperature Tg

[0022] The glass transition temperature Tg was determined according to ISO 11357-2 (2013) on granules using differential scanning calorimetry (DSC). This was carried out for each of the two heatings at a heating rate of 20 K/min. After the first heating, the sample was quenched in dry ice. The glass transition temperature (Tg) was determined during the second heating. The center of the glass transition range, which was specified as the glass transition temperature, was determined using the “half height” method.

Flame retardant classification

[0023] The flame retardancy classification is determined according to UL94 (“Tests for Flammability of Plastic Materials for Parts in Devices and Applications” by Underwriters Laboratories) on test specimens measuring 127 x 12.7 x 0.5 mm, which were previously conditioned for 48 hours in a standard climate at 23 °C and a relative humidity of 50%.

Examples PA-1 to PA-2

[0024] The diamine MACM (component A), the phosphorus-containing dicarboxylic acid (component B) and, in example PA-2, additionally aminododecanoic acid (component F) were introduced into a 2000 ml autoclave together with 20 percent by weight of water, based on the total batch, the individual amounts being chosen according to the composition given in Table 1 so that the total batch yielded approximately 1100 g. The batch was heated to a temperature of 240 °C while stirring and then held at this temperature for one hour in the pressure phase. The pressure was then released over a period of one hour and the temperature was increased to 270 °C. The polycondensate formed was then discharged from the autoclave through an opening and, after cooling in a water bath, granulated. The granules were then dried for 24 hours at 90 °C and a vacuum of 30 mbar.

Table 1. Composition and properties of polyamides PA-1 and PA-2

[0025] MACM (component A) mol-% 50 35 3,5-dicarboxyphenyldiphenylphosphine oxide (component B) mol-% 50 35 Aminododecanoic acid (component F) mol-% 0 30 Properties Relative viscosity (ηrel) - 1.80 1.73 Glass transition temperature* °C 185 162 Melting temperature* °C - - Melting enthalpy* J/g < 1 < 1 Haze % 1.5 2.0 Transmission % 93 93 Phosphorus content wt.% 5.45 4.45 Fire classification UL94 - V0 V0 Sample thickness: 0.5 mm Conditioning: 48 h, 23 °C, 50% r.h. * Values of the 2nd heating

Claims (15)

1. Polyamide X with the polyamide units AB/AC/AD/EB/EC/ED/F, where at least the polyamide units AB must be present, the polyamide units AC, AD, EB, EC, ED and F are optional and where the monomer units A, B, C, D, E and F are derived from the following molecules which are present in an amide-bound form in the polyamide X: A: Cycloaliphatic diamines; B: Phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1 - C8 alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; C: Aliphatic dicarboxylic acids; D: Aromatic phosphorus-free dicarboxylic acids; E: Acyclic aliphatic diamines; F: α,ω-aminocarboxylic acids, lactams; wherein the polyamide X has a transparency of at least 85% and a haze of not more than 7%, determined according to the ASTM D1003:2013 method using the CIE-C illuminant on a plate with a thickness of 2 mm. 2. Polyamide X according to claim 1, characterized in that the content of the polyamide units AB or the sum of the contents of the polyamide units AB and EB is 1 to 100 mol-%, preferably 10 to 90 mol-% and particularly preferably 20 to 80 mol-%, in each case based on the polyamide X with the polyamide units AB/AC/AD/EB/EC/ED/F. 3. Polyamide X according to one of the preceding claims, characterized in that at least one of the following selection groups is selected for components A to F, preferably the selection groups are selected for components A and B, particularly preferably the selection groups are selected for components A, B, C and D and particularly preferably all selection groups are selected simultaneously: A: the cycloaliphatic diamines are selected from the group consisting of bis-(4-amino-3-methylcyclohexyl)methane, bis(4-aminocyclohexyl)methane, bis(4-amino-3,5-dimethylcyclohexyl)methane and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphospine oxide, 3,5-dicarboxyphenyldimethylphospine oxide, 3,5-dicarboxyphenyldiethylphospine oxide, 2,4-dicarboxyphenyldiphenylphospine oxide, 2,4-dicarboxyphenyldimethylphospine oxide, 2,4-dicarboxyphenyldiethylphospine oxide, preferably 3,5-dicarboxyphenyldiphenylphospine oxide, 3,5-dicarboxyphenyldimethylphospine oxide or 3,5-dicarboxyphenyldiethylphospine oxide, particularly preferably 3,5-dicarboxyphenyldiphenylphospine oxide is selected; C: the aliphatic dicarboxylic acids are selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid and mixtures thereof;. D: the aromatic phosphorus-free dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably mixtures of terephthalic acid and isophthalic acid are selected; E: the acyclic aliphatic diamines are selected from the group consisting of 1,6-hexanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, preferably selected as 1,6-hexanediamine or 1,10-decanediamine; F: the α,ω-aminocarboxylic acids or the lactams F are selected from the group consisting of α,ω-aminoundecanoic acid, caprolactam, laurolactam and mixtures thereof. 4. Polyamide X according to one of the preceding claims, characterized in that the polyamide X comprises at least the polyamide units AB and AC; or comprises at least the polyamide units AB and AD; or comprises at least the polyamide units AB, AC and AD. 5. Polyamide X according to one of the preceding claims, characterized in that the polyamide units AC are selected from the group consisting of the polyamide units MACM10, MACM12, MACM14, MACM16, MACM18, PACM10, PACM12, PACM14, PACM16, PACM18, TMDC10, TMDC12, TMDC14, TMDC16 and TMDC18; and/or the polyamide units AD are selected from the group consisting of the polyamide units MACMI, MACMT, PACMI, PACMT, TMDCI and TMDCT. 6. Polyamide X according to one of the preceding claims, characterized in that the polyamide comprises at least the polyamide units AB and AC and/or AD, wherein the content of the polyamide units AB is 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 20 to 80 mol% and wherein the content of the polyamide units AC and/or AD or the sum of AC and AD is 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 20 to 80 mol%, in each case based on the sum of the polyamide units AB, AC and AD. 7. Polyamide X according to one of the preceding claims, characterized in that the polyamide X consists exclusively of the polyamide units AB or AB and F; or of the polyamide units AB and AC or AB, AC and F; or of the polyamide units AB, AC and AD or AB, AC, AD and F. 8. Polyamide X according to one of the preceding claims, characterized in that the polyamide X has a transparency of at least 90%, particularly preferably at least 92% and a haze of a maximum of 5%, particularly preferably a maximum of 3%, each determined according to the ASTM D1003:2013 method with the CIE-C light type using a plate with a thickness of 2 mm; and/or the polyamide X has a solution viscosity ηrel, determined using a solution of 0.5 g of polymer granulate in 100 ml of m-cresol at 20 °C according to ISO 307:2007, in the range from 1.4 to 2.5, preferably in the range from 1.4 to 2.0, in particular in the range from 1.45 to 1.85; and/or the polyamide X has a flame retardancy classification V0, determined according to UL94 on test specimens measuring 127 × 12.7 × 0.35 mm, 127 × 12.7 × 0.5 mm, 127 × 12.7 × 0.75 mm, 127 × 12.7 × 1.5 mm and 127 × 12.7 × 3.0 mm, which were previously conditioned for 48 hours in a standard climate at 23 °C and a relative humidity of 50% or stored for 7 days at 70 °C in a convection oven. 9. Process for producing a polyamide X according to one of claims 1 to 8, characterized in that the process comprises a polycondensation reaction between at least one phosphorus-containing, aromatic dicarboxylic acid B according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1 - C8 alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; and at least one cycloaliphatic diamine A; and optionally further monomers C, D, E and F, optionally in the presence of monofunctional regulators G and/or process auxiliaries. 10. Polyamide molding compound FM containing the polyamide X according to one of claims 1 to 8, and at least one filler and/or at least one additive and/or a polyamide Y different from the polyamide X. 11. Polyamide molding compound FM according to claim 10, characterized in that it contains the following components, preferably consists of the following components: 20 to 99.99% by weight of polyamide X 0 to 60% by weight of at least one filler T; 0.01 to 60% by weight of at least one additive S different from X and T; wherein the components S, T and X together make up 100% by weight. 12. Polyamide molding compound FM according to claim 10, characterized in that the polyamide molding compound FM contains the following components, preferably consists of the following components: 20 to 100% by weight of a polymer mixture P containing or preferably consisting of 10 to 90% by weight of polyamide X and 10 to 90% by weight of polyamide Y different from polyamide X, preferably selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6/12 or mixtures thereof, where the sum of X and Y is 100% by weight of the polymer mixture P; 0 to 50% by weight of at least one filler T; 0 to 50% by weight of at least one additive S other than X, Y and T; wherein the components P, S and T together make up 100% by weight. 13. A molded body made from a polyamide X according to one of claims 1 to 8, or from a polyamide molding compound FM according to one of claims 10 to 12 or having at least one region made from a polyamide X according to one of claims 1 to 8, or from a polyamide molding compound FM according to one of claims 10 to 12, preferably produced by injection molding, injection blow molding, injection compression molding, pultrusion, melt spinning, extrusion or blow molding. 14. Shaped body according to claim 13, characterized in that the shaped body is selected from the group consisting of fibers, films, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies, spectacle parts, in particular privacy screens or window panes, housings or components for switches or fuses, sensor elements or sensor covers, components for the security sector or surveillance, camera components, such as lenses, housings or covers, spectacle frames, spectacle frames or spectacle temples, in particular for safety glasses, sports glasses or ski goggles, sports equipment, in particular ski boots, touring ski boots, snowboard boots or helmets, housings, housing parts, frames, protective housings, covers or cladding elements, in particular for electrical devices, electronic devices, electro-optical devices, electro-optical components, connectors, fans, in particular fan wheels, office automation devices, entertainment electronics, portable computers, in particular laptops, notebooks, netbooks and tablet PCs, game consoles, navigation devices, measuring devices, personal digital assistance devices, telecommunications devices, cameras, Clocks, wristwatches, computers, electronic storage devices, keyboards, music recorders, digital music players, e.g. CD and MP3 players, e-books, mobile phones, smartphones or drones, unpainted visible parts with or without function, in the vehicle interior or trunk, household, mechanical engineering, on electrical devices, electronic devices, household appliances, furniture, in particular fan blades, gear levers, shift paddles, buttons, rotary controls, handles, seat adjustment controls, controls on the steering column, control levers, controls, drawers, holders for additional devices, cup holders, luggage hooks, covers, light switches, razor heads, scissor parts, threaded rods, in particular for insulin pumps, housings and decorative elements, sanitary components, i.e. with contact with cold/warm/hot aqueous media or hot water or warm water, water meters, water meter housings, and water meter components, including bearings, propellers, pylons, pipes, lines, pipe connectors, fittings, in particular for drinking water applications, Valves, fittings, household appliances, hot water heaters, rice cookers, steam cookers, steam irons, parts for tea and coffee machines, molded bodies in contact with hot water in the water supply, such as hot water tanks in particular, and in heating and cooling systems, in particular oil, gas, wood and solar heating systems as well as heat pumps and room heaters, headlight housings, reflectors, cornering light adjustment, gears, plug connections, connectors. 15. Use of a polyamide X according to one of claims 1 to 8, or of a polyamide molding compound FM according to one of claims 10 to 12, for producing molded articles according to claim 14, in particular fibers, films, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies.