[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Sangha et al., 1997 - Google Patents

Novel aluminium-silicon alloys for electronics packaging

Sangha et al., 1997

Document ID
7512276150387821631
Author
Sangha S
Jacobson D
Ogilvy A
Azema M
Junai A
Botter E
Publication year
Publication venue
Engineering Science & Education Journal

External Links

Snippet

A novel series of aluminium-silicon alloys has been developed using the Osprey method. These high silicon (50-70 wt%) content alloys have fine, isotropic microstructure. Unlike the conventional silicon-carbide-containing metal matrix composites (MMCs), the new alloys are …
Continue reading at digital-library.theiet.org (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0103Zinc [Zn]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component

Similar Documents

Publication Publication Date Title
Sangha et al. Novel aluminium-silicon alloys for electronics packaging
US6413589B1 (en) Ceramic coating method
US5874175A (en) Ceramic composite
US5230924A (en) Metallized coatings on ceramics for high-temperature uses
US5248079A (en) Ceramic bonding method
US7663242B2 (en) Thermal interface material and solder preforms
US6974558B2 (en) Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
US7187083B2 (en) Thermal interface material and solder preforms
US5392982A (en) Ceramic bonding method
US4117968A (en) Method for soldering metals with superhard man-made materials
US6390354B1 (en) Adhesive composition for bonding different kinds of members
US6531226B1 (en) Brazeable metallizations for diamond components
US7170186B2 (en) Laminated radiation member, power semiconductor apparatus, and method for producing the same
US6830780B2 (en) Methods for preparing brazeable metallizations for diamond components
Jacobson Lightweight electronic packaging technology based on spray formed Si-Al
EP0117352A1 (en) A process for welding aluminium-based elements and a welded assembly
Jacobson Spray-Formed Silicon-Aluminum.
Burgess et al. The direct bonding of metals to ceramics and application in electronics
Xu et al. Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem
WO1997005757A1 (en) Diamond electronic packages featuring bonded metal
US5653379A (en) Clad metal substrate
TWI283463B (en) Members for semiconductor device
Jacobson et al. A novel lightweight microwave packaging technology
Ljungberg et al. Wetting of silicon nitride with selected metals and alloys
Tang et al. Fabrication and microstructures of sequentially electroplated Sn-rich Au-Sn alloy solders