Article

Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method

Authors:

Joong-Ho Kim,

Erdem Matoglu,

Jinwoo Choi,

Madhavan SwaminathanAuthors Info & Claims

ASP-DAC '02: Proceedings of the 2002 Asia and South Pacific Design Automation Conference

Page 59

Published: 07 January 2002 Publication History

Publisher Site Get Access

Abstract

This paper presents a method for analyzing multi-layered power distribution networks in the frequency domain.Using a two dimensional array of distributed RLCG circuits,multi-layered power distribution planes are represented.Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network,a multi-input and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements.This method has been compared with the cavity resonator method simulated in Spice.

References

[1]

{1} R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook, 2nd ed. New York: Chapman & Hall, 1997, pt. I.

Google Scholar

[2]

{2} J. Kim and M. Swaminathan, "Modeling of irregular shaped power distribution networks using transmission matrix method," in Proc. 9th Topical Meeting on Elect. Perform. Electron. Packag., Oct. 2000, pp. 83-86.

Google Scholar

[3]

{3} J. Kim and M. Swaminathan, "Modeling of power distribution networks for mixed signal applications," in Proc. IEEE Int. Symp. Electromagn. Compat., Aug. 2001, pp. 1117- 1122.

Google Scholar

[4]

{4} S. Chun, M. Swaminathan, L. D. Smith, J. Srinivasan, Z. Jin, and M. K. Iyer, "Modeling of simultaneous switching noise in high speed systems," IEEE Trans. Comp., Packag., Manuf. Technol., vol. 24, pp. 132-142, May 2001.

Google Scholar

[5]

{5} M. Pozar, Microwave Engineering, 2nd ed. New York: Wiley, 1998, ch. 4.

Google Scholar

[6]

{6} K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Comp., Packag., Manuf. Technol. B, vol.18, pp. 628-639, Nov. 1995.

Crossref

Google Scholar

[7]

{7} E. Laermans, J. D. Zutter, F. Olyslager, S. Sercu, and D. Morlion, "Modeling differential via holes," in Proc. 9th Topical Meeting on Elect. Perform. Electron. Packag., Oct. 2000, pp. 127-130.

Google Scholar

Modeling of Multi-Layered Power Distribution Planes Including Via Effects Using Transmission Matrix Method
1. Hardware

Recommendations

Multifrequency Wilkinson power divider using microstrip nonuniform transmission lines

A new idea is proposed to modify the conventional Wilkinson power dividers to operate at two or several desired frequencies. The proposed structure contains two Microstrip Nonuniform Transmission Lines (MNTLs) instead of two uniform ones with nearly the ...
A Novel Method of Optimization SIW Bandpass Filter Using Coupling Matrix
ICCTA '19: Proceedings of the 2019 5th International Conference on Computer and Technology Applications

In this paper, a novel three-pole substrate integrated waveguide (SIW) bandpass filter (BPF) using the coupling Matrix is proposed, commercially available printed circuit board (PCB) technology. The detailed design procedure beginning from the ...
The Series of Four Rectenna Using Monopole Microstrip Circular Patch Antenna as Wireless Power Transmission Receiver Device at Frequency 2,4 GHz
WCNA 2017: Proceedings of the 2017 International Conference on Wireless Communications, Networking and Applications

This paper proposes four series of rectenna using monopole microstrip circular patch used as receiver device on wireless power transmission. The antenna is simulated and optimized using commercially available software, Computer Simulation Technology (...

Comments

Please enable JavaScript to view thecomments powered by Disqus.

Information & Contributors

Information

Published In

ASP-DAC '02: Proceedings of the 2002 Asia and South Pacific Design Automation Conference

January 2002

753 pages

ISBN:0769514413

Publisher

IEEE Computer Society

United States

Publication History

Published: 07 January 2002

Check for updates

Qualifiers

Article

Conference

ASPDAC/VLSI02

Sponsor:

SIGDA

ASPDAC/VLSI02: ASP-DAC/VLSI Design Conference 2002

January 7 - 11, 2002

Acceptance Rates

Overall Acceptance Rate 466 of 1,454 submissions, 32%

Upcoming Conference

ASPDAC '25

Sponsor:
sigda

30th Asia and South Pacific Design Automation Conference

January 20 - 23, 2025

Tokyo , Japan

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

0
Total Citations
217
Total Downloads

Downloads (Last 12 months)1
Downloads (Last 6 weeks)0

Reflects downloads up to 11 Dec 2024

Other Metrics

View Author Metrics

Citations

View Options

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Recommendations

Multifrequency Wilkinson power divider using microstrip nonuniform transmission lines

A Novel Method of Optimization SIW Bandpass Filter Using Coupling Matrix

The Series of Four Rectenna Using Monopole Microstrip Circular Patch Antenna as Wireless Power Transmission Receiver Device at Frequency 2,4 GHz