CA1140317A - Apparatus for making electrical circuit components - Google Patents
Apparatus for making electrical circuit componentsInfo
- Publication number
- CA1140317A CA1140317A CA000346887A CA346887A CA1140317A CA 1140317 A CA1140317 A CA 1140317A CA 000346887 A CA000346887 A CA 000346887A CA 346887 A CA346887 A CA 346887A CA 1140317 A CA1140317 A CA 1140317A
- Authority
- CA
- Canada
- Prior art keywords
- carrier tape
- transferring
- chip components
- recesses
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004080 punching Methods 0.000 claims description 10
- 238000005304 joining Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 4
- 108020003175 receptors Proteins 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000000151 deposition Methods 0.000 description 3
- 101800001109 Assemblin Proteins 0.000 description 2
- 102000004338 Transferrin Human genes 0.000 description 2
- 108090000901 Transferrin Proteins 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000012581 transferrin Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 102100034742 Rotatin Human genes 0.000 description 1
- 101710200213 Rotatin Proteins 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/003—Placing of components on belts holding the terminals
- H05K13/0038—Placing of components on belts holding the terminals placing the components in a predetermined order
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Packages (AREA)
Abstract
Abstract of the Disclosure An assembly apparatus comprising a driving means for intermittently feeding a carrier tape with recesses formed at a uniform space interval, a plurality of transferring station units for transferring different kinds of electrical chip components from feeders into the recesses, and a control means for controlling assembling order and timings of the transferring operation by the transferring station units.
Description
conv Date ~arch 5 l ~V~ 7 ---- -SPECIFICATIO~
Title of the Invention __ ._ _ _ An apparatus for malcing electrical circuit components asserribly Back~round of the Invention ~ __ _ __ _ _ _ 1. Field of th_ Invention:
The present invention relates to an apparatus for nlaking electrical circuit components assembly, wherein the electrical components are in a carrying tape for supplying several different wireless electrical cornponents of small sizes (hereirafter referred to as chip components) to a mounting machine for depositing the chip components onto predetermined ~laces on an electrical circuit board.
Brief Description of the Draw ngs_ _ _ _ _ _ _ _ FIC.l is a perspective view showing a conventional bowl type work-feeder combined with a known in-line type work-feeder.
FOGs.2(a) and 2(b) are crcss-sectional views sche-matically showing portions of another type of conventional assembly machines of ma~azine type.
FIG.3 is a perspective view showing a part of still another type Or conventional assembly machines of carrier magazine type.
FIC.4 is a perspective view showing an assembly apparatus embodying the present invention.
FIG.5 is a perspective view of a carrier tape eMployed in the assembly apparatus in accordance with the present invention.
.... ~ , FlGs.~(a) and 6(b) ~re a fra~,n,entary sectlonal sid~
view and a front view of a principal portion of a feeding means to sequentially feed the carrier tape of FIG.5, respectively.
FIG.rl is a partially cutaway and sectional side view of a station unit for sequentially making punched holes or. the carrier tape of FIG.5.
FIG.8 is a partially sectional side view of a transfer-ring station unit for transferring chip components to the punched holes on the carrier tape of FIG.5.
FIG.9 is a simplified view schematically illustrating processing steps made on the carrier tape of FIG.5 by the assembly app2ratus embodying the present inventioo.
FIG.10 is a perspective view showing another example of a carrier ta~e used for assemblying the chip cornponents.
Title of the Invention __ ._ _ _ An apparatus for malcing electrical circuit components asserribly Back~round of the Invention ~ __ _ __ _ _ _ 1. Field of th_ Invention:
The present invention relates to an apparatus for nlaking electrical circuit components assembly, wherein the electrical components are in a carrying tape for supplying several different wireless electrical cornponents of small sizes (hereirafter referred to as chip components) to a mounting machine for depositing the chip components onto predetermined ~laces on an electrical circuit board.
Brief Description of the Draw ngs_ _ _ _ _ _ _ _ FIC.l is a perspective view showing a conventional bowl type work-feeder combined with a known in-line type work-feeder.
FOGs.2(a) and 2(b) are crcss-sectional views sche-matically showing portions of another type of conventional assembly machines of ma~azine type.
FIG.3 is a perspective view showing a part of still another type Or conventional assembly machines of carrier magazine type.
FIC.4 is a perspective view showing an assembly apparatus embodying the present invention.
FIG.5 is a perspective view of a carrier tape eMployed in the assembly apparatus in accordance with the present invention.
.... ~ , FlGs.~(a) and 6(b) ~re a fra~,n,entary sectlonal sid~
view and a front view of a principal portion of a feeding means to sequentially feed the carrier tape of FIG.5, respectively.
FIG.rl is a partially cutaway and sectional side view of a station unit for sequentially making punched holes or. the carrier tape of FIG.5.
FIG.8 is a partially sectional side view of a transfer-ring station unit for transferring chip components to the punched holes on the carrier tape of FIG.5.
FIG.9 is a simplified view schematically illustrating processing steps made on the carrier tape of FIG.5 by the assembly app2ratus embodying the present inventioo.
FIG.10 is a perspective view showing another example of a carrier ta~e used for assemblying the chip cornponents.
2. Prior Arts:
Conventionally, chip components 100 s~,own in FIG.l such as wireless resistor components and wireless layer-built capacitors are fed to an eleectrical circuit board(rlot shown) such as printed circuit boards by rneans of a known bowl type work-feeder 101 combined with a known in-line type ~ork-feeder 102. The chip cornponents are successively fed in a row by these feeders suitab].y fixed on a worktable (not shown).
FICs.2(a) and 2(b) are cross-sectional views schema-tically showing portions of another conventional assembly mâchille of magazine type. FIGs.~(a) and 2(b) correspond respectively to a feeding process for féeding chip components one by one insi~e a cylindrical colurnn 103 in a horizontal direction and in a vertical direction.
~ , . .
I
FIG.3 is a perspectivc vicw showing a part of still another conventional assernbly machine of` carricr magazine type.
FIG.3 corresponds to the case where a casing 104 is rnade of e.g. plastics and has encaved recesses 105. The recesses 105 are formed at an equal interval and used for carrying the chip com~onents therein.
The above three conventional methods have the following drawbacks. In the case of FIG.l, the bowl type and in-line type work-feeders 101 and 102 feed the chip ccmponents 100 lo by vibration, thereby resulting in shortcolr,ings that vibration adversely affects other portions of the assembly machine, that large spaces are necessary for installing several work-feeders at the assen.bly rnachine, and further that the chip components 100 are liable to be stuck during feeding through a chute of the in-line type work-feeder 102.
In the case of FIG.2, the chip components 100 are indexed by a suitable pushing means (not shown). But the rnagazine method has shortcomings that it takes much time to restore the machine operation when the chip components 100 are stuck, and that the number of the chip cornponents 100 stocked in one column magazine is generally limited.
Further, in the case of FIG.3, although a stable feeding operation is obtainable, the feeding method by use of` the carrier magazines 104 has another shortc~min~s that a relatively l~e size is necescary for the carrier ma~Jazine~ 1~4 in comparison with the sr~l1 size of the chip c~l~onents, tl~t larse sp2ces and a complex fe~in~ ~chine ~ V~1'7 ~ tC ~;a~y for automatically feccir.lr the carrier ma~azines 104 and f`urther that the carrier rr.~-a~irre~ 04 are necessary to be replac~d rr.anually after use.
Because of` the drawbacks of~ t~le abcve three conventional feeding methods, when the chip components are r.ounted on an electrical circuit board, the conventional assembly machine has been cifficult to operate due to 2 conplicated structure and a stable feeding operation is not always obtainable.
On the other hand U.S.Patent No. 3 421 284 for A.l~.Zernek, assignor to Universal Instrurner.ts ~orporation discloses a machine for preparing prorrramr;ed packages of taped electrical conponents for use in printed circui~ board compor.erlt insertion machines. The machine is adapted to successively deposit groups of programmed compor.ents onto â conveyor ar.d to tape the Eroups of components directly frcm the conveyor.
Anot~.er object of the invention there is to provide a dispenser adapted to trinl the leads of taped axial lead cornponents and to deposit trimrned components one at a time on an endless conveyor. However th~re is a technical n~d that electrical comporlents without lead wires are reliably assembled in a carrying tape.
The assembly apparatus in accordance with the present invention is used for assembling chip cornponents in predetermined assembling order. There are several diff`erences bet~een the assen.bly apparatus of the present invention ar.d conventional machines for handling electrical components with wire leads.
"~
11~0;~1~
Problems supposedly arise f`rom the conventional rr;achines for t~le following reasons, if they are used for assembling the chip components. i) Suitably assembled chip components are not available due to difficulties in assembling them.
ii) It is not possible to handle tne chip components as like the conventional electrical components with wire leads. iii) It is further not possible to assemble the chip components by taping them since they have no suitable holding portions like the electrical components with ~ire leads.
Summary of the Invention The present invention provides an apparatus for assembling wireless electrical components, wherein the dis-similar electrical components of small sizes are sequentially assembled for a preprocess in predetermined order to efficiently supply several dissimilar wireless electrical corr,ponents to a mounting machine for depositing the asserr.bled, or taped chip components onto predetermined places on an electrical circuit board.
The present invention purports to provide an assembly apparatus suitable for assernbling dissirnilar chip components in a carrier tape in ~redetermincd assemblin~ order. Such a carrier tape with the assernbled chip components makes it possible to feed dissimilar chip components to a m.ounting machine used for depositing the chip corr.ponents onto an electrical circuit board.
Thus, in accordance with the present invention, an assembly apparatus comprises ~,~
li~V~17 a supporting means for supporting a carrier tape which has recesses at least with upper openin~s and formed at a uniform space interval, a driving means for intermittently feeding said carrier tape a predetermined distance correspondin~ to said uniform space in-terval of said recesses on said carrier tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding direction of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined posi.-tions near said carrier tape, and ~ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said electrical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for trans-ferring a single kind of said electrical chip components, a control means for controlling assembling orders and timing of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
The assembly apparatus of the present invention makes it possible to solve the abovementioned problems associated with the assembling process of the chip components. The assembly apparatus in accordance with the present invention has distinctive features l~U3i7 that the structure thereof is simple and the assembly operation is stable and reliable.
- 6a -.....
FIG. 4 is a perspective view showing an overall structure of an assembly apparatus in accordance wit'n the present invention. ~ carrier tape 1 supported by a bracket 40 is intermittentl~ fed in a horizontal direction shown by an arrow denoted by "a". This feeding is made by two tape feeding means 4 and 4', and the carrier tape 1 is wound by a tape winding means 6. The carrier tape 1 is punched out by a punching means 2 to form holes for carrying chip components contained therein. Several transferring station units 3 are I0 disposed along the carrier tape 1 in order to transfer the chip components fed from respective feeder means 8 to the punched-out holes at the carrier tape 1. Units 5 and 5' respectively make a lower cover tape 41 and an upper cover tape 38 adhere to the carrier tape 1~ An electric control means 7 such as electronics circuits including a small computer is also provided to control the operation of the assembly apparatus of FIG. 4.
FIG. 5 is a perspective view showing the carrier tape 1 which is used for the assembly apparatus of FIG. 4 and has a number of small holes at a constant interval for feeding by a sprocket means. The carrier tape 1 is preferably elastic and made of e.g. paper.
FIGs. 6(a) and 6(b) are a partially sectional view and a front view of the tape feeding means 4 of the assembly apparatus of FIG. 4. A sprocket 11 having several pins 10 which are to engage with the holes 9 is fixed to a shaft 13 ~40317 of a drivin~ motor 12. A roller 14 used for pressing the carrier tape 1 is pivotally held on a shaft 15. A bracket 16 supports the driving motor 12 and the shaft 15. The tape feeding means 4' of FIG. 4 has a similar structure to the tape feeding means ~ of FIGs. 6~a) and 6(b). l`he tape feediny means 4 and 4' are disposed on a worktable 42 to feed the carrier tape 1 on stand holders 43 and 43' without sag.
FIG. 7 is a partially cutaway and cross sectional view showing the punching means 2 of FIG. 4. A punch 17 and a die 18 are used for punching the carrier tape 1 to form holes 19 at predetermined places on the carrier tape 1. The size of the holes 19 is set to be slightly larger than that of the chip components. A cylinder 21 for pressing the punch 17 is fixed to a frame 20. A spring 22 controls the up- and down-motion of the punch 17. A pilot pin 23 adjacent the punch 17 positions the carrier tape 1 by use of the holes 9.
In practice, the external form size of the chip components varies much, and therefore a plurality of the punching means 2 are preferably provided along the carrier tape 1 as shown in FIG. 4 so as to punch several different sizes of holes respond-ing to those of the chip components.
FIG. 8 is a partially cross-sectional view showing the transferring station units 3 of FIG. 4. A plurality of transferring units 26 are disposed alony the carrier tape 1, in accordance with the number and kinds of the chip components to be transferred. Each transferring unit 26 comprlses `` ll~V317 an in-line ~eeder 24 and a transferring head 25. The in-line feeder 24 feeds by vibration a number of the chip components 28 in a pot 27 to a chute 29 one by one in line. The trans-ferring head 25 is provided with a receptor 31. The receptor 31 is rotationally supported by a shaft 33 of a rotational cylinder 32. The receptor 31 has a groove 30 and receives one chip component from one tip of the chute 29. The transferring unit 26 further comprises a cylinder 37 with a piston 36.
A hole 35 for vacuum-suction is formed in the piston 36, and a suction portion 34 at the lower tip of the piston 36 is positioned so as to fit the position of the groove 30 of the receptor 31. A hose 39 is connected with the upper tip of the piston 36 and is used to suck the air inside the piston 36.
The other end of the hose 39 is connected to a vacuum pump (not shown).
The operation of the assembly apparatus of the present invention is further elucidated below in detail by referring to FIG. 4 to FIG. 9. FIG. 9 is a ~iew schematically showing the assembly process of the carrier tape l. The carrier tape l wound in a disk form is set at the bracket 40 on the work-table 42. The carrier tape 1 is intermittently fed by the ~' , sprocket ll under the control operation of the feeding means 4 and .i 4~, When the carrier tape 1 stops in the intermittent motion, the cylinder 21 of the punching means 2 is actuated and punches the carrier tape l by means of the punch 17 and the die 18, thereby forming the hole 19 on the carrier tape 1.
_ g : `
Then, the unit 5 r.la]ces the lower cover tape 41 aclhere to the lower side of the carrier tape 1 thereby coverincJ the hole 19 fror~t the bottom side thereoi.
~ t the transferrin~ station units 3, the transferring units 26 are actuated to transfer various kinds of the chip components to the respective holes 19 in pre-programmed order.
The transferrin~ operation of the transferring units 26 is as follows:
The chip component 28 fed to the ~roove 30 of the receptor 31 is sucked at the suction portion 34 of the piston 36. When the carrier tape 1 stops at a predetermined position, the rotational cylinder 32 is rotated thereby rotatin~ the receptor 31 clockwise, and then the cylinder 36 with the chip component 28 descends and deposits the sucked chip component 28 into the hole 19 of the carrier tape 1. ~.fter several kinds of the chip components 28 are assembled in the carrier tape 1 in the pro~rammed assemblin~ order~ the unit S' makes the upper cover tape 38 adhere to the upper side of the carrier tape 1 so as to cover it and to seal the chip components 28 in the holes 19. ~nd finally, the assembled carrier tape 1 is wound by the tape windin~ means 6.
It is also preferablc to cri~ploy a thermal pressin~
method to make the lower and upper cover tapes 41 and 38 adhere to the carrier tape 1, sincc it is free from adverse effects tha-t the chip components 28 in the holes 19 are liable to adhere to the tapes 41 and 38.
11403~
1~IG. 10 is a perspectivc view showing another e~ample of a carrier tape 1. I~hen the carrier tape 1 is made of a resin, recesses 19' with bottoms can be formed by a mold in place of the punch 17. ~n upper cover tape 38' is used to cover the recesses 19'. In addition, the assembly apparatus in accordance with the present invention may further comprise a printing means for printing ordering numbers and the number of the chip componen-ts on the carrier tape 1. It is also possible to form holes having different sizes in accordance with size variations of the chip components by replacing the punching means 2. Further, it is also necessary for a practical operation to arrange a plurality of the punching means 2 along the carrier tape 1 to punch holes having different sizes adapted to several dissimilar chip components. In this case, it is further necessary to control punching order of the punchin~ means 2 in accordance with the assembling order of the dissimilar chip components.
As so far described, the assembly apparatus in accordance with the present invention makes it possible to assemble several kinds of the chip components in one carrier tape in programmed assembliny order. Such an assembled tape is particularly suitable for mounting the chip components on an electrical circuit board, and can be made easily by the operation of the assembly apparatus in accordance with the present invention. The assembly apparatus is thereEore versatile in production fields.
Conventionally, chip components 100 s~,own in FIG.l such as wireless resistor components and wireless layer-built capacitors are fed to an eleectrical circuit board(rlot shown) such as printed circuit boards by rneans of a known bowl type work-feeder 101 combined with a known in-line type ~ork-feeder 102. The chip cornponents are successively fed in a row by these feeders suitab].y fixed on a worktable (not shown).
FICs.2(a) and 2(b) are cross-sectional views schema-tically showing portions of another conventional assembly mâchille of magazine type. FIGs.~(a) and 2(b) correspond respectively to a feeding process for féeding chip components one by one insi~e a cylindrical colurnn 103 in a horizontal direction and in a vertical direction.
~ , . .
I
FIG.3 is a perspectivc vicw showing a part of still another conventional assernbly machine of` carricr magazine type.
FIG.3 corresponds to the case where a casing 104 is rnade of e.g. plastics and has encaved recesses 105. The recesses 105 are formed at an equal interval and used for carrying the chip com~onents therein.
The above three conventional methods have the following drawbacks. In the case of FIG.l, the bowl type and in-line type work-feeders 101 and 102 feed the chip ccmponents 100 lo by vibration, thereby resulting in shortcolr,ings that vibration adversely affects other portions of the assembly machine, that large spaces are necessary for installing several work-feeders at the assen.bly rnachine, and further that the chip components 100 are liable to be stuck during feeding through a chute of the in-line type work-feeder 102.
In the case of FIG.2, the chip components 100 are indexed by a suitable pushing means (not shown). But the rnagazine method has shortcomings that it takes much time to restore the machine operation when the chip components 100 are stuck, and that the number of the chip cornponents 100 stocked in one column magazine is generally limited.
Further, in the case of FIG.3, although a stable feeding operation is obtainable, the feeding method by use of` the carrier magazines 104 has another shortc~min~s that a relatively l~e size is necescary for the carrier ma~Jazine~ 1~4 in comparison with the sr~l1 size of the chip c~l~onents, tl~t larse sp2ces and a complex fe~in~ ~chine ~ V~1'7 ~ tC ~;a~y for automatically feccir.lr the carrier ma~azines 104 and f`urther that the carrier rr.~-a~irre~ 04 are necessary to be replac~d rr.anually after use.
Because of` the drawbacks of~ t~le abcve three conventional feeding methods, when the chip components are r.ounted on an electrical circuit board, the conventional assembly machine has been cifficult to operate due to 2 conplicated structure and a stable feeding operation is not always obtainable.
On the other hand U.S.Patent No. 3 421 284 for A.l~.Zernek, assignor to Universal Instrurner.ts ~orporation discloses a machine for preparing prorrramr;ed packages of taped electrical conponents for use in printed circui~ board compor.erlt insertion machines. The machine is adapted to successively deposit groups of programmed compor.ents onto â conveyor ar.d to tape the Eroups of components directly frcm the conveyor.
Anot~.er object of the invention there is to provide a dispenser adapted to trinl the leads of taped axial lead cornponents and to deposit trimrned components one at a time on an endless conveyor. However th~re is a technical n~d that electrical comporlents without lead wires are reliably assembled in a carrying tape.
The assembly apparatus in accordance with the present invention is used for assembling chip cornponents in predetermined assembling order. There are several diff`erences bet~een the assen.bly apparatus of the present invention ar.d conventional machines for handling electrical components with wire leads.
"~
11~0;~1~
Problems supposedly arise f`rom the conventional rr;achines for t~le following reasons, if they are used for assembling the chip components. i) Suitably assembled chip components are not available due to difficulties in assembling them.
ii) It is not possible to handle tne chip components as like the conventional electrical components with wire leads. iii) It is further not possible to assemble the chip components by taping them since they have no suitable holding portions like the electrical components with ~ire leads.
Summary of the Invention The present invention provides an apparatus for assembling wireless electrical components, wherein the dis-similar electrical components of small sizes are sequentially assembled for a preprocess in predetermined order to efficiently supply several dissimilar wireless electrical corr,ponents to a mounting machine for depositing the asserr.bled, or taped chip components onto predetermined places on an electrical circuit board.
The present invention purports to provide an assembly apparatus suitable for assernbling dissirnilar chip components in a carrier tape in ~redetermincd assemblin~ order. Such a carrier tape with the assernbled chip components makes it possible to feed dissimilar chip components to a m.ounting machine used for depositing the chip corr.ponents onto an electrical circuit board.
Thus, in accordance with the present invention, an assembly apparatus comprises ~,~
li~V~17 a supporting means for supporting a carrier tape which has recesses at least with upper openin~s and formed at a uniform space interval, a driving means for intermittently feeding said carrier tape a predetermined distance correspondin~ to said uniform space in-terval of said recesses on said carrier tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding direction of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined posi.-tions near said carrier tape, and ~ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said electrical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for trans-ferring a single kind of said electrical chip components, a control means for controlling assembling orders and timing of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
The assembly apparatus of the present invention makes it possible to solve the abovementioned problems associated with the assembling process of the chip components. The assembly apparatus in accordance with the present invention has distinctive features l~U3i7 that the structure thereof is simple and the assembly operation is stable and reliable.
- 6a -.....
FIG. 4 is a perspective view showing an overall structure of an assembly apparatus in accordance wit'n the present invention. ~ carrier tape 1 supported by a bracket 40 is intermittentl~ fed in a horizontal direction shown by an arrow denoted by "a". This feeding is made by two tape feeding means 4 and 4', and the carrier tape 1 is wound by a tape winding means 6. The carrier tape 1 is punched out by a punching means 2 to form holes for carrying chip components contained therein. Several transferring station units 3 are I0 disposed along the carrier tape 1 in order to transfer the chip components fed from respective feeder means 8 to the punched-out holes at the carrier tape 1. Units 5 and 5' respectively make a lower cover tape 41 and an upper cover tape 38 adhere to the carrier tape 1~ An electric control means 7 such as electronics circuits including a small computer is also provided to control the operation of the assembly apparatus of FIG. 4.
FIG. 5 is a perspective view showing the carrier tape 1 which is used for the assembly apparatus of FIG. 4 and has a number of small holes at a constant interval for feeding by a sprocket means. The carrier tape 1 is preferably elastic and made of e.g. paper.
FIGs. 6(a) and 6(b) are a partially sectional view and a front view of the tape feeding means 4 of the assembly apparatus of FIG. 4. A sprocket 11 having several pins 10 which are to engage with the holes 9 is fixed to a shaft 13 ~40317 of a drivin~ motor 12. A roller 14 used for pressing the carrier tape 1 is pivotally held on a shaft 15. A bracket 16 supports the driving motor 12 and the shaft 15. The tape feeding means 4' of FIG. 4 has a similar structure to the tape feeding means ~ of FIGs. 6~a) and 6(b). l`he tape feediny means 4 and 4' are disposed on a worktable 42 to feed the carrier tape 1 on stand holders 43 and 43' without sag.
FIG. 7 is a partially cutaway and cross sectional view showing the punching means 2 of FIG. 4. A punch 17 and a die 18 are used for punching the carrier tape 1 to form holes 19 at predetermined places on the carrier tape 1. The size of the holes 19 is set to be slightly larger than that of the chip components. A cylinder 21 for pressing the punch 17 is fixed to a frame 20. A spring 22 controls the up- and down-motion of the punch 17. A pilot pin 23 adjacent the punch 17 positions the carrier tape 1 by use of the holes 9.
In practice, the external form size of the chip components varies much, and therefore a plurality of the punching means 2 are preferably provided along the carrier tape 1 as shown in FIG. 4 so as to punch several different sizes of holes respond-ing to those of the chip components.
FIG. 8 is a partially cross-sectional view showing the transferring station units 3 of FIG. 4. A plurality of transferring units 26 are disposed alony the carrier tape 1, in accordance with the number and kinds of the chip components to be transferred. Each transferring unit 26 comprlses `` ll~V317 an in-line ~eeder 24 and a transferring head 25. The in-line feeder 24 feeds by vibration a number of the chip components 28 in a pot 27 to a chute 29 one by one in line. The trans-ferring head 25 is provided with a receptor 31. The receptor 31 is rotationally supported by a shaft 33 of a rotational cylinder 32. The receptor 31 has a groove 30 and receives one chip component from one tip of the chute 29. The transferring unit 26 further comprises a cylinder 37 with a piston 36.
A hole 35 for vacuum-suction is formed in the piston 36, and a suction portion 34 at the lower tip of the piston 36 is positioned so as to fit the position of the groove 30 of the receptor 31. A hose 39 is connected with the upper tip of the piston 36 and is used to suck the air inside the piston 36.
The other end of the hose 39 is connected to a vacuum pump (not shown).
The operation of the assembly apparatus of the present invention is further elucidated below in detail by referring to FIG. 4 to FIG. 9. FIG. 9 is a ~iew schematically showing the assembly process of the carrier tape l. The carrier tape l wound in a disk form is set at the bracket 40 on the work-table 42. The carrier tape 1 is intermittently fed by the ~' , sprocket ll under the control operation of the feeding means 4 and .i 4~, When the carrier tape 1 stops in the intermittent motion, the cylinder 21 of the punching means 2 is actuated and punches the carrier tape l by means of the punch 17 and the die 18, thereby forming the hole 19 on the carrier tape 1.
_ g : `
Then, the unit 5 r.la]ces the lower cover tape 41 aclhere to the lower side of the carrier tape 1 thereby coverincJ the hole 19 fror~t the bottom side thereoi.
~ t the transferrin~ station units 3, the transferring units 26 are actuated to transfer various kinds of the chip components to the respective holes 19 in pre-programmed order.
The transferrin~ operation of the transferring units 26 is as follows:
The chip component 28 fed to the ~roove 30 of the receptor 31 is sucked at the suction portion 34 of the piston 36. When the carrier tape 1 stops at a predetermined position, the rotational cylinder 32 is rotated thereby rotatin~ the receptor 31 clockwise, and then the cylinder 36 with the chip component 28 descends and deposits the sucked chip component 28 into the hole 19 of the carrier tape 1. ~.fter several kinds of the chip components 28 are assembled in the carrier tape 1 in the pro~rammed assemblin~ order~ the unit S' makes the upper cover tape 38 adhere to the upper side of the carrier tape 1 so as to cover it and to seal the chip components 28 in the holes 19. ~nd finally, the assembled carrier tape 1 is wound by the tape windin~ means 6.
It is also preferablc to cri~ploy a thermal pressin~
method to make the lower and upper cover tapes 41 and 38 adhere to the carrier tape 1, sincc it is free from adverse effects tha-t the chip components 28 in the holes 19 are liable to adhere to the tapes 41 and 38.
11403~
1~IG. 10 is a perspectivc view showing another e~ample of a carrier tape 1. I~hen the carrier tape 1 is made of a resin, recesses 19' with bottoms can be formed by a mold in place of the punch 17. ~n upper cover tape 38' is used to cover the recesses 19'. In addition, the assembly apparatus in accordance with the present invention may further comprise a printing means for printing ordering numbers and the number of the chip componen-ts on the carrier tape 1. It is also possible to form holes having different sizes in accordance with size variations of the chip components by replacing the punching means 2. Further, it is also necessary for a practical operation to arrange a plurality of the punching means 2 along the carrier tape 1 to punch holes having different sizes adapted to several dissimilar chip components. In this case, it is further necessary to control punching order of the punchin~ means 2 in accordance with the assembling order of the dissimilar chip components.
As so far described, the assembly apparatus in accordance with the present invention makes it possible to assemble several kinds of the chip components in one carrier tape in programmed assembliny order. Such an assembled tape is particularly suitable for mounting the chip components on an electrical circuit board, and can be made easily by the operation of the assembly apparatus in accordance with the present invention. The assembly apparatus is thereEore versatile in production fields.
Claims (9)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An assembly apparatus comprising:
a supporting means for supporting a carrier tape which has recesses at least with upper openings and formed at a uniform space interval, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uniform space interval of said recesses on said carrier tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding di-rection of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined positions near said carrier tape, and (ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said elec-trical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferr-ing a single kind of said electrical chip components, a control means for controlling assembling orders and timing of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
a supporting means for supporting a carrier tape which has recesses at least with upper openings and formed at a uniform space interval, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uniform space interval of said recesses on said carrier tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding di-rection of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined positions near said carrier tape, and (ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said elec-trical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferr-ing a single kind of said electrical chip components, a control means for controlling assembling orders and timing of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
2. An assembly apparatus in accordance with claim 1 further comprising a covering means for covering openings of said recesses by use of an upper covering tape and a lower covering tape.
3. An assembly apparatus in accordance with claim 1 further comprising a printing means for printing marks onto said carrier tape.
4. An assembly apparatus comprising:
a supporting means for supporting a carrier tape, at least one molding means for molding said carrier tape thereby forming recesses with upper openings at uniform space intervals in said carrier tape, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uni-form space intervals of said recesses formed in said carrier tape, a plurality of transferring station units for trans-ferring different kinds of electrical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferring a single kind of said electrical chip components, a control means for controlling assembling orders and timings of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
a supporting means for supporting a carrier tape, at least one molding means for molding said carrier tape thereby forming recesses with upper openings at uniform space intervals in said carrier tape, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uni-form space intervals of said recesses formed in said carrier tape, a plurality of transferring station units for trans-ferring different kinds of electrical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferring a single kind of said electrical chip components, a control means for controlling assembling orders and timings of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
5. An assembly apparatus in accordance with claim 4 further comprising a printing means for printing marks onto said carrier tape.
6. An assembly apparatus comprising:
a supporting means for supporting a carrier tape, at least one punching means for punching said carrier tape to form recesses with upper and lower openings at a uniform space interval of recesses in said carrier tape, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uniform space interval of said recesses formed in said carrier tape, a covering means for covering said lower openings of said recesses by use of a lower covering tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding direction of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined positions near said carrier tape, and (ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said elec-trical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferr-ing a single kind of said electrical chip components, a control means for controlling assembling orders and timings of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
a supporting means for supporting a carrier tape, at least one punching means for punching said carrier tape to form recesses with upper and lower openings at a uniform space interval of recesses in said carrier tape, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uniform space interval of said recesses formed in said carrier tape, a covering means for covering said lower openings of said recesses by use of a lower covering tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding direction of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined positions near said carrier tape, and (ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said elec-trical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferr-ing a single kind of said electrical chip components, a control means for controlling assembling orders and timings of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
7. An assembly apparatus comprising:
a supporting means for supporting a carrier tape, at least one molding means for molding said carrier tape thereby forming recesses with upper openings at uniform space interval in said carrier tape, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uniform space interval of said recesses formed in said carrier tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding direction of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined positions near said carrier tape, and (ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said elec-trical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferr-ing a single kind of said electrical chip components, a control means for controlling assembling orders and timings of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
a supporting means for supporting a carrier tape, at least one molding means for molding said carrier tape thereby forming recesses with upper openings at uniform space interval in said carrier tape, a driving means for intermittently feeding said carrier tape a predetermined distance corresponding to said uniform space interval of said recesses formed in said carrier tape, a plurality of transferring station units comprising (i) a plurality of in-line feeders disposed along the feeding direction of said carrier tape with space intervals equal to or a multiple of said uniform space interval, for feeding electrical chip components to respective receptors at predetermined positions near said carrier tape, and (ii) at least one transferring unit disposed above said receptors for sucking said electrical chip components on said receptors and then for transferring said elec-trical chip components onto said recesses at stop times of said carrier tape, each transferring station unit being for transferr-ing a single kind of said electrical chip components, a control means for controlling assembling orders and timings of the transferring operations by said transferring station units, and a binding means for joining a cover tape on said carrier tape after the transferring operations thereby covering said upper openings of said recesses containing said electrical chip components therein.
8. An assembly apparatus in accordance with claim 6 further comprising a printing means for printing marks onto said carrier tape.
9. An assembly apparatus in accordance with claim 7 further comprising a printing means for printing marks onto said carrier tape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54-25807 | 1979-03-05 | ||
| JP2580779A JPS55118697A (en) | 1979-03-05 | 1979-03-05 | Device for and method of fabricating electronic part assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1140317A true CA1140317A (en) | 1983-02-01 |
Family
ID=12176128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000346887A Expired CA1140317A (en) | 1979-03-05 | 1980-03-04 | Apparatus for making electrical circuit components |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4354337A (en) |
| JP (1) | JPS55118697A (en) |
| CA (1) | CA1140317A (en) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60126305U (en) * | 1984-02-01 | 1985-08-26 | ロ−ム株式会社 | Chip parts taping packaging equipment |
| US4598529A (en) * | 1985-01-18 | 1986-07-08 | Pongrass Robert G | Method and apparatus for forming, filling and sealing flexible plastic bags |
| JPH0212162Y2 (en) * | 1985-11-15 | 1990-04-05 | ||
| JPS62122911A (en) * | 1985-11-15 | 1987-06-04 | 澁谷工業株式会社 | Article container |
| JPH052406Y2 (en) * | 1985-11-15 | 1993-01-21 | ||
| DE3601350A1 (en) * | 1986-01-18 | 1987-07-23 | Bachmann Horst | Device and method for packaging fine mechanical and/or electronic components |
| US4798041A (en) * | 1987-02-06 | 1989-01-17 | Minigrip, Inc. | Link bag and opening fixture |
| JPS63119217A (en) * | 1987-07-11 | 1988-05-23 | 株式会社村田製作所 | Automatic manufacturing system of chip electronic parts assembly |
| JP2855673B2 (en) * | 1989-07-14 | 1999-02-10 | セイコーエプソン株式会社 | Transport tape |
| US5483351A (en) * | 1992-09-25 | 1996-01-09 | Xerox Corporation | Dilation of images without resolution conversion to compensate for printer characteristics |
| WO1997043891A1 (en) * | 1996-05-10 | 1997-11-20 | Matsushita Electric Industrial Co., Ltd. | Component assembling method and component assembling apparatus |
| EP1021336A4 (en) | 1997-07-16 | 2002-08-07 | Robotic Vision Systems | Position sensing system for an inspection and handling system |
| JP4179680B2 (en) * | 1998-10-12 | 2008-11-12 | 富士通コンポーネント株式会社 | Electronic component carrier, electronic component package, and electronic component carrying method |
| US6779726B1 (en) | 1999-11-03 | 2004-08-24 | Solectron Corporation | Method and apparatus for controlling a production operation using printed information on a component tape |
| US6332536B2 (en) * | 1999-11-03 | 2001-12-25 | Solectron Corporation | Component tape including a printed component count |
| JP3671789B2 (en) * | 2000-01-13 | 2005-07-13 | 株式会社村田製作所 | Parts handling equipment and handling method |
| JP4366659B2 (en) * | 2002-06-25 | 2009-11-18 | 住友ベークライト株式会社 | Carrier tape processing apparatus and processing method |
| US7771187B2 (en) | 2003-04-01 | 2010-08-10 | Adaptsys Limited | Plastic embossed carrier tape apparatus and process |
| US7987653B2 (en) * | 2004-03-03 | 2011-08-02 | Adaptsys Limited | Plastic embossed carrier tape process |
| US7219803B2 (en) * | 2005-03-28 | 2007-05-22 | Entegris, Inc. | Carrier tape for disk components |
| CN103662210B (en) * | 2012-09-07 | 2016-03-02 | 深圳富泰宏精密工业有限公司 | Wrapping machine |
| JP6660686B2 (en) * | 2015-07-23 | 2020-03-11 | 日東工業株式会社 | Taping device |
| US10421571B2 (en) * | 2016-03-28 | 2019-09-24 | An-Sung Wang | System for sensing element adjustment and material belt detection |
| CN113858322B (en) * | 2021-09-15 | 2023-03-10 | 梧州学院 | A high-speed SMT carrier tape punching machine |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3291136A (en) * | 1962-03-28 | 1966-12-13 | James B Boyer | Manufacture of cigarette-type smoking media |
| US3421284A (en) * | 1965-12-20 | 1969-01-14 | Universal Instruments Corp | Component sequencing and taping machine |
| US3445981A (en) * | 1966-07-29 | 1969-05-27 | Gates Rubber Co | Method and means for forming a seed tape |
| US3655496A (en) * | 1969-09-25 | 1972-04-11 | Vitta Corp | Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates |
| US3608711A (en) * | 1969-10-06 | 1971-09-28 | Teledyne Inc | Package for electronic devices and the like |
| US3673760A (en) * | 1970-10-26 | 1972-07-04 | American Can Co | Packaging method and apparatus |
| US3767349A (en) * | 1971-09-24 | 1973-10-23 | Morrell & Co John | Vacuum package machine |
| US3759011A (en) * | 1972-05-04 | 1973-09-18 | Reed Lane Inc | Packaging machine for packaging uniform articles such as pharmaceutical tablets |
| US3871945A (en) * | 1973-03-12 | 1975-03-18 | Ferranti Packard Ltd | Magnetically actuable element |
| US4043094A (en) * | 1975-09-29 | 1977-08-23 | Western Electric Company, Inc. | Method and apparatus for processing taped components |
| JPS5337852A (en) * | 1976-09-17 | 1978-04-07 | Matsushita Electric Ind Co Ltd | Device for arranging parts |
-
1979
- 1979-03-05 JP JP2580779A patent/JPS55118697A/en active Pending
-
1980
- 1980-02-28 US US06/125,658 patent/US4354337A/en not_active Expired - Lifetime
- 1980-03-04 CA CA000346887A patent/CA1140317A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55118697A (en) | 1980-09-11 |
| US4354337A (en) | 1982-10-19 |
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