ATE541242T1 - Positiv-lichtempfindliche harzzusammensetzung - Google Patents
Positiv-lichtempfindliche harzzusammensetzungInfo
- Publication number
- ATE541242T1 ATE541242T1 AT08703494T AT08703494T ATE541242T1 AT E541242 T1 ATE541242 T1 AT E541242T1 AT 08703494 T AT08703494 T AT 08703494T AT 08703494 T AT08703494 T AT 08703494T AT E541242 T1 ATE541242 T1 AT E541242T1
- Authority
- AT
- Austria
- Prior art keywords
- component
- resin composition
- group
- photosensitive resin
- positive photosensitive
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 2
- 125000000524 functional group Chemical group 0.000 abstract 2
- 125000000962 organic group Chemical group 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 125000003709 fluoroalkyl group Chemical group 0.000 abstract 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000003921 oil Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 238000001029 thermal curing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Polyurethanes Or Polyureas (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007011414 | 2007-01-22 | ||
| PCT/JP2008/050644 WO2008090827A1 (ja) | 2007-01-22 | 2008-01-18 | ポジ型感光性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE541242T1 true ATE541242T1 (de) | 2012-01-15 |
Family
ID=39644404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT08703494T ATE541242T1 (de) | 2007-01-22 | 2008-01-18 | Positiv-lichtempfindliche harzzusammensetzung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8168371B2 (de) |
| EP (1) | EP2109001B1 (de) |
| JP (1) | JP5083568B2 (de) |
| KR (1) | KR101401564B1 (de) |
| AT (1) | ATE541242T1 (de) |
| TW (1) | TWI403849B (de) |
| WO (1) | WO2008090827A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8828651B2 (en) * | 2005-07-25 | 2014-09-09 | Nissan Chemical Industries, Ltd. | Positive-type photosensitive resin composition and cured film manufactured therefrom |
| TWI505034B (zh) * | 2010-02-02 | 2015-10-21 | Nissan Chemical Ind Ltd | 正型感光性樹脂組成物及撥液性被膜 |
| JP5635449B2 (ja) * | 2011-03-11 | 2014-12-03 | 富士フイルム株式会社 | 樹脂パターン及びその製造方法、ｍｅｍｓ構造体の製造方法、半導体素子の製造方法、並びに、メッキパターン製造方法 |
| JP6064990B2 (ja) * | 2012-03-23 | 2017-01-25 | Jsr株式会社 | フォトレジスト組成物及びレジストパターン形成方法 |
| KR101420527B1 (ko) * | 2012-11-30 | 2014-07-17 | 인하대학교 산학협력단 | 광이합체화 반응을 이용하는 포토레지스트 및 이를 이용한 유기발광 다이오드 표시장치 제조 방법 |
| CN103902801B (zh) * | 2012-12-30 | 2017-12-22 | 上海联影医疗科技有限公司 | 肝灌注的仿真方法和肝灌注的定量测试方法 |
| JP6492444B2 (ja) * | 2013-09-04 | 2019-04-03 | Jsr株式会社 | 感放射線性樹脂組成物、硬化膜、その形成方法、及び電子デバイス |
| WO2015190294A1 (ja) * | 2014-06-09 | 2015-12-17 | 旭硝子株式会社 | 撥インク剤、ネガ型感光性樹脂組成物、隔壁および光学素子 |
| TW201612250A (en) * | 2014-09-29 | 2016-04-01 | Fujifilm Corp | Photosensitive resin composition, manufacturing method for cured film, cured film, liquid crystal display device, organic electroluminescence display device and touch panel |
| JP6826327B2 (ja) * | 2016-01-20 | 2021-02-03 | 日産化学株式会社 | ポジ型感光性樹脂組成物 |
| WO2018079449A1 (ja) * | 2016-10-27 | 2018-05-03 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法 |
| JP7045001B2 (ja) * | 2017-04-21 | 2022-03-31 | 日産化学株式会社 | 感光性樹脂組成物 |
| WO2022009676A1 (ja) * | 2020-07-06 | 2022-01-13 | 昭和電工株式会社 | 感光性樹脂組成物及びその樹脂硬化膜 |
| KR20230144044A (ko) * | 2021-02-08 | 2023-10-13 | 샌트랄 글래스 컴퍼니 리미티드 | 발액제, 경화성 조성물, 경화물, 격벽, 유기 전계 발광 소자, 함불소 도막의 제조 방법 및 함불소 도막 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3817011A1 (de) | 1988-05-19 | 1989-11-30 | Basf Ag | Strahlungsempfindliches gemisch und verfahren zur herstellung von reliefmustern |
| JP2927014B2 (ja) | 1990-02-20 | 1999-07-28 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
| JP3518158B2 (ja) * | 1996-04-02 | 2004-04-12 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料 |
| JPH10197715A (ja) | 1997-01-10 | 1998-07-31 | Canon Inc | 液晶用カラーフィルターの製造方法、該方法により製造された液晶用カラーフィルター及び液晶パネル |
| JPH10206627A (ja) | 1997-01-17 | 1998-08-07 | Seiko Epson Corp | カラーフィルタ及びその製造方法 |
| EP0878738B1 (de) * | 1997-05-12 | 2002-01-09 | Fuji Photo Film Co., Ltd. | Positiv arbeitende Resistzusammensetzung |
| JP3911775B2 (ja) | 1997-07-30 | 2007-05-09 | セイコーエプソン株式会社 | 有機ｅｌ素子の製造方法 |
| CN100530758C (zh) | 1998-03-17 | 2009-08-19 | 精工爱普生株式会社 | 薄膜构图的衬底及其表面处理 |
| JPH11326625A (ja) | 1998-05-13 | 1999-11-26 | Seiko Epson Corp | カラーフィルタ、カラー液晶ディスプレイ及びこれらの製造方法 |
| TWI250379B (en) * | 1998-08-07 | 2006-03-01 | Az Electronic Materials Japan | Chemical amplified radiation-sensitive composition which contains onium salt and generator |
| JP4138117B2 (ja) | 1998-12-21 | 2008-08-20 | セイコーエプソン株式会社 | カラーフィルタ基板の製造方法 |
| JP4424630B2 (ja) | 1999-07-13 | 2010-03-03 | 三菱レイヨン株式会社 | 化学増幅型レジスト組成物およびレジストパターン形成方法 |
| SG98433A1 (en) * | 1999-12-21 | 2003-09-19 | Ciba Sc Holding Ag | Iodonium salts as latent acid donors |
| WO2003087941A1 (fr) * | 2002-04-18 | 2003-10-23 | Nissan Chemical Industries, Ltd. | Composition de resine positivement photosensible et procede de formation de motifs |
| JP2004212678A (ja) * | 2002-12-27 | 2004-07-29 | Kyocera Chemical Corp | 感光性樹脂組成物及びポジ型パターン形成方法 |
| WO2004079454A1 (ja) * | 2003-03-07 | 2004-09-16 | Asahi Glass Company Limited | 感光性樹脂組成物及びその塗膜硬化物 |
| CN1816774B (zh) * | 2003-07-28 | 2010-08-04 | 日产化学工业株式会社 | 正型感光性树脂组合物 |
| JP5177933B2 (ja) * | 2003-08-12 | 2013-04-10 | 東洋インキＳｃホールディングス株式会社 | 隔壁用組成物、それを用いた画素形成用基板および画素の形成方法 |
| JP4363161B2 (ja) | 2003-10-28 | 2009-11-11 | Ｊｓｒ株式会社 | 感放射線性樹脂組成物、並びに層間絶縁膜およびマイクロレンズの形成方法 |
| JP4543886B2 (ja) * | 2003-11-14 | 2010-09-15 | 旭硝子株式会社 | 画像表示素子の隔壁の形成方法 |
| JP4131864B2 (ja) * | 2003-11-25 | 2008-08-13 | 東京応化工業株式会社 | 化学増幅型ポジ型感光性熱硬化性樹脂組成物、硬化物の形成方法、及び機能素子の製造方法 |
| JP4415737B2 (ja) | 2004-04-08 | 2010-02-17 | 旭硝子株式会社 | 感光性樹脂組成物及びその塗膜硬化物 |
| TWI424270B (zh) | 2004-05-26 | 2014-01-21 | Nissan Chemical Ind Ltd | 正型感光性樹脂組成物及所得層間絕緣膜以及微透鏡 |
| CN1989145B (zh) * | 2004-05-28 | 2010-06-23 | 三亚普罗株式会社 | 新颖的氟代烷基氟磷酸鎓盐和过渡金属络合物盐 |
| US8828651B2 (en) * | 2005-07-25 | 2014-09-09 | Nissan Chemical Industries, Ltd. | Positive-type photosensitive resin composition and cured film manufactured therefrom |
| CN101374878B (zh) | 2006-01-25 | 2012-01-18 | 日产化学工业株式会社 | 正型感光性树脂组合物和由其得到的固化膜 |
| CN101443705B (zh) | 2006-05-16 | 2012-05-30 | 日产化学工业株式会社 | 含有硅氧烷化合物的正型感光性树脂组合物 |
| TW200813635A (en) | 2006-05-16 | 2008-03-16 | Nissan Chemical Ind Ltd | Positive type photosensitive resin composition and porous film obtained therefrom |
| WO2007145249A1 (ja) | 2006-06-15 | 2007-12-21 | Nissan Chemical Industries, Ltd. | 環構造を持つ高分子化合物を含有するポジ型感光性樹脂組成物 |
| JP5488779B2 (ja) | 2006-09-01 | 2014-05-14 | 日産化学工業株式会社 | 高平坦化膜形成用樹脂組成物 |
| WO2008035672A1 (fr) | 2006-09-20 | 2008-03-27 | Nissan Chemical Industries, Ltd. | Procédé de fabrication d'un film durci transparent en utilisant une couche de résine photosensible positive pendant une demie exposition |
-
2008
- 2008-01-18 EP EP08703494A patent/EP2109001B1/de not_active Not-in-force
- 2008-01-18 AT AT08703494T patent/ATE541242T1/de active
- 2008-01-18 US US12/449,022 patent/US8168371B2/en not_active Expired - Fee Related
- 2008-01-18 KR KR1020097014687A patent/KR101401564B1/ko not_active Expired - Fee Related
- 2008-01-18 WO PCT/JP2008/050644 patent/WO2008090827A1/ja active Application Filing
- 2008-01-18 JP JP2008555039A patent/JP5083568B2/ja not_active Expired - Fee Related
- 2008-01-22 TW TW097102387A patent/TWI403849B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20100028805A1 (en) | 2010-02-04 |
| EP2109001A4 (de) | 2010-11-24 |
| US8168371B2 (en) | 2012-05-01 |
| WO2008090827A1 (ja) | 2008-07-31 |
| JP5083568B2 (ja) | 2012-11-28 |
| EP2109001B1 (de) | 2012-01-11 |
| KR20090109538A (ko) | 2009-10-20 |
| EP2109001A1 (de) | 2009-10-14 |
| TW200903170A (en) | 2009-01-16 |
| KR101401564B1 (ko) | 2014-06-03 |
| JPWO2008090827A1 (ja) | 2010-05-20 |
| TWI403849B (zh) | 2013-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE541242T1 (de) | Positiv-lichtempfindliche harzzusammensetzung | |
| TWI746653B (zh) | 感光性組合物、與著色圖案及其製造方法 | |
| WO2011108705A1 (ja) | 感光性樹脂組成物 | |
| JP5628489B2 (ja) | 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ | |
| TWI477537B (zh) | A hardening composition having an alkaline developability, an insulating film using the same, and a thin film transistor | |
| EP2714811B1 (de) | Epoxidfunktionelle strahlungshärtbare zusammensetzung mit epoxifunktionellem siloxanoligomer | |
| US20180066159A1 (en) | Siloxane polymer compositions and their use | |
| KR20110044193A (ko) | 네거티브형 감광성 조성물, 그것을 사용한 광학 소자용 격벽 및 그 격벽을 갖는 광학 소자 | |
| US8283103B2 (en) | Composition for forming resist underlayer film for lithography and production method of semiconductor device | |
| KR20120039693A (ko) | 나노 임프린트용 레지스트 하층막 형성 조성물 | |
| JP2010235862A (ja) | 硬化性組成物 | |
| CN110297398B (zh) | 感光树脂组合物、感光树脂层合体和图案形成方法 | |
| JP2010285517A (ja) | 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ | |
| TW201640225A (zh) | 感光性樹脂組成物、樹脂膜之製造方法、有機半導體元件之製造方法及含氟聚合物 | |
| US20160102226A1 (en) | Curable Composition, Method Of Preparing Cured Article, And Cured Article Formed Thereby | |
| KR20190079548A (ko) | 감광성 수지 조성물, 패턴 형성 방법 및 광 반도체 소자의 제조 방법 | |
| JP6883946B2 (ja) | 積層体及びその製造方法並びに基板の接着方法 | |
| JP2021195475A (ja) | 変性シロキサン二酸無水物およびネガ型感光性ポリイミド樹脂組成物 | |
| JP6021866B2 (ja) | 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ | |
| JP6021867B2 (ja) | 光硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ | |
| KR20190024833A (ko) | 에폭시기 함유 이소시아누르산 변성 실리콘 수지, 감광성 수지 조성물, 감광성 드라이 필름, 적층체 및 패턴 형성 방법 | |
| JP2017090515A (ja) | ネガ型硬化性組成物、硬化物および積層体 | |
| JP7634403B2 (ja) | 基板積層体、および前記基板積層体の製造方法 | |
| JPWO2019059202A1 (ja) | 半導体リソグラフィー膜形成組成物、並びにレジストパターン形成方法及びデバイス | |
| JP7194060B2 (ja) | ネガ型感光性樹脂組成物 |