NL2022403B1 - End effector for holding substrates - Google Patents
End effector for holding substrates Download PDFInfo
- Publication number
- NL2022403B1 NL2022403B1 NL2022403A NL2022403A NL2022403B1 NL 2022403 B1 NL2022403 B1 NL 2022403B1 NL 2022403 A NL2022403 A NL 2022403A NL 2022403 A NL2022403 A NL 2022403A NL 2022403 B1 NL2022403 B1 NL 2022403B1
- Authority
- NL
- Netherlands
- Prior art keywords
- end effector
- top surface
- holding
- arm
- side edges
- Prior art date
Links
- 239000012636 effector Substances 0.000 title claims abstract description 60
- 239000000758 substrate Substances 0.000 title claims abstract description 46
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 235000012431 wafers Nutrition 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An end effector (10) for holding substrates has a main body (12) and a fluid channel which is provided in the main body (12), wherein the main body (12) comprises at least one holding 5 arm (14) having two lateral edges (28) and a top surface (18) extending between the lateral edges (28), wherein the top surface (18) of the at least one holding arm (14) slopes downwardly towards at least one of the lateral edges (28). Fig. 3
Description
End effector for holding substrates The invention relates to an end effector for holding substrates.
End effectors are the last element of a kinematic chain of transport apparatuses, e.g. robots. They are used e.g. for gripping or holding objects.
In the production of nano- and micro-structured components, e.g. in chip manufacturing, end effectors are usually used to hold substrates in order to move substrates between different process stations.
Within the scope of this invention, substrates include in particular wafers, such as semiconductor wafers or glass wafers, flexible substrates, wafers which are produced synthetically from chips and casting compound (reconstituted wafers; molded wafers with embedded dies) or substrates having 3-dimensional surfaces.
Such end effectors are known and usually consist of a main body having e.g. a milled vacuum channel and a cover which closes the vacuum channel. Suction, i.e. low-pressure, may be applied to the substrate and it can be held by means of vacuum technology through openings inthe cover.
Thin, flexible substrates, however, may sag or bend when held by known end effectors. Thus, their lower side may come in contact with parts of the end effector not made for direct contact. However, in case that the substrates have a coating of structures on their lower side, the substrates, in particular the coating or structures might be damaged due to the contact between the substrate and the end effector.
Thus, it is the object of the invention to provide an end effector which reduces the risk of damaging the substrate during handling.
The object is achieved by means of an end effector for holding substrates, having a main body and a fluid channel which is provided in the main body, wherein the main body comprises at least one holding arm having two lateral edges and a top surface extending between the lateral edges, wherein the top surface of the at least one holding arm slopes downwardly towards at least one of the lateral edges.
-2- The advantage of the top surface of one holding arm sloping downwardly towards at least one of the lateral edges is that the substrate may bend without being in direct contact with the at least one holding arm of the end effector. In particular, due to the top surface of the holding arm sloping downwardly, a deflection up to 7 mm or even more can be handled sufficiently.
With conventional end effectors a maximum deflection of 3 mm is possible.
The downward slope does not have to be continuous. In particular, a gradient or curvature of the downward slope may vary, for example such that the gradient increases towards a lateral edge of the holding arm. This is advantageous because a deflection of the substrate increases towards a center of the end effector.
For example, the top surface slopes downwardly towards an inner lateral edge, i.e. the edge facing another holding arm. Thus, the substrate may sag downwardly without contacting the end effector.
According to one embodiment, the top surface slopes downwardly towards both lateral edges. In this case, the substrate may bend downwardly or upwardly without contacting the holding arms of the end effector.
Additionally, the top surface may slope downwardly towards a front end of the holding arm.
Thereby, a wide variety of substrates may be handled properly.
The described geometries are in particular valid for a cross sectional view perpendicular to the lateral edges.
The lateral edges may be the outermost edges of the holding arm with respect to a main extension plane. In other words, viewing the end effector from a top view, the lateral edges are the edges confining the holding arm.
According to one embodiment, the main body is multi-layered. This makes it particularly easy to manufacture the main body and in particular any fluid channels in the main body.
According an aspect of the invention, the top surface has a curved portion, a stepped portion and/or an inclined portion with respect to a main extension plane of the end effector. The curved portion may be concave or convex. Due to a curved, inclined or stepped portion, the top surface of the holding arm may slope downwardly in a sufficient way within a short distance.
-3- The top surface of the holding arms may include at least one downwardly sloping section and one parallel section which is parallel to the main extension plane. The parallel section can serve to support additional components or as an alignment surface.
The downwardly sloping section may extend from the parallel section up to one of the lateral edges.
It is also possible that no parallel section is present, e.g. that the entire top surface of the holding arms is curved.
According to one embodiment, the cross section of the holding arms includes a trapezoidal section. In particular, two inclined sections may respectively extend from the parallel section down to both lateral edges. A holding arm including a trapezoidal section allows a sufficient deflection of a substrate in both an upward and a downward way.
However, the largest allowable deflection of the substrate depends on the gradient of the inclined portions. The steeper the inclined surface drops starting from the parallel section, the lower the substrate may bend without touching the end effector, in particular the holding arm. A slope that is too flat therefore does not provide notable additional benefit compared to a holding arm with a planar top surface. The gradient for allowing a sufficient bending of the substrate lies, for example, between 15° and 70°.
Preferably, the top surface at at least one of the lateral edges lies lower than the highest point in a center portion between the lateral edges of the top surface, in particular the top surface has its lowest point at the lateral edges. This is advantageous as the deflection of the substrate is increasing towards the center. In other words, the lowest point of a deflected substrate lies in the middle between the holding arms, while in the lateral portions the substrate is supported by the holding arms and does not sag. In order to avoid contact between the substrate and the holding arm, the top surface therefore preferably slopes downward continuously from the center of the top surface to at least one of the lateral edges.
The center portion may have a width equal to or between a third and an eight of the width of the holding arm.
Moreover, the center portion may be parallel to the main extension plane.
-4- According to one embodiment, the vertical distance between the top surface at the lateral edge and the highest point is larger than 0,5 mm, in particular larger than 1,5 mm, preferably larger than or equal to 2,5 mm. This allows the substrate to bend such that an angle between the substrate and the main extension plane in the region of the holding arm is about 0,5° to 5°.
In particular, the gradient of the slope of the top surface should correspond to the maximum expected slope of the substrate. The maximum expected slope of the substrate may be determined by experiments or simulations. Furthermore, due to the vertical distance between the top surface at the lateral edge and the highest point being larger than 1 mm, the mechanical stability of the holding arm is improved.
In an aspect, the top surface slopes downwardly at an angle of at least 3°, for example 12° to achieve a stable and save end effector. The angle is in particular measured between the main extension plane and the top surface.
The downwardly sloping portion, in particular the curved portion, the stepped portion or the inclined portion, may be adjacent to the lateral edge of the respective holding arm. Thereby, the lowest point of the top surface may lie on one of the lateral edges of the holding arm.
In case that the holding arm has two downwardly sloping portions, the gradients of the respective portions may differ from each other.
In particular, the holding arm has a non-rectangular cross section, for example a circular cross section or an elliptical cross section. A semi-circular or semi-elliptical cross-section is also possible. In case of a circular or elliptical cross section as well as for semi-circular or semi- elliptical cross-sections, the highest point should lie on a center line between the lateral edges of the respective holding arm. In this case, the top surface slopes downwardly in a sufficient way, whereby, due to the curvature of the circular or elliptical cross section, the gradient gets steeper towards the lateral edge.
The top surface may slope downwardly along at least three quarters, in particular the entire length of the respective holding arm.
The length of the holding arm preferably corresponds to a section of the holding arm in which the holding arm is exposed, i.e. does not overlap with any other components of the end effector, for example a fastening flange to which the holding arms may be fastened.
-5- According to one embodiment, the end effector comprises at least one holding device, in particular a suction cup, which is provided in or on an opening in the top surface of the holding arm, wherein the opening is in fluid connection with the fluid channel. The suction cup is, for example, a vacuum suction cup or a fixing apparatus based on the Bernoulli Effect. Due to the holding device, a substrate may be held securely on the holding arms during handling of the substrate. In particular, the holding device prevents the substrates from slipping. Of course, more than one holding device may be provided, for example three or four holding devices.
The opening is preferably provided in a center portion between the lateral edges, in particular at an upper peak line of the top surface. Thus, the holding arm may have a symmetric cross section.
For example, the holding device at least partially overlaps with the downwardly sloping portion of the holding arm in a top view. Thus, starting from the holding device, the substrate can bend without contacting the holding arm. Furthermore, by means of the holding device, a substrate may be arranged on the end effector with a distance to the top surface of the holding arm.
When the substrate bends, a suction force at the holding device may be increased compared to a situation when the substrate is not allowed to bend.
According to one embodiment, the end effector comprises at least three holding devices which are distributed such that a connection line connecting all holding devices has the shape of a triangle, in particular an isosceles triangle. Such an arrangement of the holding devices is advantageous with regard to a stable support of a substrate.
The main body may comprises a base, wherein the at least one holding arm, in particular two holding arms, extend from the base. The base may serve to connect the end effector to a drive system such as a robot.
The distance between the holding arms may be smaller than 450 mm, in particular smaller than 300 mm. For example, a distance of 140 mm is applied for handling of substrates with a diameter of 200 mm.
Further advantages and features of the invention will be apparent from the following description and the enclosed drawings to which reference is made. In the drawings: - Figure 1 shows a perspective view of an end effector in accordance with the invention,
-6- - Figures 2a and 2b show the end effector of Figure 1 in a top view and a downward view, - Figure 3 shows a cross section through a holding arm of the end effector according to Figure 1, - Figures 4a to 4f show possible cross sections of holding arms of further embodiments of the invention, - Figure 5 shows a further embodiment of an end effector in accordance with the invention in a top view, and - Figure 6 shows a further embodiment of an end effector in accordance with the invention in a top view.
Figure 1 shows a first embodiment of an end effector 10 according to the present invention. The end effector 10 comprises a multi layered main body 12 with two holding arms 14. The holding arms 14 each comprise an upper layer 16 having a top surface 18 of the respective holding arm 14 and a lower layer 20. The main body 12 further comprises a base 22 wherein the holding arms 14 extend from the base 22. The base 22 serves to connect the end effector 10 to a drive system such as a robot. The length L of the holding arms 14 is defined as the free length of the holding arm 14, i.e. the length in which the holding arm 14 do not overlap with the base 22 of the end effector 10. The upper layers 16 have a fluid channel 23 (Fig. 3) and holding devices 24 fluidly connected to respective the fluid channel 23. In the embodiment according to Figure 1, four holding devices 24 are provided. The upper layer 16 may be more stable than the lower layer 20. Especially, the lower layer 20 may be foil-like and serves to cover fluid channel 23. Figures 2a and 2b show the end effector 10 of Figure 1 in a top view and a bottom view. As seen in Figures 1, 2a and 2b, the holding arms 14 are parallel to each other. The distance between the holding arms 14 lies, for example, between 140 mm and 220 mm.
-7- The holding arms 14 have two lateral edges 28, wherein the top surface 18 extends between the lateral edges 28. The lateral edge 28 of one of the holding arms 14 facing the other holding arm 14 is called the inner lateral edge 28.
In accordance with Figure 3, the shape of the holding arms 14 is described in more detail. Figure 3 shows a cross section through an exemplary holding arm 14 of the end effector 10 according to Figure 1 at the position of a holding device 24. The cross section is a section perpendicular to the lateral edges 28 of the holding arm 14.
In the embodiment according to Figure 3, the cross section of the holding arm 14 includes a trapezoidal section 30. That means, the top surface 18 of the holding arm 14 has a parallel section 32 and at least one, in particular two downwardly sloping, inclined portion 34.
The parallel section 32 may be in the center of the holding arm 14 and thus also be a center portion. The parallel section 32 is parallel to a main extension plane M of the end effector 10, i.e. a plane spanned by the holding arms 14 and the base 22.
The width of the parallel section 32 is about an eight of the entire width (lateral edge 28 to lateral edge 28) of the holding arm 14. For example, the parallel section 32 has a width of 3 mm.
An opening 26 is present in the center portion or parallel section 32 of the top surface 18. The opening 26 is fluidly connected to the fluid channel 23.
The holding devices 24 — that are in particular suction cups — are provided in the openings
26.
Thus, a substrate can be held securely on the end effector 10 when a vacuum is generated in the fluid channel 23. In general, the holding devices 24 may be provided at the center between the lateral edges 28.
The inclined portions 34 extend from the parallel section 32 outwardly and slope continuously downwardly all the way to the lateral edge 28 of the holding arm 14. Thus, the parallel section 32 includes the highest point of the top surface 18.
The vertical distance between the top surface 18 at a lateral edge 28 and the highest point is for example larger than 0,5 mm, in particular larger than 1,5 mm.
-8- In particular, the angle of the slope of the top surface 18 should be at least 3°, for example 12°. Accordingly, the top surface 18 at at least one of the lateral edges 28 lies lower than the highest point in a center portion between the lateral edges 28 of the top surface 18. In the sown embodiment, the top surface 18 has its lowest point at the lateral edges 28. The holding device 24 at least partially overlaps with the downwardly sloping portion of the holding arm 14.
Turning back to Figure 1, it can be seen that the geometry describe in the context of Figure 3 extends along the entire length L of the holding arms 14, i.e. the top surface 18 of the holding arms 14 slopes downwardly along the entire length L of the respective holding arm 14. It is also possible that the top surface 18 of the holding arms 14 slopes downwardly along at least three quarters of the length of the respective holding arm 14. Especially, the top surface 18 may slope downwardly at least along an axial extend of the holding arm 14, which is intended to be covered by the substrate. It is apparent that due to the inclined portions 34, a substrate resting on the holding arm 14, in particular on the holding device 24, may bend significantly without contacting the top surface 18 of the holding arm 14. Figures 4a to 4f show further embodiments of non-rectangular cross sections of a holding arm 14 for an end effector 10 according to the present invention. These embodiments correspond to the first embodiment discussed above. For identical features or features with identical functions the same reference signs are used. Only the differences of the respective embodiments are described in the following in order to avoid repetitions. In these embodiments, the opening 26 for the holding device 24 may be provided at the center of the top surface 18 as indicated by dashed lines. In the embodiments of Figure 4a and Figure 4b the top surface 18 of the holding arm 14 has an elliptical or a circular cross section, respectively.
-g- In both embodiments, the top surface 18 has a convexly curved portion 40. In particular, the entire top surface 18 is curved, that means that no parallel section 32 is present in these embodiments.
In the embodiment shown in Figure 4c, the top surface 18 has a stepped portion 44. Due to the downward steps of the stepped portion 44, this portion of top surface 18 slopes downwardly, even though the slope is discontinuous.
In the embodiment shown in Figure 4d, the top surface 18 includes a concave curved portion
42.
Figures 4e and 4f show further embodiments with cross sections, which include a trapezoidal section or are entirely trapezoidal.
The width of the holding arm 14, for example, lies between 5 mm and 20 mm. A maximum height of the holding arm 14 for example lies between 2 mm and 5 mm. Of course, these values are only exemplary and other dimensions are also possible.
Figures 5 and 6 show further embodiments of the end effector 10, which are similar to the embodiment according to Figures 1 to 3 so that only the differences are discussed in the following.
In both embodiments, the end effector 10 has an additional support arm 36 which is arranged in the center between the holding arms 14 and fixed to the base 22 of the end effector
10. The length of the additional support arm 36 is much smaller than the length of the holding arms 14, e.g. smaller than 20 % of the length L of the holding arms 14.
Further, the embodiments differ from the first embodiment in the number and arrangement of the holding devices 24. In particular, only three instead of four holding devices 24 are provided, which are distributed such that a connection line C connecting all holding devices 24 has the shape of a triangle, in particular an isosceles triangle.
In Figure 5, a symmetrical design is shown, which is achieved by arranging one of the holding device 24 on the additional support arm 36 and one of the holding devices 24 on each of the holding arms 14 in the same distance from the base 22.
-10 - Figure 6 shows an unsymmetrical design, wherein two holding devices 24 are arranged on one holding arm 14 and one other holding device 24 is arranged on the other holding arm 14.
The additional support arm 36 does not have a holding device 24 in this embodiment and may as well be omitted.
Moreover, in the embodiments shown in Figures 5 and 6, the top surface 18 of the holding arms 14 does not only slope towards the lateral edges 28, but also towards a front end 38 of the holding arms 14. The slope towards the front end 38 of the holding arm 14 start after the holding device 24, i.e. between the holding device 24 and the front end of the holding arm 14.
The slope at the front ends 38 is advantageous for handling, especially in the case of three holding devices 24 and/or in an unsymmetrical design.
Of course, the features of the different embodiments may be combined with each other. Especially, each of the different geometries of the top surfaces 18 of the embodiments of Figures 3 and 4a to 4f may be combined with any of the arrangements of the holding devices 24 of the embodiments of Figures 1, 2, 5 and 6.
Needless to say, combinations of the different geometries of the top surfaces 18 of the embodiments of Figures 3 and 4a to 4f are also possible.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2022403A NL2022403B1 (en) | 2019-01-15 | 2019-01-15 | End effector for holding substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2022403A NL2022403B1 (en) | 2019-01-15 | 2019-01-15 | End effector for holding substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2022403B1 true NL2022403B1 (en) | 2020-08-14 |
Family
ID=66218357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2022403A NL2022403B1 (en) | 2019-01-15 | 2019-01-15 | End effector for holding substrates |
Country Status (1)
| Country | Link |
|---|---|
| NL (1) | NL2022403B1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758182A (en) * | 1993-08-17 | 1995-03-03 | Sony Corp | System and method for manufacturing transparent thin-film semiconductor substrate for display |
| US20150255322A1 (en) * | 2014-03-06 | 2015-09-10 | Cascade Microtech, Inc. | Wafer-handling end effectors |
-
2019
- 2019-01-15 NL NL2022403A patent/NL2022403B1/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758182A (en) * | 1993-08-17 | 1995-03-03 | Sony Corp | System and method for manufacturing transparent thin-film semiconductor substrate for display |
| US20150255322A1 (en) * | 2014-03-06 | 2015-09-10 | Cascade Microtech, Inc. | Wafer-handling end effectors |
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| Date | Code | Title | Description |
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| MM | Lapsed because of non-payment of the annual fee |
Effective date: 20230201 |