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research-article

Novel Proximal Group ADMM for Placement Considering Fogging and Proximity Effects

Authors:

Yao-Wen ChangAuthors Info & Claims

2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

Pages 1 - 7

https://doi.org/10.1145/3240765.3240832

Published: 05 November 2018 Publication History

Abstract

Fogging and proximity effects are two major factors that cause inaccurate exposure and thus layout pattern distortions in e-beam lithography. In this paper, we propose the first analytical placement algorithm to consider both the fogging and proximity effects. We first formulate the global placement problem as a separable minimization problem with linear constraints, where different objectives can be tackled one by one in an alternating fashion. Then, we propose a novel proximal group alternating direction method of multipliers (ADMM) to solve the separable minimization problem with two subproblems, where the first subproblem (mainly associated with wirelength and density) is solved by a steepest descent method without line-search, and the second one (mainly associated with the fogging and proximity effects) is handled by an analytical scheme. We prove the property of global convergence of the proximal group ADMM method. Finally, legalization and detailed placement are used to legal and further improve the placement result. Experimental results show that our algorithm is effective and efficient for the addressed problem. Compared with the state-of-the-art work, our algorithm not only can achieve 13.4% smaller fogging variation and 21.4% lower proximity variation, but also has a 1.65× speedup.

References

[1]

I.S. Bustany, D. Chinnery, J.R. Shinnerl, and V. Yutsis. ISPD 2015 benchmarks with fence regions and routing blockages for detailed-routing-driven placement. In Proceedings of International Symposium on Physical Design, pages 157–164, 2015.

[2]

T. Chan, J. Cong, and K. Sze. Multilevel generalized force-directed method for circuit placement. In Proceedings of International Symposium on Physical Design, pages 185–192, 2005.

[3]

Y.-W. Chang, R.-G. Liu, and S.-Y. Fang. EUV and e-beam manufacturability: challenges and solutions. In Proceedings of IEEE/ACM Design Automation Conference, pages 198–204, 2015.

[4]

T.-C. Chen, Z.-W. Jiang, T.-C. Hsu, H.-C. Chen, and Y.-W. Chang. NTUplace3: an analytical placer for large-scale mixed-size designs with preplaced blocks and density constraints. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 27 (7): 1228–1240, 2008.

Digital Library

[5]

C.-C. Huang, H.-Y. Lee, B.-Q. Lin, S.-W. Yang, C.-H. Chang, S.-T. Chen, and Y.-W. Chang. Detailed-routability-driven analytical placement for mixed-size designs with technology and region constraints. In Proceedings of IEEE/ACM International Conference on Computer-Aided Design, pages 508–513, 2015.

[6]

X.X. Huang and X.Q. Yang. Convergence analysis of a class of nonlinear penalization methods for constrained optimization via first-order necessary optimality conditions. Journal of Optimization Theory & Applications, 116 (2): 311–332, 2003.

[7]

Y.-C. Huang and Y.-W. Chang. Fogging effect aware placement in electron beam lithography. In Proceedings of IEEE/ACM Design Automation Conference, pages 53:1–53:6, 2017.

[8]

P. Hudek and D. Beyer. Exposure optimization in high-resolution e-beam lithography. Elsevier Science Ltd., 2006.

[9]

P. Hudek, U. Denker, D. Beyer, N. Belic, and H. Eisenmann. Fogging effect correction method in high-resolution electron beam lithography. Microelectronic Engineering, 84 (5–8): 814–817, 2007.

Digital Library

[10]

A.B. Kahng and Q. Wang. Implementation and extensibility of an analytic placer. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 24 (5): 734–747, 2005.

Digital Library

[11]

S.-J. Lin, P.-Y. Liu, C.-H. Chen, W.-C. Wang, J.-J. Shin, B.J. Lin, M.A. McCord, and S.K. Shriyan. Influence of data volume and EPC on process window in massively parallel e-beam direct write. The International Society for Optical Engineering, 8680 (5), 2013.

[12]

W.C. Naylor, R. Donelly, and L. Sha. Non-linear optimization system and method for wire length and delay optimization for an automatic electric circuit placer, 2001.

[13]

L. Pain, M. Jurdit, J. Todeschini, S. Manakli, B. Icard, B. Minghetti, G. Bervin, A. Beverina, F. Leverd, and M. Broekaart. Electron beam direct write lithography flexibility for ASIC manufacturing: an opportunity for cost reduction. In Microlithography, pages 35–45, 2005.

[14]

W. Shi, Q. Ling, K. Yuan, G. Wu, and W. Yin. On the linear convergence of the ADMM in decentralized consensus optimization. IEEE Transactions on Signal Processing, 62 (7): 1750–1761, 2014.

Digital Library

[15]

N. Shimomura, M. Ogasawara, J. Takamatsu, S. Yoshitake, K. Ooki, N. Nakaya-mada, F. Okabe, and T. Tojo. Reduction of fogging effect caused by scattered electrons in an electron beam system. In Photomask and X-Ray Mask Technology VI, pages 408–415, 1999.

[16]

A. Sinharay, P. Roy, and H. Rahaman. Computing frãl'chet distance metric based L-shape tile decomposition for e-beam lithography. In International Conference on VlSI Design and 2018 International Conference on Embedded Systems, pages 313–318, 2018.

[17]

P. Spindler, U. Schlichtmann, and F.M. Johannes. Abacus: fast legalization of standard cell circuits with minimal movement. In Proceedings of International Symposium on Physical Design, pages 47–53, 2008.

[18]

L.-T. Wang, Y.-W. Chang, and K.-T. Cheng. Electronic design automation: Synthesis, verifcation, and testing. In Elsevier/Morgan Kaufmann, 2009.

Cited By

Sadrafshari MDobre OZhang L(2024)Reinforcement-Learning-Based Foggy-Aware Optimal Placement Method for Analog and MixedSignal Circuits2024 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS58744.2024.10558520(1-5)Online publication date: 19-May-2024
https://doi.org/10.1109/ISCAS58744.2024.10558520
Chen JHuang ZZhu ZPeng ZZhu WChang Y(2022)Novel Proximal Group ADMM for Placement Considering Fogging and Proximity EffectsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2022.315506641:12(5541-5553)Online publication date: Dec-2022
https://doi.org/10.1109/TCAD.2022.3155066
Hajijafari MAhmadi MZhao ZZhang L(2022)Reinforcement-Learning-based Mixed-Signal IC Placement for Fogging Effect Control2022 23rd International Symposium on Quality Electronic Design (ISQED)10.1109/ISQED54688.2022.9806259(127-132)Online publication date: 6-Apr-2022
https://doi.org/10.1109/ISQED54688.2022.9806259
Show More Cited By

Index Terms

Novel Proximal Group ADMM for Placement Considering Fogging and Proximity Effects
1. Applied computing
  1. Physical sciences and engineering
2. Hardware
  1. Electronic design automation
    1. Physical design (EDA)
      1. Placement
      2. Wire routing

Index terms have been assigned to the content through auto-classification.

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2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

Nov 2018

939 pages

Copyright © 2018.

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IEEE Press

Publication History

Published: 05 November 2018

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Cited By

Sadrafshari MDobre OZhang L(2024)Reinforcement-Learning-Based Foggy-Aware Optimal Placement Method for Analog and MixedSignal Circuits2024 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS58744.2024.10558520(1-5)Online publication date: 19-May-2024
https://doi.org/10.1109/ISCAS58744.2024.10558520
Chen JHuang ZZhu ZPeng ZZhu WChang Y(2022)Novel Proximal Group ADMM for Placement Considering Fogging and Proximity EffectsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2022.315506641:12(5541-5553)Online publication date: Dec-2022
https://doi.org/10.1109/TCAD.2022.3155066
Hajijafari MAhmadi MZhao ZZhang L(2022)Reinforcement-Learning-based Mixed-Signal IC Placement for Fogging Effect Control2022 23rd International Symposium on Quality Electronic Design (ISQED)10.1109/ISQED54688.2022.9806259(127-132)Online publication date: 6-Apr-2022
https://doi.org/10.1109/ISQED54688.2022.9806259
Hajijafari MAhmadi MZhao ZZhang L(2022)Fogging-Effect-Aware Mixed-Signal IC Placement with Reinforcement Learning2022 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS48785.2022.9937950(2895-2899)Online publication date: 28-May-2022
https://doi.org/10.1109/ISCAS48785.2022.9937950
Chen WHuang HHuang ZChen J(2022)Analytical Optimization Method for VLSI Global Placement2022 China Semiconductor Technology International Conference (CSTIC)10.1109/CSTIC55103.2022.9856893(1-4)Online publication date: 20-Jun-2022
https://doi.org/10.1109/CSTIC55103.2022.9856893
Chen JChang YHuang Y(2021)Analytical Placement Considering the Electron-Beam Fogging EffectIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2020.300257040:3(560-573)Online publication date: Mar-2021
https://doi.org/10.1109/TCAD.2020.3002570
Shahsavani SPedram M(2020)TDP-ADMM: A Timing Driven Placement Approach for Superconductive Electronic Circuits Using Alternating Direction Method of Multipliers2020 57th ACM/IEEE Design Automation Conference (DAC)10.1109/DAC18072.2020.9218527(1-6)Online publication date: Jul-2020
https://doi.org/10.1109/DAC18072.2020.9218527

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