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Fabrication of high-resolution conductive lines by combining inkjet printing with soft lithography

Published: 01 October 2013 Publication History

Abstract

In this study, an effective method to fabricate well-defined conductive lines with high resolution has been proposed by combining inkjet printing with soft lithography. Soft lithography techniques such as nano-imprint lithography for negative SU-8 patterns and micro-contact printing for hydrophobic fluorocarbon layer were used to create surface wettability contrasts so that the spreading of droplets was confined on a hydrophilic region surrounded by hydrophobic regions. Surface wettability contrasts were evaluated by water contact angle measurements, and the maximum contact angle difference between hydrophobic and hydrophilic surfaces was 104^o. With the help of such surface wettability contrasts and lift-off process for removing small amount of ink stains, well-defined inkjet-printed lines as narrow as 2.8@mm can be successfully generated. The sintered Ag lines also show good electrical resistivity of 7.6@[email protected], 4.7 times as large as bulk Ag's resistivity. This combined approach can be used to fabricate high-quality, high-resolution electrodes in printed electronics applications.

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  1. Fabrication of high-resolution conductive lines by combining inkjet printing with soft lithography

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    Published In

    cover image Microelectronic Engineering
    Microelectronic Engineering  Volume 110, Issue
    October, 2013
    476 pages

    Publisher

    Elsevier Science Ltd.

    United Kingdom

    Publication History

    Published: 01 October 2013

    Author Tags

    1. High-resolution printing
    2. Inkjet printing
    3. Soft lithography
    4. Surface wettability contrast
    5. UV treatment

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