Zhang et al., 2020 - Google Patents
Epitaxial fabrication of monolayer copper arsenide on Cu (111)Zhang et al., 2020
View PDF- Document ID
- 9061614044260820152
- Author
- Zhang S
- Song Y
- Li J
- Wang Z
- Liu C
- Wang J
- Gao L
- Lu J
- Zhang Y
- Lin X
- Pan J
- Du S
- Gao H
- Publication year
- Publication venue
- Chinese Physics B
External Links
Snippet
We report the epitaxial growth of monolayer copper arsenide (CuAs) with a honeycomb lattice on Cu (111) by molecular beam epitaxy (MBE). Scanning tunneling microscopy (STM), low energy electron diffraction (LEED), x-ray photoelectron spectroscopy (XPS), and …
- 239000010949 copper 0 title abstract description 59
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B31/00—Carbon; Compounds thereof
- C01B31/02—Preparation of carbon; Purification; After-treatment
- C01B31/04—Graphite, including modified graphite, e.g. graphitic oxides, intercalated graphite, expanded graphite or graphene
- C01B31/0438—Graphene
- C01B31/0446—Preparation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies; Multistep manufacturing processes therefor characterised by the materials of which they are formed
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