[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

AU2002235169A1 - Mechanical housing - Google Patents

Mechanical housing

Info

Publication number
AU2002235169A1
AU2002235169A1 AU2002235169A AU3516902A AU2002235169A1 AU 2002235169 A1 AU2002235169 A1 AU 2002235169A1 AU 2002235169 A AU2002235169 A AU 2002235169A AU 3516902 A AU3516902 A AU 3516902A AU 2002235169 A1 AU2002235169 A1 AU 2002235169A1
Authority
AU
Australia
Prior art keywords
mechanical housing
housing
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002235169A
Inventor
Michelle Bishop
Frederick Daniels
Gary Gustine
Lane King
Matthew Kusz
Michael Sawyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commscope Connectivity LLC
Original Assignee
ADC Telecommunications Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADC Telecommunications Inc filed Critical ADC Telecommunications Inc
Publication of AU2002235169A1 publication Critical patent/AU2002235169A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/035Cooling of active equipments, e.g. air ducts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/09Frames or mounting racks not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q2201/00Constructional details of selecting arrangements
    • H04Q2201/06Cooling arrangements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q2201/00Constructional details of selecting arrangements
    • H04Q2201/10Housing details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q2201/00Constructional details of selecting arrangements
    • H04Q2201/12Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2002235169A 2000-11-06 2001-11-05 Mechanical housing Abandoned AU2002235169A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US24617400P 2000-11-06 2000-11-06
US608/246,174 2000-11-06
US09/804,129 US6628521B2 (en) 2000-11-06 2001-03-12 Mechanical housing
US09/804,129 2001-03-12
PCT/US2001/047232 WO2002037912A2 (en) 2000-11-06 2001-11-05 Mechanical housing

Publications (1)

Publication Number Publication Date
AU2002235169A1 true AU2002235169A1 (en) 2002-05-15

Family

ID=26937769

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002235169A Abandoned AU2002235169A1 (en) 2000-11-06 2001-11-05 Mechanical housing

Country Status (4)

Country Link
US (4) US6628521B2 (en)
AU (1) AU2002235169A1 (en)
CA (1) CA2428279C (en)
WO (1) WO2002037912A2 (en)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900984B2 (en) 2001-04-24 2005-05-31 Apple Computer, Inc. Computer component protection
KR20030073042A (en) * 2002-03-08 2003-09-19 현대네트웍스 주식회사 Device for cooling of outside the board type system in dsl
US7031158B2 (en) * 2002-10-30 2006-04-18 Charles Industries, Ltd. Heat pipe cooled electronics enclosure
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
US6979772B2 (en) * 2003-05-14 2005-12-27 Chaun-Choung Technology Corp. Integrated heat dissipating enclosure for electronic product
US7164581B2 (en) * 2004-06-21 2007-01-16 Computer Network Technology Corp. Modular chassis divided along a midplane and cooling system therefor
US20060130221A1 (en) * 2004-12-20 2006-06-22 Bulala Cherie A Multi-function toilet device
US20070115635A1 (en) * 2005-11-18 2007-05-24 Low Andrew G Passive cooling for fiber to the premise (FTTP) electronics
US20080098634A1 (en) * 2006-11-01 2008-05-01 Skyline Products, Inc. Outdoor display sign
US7408782B2 (en) * 2007-01-04 2008-08-05 Tellabs Bedford, Inc. Multiple printed circuit board heat transfer guide plates
US7457123B1 (en) * 2007-05-10 2008-11-25 Adc Telecommunications, Inc. Chassis mounted heat sink system
US7450382B1 (en) 2007-05-15 2008-11-11 Adc Telecommunications, Inc. Apparatus for enclosing electronic components
US7535716B2 (en) * 2007-05-23 2009-05-19 Adc Telecommunications, Inc. Apparatus for enclosing electronic components used in telecommunication systems
US7796376B2 (en) * 2008-01-17 2010-09-14 Yaskawa America, Inc. Electrical enclosure cooling structure assembly and method
WO2009113818A2 (en) * 2008-03-12 2009-09-17 Kmw Inc. Enclosure device of wireless communication apparatus
US7855891B1 (en) 2008-03-25 2010-12-21 Adtran, Inc. Modular heat sinks for housings for electronic equipment
US7734040B1 (en) 2008-03-25 2010-06-08 Adtran, Inc. Modular housing system for outside plant telecommunications equipment
US7646606B2 (en) * 2008-05-13 2010-01-12 Honeywell International Inc. IGBT packaging and cooling using PCM and liquid
US7915544B1 (en) 2008-06-05 2011-03-29 Adtran, Inc. Cable seal apparatus and techniques for outside plant telecommunications housings
BRPI0918292A2 (en) * 2008-09-08 2015-12-22 Intergraph Technologies Co rugged computer capable of operating in high temperature environments
US20100242590A1 (en) * 2009-03-27 2010-09-30 Daniel Measurement And Control, Inc. Flow Meter and Temperature Stabilizing Cover Therefor
EP2299582B1 (en) * 2009-09-18 2015-03-11 SMA Solar Technology AG Inverter with a housing and electric and electronic components assembled within same
WO2011119926A2 (en) * 2010-03-25 2011-09-29 Porreca Paul J Conduction-cooled apparatus and methods of forming said apparatus
CN102439900A (en) * 2010-06-28 2012-05-02 中兴通讯股份有限公司 Totally enclosed type integrated access system and method of reducing power consumption of the system
US8427828B2 (en) * 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
US8537540B2 (en) * 2010-11-02 2013-09-17 Technology Advancement Group, Inc. Field serviceable CPU module
US20120120594A1 (en) * 2010-11-12 2012-05-17 Tien-Sheng Huang Heat dissipating casing structure for main board
WO2012104017A1 (en) * 2011-02-04 2012-08-09 Sew-Eurodrive Gmbh & Co. Kg Electrical device
US8830680B2 (en) * 2011-07-18 2014-09-09 Public Wireless, Inc. Systems and methods for heat extraction in a power supply
US20130050939A1 (en) * 2011-08-28 2013-02-28 Purewave Networks, Inc. Methods and system for effectively removing heat from a wireless base station
US9161478B2 (en) * 2012-02-24 2015-10-13 Futurewei Technologies, Inc. Apparatus and method for an active antenna heat sink
US9274548B2 (en) * 2013-03-01 2016-03-01 Seagate Technology Llc Electronic apparatus comprising backplane and methods of assembling and disassembling
US9368870B2 (en) 2014-03-17 2016-06-14 Ubiquiti Networks, Inc. Methods of operating an access point using a plurality of directional beams
US10327357B2 (en) * 2014-09-18 2019-06-18 Artesyn Embedded Computing, Inc. Thermal conduction to a cylindrical shaft
US9338907B2 (en) * 2014-09-24 2016-05-10 Hil Tech Llc Thermally managed enclosure
US10720683B2 (en) 2014-09-30 2020-07-21 Cps Technology Holdings Llc Battery module thermal management features for internal flow
US9825343B2 (en) 2014-09-30 2017-11-21 Johnson Controls Technology Company Battery module passive thermal management features and positioning
US10658717B2 (en) 2014-09-30 2020-05-19 Cps Technology Holdings Llc Battery module active thermal management features and positioning
US10164332B2 (en) 2014-10-14 2018-12-25 Ubiquiti Networks, Inc. Multi-sector antennas
WO2016137938A1 (en) 2015-02-23 2016-09-01 Ubiquiti Networks, Inc. Radio apparatuses for long-range communication of radio-frequency information
TWM523267U (en) * 2015-07-16 2016-06-01 鋐寶科技股份有限公司 Electronic apparatus
CN206743244U (en) 2015-10-09 2017-12-12 优倍快网络公司 Multiplexer device
US10674641B2 (en) * 2016-04-04 2020-06-02 Hamilton Sundstrand Corporation Immersion cooling systems and methods
USD835040S1 (en) 2016-09-09 2018-12-04 Corning Research & Development Corporation 1×4 distribution point unit
US20220201899A1 (en) 2019-04-10 2022-06-23 Sew-Eurodrive Gmbh & Co. Kg Electric appliance having a housing part
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus

Family Cites Families (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US336171A (en) * 1886-02-16 Vault-light
US2737579A (en) 1951-04-06 1956-03-06 Acf Ind Inc Amplifier assembly
US2796559A (en) 1952-09-11 1957-06-18 Bendix Aviat Corp Electrical apparatus
US2876277A (en) 1954-12-29 1959-03-03 Ibm Electrical component mounting apparatus
US2833966A (en) 1956-06-13 1958-05-06 George N Goodier Heat conducting tube mount
US3087095A (en) 1959-12-28 1963-04-23 Bell Telephone Labor Inc Cushion mounting for electrical apparatus
US3135321A (en) 1960-03-07 1964-06-02 Trane Co Heat exchanger
CH440464A (en) 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Heat sinks for semiconductor elements
US3467891A (en) 1967-10-03 1969-09-16 Gen Electric Combination electrical,mechanical,and thermal connector assembly
US3487267A (en) 1968-01-02 1969-12-30 Jerrold Electronics Corp Thermally conducting transistor support arms
US3697929A (en) 1971-01-18 1972-10-10 Bunker Ramo Controlled insertion force receptacle for flat circuit bearing elements
US3767974A (en) 1972-01-03 1973-10-23 Cogar Corp Insertion and extraction lever for printed circuit cards
US3809798A (en) 1972-09-06 1974-05-07 H Simon Angle type feedthrough cable clamp
DE2443122B2 (en) 1974-09-09 1979-05-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Device for high frequency and communications engineering
US4184539A (en) 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
US4172212A (en) 1978-07-24 1979-10-23 International Telephone And Telegraph Corporation Submarine housing for submarine cable system repeater components or the like
US4301494A (en) 1979-09-28 1981-11-17 Wescom, Inc. Printed circuit board faceplate assembly
US4259843A (en) * 1979-10-09 1981-04-07 Cromemco Inc. Isolation chamber for electronic devices
JPS5693634A (en) 1979-12-26 1981-07-29 Motoda Electronics Co Ltd Device for sucking thin sheet
DE3044314C2 (en) 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Housing for accommodating printed circuits equipped with heat-generating electronic components
JPS58105187A (en) 1981-12-17 1983-06-22 佐瀬 英三 Flour mill model harnessing water wheel
DE3150166C2 (en) 1981-12-18 1984-09-06 ANT Nachrichtentechnik GmbH, 7150 Backnang Cooling system for communications equipment with high power dissipation
US4559790A (en) * 1982-10-18 1985-12-24 General Electric Company Apparatus for maintaining electronic equipment and the like at low temperatures in hot ambient environments
US4528615A (en) 1983-05-13 1985-07-09 At&T Bell Laboratories Repeater housing and circuit mounting structure
JPS6079834A (en) 1983-10-07 1985-05-07 Nec Corp Structure of optical submarine repeater unit
US4547833A (en) 1983-12-23 1985-10-15 Schlumberger Technology Corporation High density electronics packaging system for hostile environment
GB2153151B (en) 1984-01-19 1988-04-20 Stc Plc Optical repeaters
GB2152297B (en) 1984-01-19 1988-10-19 Stc Plc Optical repeaters
US4656559A (en) 1984-05-10 1987-04-07 Ultima Electronics Ltd. Holder and heat sink for electronic components
US4777561A (en) 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
JPS6226936A (en) 1985-07-26 1987-02-04 Nec Corp Heat dissipation buffering structure of submarine repeater
JPS6267936A (en) 1985-09-19 1987-03-27 Fujitsu Ltd Radio communication equipment
JPS6279404A (en) 1985-10-03 1987-04-11 Nec Corp Optical submarine repeater enclosure
US5264719A (en) * 1986-01-07 1993-11-23 Harris Corporation High voltage lateral semiconductor device
FR2596231B1 (en) 1986-03-21 1993-01-29 Cit Alcatel HOUSING FOR ELECTRONIC CIRCUITS
GB2193552B (en) 1986-08-08 1990-05-16 Stc Plc Liners for repeater housings
JPS63232496A (en) 1987-03-20 1988-09-28 松下電器産業株式会社 Electronic parts mounter
US4858070A (en) 1987-04-24 1989-08-15 Racal Data Communications Inc. Modular expandable housing arrangement for electronic apparatus
US4805482A (en) 1987-08-24 1989-02-21 Brunswick Corporation Cam adjustment assembly
FR2630575B1 (en) 1988-04-21 1990-07-13 Cit Alcatel HOUSING FOR SUBMERSIBLE EQUIPMENT
JPH024287A (en) 1988-06-22 1990-01-09 Olympus Optical Co Ltd Display control system
JP2689550B2 (en) 1988-12-21 1997-12-10 日本電気株式会社 Heat dissipation structure of communication case
US4909752A (en) 1989-03-31 1990-03-20 Honeywell, Inc. Circuit card retainer
JP2612339B2 (en) 1989-04-18 1997-05-21 三菱電機株式会社 Electronic equipment housing
US5424916A (en) 1989-07-28 1995-06-13 The Charles Stark Draper Laboratory, Inc. Combination conductive and convective heatsink
US4953058A (en) 1989-09-01 1990-08-28 General Dynamics Corporation, Space Systems Div. Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
US4987978A (en) 1989-10-10 1991-01-29 Jungersen Thoger G Wheelchair safety brakes
US5019939A (en) 1989-10-24 1991-05-28 Ag Communication Systems Corp. Thermal management plate
FR2656763A1 (en) 1989-12-29 1991-07-05 Cit Alcatel HOUSING FOR IMMERGED ELECTRONIC CIRCUITS.
JPH0719991B2 (en) 1990-02-28 1995-03-06 三菱電機株式会社 Controller case
US5048793A (en) 1990-06-14 1991-09-17 Miller Pipeline Corporation Pipe jack
EP0501044B1 (en) 1991-02-25 1994-10-12 BELL TELEPHONE MANUFACTURING COMPANY Naamloze Vennootschap Cooling system
US5309315A (en) 1991-08-09 1994-05-03 Pulse Embedded Computer Systems, Inc. Severe environment enclosure with thermal heat sink and EMI protection
US5337218A (en) 1992-06-02 1994-08-09 International Business Machines Corporation Circuit card interconnecting structure
US5267122A (en) 1992-06-15 1993-11-30 Alcatel Network Systems, Inc. Optical network unit
US5398164A (en) 1993-02-24 1995-03-14 International Business Machines Corporation Printed circuit card latching and stiffening assembly
CA2120468A1 (en) * 1993-04-05 1994-10-06 Kenneth Alan Salisbury Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
US5381314A (en) * 1993-06-11 1995-01-10 The Whitaker Corporation Heat dissipating EMI/RFI protective function box
US5343361A (en) * 1993-06-11 1994-08-30 The Whitaker Corporation Thermal junction for card edges in a card cage and ground clip therefor
JPH07177645A (en) 1993-12-21 1995-07-14 Nec Eng Ltd Heat dissipating/shock absorbing structure for submarine repeater
US5455739A (en) * 1994-04-05 1995-10-03 Alcatel Network Systems, Inc. Assembly for transferring heat from heat generating components to a surrounding housing
US5482888A (en) * 1994-08-12 1996-01-09 United Microelectronics Corporation Method of manufacturing a low resistance, high breakdown voltage, power MOSFET
JP2602419B2 (en) 1994-08-19 1997-04-23 日本電気エンジニアリング株式会社 Heat dissipation structure of submarine repeater
US5519573A (en) 1994-12-27 1996-05-21 Intel Corporation I/O riser card for motherboard in a personal computer/server
JP3233808B2 (en) * 1995-03-17 2001-12-04 富士通株式会社 Electronic package cooling system
US6104611A (en) 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US5864365A (en) * 1996-01-26 1999-01-26 Kaman Sciences Corporation Environmentally controlled camera housing assembly
US5828807A (en) * 1996-04-30 1998-10-27 Next Level Communications Optical network unit (ONU) mechanical enclosure
US6028769A (en) * 1996-05-20 2000-02-22 Adc Telecommunication, Inc. Multiple integrated service unit for communication system
US5822196A (en) 1996-06-05 1998-10-13 Compaq Computer Corporation Securing a card in an electronic device
CA2199239A1 (en) 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
US6065530A (en) * 1997-05-30 2000-05-23 Alcatel Usa Sourcing, L.P. Weatherproof design for remote transceiver
US5825621A (en) 1997-06-12 1998-10-20 Harris Corporation Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger
US6045140A (en) 1997-07-11 2000-04-04 Cummins Engine Company, Inc. Retention gasket with cooperating cover
US5896268A (en) * 1997-08-11 1999-04-20 Abacon Telecommunications Corporation Enclosure for high-density subscriber line modules
US5923531A (en) 1997-10-14 1999-07-13 International Business Machines Corporation Enhanced circuit board arrangement for a computer
US6292556B1 (en) 1997-11-06 2001-09-18 Anacapa Technology, Inc. Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
US6002588A (en) * 1997-12-04 1999-12-14 Lockheed Martin Corporation Thermally conductive vibration isolators
US5995378A (en) 1997-12-31 1999-11-30 Micron Technology, Inc. Semiconductor device socket, assembly and methods
US5918137A (en) * 1998-04-27 1999-06-29 Spectrian, Inc. MOS transistor with shield coplanar with gate electrode
EP0954210A1 (en) * 1998-04-28 1999-11-03 Lucent Technologies Inc. Cooling electronic apparatus
IT1308435B1 (en) 1999-04-01 2001-12-17 Negesat Di Boer Fabrizio & C S CONTAINMENT AND THERMAL DISSIPATION STRUCTURE FOR EQUIPMENT IN AN AERONAUTICAL OR SPACE VEHICLE
US6289678B1 (en) * 1998-12-03 2001-09-18 Phoenix Group, Inc. Environmental system for rugged disk drive
US6295208B1 (en) 1999-02-12 2001-09-25 3Com Corporation Backplate for securing a circuit card to a computer chassis
US6151213A (en) 1999-05-12 2000-11-21 3Com Corporation Ventilation and cooling control system for modular platforms
US6209631B1 (en) * 1999-07-23 2001-04-03 Esco Electronics Corporation Thermal management apparatus for a sealed enclosure
US6310772B1 (en) 1999-09-02 2001-10-30 Special Product Company Enclosure for telecommunications equipment
JP2001085879A (en) * 1999-09-13 2001-03-30 Hitachi Ltd Assembling structure of electronic circuit board
US6496385B1 (en) 1999-09-29 2002-12-17 Silicon Graphics, Inc. Method and assembly for installation or removal of printed circuit card
US6118662A (en) * 1999-11-05 2000-09-12 Special Product Company Enclosure for telecommunications equipment
US6292361B1 (en) 1999-12-20 2001-09-18 Dell Usa, L.P. Apparatus and method for mounting and cooling a system component assembly in a computer
US6430044B2 (en) 2000-02-10 2002-08-06 Special Product Company Telecommunications enclosure with individual, separated card holders
US6404637B2 (en) 2000-02-14 2002-06-11 Special Product Company Concentrical slot telecommunications equipment enclosure
US6396691B1 (en) * 2000-04-17 2002-05-28 Circa Telecom, Usa, Inc. Thermal cover for T1/HDSL repeater case
US6507494B1 (en) 2000-07-27 2003-01-14 Adc Telecommunications, Inc. Electronic equipment enclosure
US6381146B1 (en) 2000-09-28 2002-04-30 Hewlett-Packard Company Module removal system
US6421252B1 (en) 2000-11-10 2002-07-16 International Business Machines Corporation System and method for a self aligning multiple card enclosure with hot plug capability
US6396129B1 (en) * 2001-03-05 2002-05-28 Siliconware Precision Industries Co., Ltd. Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package
US6406312B1 (en) 2001-04-25 2002-06-18 Juniper Networks, Inc. Circuit card captivation and ejection mechanism including a lever to facilitate removal of the mechanism from a housing
JP3673733B2 (en) 2001-05-29 2005-07-20 株式会社ソニー・コンピュータエンタテインメント Electronic device and board insertion / extraction apparatus for electronic device
US6587339B1 (en) 2002-03-29 2003-07-01 Thornhurst Manufacturing, Inc. Protective pot or container

Also Published As

Publication number Publication date
US20080239674A1 (en) 2008-10-02
US20040163552A1 (en) 2004-08-26
US6628521B2 (en) 2003-09-30
US20020054481A1 (en) 2002-05-09
WO2002037912A2 (en) 2002-05-10
WO2002037912A3 (en) 2003-05-30
US20070127212A1 (en) 2007-06-07
CA2428279C (en) 2010-09-28
US7075789B2 (en) 2006-07-11
US7633757B2 (en) 2009-12-15
CA2428279A1 (en) 2002-05-10

Similar Documents

Publication Publication Date Title
AU2002235169A1 (en) Mechanical housing
AU2002212361A1 (en) Miniature motor
AU6419701A (en) Electropancreatography
AU2001228708A1 (en) Coin-validation arrangement
AU2001254546A1 (en) Aminopiperidines
AU2000267458A1 (en) Hypercomputer
AU2001239310A1 (en) Decahydro-isoquinolines
AU2001220246A1 (en) Neckphone
AU2001258349A1 (en) Bisacylguanidine
AU2002212132A1 (en) Toothbrush housing
AU2001227714A1 (en) Pump housing construction
AU2002239632A1 (en) Display housing
AU2002225698A1 (en) Improved insert for housing
AU2001286366A1 (en) Shielded housing
AU2001282644A1 (en) Case
AU2001262711A1 (en) Cytoprotectors
AU2001226668A1 (en) Crankshaft-starter-generator
GB2365886B (en) Housing structure
AU2001281849A1 (en) Mechanical coin-testing device
AU6759601A (en) Well
GB2369103B (en) Housing
AU2002229965A1 (en) Token housing
GB0028532D0 (en) Housing
AU2001249774A1 (en) Pressurized camera housing
AU2000268774A1 (en) Case