CA2558898C - Laser assisted machining process with distributed lasers - Google Patents
Laser assisted machining process with distributed lasers Download PDFInfo
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- CA2558898C CA2558898C CA2558898A CA2558898A CA2558898C CA 2558898 C CA2558898 C CA 2558898C CA 2558898 A CA2558898 A CA 2558898A CA 2558898 A CA2558898 A CA 2558898A CA 2558898 C CA2558898 C CA 2558898C
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- laser
- cutting tool
- workpiece
- turning process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
- B23P25/003—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress immediately preceding a cutting tool
- B23P25/006—Heating the workpiece by laser during machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.
Description
LASER ASSISTED MACHINING PROCESS WITH DISTRIBUTED LASERS
TECHNICAL FIELD OF THE INVENTION
The present invention relates generally to laser assisted machining and, more particularly, to systems and processes that utilize multiple laser units to assist in machining a turning workpiece.
BACKGROUND OF THE INVENTION
Laser assisted machining is based upon the idea that the strength of materials generally decreases at elevated temperatures, and has been in use since the late 1970s when lasers became a viable heat source capable of producing intense heat in a very precise region. Laser assisted machining typically involves using a high power laser as a heat source to soften workpiece material ahead of a cutting tool in a lathe or milling machine, for example, to facilitate material removal and prolong tool life.
FIG. 1 is a diagram of a typical laser assisted turning operation 10 utilizing a laser unit 12 to soften a workpiece 14 with a single laser spot 16 that locally elevates the temperature of the material before it is removed with a conventional cutting tool 18.
Due to inefficiencies associated with laser-metal interactions and high initial startup costs, economic justification for laser assisted machining of metals was not achieved, and interest in laser assisted machining was diverted to other areas of research.
However, continued improvements in lasers, such as higher power Nd:Yag lasers and solid state diode lasers, have provided potential for improvements in laser assisted machining of metals. The present invention involves the use of multiple distributed =
=
Attorney Docket No 13054-242A I
lasers to assist in the machining of materials, such as ceramics, high temperature alloys, and composites, for example, which are typically difficult to machine.
TECHNICAL FIELD OF THE INVENTION
The present invention relates generally to laser assisted machining and, more particularly, to systems and processes that utilize multiple laser units to assist in machining a turning workpiece.
BACKGROUND OF THE INVENTION
Laser assisted machining is based upon the idea that the strength of materials generally decreases at elevated temperatures, and has been in use since the late 1970s when lasers became a viable heat source capable of producing intense heat in a very precise region. Laser assisted machining typically involves using a high power laser as a heat source to soften workpiece material ahead of a cutting tool in a lathe or milling machine, for example, to facilitate material removal and prolong tool life.
FIG. 1 is a diagram of a typical laser assisted turning operation 10 utilizing a laser unit 12 to soften a workpiece 14 with a single laser spot 16 that locally elevates the temperature of the material before it is removed with a conventional cutting tool 18.
Due to inefficiencies associated with laser-metal interactions and high initial startup costs, economic justification for laser assisted machining of metals was not achieved, and interest in laser assisted machining was diverted to other areas of research.
However, continued improvements in lasers, such as higher power Nd:Yag lasers and solid state diode lasers, have provided potential for improvements in laser assisted machining of metals. The present invention involves the use of multiple distributed =
=
Attorney Docket No 13054-242A I
lasers to assist in the machining of materials, such as ceramics, high temperature alloys, and composites, for example, which are typically difficult to machine.
SUMMARY OF THE INVENTION
According to an aspect of the present invention, there is provided a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising: cutting material from the rotating workpiece with the cutting tool, thereby creating a circumferential chamfer on the rotating workpiece;
providing a first laser unit with independent operational control; providing a second laser unit with independent operational control; sequentially, incrementally heating a small radially outer portion of the rotating workpiece with said first and second laser units prior to the cutting tool beginning to remove the small portion, the small portion including part of the chamfer surface, said sequential, incremental heating including preheating the small portion by directing the first laser beam onto its radially outermost surface when its circumferential position about the rotational axis of the rotating workpiece is substantially ahead of that of the cutting tool, and then further heating the small portion by directing the second laser beam onto its chamfer surface at a high angle thereto when its circumferential position is in close proximity to that of the cutting tool; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units.
According to another aspect of the present invention, there is provided a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising: heating the rotating workpiece with a first laser unit by directing a first laser beam onto the workpiece at a first point axially ahead of the cutting tool relative to the travel direction thereof, and substantially circumferentially ahead of the cutting tool; heating the rotating workpiece with a second laser unit by directing a second laser beam onto the workpiece at a second point axially even with the cutting tool and on a chamfer of the workpiece, and circumferentially ahead of the cutting tool and substantially behind said first point;
independently controlling power output of each of the laser units to control temperature gradients within the workpiece; and cutting heated material from the rotating workpiece with the cutting tool.
According to an aspect of the present invention, there is provided a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising: cutting material from the rotating workpiece with the cutting tool, thereby creating a circumferential chamfer on the rotating workpiece;
providing a first laser unit with independent operational control; providing a second laser unit with independent operational control; sequentially, incrementally heating a small radially outer portion of the rotating workpiece with said first and second laser units prior to the cutting tool beginning to remove the small portion, the small portion including part of the chamfer surface, said sequential, incremental heating including preheating the small portion by directing the first laser beam onto its radially outermost surface when its circumferential position about the rotational axis of the rotating workpiece is substantially ahead of that of the cutting tool, and then further heating the small portion by directing the second laser beam onto its chamfer surface at a high angle thereto when its circumferential position is in close proximity to that of the cutting tool; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units.
According to another aspect of the present invention, there is provided a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising: heating the rotating workpiece with a first laser unit by directing a first laser beam onto the workpiece at a first point axially ahead of the cutting tool relative to the travel direction thereof, and substantially circumferentially ahead of the cutting tool; heating the rotating workpiece with a second laser unit by directing a second laser beam onto the workpiece at a second point axially even with the cutting tool and on a chamfer of the workpiece, and circumferentially ahead of the cutting tool and substantially behind said first point;
independently controlling power output of each of the laser units to control temperature gradients within the workpiece; and cutting heated material from the rotating workpiece with the cutting tool.
According to another aspect of the present invention, there is provided a laser assisted machining apparatus, comprising: a lathe having a workpiece holder that spins about a rotational axis and a cutting tool holder that moves along a path parallel to said rotational axis of said workpiece holder; a first laser unit connected to said cutting tool holder so as to emit a first laser beam impinging upon a workpiece in said workpiece holder at a circumferential position about said rotational axis that is substantially ahead of that of a cutting tool in said tool holder; a second laser unit connected to said cutting tool holder so as to emit a second laser beam impinging upon the workpiece from an axial position behind the cutting tool relative to its travel direction along said path, and at a circumferential position close to and ahead of that of the cutting tool and substantially behind that of the first laser beam on the workpiece; and control means for independently controlling output of each of said first and second laser units.
According to another aspect of the present invention, there is provided a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising: cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece;
providing a first laser unit with independent operational control; heating the workpiece with said first laser unit at a first point circumferentially ahead of the cutting tool;
providing a second laser unit with independent operational control; heating said chamfer with said second laser unit at a second point, circumferentially behind said first point and ahead of the cutting tool, thereby sequentially incrementally heating the rotating workpiece; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units, wherein said first laser unit comprises a higher-power laser than said second laser unit.
Another aspect includes a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece. The process involves cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece. A first laser unit is provided with independent operational control that heats the workpiece at a first point substantially 3a = 79797-10 circumferentially ahead of the cutting tool. A second laser unit is provided with independent operational control that heats the chamfer at a second point circumferentially behind said first point and ahead of the cutting tool, sequentially incrementally heating the rotating workpiece. Temperature gradients within the workpiece are controlled with the independent operational controls of the laser units.
Another aspect of the present invention involves a laser assisted machining apparatus. The apparatus includes a lathe having a workpiece holder that rotates about an axis and a cutting tool holder that moves along a path parallel to the rotational axis of said workpiece holder. First and second laser units are connected to said cutting tool holder and are controlled by a control means for independently controlling output of each of the laser units.
The objects and advantages of the present invention will be more apparent upon reading the following detailed description in conjunction with the accompanying drawings.
3b Attorney Docket No 13054-242A1 BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagram of a typical prior art laser assisted turning operation.
FIG. 2 is a diagram of a laser assisted turning process utilizing multiple distributed lasers according to one embodiment of the present invention.
FIG. 3 shows a lathe with multiple distributed lasers for performing laser assisted turning operations according to another embodiment of the present invention.
According to another aspect of the present invention, there is provided a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising: cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece;
providing a first laser unit with independent operational control; heating the workpiece with said first laser unit at a first point circumferentially ahead of the cutting tool;
providing a second laser unit with independent operational control; heating said chamfer with said second laser unit at a second point, circumferentially behind said first point and ahead of the cutting tool, thereby sequentially incrementally heating the rotating workpiece; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units, wherein said first laser unit comprises a higher-power laser than said second laser unit.
Another aspect includes a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece. The process involves cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece. A first laser unit is provided with independent operational control that heats the workpiece at a first point substantially 3a = 79797-10 circumferentially ahead of the cutting tool. A second laser unit is provided with independent operational control that heats the chamfer at a second point circumferentially behind said first point and ahead of the cutting tool, sequentially incrementally heating the rotating workpiece. Temperature gradients within the workpiece are controlled with the independent operational controls of the laser units.
Another aspect of the present invention involves a laser assisted machining apparatus. The apparatus includes a lathe having a workpiece holder that rotates about an axis and a cutting tool holder that moves along a path parallel to the rotational axis of said workpiece holder. First and second laser units are connected to said cutting tool holder and are controlled by a control means for independently controlling output of each of the laser units.
The objects and advantages of the present invention will be more apparent upon reading the following detailed description in conjunction with the accompanying drawings.
3b Attorney Docket No 13054-242A1 BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagram of a typical prior art laser assisted turning operation.
FIG. 2 is a diagram of a laser assisted turning process utilizing multiple distributed lasers according to one embodiment of the present invention.
FIG. 3 shows a lathe with multiple distributed lasers for performing laser assisted turning operations according to another embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated device and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates.
One aspect of the present invention involves a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a workpiece. FIG. 2 shows that laser units 20 and 22 are strategically positioned around workpiece 24 so that a desired temperature distribution that assists in the removal of material can be created within the workpiece. Laser beam 26 provided by laser unit 22 heats the chamfer 28 of the workpiece prior to cutting tool 30 removing material, while laser beam 32 provided by laser unit 20 heats the workpiece surface ahead of laser beam 26.
The multiple laser beams 26 and 32 provide sequential incremental heating from different directions and positions such that only the material zone to be removed reaches the temperature conducive to machining, while the remaining bulk material is relatively unaffected. Furthermore, sequential heating can generate surface treatment effects, which can improve absorptivity for the following laser beams, thereby significantly improving energy efficiency for the laser assisted machining of materials with high reflectivity such as metals.
Another aspect of the present invention involves a lathe with multiple distributed lasers for performing laser assisted turning operations. One embodiment of the lathe, used in turning austenitic stainless steel P550, is shown in FIG. 3. The lathe shown, 34, is a 60 hp Jones and Lambson turret lathe equipped with a NUM 1060 controller.
The two laser units shown, 38 and 36, are a 500 W Nd:Yag laser and a 1.5 kW CO2 laser, respectively.
Laser units 36 and 38 in the embodiment shown are connected to the cutting tool holder 40 of the lathe 34 so that they jointly translate with the cutting tool (not shown) as Attorney Docket No. 13054-242A1 the cutting tool holder 40 moves along a path parallel to the rotational axis of the workpiece holder 42. Laser unit 38 is positioned about 10-13 degrees circumferentially ahead of the cutting tool, and laser unit 36 is positioned about 55 degrees circumferentially ahead of the cutting tool. Utilizing two independently controlled laser units allows more precise control over temperature gradients within the workpiece 44, avoids undesirable subsurface thermal damage, prevents microstructural change in the workpiece, and improves overall energy efficiency of the laser assisted machining process.
Laser assisted turning operations using the embodiment of the lathe shown in FIG. 3 resulted in a decrease in the overall time required to machine an austenitic stainless steel P550 workpiece 44 by 20-50% when compared with both carbide and conventional ceramic machining due to the higher machining speeds and longer tool life.
The shorter machining times resulted in an estimated economic savings of 20-50%, when taking into account additional costs associated with operating and maintaining the laser units.
While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiment has been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected.
For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated device and such further applications of the principles of the invention as illustrated therein being contemplated as would normally occur to one skilled in the art to which the invention relates.
One aspect of the present invention involves a turning process utilizing multiple distributed lasers to assist a cutting tool in machining a workpiece. FIG. 2 shows that laser units 20 and 22 are strategically positioned around workpiece 24 so that a desired temperature distribution that assists in the removal of material can be created within the workpiece. Laser beam 26 provided by laser unit 22 heats the chamfer 28 of the workpiece prior to cutting tool 30 removing material, while laser beam 32 provided by laser unit 20 heats the workpiece surface ahead of laser beam 26.
The multiple laser beams 26 and 32 provide sequential incremental heating from different directions and positions such that only the material zone to be removed reaches the temperature conducive to machining, while the remaining bulk material is relatively unaffected. Furthermore, sequential heating can generate surface treatment effects, which can improve absorptivity for the following laser beams, thereby significantly improving energy efficiency for the laser assisted machining of materials with high reflectivity such as metals.
Another aspect of the present invention involves a lathe with multiple distributed lasers for performing laser assisted turning operations. One embodiment of the lathe, used in turning austenitic stainless steel P550, is shown in FIG. 3. The lathe shown, 34, is a 60 hp Jones and Lambson turret lathe equipped with a NUM 1060 controller.
The two laser units shown, 38 and 36, are a 500 W Nd:Yag laser and a 1.5 kW CO2 laser, respectively.
Laser units 36 and 38 in the embodiment shown are connected to the cutting tool holder 40 of the lathe 34 so that they jointly translate with the cutting tool (not shown) as Attorney Docket No. 13054-242A1 the cutting tool holder 40 moves along a path parallel to the rotational axis of the workpiece holder 42. Laser unit 38 is positioned about 10-13 degrees circumferentially ahead of the cutting tool, and laser unit 36 is positioned about 55 degrees circumferentially ahead of the cutting tool. Utilizing two independently controlled laser units allows more precise control over temperature gradients within the workpiece 44, avoids undesirable subsurface thermal damage, prevents microstructural change in the workpiece, and improves overall energy efficiency of the laser assisted machining process.
Laser assisted turning operations using the embodiment of the lathe shown in FIG. 3 resulted in a decrease in the overall time required to machine an austenitic stainless steel P550 workpiece 44 by 20-50% when compared with both carbide and conventional ceramic machining due to the higher machining speeds and longer tool life.
The shorter machining times resulted in an estimated economic savings of 20-50%, when taking into account additional costs associated with operating and maintaining the laser units.
While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiment has been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected.
Claims (18)
1. A turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising:
cutting material from the rotating workpiece with the cutting tool, thereby creating a circumferential chamfer on the rotating workpiece;
providing a first laser unit with independent operational control;
providing a second laser unit with independent operational control;
sequentially, incrementally heating a small radially outer portion of the rotating workpiece with said first and second laser units prior to the cutting tool beginning to remove the small portion, the small portion including part of the chamfer surface, said sequential, incremental heating including preheating the small portion by directing the first laser beam onto its radially outermost surface when its circumferential position about the rotational axis of the rotating workpiece is substantially ahead of that of the cutting tool, and then further heating the small portion by directing the second laser beam onto its chamfer surface at a high angle thereto when its circumferential position is in close proximity to that of the cutting tool; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units.
cutting material from the rotating workpiece with the cutting tool, thereby creating a circumferential chamfer on the rotating workpiece;
providing a first laser unit with independent operational control;
providing a second laser unit with independent operational control;
sequentially, incrementally heating a small radially outer portion of the rotating workpiece with said first and second laser units prior to the cutting tool beginning to remove the small portion, the small portion including part of the chamfer surface, said sequential, incremental heating including preheating the small portion by directing the first laser beam onto its radially outermost surface when its circumferential position about the rotational axis of the rotating workpiece is substantially ahead of that of the cutting tool, and then further heating the small portion by directing the second laser beam onto its chamfer surface at a high angle thereto when its circumferential position is in close proximity to that of the cutting tool; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units.
2. The turning process of claim 1, wherein said circumferential position in close proximity to the cutting tool is from about 10 to about 13 degrees circumferentially ahead of the cutting tool.
3. The turning process of claim 2, wherein said circumferential position substantially ahead of the cutting tool is about 55 degrees circumferentially ahead of the cutting tool.
4. The turning process of any one of claims 1 to 3, wherein said first and second laser units provide sequential incremental heating of the small radially outer portion of the rotating workpiece from different directions.
5. The turning process of any one of claims 1 to 4, wherein said second laser unit comprises a solid-state laser and said first laser unit comprises a gas laser.
6. The turning process of claim 5, wherein said solid-state laser comprises a Yag laser and said gas laser comprises a CO2 laser.
7. The turning process of claim 6, wherein said Yag laser comprises a Nd:Yag laser.
8. The turning process of any one of claims 1 to 7, wherein said second laser unit comprises a laser with power output on the order of 500 W.
9. The turning process of any one of claims 1 to 8, wherein said first laser unit comprises a laser with power output on the order of 1.5 kW.
10. A turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising:
heating the rotating workpiece with a first laser unit by directing a first laser beam onto the workpiece at a first point axially ahead of the cutting tool relative to the travel direction thereof, and substantially circumferentially ahead of the cutting tool;
heating the rotating workpiece with a second laser unit by directing a second laser beam onto the workpiece at a second point axially even with the cutting tool and on a chamfer of the workpiece, and circumferentially ahead of the cutting tool and substantially behind said first point;
independently controlling power output of each of the laser units to control temperature gradients within the workpiece; and cutting heated material from the rotating workpiece with the cutting tool.
heating the rotating workpiece with a first laser unit by directing a first laser beam onto the workpiece at a first point axially ahead of the cutting tool relative to the travel direction thereof, and substantially circumferentially ahead of the cutting tool;
heating the rotating workpiece with a second laser unit by directing a second laser beam onto the workpiece at a second point axially even with the cutting tool and on a chamfer of the workpiece, and circumferentially ahead of the cutting tool and substantially behind said first point;
independently controlling power output of each of the laser units to control temperature gradients within the workpiece; and cutting heated material from the rotating workpiece with the cutting tool.
11. The turning process of claim 10, wherein said second point is from about 10 to about 13 degrees circumferentially ahead of the cutting tool.
12. The turning process of claim 10, wherein said first point is about 55 degrees circumferentially ahead of the cutting tool.
13. The turning process of claim 10, wherein the second beam impinges substantially perpendicularly upon said chamfer.
14. A turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising:
cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece;
providing a first laser unit with independent operational control;
heating the workpiece with said first laser unit at a first point circumferentially ahead of the cutting tool;
providing a second laser unit with independent operational control;
heating said chamfer with said second laser unit at a second point, circumferentially behind said first point and ahead of the cutting tool, thereby sequentially incrementally heating the rotating workpiece; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units, wherein said first laser unit comprises a higher-power laser than said second laser unit.
cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece;
providing a first laser unit with independent operational control;
heating the workpiece with said first laser unit at a first point circumferentially ahead of the cutting tool;
providing a second laser unit with independent operational control;
heating said chamfer with said second laser unit at a second point, circumferentially behind said first point and ahead of the cutting tool, thereby sequentially incrementally heating the rotating workpiece; and controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units, wherein said first laser unit comprises a higher-power laser than said second laser unit.
15. The turning process of claim 14, wherein said first point has a first circumferential position about a rotational axis of the rotating workpiece, said first circumferential position being at least 45 degrees ahead of that of the cutting tool.
16. The turning process of claim 14, wherein said second point has a second circumferential position about a rotational axis of the rotating workpiece, said second circumferential position being less than 15 degrees ahead of that of the cutting tool.
17. The turning process of claim 14, wherein said heating of said chamfer includes directing a beam from said second laser unit onto said chamfer at a high angle thereto.
18. The turning process of claim 17, wherein said beam impinges substantially perpendicularly upon said chamfer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71479905P | 2005-09-07 | 2005-09-07 | |
| US60/714,799 | 2005-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2558898A1 CA2558898A1 (en) | 2007-03-07 |
| CA2558898C true CA2558898C (en) | 2013-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2558898A Expired - Fee Related CA2558898C (en) | 2005-09-07 | 2006-09-07 | Laser assisted machining process with distributed lasers |
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|---|---|
| US (2) | US8053705B2 (en) |
| CA (1) | CA2558898C (en) |
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| US20120024827A1 (en) | 2012-02-02 |
| US20070062920A1 (en) | 2007-03-22 |
| CA2558898A1 (en) | 2007-03-07 |
| US8698041B2 (en) | 2014-04-15 |
| US8053705B2 (en) | 2011-11-08 |
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